Thermal column structure
By introducing capillary connectors into the hot column structure, the problem of poor working fluid return caused by poor capillary contact is solved, achieving smooth working fluid return and benign circulation, and ensuring the heat transfer effect of the hot column.
Patent Information
- Application Number
- CN202520055877.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-09
- Publication Date
- 2025-12-23
- Estimated Expiration
- 2035-01-09
AI Technical Summary
Poor capillary contact in traditional heat pipes leads to poor recirculation of the working fluid, affecting heat transfer efficiency.
By introducing capillary connectors into the hot column structure, the contact area between the capillary structure of the base plate and the capillary structure of the column is increased, ensuring smooth return of the working fluid.
The improved working fluid reflux rate prevented the problem of dry burning of the base plate, ensuring the heat transfer effect and stability of the heat column.
Smart Images
Figure CN223714465U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of radiator technology, and in particular to a heat column structure. Background Technology
[0002] As the performance of various communication and industrial electronic products improves, the power of devices is increasing and the heat flux density is also increasing. The overall size of the heat sink should also increase accordingly. However, due to limitations in installation space and weight, the heat dissipation power of conventional heat sinks is difficult to fully adapt to high-power equipment, which affects the working stability of the equipment components.
[0003] A heat column is a two-phase flow heat transfer technology used to solve hotspot problems caused by excessively high local heat flux density. Compared to heat pipes, it has a larger evaporation and condensation area. Traditional heat columns are cylindrical structures with sealed connections at both ends via base plates and cover plates. The internal capillary structure is generally formed by sintering copper powder. However, there is a problem of poor contact between the capillary structure of the base plate and the capillary structure of the column, resulting in poor recirculation of the working fluid and severely affecting the heat transfer and heat dissipation effect of the heat column. Utility Model Content
[0004] While existing heat columns offer excellent axial heat transfer capabilities, they suffer from poor capillary contact and high resistance to working fluid flow. Therefore, the main objective of this invention is to provide a heat column structure that improves the contact area between the capillary structure of the base plate and the capillary structure of the column through capillary connectors, thereby solving the problem of difficult working fluid reflux and ensuring the heat transfer effect of the heat column.
[0005] This utility model provides a hot column structure, including a column, a capillary structure disposed within the column, and a base plate and a cover plate disposed at both ends of the column and sealed to the column. The column contains a working fluid and a capillary connector. The capillary structure of the base plate and the capillary structure within the column are in contact with and connected to the capillary connector. The cover plate has a through hole, and a degassing head is disposed within the through hole.
[0006] In some embodiments, the diameter of the column is 10mm to 100mm, and the wall thickness of the column is 0.3mm to 1mm.
[0007] In some embodiments, the thickness of the capillary structure within the column is 0.4 mm to 2 mm.
[0008] In some embodiments, the base plate, cover plate, and column are assembled by welding.
[0009] In some embodiments, the capillary structure of the base plate may or may not have the same pore size, porosity, permeability, and equivalent thermal conductivity as the capillary connector.
[0010] In some embodiments, the capillary connector is at least one of powder sintered body, fiber sintered body, and copper mesh sintered body.
[0011] In some embodiments, the capillary connector and the capillary structure of the base plate are integrally formed by sintering.
[0012] In some embodiments, the capillary connector includes a first ring, a first end face of which abuts against the capillary structure of the base plate, and a second end face abuts against the capillary structure of the column, wherein the first end face and the second end face are the two ends of the capillary connector.
[0013] In some embodiments, the capillary connector includes a second ring and a third ring disposed within the second ring. A plurality of radially arranged ribs are connected between the third ring and the second ring. The end face of the second ring abuts against the capillary structure of the base plate, and the outer peripheral wall of the second ring abuts against the capillary structure of the column.
[0014] The technical solution provided by this utility model can include the following beneficial effects:
[0015] The present invention provides a hot column structure in which a capillary connector has a capillary structure that is in contact with and connected to the capillary structure of the base plate and the capillary structure of the column. By connecting the capillary structure of the base plate and the capillary structure of the column through the capillary connector, when the working fluid flows to the bottom of the column, the speed at which the working fluid returns to the base plate can be increased through the capillary connector, which can effectively avoid the problem of dry burning of the base plate due to the untimely return of the working fluid. Attached Figure Description
[0016] The above and other objects, features and advantages of this application will become more apparent from the more detailed description of exemplary embodiments thereof in conjunction with the accompanying drawings, wherein the same reference numerals generally represent the same components in the exemplary embodiments thereof.
[0017] Figure 1 This is a schematic diagram of the thermal column structure shown in an embodiment of the present invention;
[0018] Figure 2 This is a schematic diagram of the capillary connector structure shown in an embodiment of the present invention;
[0019] Figure 3 This is another structural schematic diagram of the capillary connector shown in an embodiment of the present invention;
[0020] Figure 4 This is another structural schematic diagram of the capillary connector shown in an embodiment of the present utility model.
