Circuit board dispensing and drying device for microelectronic processing

Abstract

The utility model relates to the technical field of microelectronic processing, in particular to a circuit board dispensing and drying device for microelectronic processing, which comprises a bottom plate, a first support plate, a second support plate, a first through groove, a baking lamp, a storage battery, a temperature sensor and a single chip microcomputer. The temperature of the baking lamp is increased, so that the temperature of a cavity formed among a first connecting plate, a first supporting plate and a second supporting plate is increased, and when the temperature is increased to a threshold value of a temperature sensor, the single-chip microcomputer reduces discharge of the storage battery to the baking lamp, so that the temperature in the cavity is stably kept at a proper temperature for drying the circuit board; then the circuit board is placed on the conveying belt and driven by the first motor to enter the cavity, so that drying of the circuit board is achieved, the scheme that the circuit board is dried through the baking lamp can effectively avoid the problem of glue position deviation occurring when an air heater is used for drying, and therefore the drying effect of the device on the circuit board is improved; and the subsequent maintenance cost of the circuit board is reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to the microelectronic processing technical field, concretely is a kind of circuit board dispensing drying device for microelectronic processing. BACKGROUND

[0002] It is known that in microelectronic processing process, circuit board needs to be dispensed to fix components and provide insulation, etc., after dispensing and component installation are finished, circuit board needs to be dried to accelerate the drying of glue and the fixation of components and circuit board, and existing circuit board dispensing drying is mostly by baking lamp drying and hot air drying.

[0003] Through retrieval, the utility model patent with Chinese patent publication No. CN216126018U discloses a circuit board dispensing drying device for microelectronic processing, which comprises a base and two side plates, a conveying assembly is arranged between the lower parts of the two side plates, a top plate and a hot air blower are arranged between the upper parts of the two side plates, the hot air blower is connected with a drying plate through an air inlet pipe and a conveying pipe, a plurality of drying cavities and drying holes are arranged in the drying plate, and a sealing assembly is arranged in the drying cavities, the utility model transports circuit board through the conveying assembly, delivers hot air into the plurality of drying cavities through the hot air blower, the air inlet pipe and the conveying pipe, and discharges the hot air through the drying holes, and the circuit board on the lower conveying belt is dried, the range of hot air output in the drying cavities can be adjusted through the sealing assembly, and the range is adapted to the placement range of the circuit board on the conveying belt, so that the hot air is concentrated on the circuit board for drying.

[0004] Although the above technical solution solves the problem of adjusting the drying range according to the size of the circuit board, in the above technical solution, the glue flowing on the circuit board may deviate from the position during the process of drying the circuit board by the hot air blower, thereby reducing the drying effect of the circuit board, in order to solve the above problem, therefore, a circuit board dispensing drying device for microelectronic processing is needed. UTILITY MODEL CONTENTS

[0005] TECHNICAL PROBLEM SOLVED

[0006] In view of the deficiencies of the prior art, the utility model provides a circuit board dispensing drying device for microelectronic processing to solve the problems in the above background art.

[0007] (II) TECHNICAL SCHEME

[0008] In order to achieve the above object, the utility model provides the following technical scheme: A circuit board point gum drying device for microelectronic processing, including bottom plate, two first support plates which are vertically arranged with the bottom plate, second support plate, two first through slot, a plurality of baking lamps, battery, temperature sensor and singlechip, each first support plate is fixedly arranged on both sides of the bottom plate, the second support plate is fixedly arranged between the first support plate, each first through slot is respectively set up on both sides of the second support plate, each baking lamp is fixedly arranged between the first support plate, the battery is fixedly arranged on the top of the second support plate, the temperature sensor is fixedly arranged on one side of the first support plate, and the singlechip is fixedly arranged on the top of the second support plate.

[0009] Preferably, it further includes a plurality of support blocks, a conveyor belt and a first motor, each support block is fixedly arranged on the top of the bottom plate, the conveyor belt is fixedly arranged between the support blocks, and the first motor is fixedly arranged on the bottom plate, and the output shaft of the first motor is connected to the transmission shaft of the conveyor belt through a key.

