Inverter

Abstract

The utility model provides an inverter, which comprises a box body internally provided with an accommodating space, a surface cover matched with the box body, a fan bracket arranged in the box body, a fan arranged on the fan bracket and an air duct assembly, the fan bracket divides the space in the box body into a first accommodating bin and a second accommodating bin, and the fan is arranged on the fan bracket; an air outlet is formed in the box body corresponding to the first accommodating bin, and an air inlet is formed in the box body corresponding to the second accommodating bin; the air duct assembly defines a closed air duct in the box body, the electronic device is installed in the air duct, and the two ends of the air duct are communicated with the air inlet and the fan respectively. The air channel is well sealed, heating electronic devices are arranged in the air channel, the structure is compact, and centralized heat dissipation is facilitated. The fan of the first containing bin cools the radiator of the internal device in a forced air cooling mode, external air forms a heat dissipation path from the air inlet to the electronic device to the fan to the air outlet, and the heat dissipation efficiency is high.

Description

Technical Field

[0001] This utility model relates to the field of inverter technology, specifically to an inverter with better heat dissipation. Background Technology

[0002] The components in an inverter all have their rated operating temperatures. If the inverter's heat dissipation performance is poor, as the inverter continues to operate, the heat from the components cannot be transferred to the outside, and their temperatures will rise higher and higher. Excessive temperature will reduce the performance and lifespan of the components. In order to keep the operating temperature of the internal components of the inverter within the rated temperature range and ensure its efficiency and lifespan, it is necessary to transfer the heat from inside the inverter.

[0003] Forced air cooling is a common heat dissipation method. It primarily uses fans or other devices to force airflow around components, thereby carrying away the heat generated by the components. As inverter power increases, it requires larger airflow fans, larger heat sinks, and larger product size. This increases costs and is not conducive to improving the product's power density.

[0004] With increasing demand for airflow, inverter protection has become a significant issue. Inverters are typically installed outdoors (and may be in desert or Gobi areas). Accumulation of foreign objects and dust inside the inverter can not only impair heat dissipation but also cause electrical clearances and creepage distances of electronic components to fail to meet installation requirements. Inverter malfunctions not only affect normal operation but can also endanger personal safety, and even lead to serious fires due to electrical short circuits.

[0005] Forced air cooling is a common heat dissipation method. It primarily uses fans or other devices to force airflow around components, thereby carrying away the heat generated by the components. As inverter power increases, larger airflow fans, larger heat sinks, and larger product sizes are required. This increases costs and hinders improvements in power density. With increasing airflow demands, inverter protection also becomes an issue. Inverters are typically installed outdoors (and may be in desert or Gobi areas). Accumulation of foreign objects and dust inside the inverter can not only worsen heat dissipation but also cause electrical clearances and creepage distances of electronic components to fail to meet safety regulations. Inverter malfunctions not only affect normal operation but can also endanger personal safety, and even lead to electrical short circuits causing serious fires or other safety hazards. Utility Model Content

[0006] The technical problem to be solved by this utility model is to provide an inverter to address the above-mentioned problems.

[0007] The technical solution adopted by this utility model to solve the above-mentioned technical problems is as follows: an inverter is provided, including a box with an internal accommodating space, a cover that matches the box, a fan bracket, a fan mounted on the fan bracket, and an air duct assembly. The fan bracket divides the internal space of the box into a first accommodating compartment and a second accommodating compartment.

[0008] An air outlet is provided on the box corresponding to the first storage compartment, and an air inlet is provided on the box corresponding to the second storage compartment;

[0009] A fan is mounted on the fan bracket;

[0010] The air duct assembly defines a sealed air duct within the housing, and electronic devices are installed within the air duct. The two ends of the air duct are respectively connected to an air inlet and a fan.

[0011] Furthermore, preferably, the air duct assembly has an inclined outer wall surface near the fan end.

[0012] Furthermore, the electronic device preferably includes a PCS board, on which a transformer is disposed, and a thermal pad is disposed on the back of the PCS board corresponding to the transformer, with both ends of the thermal pad contacting the PCS board and the housing, respectively.

[0013] Furthermore, preferably, transformer solder feet are provided on the back of the PCS board corresponding to the transformer, and the thermal pad is provided in the area of ​​the transformer solder feet.

[0014] Furthermore, the electronic device preferably includes a heat-generating device and a heat sink, the heat sink being configured to dissipate heat for at least a portion of the heat-generating device.

[0015] Furthermore, the air duct assembly is preferably a housing component, and the air duct assembly and the inner wall of the housing define an air duct, covering the heat-generating device and the heat sink within the air duct;

[0016] Alternatively, the air duct assembly may be a semi-shell component, with the heat sink disposed on both sides of the heat-generating device, and the air duct assembly, the side wall of the heat sink, and the bottom of the housing defining an air duct.

