Lane controller with heat dissipation device

Abstract

The utility model discloses a lane controller with a radiating device, which comprises a shell, a circuit board and a radiator, the shell is provided with a groove, the radiator is arranged in the groove, the radiator is composed of a substrate and radiating fins, the substrate is arranged on the circuit board, and the radiating fins are arranged on the circuit board. The cooling fins comprise fin rods and a plurality of fins which are vertically and symmetrically arranged, and the lengths of the fins are gradually increased from the end away from the substrate to the end close to the substrate. By arranging the radiator, the heat dissipation efficiency can be effectively improved, rapid heat conduction between the substrate and the circuit board is ensured, the design of the radiating fins is beneficial for airflow to take away heat, the lane controller can stably and efficiently operate for a long time, and the problem of function failure or performance reduction caused by overheating is avoided.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of intelligent transportation, specifically relates to a lane controller containing heat dissipation device. BACKGROUND

[0002] With the rapid development of intelligent transportation system, the use of lane controller is more and more extensive. However, a large amount of heat will be generated in the working process of lane controller, if it cannot be effectively dissipated, not only the working life of the controller will be shortened, but also electrical failure may be caused, affecting the normal operation of the system. The traditional heat dissipation mode depends on air natural convection, and the heat dissipation efficiency is limited, especially when the controller is used in high-density and high-temperature environment, natural cooling is difficult to meet the heat dissipation demand. SUMMARY

[0003] The utility model discloses at least solve one of the prior art technical problems, and for this purpose, the utility model provides a lane controller containing heat dissipation device, including shell and circuit board, the circuit board is arranged in the shell interior, still includes radiator, the shell is equipped with recess, the radiator is installed in the recess, the radiator includes base plate and fin, the base plate is arranged on the circuit board, the fin is arranged on the base plate, the fin is equipped with fin bar and a plurality of fins, a plurality of the fins vertical symmetry is arranged on both sides of the fin bar, and the length of each fin gradually increases from the end far from the base plate to the end close to the base plate.

[0004] According to one embodiment of the utility model, the fin includes top end piece, middle piece and bottom end piece, the top end piece, the middle piece and the bottom end piece are arranged from top to bottom.

[0005] According to one embodiment of the utility model, the top end piece and the bottom end piece are vertically arranged on the fin bar.

[0006] According to one embodiment of the utility model, the middle piece forms an upward 5 ° ~ 45 ° angle with the fin bar in the horizontal direction.

[0007] According to one embodiment of the utility model, the number of middle pieces is four.

[0008] According to one embodiment of the utility model, the recess structure includes top surface, inclined plane and bottom surface, the top surface is arranged on the surface of the shell, the upper edge of the inclined plane is connected with the top surface, the lower edge of the inclined plane is connected with the bottom surface, and the angle between the inclined plane and the bottom surface is 45 °.

[0009] According to one embodiment of the utility model, the setting height of the fin does not exceed the top surface.

[0010] According to one embodiment of the utility model, the fin is arranged in matrix, and the gap between each fin is 3-6mm.

[0011] According to one embodiment of the utility model, the fin is made of aluminum alloy.

[0012] According to one embodiment of the utility model, the gap between the heat sink and the circuit board is filled with heat-conducting silicone grease.

[0013] Compared with the prior art, the utility model has the following beneficial effects:

[0014] The application effectively improves the heat dissipation efficiency by arranging the heat sink with the gradually increasing fin length inside the shell. Specifically, the substrate of the heat sink directly contacts the circuit board, ensuring rapid heat conduction. The fin rod and the multiple vertically symmetrical and gradually increasing length fins of the fin design help the airflow flow between the fins more effectively to carry away heat, thereby keeping the controller at a low temperature during long-time operation, avoiding overheating and resulting in functional failure or performance degradation, and ensuring stable and efficient operation of the lane controller. BRIEF DESCRIPTION OF DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the utility model, the following will briefly introduce the drawings needed to be used in the embodiments. Obviously, the drawings in the following description are only some embodiments of the utility model, and for those skilled in the art, other drawings can also be obtained from these drawings without creative labor.

[0016] Figure 1 It is a schematic diagram of the utility model;

[0017] Figure 2 It is a schematic diagram of the heat dissipation device;

[0018] Figure 3 It is a schematic diagram of the fin;

[0019] Figure 4 It is a schematic diagram of the heat dissipation device and the groove position.