[0010] Further, it further includes a support frame and a first through hole, the support frame is fixedly arranged on the top of the bottom plate, and the first through hole is set up on the top of the support frame.

[0011] Still further, it further includes a first screw rod and a second motor, one end of the first screw rod is rotatably arranged on the top of the second support plate, the second motor is fixedly arranged on the top of the second support plate, and the other end of the first screw rod is connected to the output shaft of the second motor through a key.

[0012] Further scheme, it further includes a first connecting plate, a threaded hole and two second connecting plates, the first connecting plate is arranged on the first screw rod through a thread, the threaded hole is set up in the first connecting plate, each second connecting plate is fixedly arranged on both ends of the first connecting plate, and each second connecting plate is slidably arranged in the first through slot.

[0013] On the basis of the foregoing scheme, the temperature sensor is electrically connected with the singlechip, the singlechip is electrically connected with the battery, and the battery is electrically connected with the baking lamp.

[0014] (Three) beneficial effects

[0015] The circuit board point gluing and drying device for microelectronic processing, including bottom plate, two first support plates vertically arranged with the bottom plate, second support plate, two first through grooves, multiple baking lamps, storage battery, temperature sensor and single-chip microcomputer, the baking lamps are fixedly arranged between the first support plates, the storage battery is fixedly arranged on the top of the second support plate, the temperature sensor is fixedly arranged on the side of the first support plate, the single-chip microcomputer is fixedly arranged on the top of the second support plate, the single-chip microcomputer controls the storage battery to discharge the baking lamps, the baking lamps are heated to heat the cavity formed between the first connecting plate, the first support plate and the second support plate, when the temperature sensor reaches the threshold value, the single-chip microcomputer reduces the discharge of the baking lamps by the storage battery, so that the temperature in the cavity is kept stable at the appropriate temperature for drying the circuit board, then the circuit board is placed on the conveyor belt, the circuit board is driven into the cavity by the first motor, so that the drying of the circuit board is realized, the above-mentioned scheme for drying the circuit board by the baking lamps can effectively avoid the position deviation of the glue when using the air heater to dry, thereby improving the drying effect of the device on the circuit board and reducing the subsequent maintenance cost of the circuit board. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 It is a three-dimensional structure schematic view of the utility model;

[0017] Figure 2 It is a connecting structure schematic view of the support frame and the first through hole of the utility model;

[0018] Figure 3 It is a connecting structure schematic view of the temperature sensor and the first support plate of the utility model;

[0019] Figure 4 It is a connecting structure schematic view of the baking lamp and the first support plate of the utility model.

[0020] In the drawing: 1, bottom plate; 2, first support plate; 3, second support plate; 4, first through groove; 5, baking lamp; 6, storage battery; 7, temperature sensor; 8, single-chip microcomputer; 9, support block; 10, conveyor belt; 11, first motor; 12, support frame; 13, first through hole; 14, first screw rod; 15, second motor; 16, first connecting plate; 17, threaded hole; 18, second connecting plate. DETAILED DESCRIPTION

[0021] The technical scheme in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model, apparently, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by the person skilled in the art without creative labor belong to the protection scope of the utility model.

[0022] Reference Figures 1 to 4A circuit board dispensing and drying device for microelectronic processing includes a base plate 1, two first support plates 2 and a second support plate 3 arranged perpendicularly to the base plate 1, and two first through slots 4.

[0023] In the above embodiment, the base plate 1 serves as the supporting foundation of the microelectronics processing circuit board dispensing and drying device. It can be made of manganese steel to provide sufficient support for the microelectronics processing circuit board dispensing and drying device, extend its service life, and reduce subsequent maintenance costs. Two first support plates 2 are welded to both sides of the base plate 1, and a second support plate 3 is welded between the first support plates 2. The first support plates 2 and the second support plates 3 can be made of silicate material and are welded to corresponding parts by argon welding. This can effectively isolate the heat emitted by the baking lamp 5 and prevent the heat from harming the human body. Two first through slots 4 are respectively opened on both sides of the second support plate 3 to restrict the movement direction of subsequent parts.