[0017] Furthermore, preferably, the housing has an installation groove on the outer wall of the second accommodating compartment, and the air inlet is opened on the installation groove. The inverter also includes a dust cover and dustproof cotton. The dust cover is installed on the installation groove and the space defined therein is used to accommodate the dustproof cotton. The dust cover has a ventilation opening.

[0018] Furthermore, it is preferable that the dust cover is flush with the outer surface of the box.

[0019] Furthermore, it preferably also includes a wiring copper busbar assembly disposed in the first receiving compartment and extending to the second receiving compartment, the wiring copper busbar assembly being electrically connected to electronic devices.

[0020] Furthermore, the preferred wiring copper busbar assembly includes an epoxy board and a copper busbar connected to the epoxy board, the epoxy board being fixed within the first receiving compartment, the electronic device including a PCS board, and the copper busbar being fixed to the PCS board.

[0021] The inverter of this invention has at least the following beneficial effects: It features multiple heat dissipation paths. First, the air duct is well-sealed, placing the heat-generating electronic components within it, resulting in a compact structure that facilitates centralized heat dissipation. The fan in the first housing compartment cools the internal component heat sinks using forced air cooling, creating a heat dissipation path of air inlet → electronic components → fan → air outlet. Second, based on the forced air cooling by the fan, a thermal pad is placed between the PCS board and the casing. Heat from the internal electronic components is conducted to the outer casing through the thermal pad, exchanging heat with the air. The casing itself becomes part of the system's heat sink, sharing some of the heat from the components. The thermal pad placement is flexible, allowing for multiple pads to be used simultaneously, thus increasing the inverter's heat dissipation efficiency. Dustproof cotton is installed at the casing's air inlet to isolate foreign objects in the air, reducing dust entry into the casing and improving its dust protection level. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a three-dimensional structural diagram of the inverter in this utility model;

[0024] Figure 2 yes Figure 1 An exploded view showing the faceplate removed.

[0025] Figure 3 yes Figure 2 A schematic diagram of the three-dimensional structure in one direction;

[0026] Figure 4 yes Figure 3 Cross-sectional view along the HH section line;

[0027] Figure 5 This is a schematic diagram of the wiring busbar assembly installed on the PCS board;

[0028] Figure 6 This is a structural schematic diagram of the wiring copper busbar assembly;

[0029] Figure 7 This is a structural diagram of the thermal pad and the PCS board;

[0030] Figure 8 This is a schematic diagram of the transformer solder joint structure. Detailed Implementation

[0031] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0032] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in this utility model embodiment are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0033] Furthermore, in this utility model, the use of terms such as "first," "second," etc., is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0034] In this utility model, unless otherwise explicitly specified and limited, the terms "connection," "fixing," etc., should be interpreted broadly. For example, "fixing" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0035] Furthermore, the technical solutions of the various embodiments of this utility model can be combined with each other, but only if they are based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0036] like Figures 1-4 As shown, an inverter of this utility model includes a housing 10 with an internal accommodating space and a cover 20 that matches the housing 10. The housing 10 serves as the main body of the inverter. Electronic devices 50 are installed inside the housing 10. The electronic devices 50 may include a PCS board 51. The PCS board 51 houses transistors 54, heat sinks 53, transformers 52, inductors 56, capacitors 55, etc. The transistors 54 transfer heat to the heat sink 53 and exchange heat with the air intake. The cover 20 is used to close the opening of the housing 10 and protect the internal components of the inverter.

[0037] The inverter includes a fan bracket 30 disposed inside the housing 10, a fan 40 mounted on the fan bracket 30, and an air duct assembly 80. The fan bracket 30 divides the space inside the housing 10 into a first receiving compartment 11 and a second receiving compartment 12. Corresponding to the first receiving compartment 11 and the second receiving compartment 12, the cover 20 is divided into a first cover 21 and a second cover 22, which respectively cover the corresponding parts of the housing 10. The fan 40 is mounted on the fan bracket 30. The first receiving chamber 11 has an air outlet 13 on its corresponding housing 10. The air outlet 13 can be located on each side of the housing 10 to allow hot air inside the housing 10 to flow out from the air outlet 13. The second receiving chamber 12 has an air inlet 14 on its corresponding housing 10. The air inlet 14 can be located near the air duct 82. After the air duct 82 exchanges heat with the electronic device 50, the hot air cooled by the fan 40 flows out from the air outlet 13 of the first receiving chamber 11. The air duct assembly 80 defines a sealed air duct 82 inside the housing 10. The electronic device 50 is installed inside the air duct 82. The two ends of the air duct 82 are connected to the air inlet 14 and the fan 40, respectively. In other words, in the inverter of this utility model, the heat source (heat-generating device) inside the housing 10 is concentrated in the air duct 82, which is compact and conducive to centralized heat dissipation. The fan 40 at the outlet of the air duct 82 cools the internal components by forced air cooling. The external air forms a heat dissipation path from the air inlet 14 to the electronic components 50, then to the fan 40, and finally to the air outlet 13, resulting in good heat dissipation.