[0020] Reference signs: 1, shell; 11, groove; 111, top surface; 112, inclined surface; 113, bottom surface; 2, circuit board; 3, heat sink; 31, substrate; 32, fin; 321, fin rod; 322, fin; 322-A, top end fin; 322-B, middle fin; 322-C, bottom end fin. DETAILED DESCRIPTION

[0021] With reference to the drawings of the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described, obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0022] In the description of the present application, it should be understood that, in relation to the orientation description, for example, the orientation or position relationship indicated by up, down, front, back, left, right and the like is based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0023] In the description of the present application, unless otherwise explicitly limited, the words such as setting, installing and connecting should be understood broadly, and those skilled in the art can reasonably determine the specific meaning of the above words in the present application in combination with the specific content of the technical solutions.

[0024] In the description of the present application, the reference "one embodiment" or "some embodiments" and the like means that the specific features, structures or characteristics described in combination with the embodiment are included in one or more embodiments of the present application. Therefore, the statements "in one embodiment", "in some embodiments", "in other some embodiments", "in other some embodiments" and the like appearing in different places in the specification are not necessarily all referring to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized. The terms "include", "contain", "have" and their variants mean "include but are not limited to", unless otherwise specifically emphasized.

[0025] Referring to Figure 1 The application provides a lane controller with high heat dissipation performance, which specifically comprises a shell 1 and a circuit board 2, the shell 1 is provided with a groove 11, and a radiator 3 is installed in the groove 11, and the specific structure is as follows:

[0026] The shell 1 adopts a cuboid structure, and the overall design is flat, which meets the compact installation requirements of the lane controller in various scenes. The shell 1 is made of high-strength metal (such as aluminum alloy) or composite material, has strong heat resistance and mechanical strength, and is provided with mounting structures such as threaded holes or slide rail type fixing devices on the side surface, so as to facilitate the installation of the lane controller in a narrow space or on a special support. The shell 1 is provided with an opening on the side surface, which corresponds to the interface position of the circuit board 2, so as to facilitate the connection of an external cable to other equipment. The shell 1 is provided with a groove 11 at the top, which is fixedly connected with the heat sink 3, so as to provide stable support and functional space for the heat dissipation device. The shell 1 is compact in design and firm in structure, which not only saves the occupied space of the equipment, but also ensures the full protection of the internal circuit and improves the contact efficiency of the heat dissipation device and the ambient air.

[0027] The circuit board 2 is arranged in the shell 1 and electrically connected with other components of the controller, and is used for processing signals and data related to lane control. The circuit board 2 is mounted in the shell 1 by screws or buckles, and is fixed in position and in close contact with the base plate 31 of the heat sink 3. The interface part of the circuit board 2 is connected with external equipment through the opening on the side surface of the shell 1, so as to ensure the convenience of signal input and output.

[0028] The groove 11 is located above the shell 1 and provides a separate space for the installation of the heat sink 3. The shape of the groove 11 is square, and the depth is matched with the height of the heat sink 3. The top surface 111 of the groove 11 is flush with the surface of the shell 1, and the overall design is beautiful, so as to ensure that the surface of the controller is smooth without protrusions. The heat sink 3 is embedded in the groove 11 and fixed, and is connected with the shell 1 by screws or buckles, so as to maintain the stability of the overall structure. The design of the groove 11 maintains the overall compactness of the shell 1 while optimizing the layout of the heat sink 3, so that the heat sink 3 can efficiently contact the external airflow and improve the heat dissipation efficiency.

[0029] The heat sink 3 is arranged in the groove 11 and includes a base plate 31 and a fin 32, and is a core heat dissipation component of the whole device. The base plate 31 is made of metal (such as copper or aluminum alloy) with high thermal conductivity and is in direct contact with the circuit board 2, so as to ensure that the heat is quickly transferred to the fin 32 through the filling of thermal conductive silicone grease. The length of the fin 322 gradually increases, which gradually increases from the end far away from the base plate 31 to the end close to the base plate 31, so as to enhance the heat dissipation effect caused by air flow. The base plate 31 of the heat sink 3 is in close contact with the heat dissipation surface of the circuit board 2 through thermal conductive silicone grease. The fin 32 is fixed with the base plate 31, and the top of the fin 32 is flush with the groove 11, so as to prevent the heat sink 3 from protruding out of the shell 1 and affecting the overall installation. Through the direct conduction of the base plate 31 and the efficient convection heat dissipation design of the fin 32, the heat sink 3 can quickly reduce the temperature of the circuit board 2 and prevent heat accumulation. The overall embedded design of the heat sink 3 and the shell 1 improves the heat dissipation performance.