[0021] Figure label:
[0022] 1. Column; 2. Base plate; 3. Cover plate; 4. Capillary connector; 41. First ring; 42. Second ring; 43. Third ring; 44. Rib; 5. Degassing head. Detailed Implementation
[0023] Preferred embodiments of the present application will now be described in more detail with reference to the accompanying drawings. While preferred embodiments of the present application are shown in the drawings, it should be understood that the present application may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided to make the present application more thorough and complete, and to fully convey the scope of the present application to those skilled in the art.
[0024] In the description of the application, it should be understood that the terms "one end", "the other end", "outer side", "upper", "inner side", "horizontal", "coaxial", "center", "end", "length", "outer end", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.
[0025] Furthermore, in the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0026] To address the problem of poor contact between the capillary structure and the base plate, this utility model provides a heat column structure that can increase the contact area between the capillary structure of the base plate and the capillary structure of the column through capillary connectors, thereby solving the problem of difficult recirculation of the working fluid and ensuring the heat transfer effect of the heat column.
[0027] The technical solutions of the embodiments of this application are described in detail below with reference to the accompanying drawings.
[0028] like Figures 1 to 2 As shown, the present invention provides a hot column structure, including a column 1, a capillary structure disposed within the column 1, and a base plate 2 and a cover plate 3 disposed at both ends of the column 1 and sealed to the column 1. The column 1 is provided with a working fluid and a capillary connector 4. The capillary structure of the base plate 2 and the capillary structure within the column 1 are both in contact with and connected to the capillary connector 4. The cover plate 3 is provided with a through hole, and a degassing head 5 is provided in the through hole.
[0029] In this embodiment, the column 1 is a hollow tubular structure. The column 1, the base plate 2, and the cover plate 3 define a vacuum-sealed space, which is filled with a working fluid. The working fluid can be pure water or a low-boiling-point solvent. The working fluid absorbs heat and evaporates within the vacuum-sealed space, then condenses and liquefies, flowing back to the base plate 2 through the capillary structure and capillary connector 4 on the column 1. The column 1 is made of pure copper, and its shape can be cylindrical, prismatic, or irregular. In some embodiments, to improve the structural strength of the column 1 and prevent it from collapsing during vacuuming, the column 1 is cylindrical with a diameter of 10mm to 100mm and a wall thickness of 0.3mm to 1mm. In specific implementations, different wall thicknesses can be selected according to the diameter of the column 1 to ensure that the column 1 does not collapse or deform under vacuum. The thickness of the capillary structure in column 1 can be selected according to the diameter of column 1 and the working fluid. In some embodiments, the thickness of the capillary structure in column 1 is 0.4 mm to 2 mm. The size of the base plate 2 is larger than the end face size of column 1. The base plate 2 has a flange for engaging the end of column 1. The capillary structure of the base plate 2 is located inside the flange. The capillary connector 4 is formed by at least one of copper powder sintering, fiber sintering, and copper mesh sintering. The capillary connector 4 has a capillary structure for absorbing the working fluid. The capillary connector 4 is in contact with the capillary structures of the base plate 2 and column 1, respectively. The capillary connector 4, the capillary structure of the base plate 2, and the capillary structure in column 1 are all powder sintered bodies. In specific implementation, the base plate 2 and the capillary structure in column 1 are first sintered using a mold. Then, the mold for sintering the capillary connector 4 is placed on the base plate 2, filled with copper powder, and subjected to high-temperature sintering. In this embodiment, the capillary structure of the sintered base plate 2, the capillary structure within the column 1, and the copper powder of the capillary connector 4 can be the same, different, or any two can be the same, to form the same or different pore sizes, porosity, permeability, and equivalent thermal conductivity. Alternatively, the aforementioned capillary structure or capillary connector 4 can be formed by sintering copper fibers or copper mesh. To ensure the reflow rate of the working fluid, in some embodiments, after the capillary structure of the base plate 2 is sintered, the capillary connector 4 can be directly sintered onto the capillary structure layer of the base plate 2 using a mold.
[0030] The cover plate 3 is embedded in the column 1. The size of the cover plate 3 matches the inner circumferential surface of the column 1. The cover plate 3 can be limited by the capillary structure in the column 1 or by setting a groove in the inner circumferential wall of the column 1, thereby fixing the cover plate 3 in the column 1. The cover plate 3 has a through hole, and a degassing head 5 is provided in the through hole. The degassing head 5 is used to perform vacuum treatment on the sealed space. After the vacuum treatment is completed, the degassing head 5 can be flattened, bent or welded to seal, so as to achieve the sealing treatment of the hot column structure.
[0031] The manufacturing process of the hot column structure is as follows: First, the capillary structure of the base plate 2 is sintered on the base plate 2 using a module. This capillary structure is a planar structure. Then, the mold for sintering the capillary connector 4 is placed on the base plate 2, filled with copper powder, and subjected to high-temperature sintering to achieve the integral molding of the capillary structure of the base plate 2 and the capillary connector 4. The mold for sintering the capillary structure of the column 1 is placed inside the column 1, filled with copper powder, and sintered at high temperature. The mold inside the column 1 is then removed, and the base plate 2 and cover plate 3 are installed inside the column 1. Copper solder paste is applied, and the column is welded together in a furnace. Finally, a certain amount of working fluid is injected into the column 1 through the degassing head 5, and a vacuum treatment is performed through the degassing head 5. The degassing head 5 is then sealed to obtain the hot column structure.