[0038] In some preferred embodiments, the air duct assembly 80 has an inclined outer wall surface 81 near the fan 40. This design guides airflow more smoothly through the air duct assembly 80 into the fan 40, reducing airflow resistance and improving heat dissipation. Simultaneously, the inclined outer wall surface 81 increases the surface area of ​​the air duct assembly 80, which is beneficial for heat dissipation.

[0039] In the inverter, the PCS board 51 is one of the important electronic components 50, and it houses heat-generating elements such as the transformer 52. To effectively reduce the temperature of the transformer 52, a thermal pad 60 is provided on the back of the PCS board 51 corresponding to the position of the transformer 52. For example... Figure 7 As shown, the two ends of the thermal pad 60 are in contact with the PCS board 51 and the housing 10, respectively, which can quickly transfer the heat generated by the transformer 52 to the housing 10 for heat exchange and dissipation with the air. The outer shell of the housing 10 becomes part of the system heat sink 53 and is made of a material with high thermal conductivity, which can share some of the heat from the components. This design not only improves heat dissipation efficiency but also protects the transformer 52 from high-temperature damage.

[0040] Furthermore, corresponding to the transformer 52, transformer solder feet 521 are provided on the back of the PCS board 51, such as... Figure 8 As shown, a thermal pad 60 is placed within the transformer solder joint area 521. Since the transformer solder joint area 521 is a heat-concentrated area, placing the thermal pad 60 in this area can more effectively transfer heat away. The placement of the thermal pad 60 within the transformer solder joint area also allows for precise location of the installation position. Furthermore, the material, quantity, and thickness of the thermal pad 60 can be adjusted according to actual needs to achieve optimal heat dissipation. Inverters also contain other heat-generating components, such as transistors, MOSFETs, inductors, and capacitors (this is not a limitation). Thermal pads can also be used to transfer heat to the enclosure for heat dissipation.

[0041] In one specific embodiment, the inverter also includes other heat-generating components, such as power devices and resistors. To reduce the temperature of these components, the present invention incorporates a heat sink 53 in the inverter. The heat sink 53 is configured to dissipate heat from at least a portion of the heat-generating components, effectively transferring heat from the heat-generating components to the air and reducing the operating temperature of the components.

[0042] In one specific embodiment, the air duct assembly 80 is a housing component, and the air duct assembly 80 and the inner wall of the housing 10 define an air duct 82, covering the heat-generating device and the heat sink 53 within the air duct 82; this design can ensure that all heat-generating devices are effectively cooled, and the housing structure of the air duct assembly 80 can also play a role in dust prevention.

[0043] In one specific embodiment, the air duct assembly 80 is a semi-shell component, the heat sink 53 is disposed on both sides of the heat-generating device, and the air duct assembly 80, the side wall of the heat sink 53, and the bottom of the housing 10 define an air duct 82. This design can reduce the manufacturing cost and weight of the air duct assembly 80 while ensuring heat dissipation effect.

[0044] Furthermore, preferably, the housing 10 has a mounting groove 15 on the outer wall of the second receiving compartment 12, and the air inlet 14 is opened on the bottom wall of the mounting groove 15. The inverter also includes a dust cover 16 and a dustproof cotton 17. The dust cover 16 is installed on the mounting groove 15 and the space defined therein is used to accommodate the dustproof cotton 17. The dust cover 16 has a ventilation opening 161. In this way, when external air enters the inverter through the air inlet 14, it will first pass through the filtration function of the dustproof cotton 17 to remove dust and other impurities, and then enter the air duct assembly 80 through the ventilation opening 161 for heat dissipation.

[0045] In a preferred embodiment, the dust cover 16 is flush with the outer surface of the housing 10. This prevents the dust cover 16 from becoming a point of accumulation for dust and other impurities, and also helps to maintain the clean and aesthetically pleasing appearance of the inverter.

[0046] Furthermore, it preferably also includes a wiring copper busbar assembly 70, such as Figures 5-6 As shown, it is used to electrically connect electronic devices 50 to each other and to an external power source. The wiring busbar assembly 70 is disposed in the first receiving compartment 11 and extends to the second receiving compartment 12. The wiring busbar assembly 70 electrically connects the electronic devices 50 to ensure reliable connection between the electronic devices 50. It has a simple structure, is easy to assemble, and helps to improve assembly efficiency.