[0030] Referring to Figure 2The heat sink 3 includes a base plate 31 and a fin 32. The base plate 31 is a rectangular flat plate made of high thermal conductivity material (such as copper or aluminum alloy) and is used to directly contact the heat source of the circuit board 2 to transfer heat to the fin 32. The surface of the base plate 31 is smooth and filled with thermal conductive silicone grease to improve the airtightness and thermal conductivity of the contact with the heat source of the circuit board 2. The size of the base plate 31 corresponds to the heat dissipation area of the circuit board 2 to ensure comprehensive heat transfer coverage. The bottom surface 113 of the base plate 31 is in close contact with the heat dissipation part of the circuit board 2 through thermal conductive silicone grease to form an efficient heat conduction path. The top of the base plate 31 is connected to the fin 32 by welding or mechanical fixation to provide stable support for the fin 32. The high thermal conductivity of the base plate 31 can quickly collect and transfer heat to provide sufficient heat source for the fin 32 and avoid damage to components caused by heat accumulation on the circuit board 2.

[0031] Referring to Figure 3 The fin 32 is long and has a tree-shaped structure in cross-section, which is composed of a fin stem 321 and a fin 322. The material of the fin 32 is consistent with that of the base plate 31 (such as aluminum alloy) and has excellent heat conduction performance. The fin stem 321 is perpendicular to the base plate 31 and serves as a support structure for the fin 322. The fin 322 is symmetrically arranged on both sides of the fin stem 321 and is arranged in layers from top to bottom. Each group of fins 322 is symmetrically arranged on both sides of the fin stem 321 and is arranged in layers from top to bottom. Each group of fins 322 is uniformly arranged to form an efficient convection heat dissipation network. The bottom end of the fin stem 321 is fixedly connected to the base plate 31 to ensure that the heat transfer path between the fin stem 321 and the base plate 31 is seamless. The tree-shaped structure design increases the air contact area and optimizes the heat exchange efficiency between the fin 32 and the surrounding air. The length of the fin 322 gradually increases from top to bottom, which allows the heat in different areas to be dispersed in turn and effectively avoids the phenomenon of heat concentration in a certain area. The symmetrically arranged fins 322 form uniform air flow channels, which utilize natural convection and external air flow to help quickly dissipate heat.

[0032] In some embodiments, referring to Figure 3The fin 322 is composed of a top end fin 322-A, a middle fin 322-B, and a bottom end fin 322-C. The three fins 322 are arranged in order from top to bottom, and their shapes, sizes, and angles are optimized to enhance heat dissipation efficiency, as follows: the top end fin 322-A is small in size and is arranged at the top of the fin rod 321, horizontally placed, with limited contact area with the airflow, and is mainly used to guide the initial airflow; the middle fin 322-B is arranged between the top end fin 322-A and the bottom end fin 322-C and is the middle layer for heat dissipation. The number of middle fins 322-B is greater than that of the top end fins 322-A and the bottom end fins 322-C, and each fin forms an upward angle (5°-45°) with the fin rod 321 in the horizontal direction. The inclined angle of the middle fin 322-B not only increases the contact area with the airflow, but also optimizes the airflow path, making it easier for heat to be carried away; the bottom end fin 322-C is arranged at the bottom layer of the heat sink 32 and is perpendicular to the fin rod 321, with a length and area greater than those of the top end fin 322-A and the middle fin 322-B, providing the largest heat dissipation surface area for processing the largest amount of heat. The length of the top end fin 322-A, the middle fin 322-B, and the bottom end fin 322-C increases in order, and the layered design not only avoids the accumulation of heat, but also forms a stable airflow circulation around the heat sink 3, improving the efficiency of natural convection.