[0024] It includes nine heat lamps 5, a storage battery 6, a temperature sensor 7, and a microcontroller 8.

[0025] Preferably, all nine heat lamps 5 are installed between the first support plates 2. The heat emitted by the heat lamps 5 dries the glued circuit board, ensuring that the glue on the circuit board is heated evenly without shifting its position, thus improving the drying effect. The battery 6 is attached to the top of the second support plate 3 to provide power for the heat lamps 5. The temperature sensor 7 is fixed to one side of the first support plate 2 with screws to monitor the temperature emitted by the heat lamps 5 in real time. The temperature sensor 7 transmits the information to the microcontroller 8 by setting a threshold. The microcontroller 8 is fixed to the second support plate 2 with screws. At the top of the support plate 3, the microcontroller 8 processes the signal emitted by the temperature sensor 7, and then controls the discharge level of the battery 6 to the heat lamp 5 through the signal. The temperature sensor 7 is electrically connected to the microcontroller 8, the microcontroller 8 is electrically connected to the battery 6, and the battery 6 is electrically connected to the heat lamp 5. By setting the threshold of the temperature sensor 7, the microcontroller 8 controls the battery 6 to discharge to the heat lamp 5. When a certain temperature is reached, the temperature sensor 7 transmits a signal to the microcontroller 8, and the microcontroller 8 controls the battery 6 to reduce the discharge level of the heat lamp 5, so that the heat lamp 5 emits stable heat and ensures that the circuit board is heated evenly.

[0026] First, refer to Figure 2 In this embodiment, it also includes three support blocks 9, a conveyor belt 10, and a first motor 11.

[0027] Three support blocks 9 are welded to the top of the base plate 1 to fix the position of the conveyor belt 10. The conveyor belt 10 is fixed between the support blocks 9 and is used to drive the circuit board into the heat dissipation area of ​​the baking lamp 5 for drying the glue application position. The first motor 11 is fixed to the base plate 1 with screws. The output shaft of the first motor 11 is connected to the drive shaft of the conveyor belt 10 by a key. The first motor 11 drives the conveyor belt 10 to move, thereby realizing the transfer of the circuit board.

[0028] Then, refer to Figure 2 In this embodiment, a support frame 12 and a first through hole 13 are also included.

[0029] The support frame 12 is welded to the top of the base plate 1 to serve as the load-bearing foundation for subsequent parts, and the first through hole 13 is opened on the top of the support frame 12.

[0030] Secondly, see Figure 2 and Figure 3 In this embodiment, it also includes a first screw 14, a second motor 15, a first connecting plate 16, a threaded hole 17, and two second connecting plates 18.

[0031] One end of the first screw 14 is rotatably mounted on the top of the second support plate 3. Rotating the first screw 14 drives the first connecting plate 16, which is threadedly connected to it, to move. The second motor 15 is fixed to the top of the second support plate 3 with screws. The other end of the first screw 14 is keyed to the output shaft of the second motor 15. The first motor 11 serves as the power source. Rotating the output shaft of the first motor 11 drives the first screw 14 to rotate, thereby moving the first connecting plate 16. The first connecting plate 16 is threaded onto the first screw 14, and a threaded hole 17 is formed in the middle of the first connecting plate 16. Rotation of the first screw 14 drives the first connecting plate 16 to move, thus achieving... The two second connecting plates 18 on both sides slide within the first through groove 4, which can be adjusted according to the thickness of the circuit board to reduce internal heat loss and waste of resources, and make full use of the heat emitted by the heat lamp 5. The two second connecting plates 18 are respectively welded to both ends of the first connecting plate 16. Both second connecting plates 18 are made of silicate material and are welded to both ends of the first connecting plate 16 by argon welding, which effectively isolates internal heat and reduces internal heat loss. The two second connecting plates 18 are slidably set in the first through groove 4. The first through groove 4 and the second connecting plates 18 are tightly slidably connected, which can limit the sliding direction of the second connecting plates 18 while reducing internal heat loss.