[0047] Furthermore, the preferred wiring copper busbar assembly 70 includes an epoxy board 71 and a copper busbar 72 connected to the epoxy board 71. The epoxy board 71 has good insulation properties and mechanical strength, ensuring the safety and reliability of the wiring copper busbar assembly 70. The copper busbar 72 is used to transmit electrical energy, and its material and cross-sectional area can be selected according to actual needs. The epoxy board 71 is fixed inside the first receiving compartment 11. The electronic device 50 includes a PCS board 51, and the copper busbar 72 is fixedly connected to the PCS board 51 to realize the electrical connection between the electronic devices 50.

[0048] The inverter of this invention has at least the following beneficial effects: It features multiple heat dissipation paths. First, the air duct 82 is well-sealed, placing the heat-generating electronic components 50 within it, resulting in a compact structure that facilitates centralized heat dissipation. The fan 40 in the first housing 11 cools the internal component heat sink 53 using forced air cooling, creating a heat dissipation path of air inlet 14 → electronic component 50 → fan 40 → air outlet 13. Second, based on the forced air cooling by the fan 40, a thermal pad 60 is placed between the PCB board and the housing 10. The heat from the internal electronic components 50 is conducted to the outer casing through the thermal pad 60, exchanging heat with the air for heat dissipation. The housing 10 becomes part of the system heat sink 53, sharing some of the heat from the components. The thermal pad 60 can be flexibly positioned, allowing for multiple heat dissipation paths to be added simultaneously, thus improving the inverter's heat dissipation efficiency. Other heat-generating components in the inverter, such as transistors, MOSFETs, inductors, and capacitors (not limited here), can also have their heat transferred to the housing for heat dissipation via thermal pads. The air inlet 14 of the enclosure 10 is equipped with dustproof cotton 17 to isolate foreign objects in the air, reduce dust entering the enclosure 10, and improve the dustproof protection level of the enclosure 10. In addition, a copper busbar 72 assembly solution is also provided, which consists of copper busbar 72 and epoxy board. It has a simple structure, is easy to assemble, and helps to improve assembly efficiency.

[0049] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. An inverter, comprising a housing with an internal accommodating space and a cover matching the housing, characterized in that, Includes a fan bracket disposed inside the housing, a fan mounted on the fan bracket, and an air duct assembly. The fan bracket divides the space inside the housing into a first accommodating compartment and a second accommodating compartment. A fan is mounted on the fan bracket. An air outlet is provided on the box corresponding to the first storage compartment, and an air inlet is provided on the box corresponding to the second storage compartment; The air duct assembly defines a sealed air duct within the housing, and electronic devices are installed within the air duct. The two ends of the air duct are respectively connected to an air inlet and a fan.

2. The inverter according to claim 1, characterized in that, The air duct assembly has an inclined outer wall surface near the fan end.

3. The inverter according to claim 1, characterized in that, The electronic device includes a PCS board, on which a transformer is disposed. A thermal pad is disposed on the back of the PCS board corresponding to the transformer, and the two ends of the thermal pad are in contact with the PCS board and the housing, respectively.

4. The inverter according to claim 3, characterized in that, A transformer solder pad is provided on the back of the PCS board corresponding to the transformer, and a thermal pad is provided in the area of ​​the transformer solder pad.

5. The inverter according to claim 1, characterized in that, The electronic device includes a heat-generating device and a heat sink, the heat sink being configured to dissipate heat for at least a portion of the heat-generating device.

6. The inverter according to claim 5, characterized in that, The air duct assembly is a housing component, and the air duct assembly and the inner wall of the housing define an air duct, covering the heat-generating device and the heat sink within the air duct. Alternatively, the air duct assembly may be a semi-shell component, with the heat sink disposed on both sides of the heat-generating device, and the air duct assembly, the side wall of the heat sink, and the bottom of the housing defining an air duct.

7. The inverter according to claim 1, characterized in that, The housing has an installation groove on the outer wall of the second accommodating compartment, and the air inlet is opened on the installation groove. The inverter also includes a dust cover and dustproof cotton. The dust cover is installed on the installation groove and the space defined therein is used to accommodate the dustproof cotton. The dust cover has a ventilation opening.

8. The inverter according to claim 7, characterized in that, The dust cover is flush with the outer surface of the box.

9. The inverter according to claim 1, characterized in that, It also includes a wiring copper busbar assembly, which is disposed in the first receiving compartment and extends to the second receiving compartment, and the wiring copper busbar assembly is electrically connected to electronic devices.

10. The inverter according to claim 9, characterized in that, The wiring copper busbar assembly includes an epoxy board and a copper busbar connected to the epoxy board. The epoxy board is fixed in the first receiving compartment. The electronic device includes a PCS board, and the copper busbar is fixed to the PCS board.

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