[0033] In some embodiments, referring to Figure 4 The groove 11 is provided with a top surface 111, an inclined surface 112, and a bottom surface 113. The top surface 111 is the entrance of the groove 11 and is located on the surface of the shell 1, directly contacting the outside world. The specific structure is as follows: the top surface 111 is designed as a plane and has a rectangular or square structure as a whole. The inclined surface 112 is the connecting transition surface of the groove 11, with an upper edge connected to the top surface 111 and a lower edge connected to the bottom surface 113, and is designed as an inclined surface. The angle between the inclined surface 112 and the bottom surface 113 is 45°, forming a natural flow guiding structure. The inclined design of the inclined surface 112 helps to guide the airflow into the interior of the groove 11 and flow through the heat sink 3, while increasing the depth of the groove 11 to accommodate the complex structure of the heat sink 3. The bottom surface 113 is the bottom layer of the groove 11 and is flat, located on the installation reference surface of the heat sink 3. The top surface 111, the inclined surface 112, and the bottom surface 113 of the groove 11 structure are closely connected to form a complete space, providing a good environment for the installation of the heat sink 3 and the circulation of the airflow; the top surface 111 serves as the opening area of the groove 11, facilitating the installation and maintenance of the heat sink 3; the design of the groove 11 embeds the heat sink 3 inside the shell 1, saving external space, and is particularly suitable for application scenarios with limited installation space.

[0034] In some embodiments, referring to Figure 2The fins 32 are arranged on the substrate 31 in a matrix rule, forming a regular grid structure, and are uniformly distributed in each row and each column with a gap of 3-6 mm. The specific value of the gap is set according to the heat dissipation requirement, material characteristics and airflow channel optimization, which ensures smooth airflow and maximizes the total surface area of the fins 32; there is no direct contact between adjacent fins 32, and the gap forms a stable airflow channel for effective heat dissipation; the matrix arrangement design makes the gap between the fins 32 clearly visible, which facilitates the user to clean the accumulated dust or debris regularly and maintain long-term heat dissipation effect.

[0035] The application effectively improves the heat dissipation performance of the lane controller through the optimized structure of the shell 1, the heat sink 3 and the groove 11. The shell 1 is made of high-strength material and is compact in design, which is convenient to install in a small space and provides reliable protection for the circuit board 2; the structure of the groove 11 stably installs the heat sink 3 and optimizes the airflow flow path; the heat sink 3 includes the substrate 31 and the tree-shaped fins 32, which quickly reduce the equipment temperature through heat conduction and convection heat dissipation; the matrix arrangement and the layered design of the fins 32 increase the heat dissipation area and enhance the natural convection effect, which avoids heat accumulation and prolongs the service life of the equipment. The overall structure of the utility model is simple, beautiful and easy to maintain, which meets the demand of high-performance heat dissipation.

[0036] The above-described embodiments are only used to illustrate the technical solutions of the utility model, rather than limit them; although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement to part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the utility model, and should be included in the protection scope of the utility model.

Claims

1. A lane controller comprising a heat sink, comprising a housing and a circuit board, the circuit board being disposed inside the housing, characterized in that, The heat sink is installed in the recess, and comprises a base plate and a plurality of fins, the base plate is arranged on the circuit board, the plurality of fins are arranged on the base plate, the plurality of fins are vertically symmetrical arranged on both sides of the fin stem, and the length of each fin gradually increases from the end far away from the base plate to the end close to the base plate.

2. The lane controller according to claim 1, wherein the fins comprise top fins, middle fins and bottom fins, and the top fins, the middle fins and the bottom fins are arranged from top to bottom.

3. The lane controller according to claim 2, wherein the top fins and the bottom fins are vertically arranged on the fin stem.

4. The lane controller according to claim 3, wherein the middle fins form an upward angle of 5°-45° with the fin stem in the horizontal direction.

5. The lane controller according to claim 2, wherein the number of the middle fins is four.

6. The lane controller according to claim 1, wherein the recess structure comprises a top surface, an inclined surface and a bottom surface, the top surface is arranged on the surface of the shell, the upper edge of the inclined surface is connected with the top surface, the lower edge of the inclined surface is connected with the bottom surface, and the angle between the inclined surface and the bottom surface is 45°.

7. The lane controller according to claim 6, wherein the arrangement height of the fins does not exceed the top surface.

8. The lane controller according to claim 1, wherein the fins are arranged in a matrix, and the arrangement gap between each fin is 3-6 mm.

9. The lane controller according to claim 1, wherein the fins are made of aluminum alloy.

10. The lane controller according to claim 1, wherein the gap between the heat sink and the circuit board is filled with heat-conducting silicone grease.

Images