[0032] Working principle:

[0033] In use, the microelectronics processing circuit board dispensing and drying device is first placed in the desired location. Then, when drying the circuit board after dispensing, the specific operation is as follows: First, the operator turns on the first motor 11 and adjusts it to a suitable speed to drive the conveyor belt 10 to rotate. Then, the operator turns on the second motor 15. The output shaft of the second motor 15 drives the first screw 14 to rotate. The first screw 14 drives the first connecting plate 16 to move, and the movement of the first connecting plate 16 causes the second connecting plate 18 to slide within the first through groove 4. When the second connecting plate 18 reaches the appropriate position, the second motor 15 is turned off. At this time, the temperature sensor 7 has not reached the signal threshold and thus transmits a signal to the microcontroller 8. The microcontroller 8 controls the battery 6 to discharge to the baking lamp 5, and the baking lamp 5 heats up, thereby heating the cavity formed between the first connecting plate 16, the first support plate 2, and the second support plate 3. When the temperature reaches the threshold of the temperature sensor 7, the microcontroller 8 reduces the discharge of the battery 6 to the baking lamp 5, so that the temperature inside the cavity is kept stable at a suitable temperature for drying the circuit board. Then the circuit board is placed on the conveyor belt 10 and driven into the cavity by the first motor 11, thereby achieving the drying of the circuit board.

[0034] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A circuit board dispensing and drying device for microelectronic processing, characterized in that, include: Base plate (1); Two first support plates (2) are arranged perpendicularly to the base plate (1), and each first support plate (2) is fixedly arranged on both sides of the base plate (1); The second support plate (3) is fixedly disposed between the first support plates (2); Two first through slots (4) are respectively opened on both sides of the second support plate (3); Multiple baking lamps (5) are fixedly arranged between the first support plates (2); A storage battery (6) is fixedly mounted on the top of the second support plate (3); Temperature sensor (7), the temperature sensor (7) is fixedly disposed on one side of the first support plate (2); and The microcontroller (8) is fixedly mounted on the top of the second support plate (3).

2. The circuit board dispensing and drying device for microelectronic processing according to claim 1, characterized in that, Also includes: Multiple support blocks (9) are fixedly installed on the top of the base plate (1); A conveyor belt (10) is fixedly disposed between the support blocks (9); as well as The first motor (11) is fixedly mounted on the base plate (1), and the output shaft of the first motor (11) is connected to the drive shaft of the conveyor belt (10) by a key.

3. The circuit board dispensing and drying device for microelectronic processing according to claim 1, characterized in that, Also includes: Support frame (12), the support frame (12) is fixedly installed on the top of the base plate (1); as well as The first through hole (13) is formed on the top of the support frame (12).

4. The dispensing and drying apparatus for circuit boards used in microelectronic processing according to claim 1, characterized in that, Also includes: The first screw (14) has one end rotatably mounted on the top of the second support plate (3); as well as The second motor (15) is fixedly mounted on the top of the second support plate (3), and the other end of the first screw (14) is connected to the output shaft of the second motor (15) by a key.

5. The dispensing and drying apparatus for circuit boards used in microelectronic processing according to claim 4, characterized in that, Also includes: The first connecting plate (16) is threaded onto the first screw (14); A threaded hole (17) is formed in the middle of the first connecting plate (16); and Two second connecting plates (18) are fixedly disposed at both ends of the first connecting plate (16), and each second connecting plate (18) is slidably disposed in the first through groove (4).

6. The circuit board dispensing and drying device for microelectronic processing according to claim 1, characterized in that, The temperature sensor (7) is electrically connected to the microcontroller (8), the microcontroller (8) is electrically connected to the battery (6), and the battery (6) is electrically connected to the baking lamp (5).

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