[0032] Compared with the prior art, this embodiment enhances the connection effect between the capillary structure of the base plate 2 and the capillary structure of the column 1 by setting capillary connector 4, improves the reflux speed of the working fluid between the two, and avoids the problem of dry burning of the base plate 2 due to untimely reflux of the working fluid. Under vacuum conditions, the liquid heat transfer working fluid is heated and vaporized rapidly and diffuses. When it cools and condenses into a liquid state, it can quickly flow to the heated surface through the capillary connector 4, thus forming a virtuous cycle. There will be no obstruction that leads to difficulty in reflux, thereby ensuring the normal operation of the hot column.
[0033] Example 2
[0034] like Figure 3 As shown, the difference between Embodiment 2 and Embodiment 1 is that the capillary connector 4 in Embodiment 2 is composed of a second ring 42, a third ring 43, and several radially arranged ribs 44. For details, please refer to... Figure 3 In manufacturing the capillary connector 4 with this structure, a mold with a corresponding structure is placed on the capillary structure layer of the base plate 2, and copper powder is then loaded into the mold. High-temperature sintering is then performed to fuse the capillary structure of the base plate 2 and the capillary connector 4 into a single unit. In Example 2, the outer peripheral wall of the second ring 42 abuts against the inner peripheral wall of the capillary structure of the column 1. Channels for the flow of working fluid are provided between the second ring 42, the third ring 43, and the ribs 44. The heated and vaporized working fluid flows through the capillary connector 4 into the column 1. When the vaporized working fluid condenses and liquefies within the column 1, it can flow back through the capillary structure of the column 1. After the working fluid flows to the area where it intersects with the capillary connector 4 and the capillary structure of the column 1, the capillary connector 4 absorbs the working fluid from the capillary structure of the column 1 to promote the flow of the working fluid in the base plate 2, ensuring that the capillary structure of the base plate 2 has sufficient working fluid for heat absorption and vaporization, thus preventing the base plate 2 from dry-burning. The other structures and working principles of this embodiment 2 are the same as those of embodiment 1, and will not be repeated here.
[0035] Example 3
[0036] The difference between Embodiment 3 and Embodiments 1 and 2 is that the capillary connector 4 in Embodiment 3 is composed of a first ring 41, a second ring 42, a third ring 43, and several radially arranged ribs 44. That is, the capillary connector 4 in Embodiment 3 is a combination of the capillary connector 4 in Embodiment 1 and the capillary connector 4 in Embodiment 2. For details, please refer to... Figure 4 In Embodiment 3, the capillary connector 4 can simultaneously contact and connect with both the end face and the inner peripheral wall of the capillary structure of the column 1. With this configuration, the hot column structure of Embodiment 3 can simultaneously possess the advantages of Embodiments 1 and 2, further improving the reflux efficiency of the working fluid. The other structures and working principles of Embodiment 3 are the same as those of Embodiment 1, and will not be repeated here.
[0037] The various embodiments of this application have been described above. These descriptions are exemplary and not exhaustive, nor are they limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is chosen to best explain the principles, practical application, or improvement of the technology in the market, or to enable others skilled in the art to understand the embodiments disclosed herein.
Claims
1. A thermal column structure, characterized in that, The device includes a column, a capillary structure disposed within the column, and a base plate and a cover plate disposed at both ends of the column and sealed to the column. The column contains a working fluid and a capillary connector. The capillary structure of the base plate and the capillary structure within the column are in contact with the capillary connector. The cover plate has a through hole, and a degassing head is disposed within the through hole.
2. The thermal column structure according to claim 1, characterized in that, The diameter of the column is 10mm to 100mm, and the wall thickness of the column is 0.3mm to 1mm.
3. The thermal column structure according to claim 1, characterized in that, The thickness of the capillary structure within the column is 0.4 mm to 2 mm.
4. The thermal column structure according to claim 1, characterized in that, The base plate, cover plate, and column are assembled by welding.
5. The thermal column structure according to claim 1, characterized in that, The capillary structure of the base plate may or may not have the same pore size, porosity, permeability, and equivalent thermal conductivity as the capillary connector.
6. The thermal column structure according to claim 1, characterized in that, The capillary connector is at least one of powder sintered body, fiber sintered body, and copper mesh sintered body.
7. The thermal column structure according to claim 6, characterized in that, The capillary connector and the capillary structure of the base plate are integrally formed by sintering.
8. The thermal column structure according to claim 7, characterized in that, The capillary connector includes a first ring, the first end face of which abuts against the capillary structure of the base plate, and the second end face abuts against the capillary structure of the column, the first end face and the second end face being the two ends of the capillary connector.
9. The thermal column structure according to claim 7, characterized in that, The capillary connector includes a second ring and a third ring disposed within the second ring. A plurality of radially arranged ribs are connected between the third ring and the second ring. The end face of the second ring abuts against the capillary structure of the base plate, and the outer peripheral wall of the second ring abuts against the capillary structure of the column.