Jade article and gem gold and silver staggered ornament structure

By utilizing the structure of seed layer, conductive layer and electroforming layer, laser engraving and electroplating processes are employed to achieve efficient and safe production of jade, gemstone and gold and silver inlaid jewelry. This solves the problems of high skill requirements and health risks associated with the process, and achieves efficient and safe gold and silver inlay effects.

CN223778106UActive Publication Date: 2026-01-09BEIJING JINBAIDAI TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202422975877.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-04
Publication Date
2026-01-09
Estimated Expiration
2034-12-04

AI Technical Summary

Technical Problem

Existing jade and gemstone gold and silver inlay techniques require high levels of skill from workers, have long construction cycles, and traditional gilding methods pose health risks and material damage problems.

Method used

It adopts a structure of seed layer, conductive layer and electroforming layer, and achieves gold and silver inlay by laser engraving grooves and depositing metal or alloy particles, combined with electroplating and electroforming processes, reducing the skill requirements and improving efficiency.

Benefits of technology

The process reduces the skill requirements for technicians, shortens the construction cycle, lowers labor costs, and reduces health risks and material damage, achieving a perfect gold and silver inlay effect for complex and intricate patterns.

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Abstract

The utility model discloses a structure of a jade article and gem gold and silver staggered ornament. The structure comprises a seed layer, a conductive layer and an electroforming layer, compared with a traditional gold and silver staggered ornament adopting a jade article and gem surface inlaying method or a gold coating method, the structure of the gold and silver staggered ornament provided by the utility model has the advantages that the skill requirements on technicians are reduced, the construction period is shortened, and the use cost of manpower is greatly reduced; a perfect gold and silver staggering effect can be easily realized even through more complex and fine patterns are formed; risks caused by misoperation of workers in the construction process are greatly reduced, reworking can be conducted easily even if mistakes occur, and re-carving is not needed.
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Description

Technical Field

[0001] This utility model belongs to the field of jewelry technology, specifically the structure of jade, gemstone and gold and silver inlaid ornaments. Background Technology

[0002] Gold and silver inlay is a traditional Chinese decorative technique for metalware, first appearing on bronze artifacts from the Shang and Zhou dynasties. The process involves first drawing the desired pattern on the bronze surface, then chiseling dovetail grooves according to the pattern. Gold or silver is then drawn into fine wires or hammered into thin sheets and embedded into the grooves. Finally, it is hammered in place, polished, and the surface is smoothed. The gold and silver patterns create a striking contrast with the bronze body, enhancing the bronzeware's elegance and brilliance.

[0003] During the Han Dynasty, another technique for inlaying gold and silver onto bronze vessels emerged—the gilding method, also known as the plating method. This involved dissolving gold and silver in mercury to create gold or silver paste, which was then applied to grooves chiseled into the surface of the bronze vessel. The mercury was then evaporated by heating over charcoal, and finally, the surface was polished smooth. Compared to the inlay method used during the Shang and Zhou dynasties, the gilding method significantly improved efficiency and allowed for the creation of more complex and intricate patterns.

[0004] The gold and silver inlay technique for jade and gemstone ornaments was extremely popular during the Qianlong period of the Qing Dynasty. The materials used included Hetian jade, jadeite and other jade stones, agate and other gemstones. These materials are much harder than bronze, which makes the gold and silver inlay technique more demanding. The lines of the patterns must be smooth and the grooves of the carving must be of uniform thickness. Otherwise, it is difficult to embed the gold and silver wires, and even if they are embedded, the bonding force will not be strong, making the construction extremely difficult.

[0005] Currently, the gold and silver inlay technique for jade and gemstones still uses traditional inlay or gilding methods, but the tools and equipment used have been greatly improved. Laser engraving has replaced traditional hand carving, allowing for more complex, intricate, and uniform inlay grooves. Under a microscope, the fine patterns made the jade details more vivid and perfect. However, these delicate operations demand extremely high skill from the craftsmen. Often, a single piece may require an experienced craftsman to spend weeks or even months on it, especially for thin-walled jade and gemstone jewelry where gold and silver inlay is even more difficult. A mistake during the process can ruin the entire piece. While gilding reduces the difficulty of the process, it also has significant drawbacks. The gilding process uses mercury, and long-term exposure to mercury can seriously harm the health of the workers. There is also a risk of mercury residue remaining on the surface of the jade and gemstones, affecting the wearer's health. Furthermore, the temperature required to remove the mercury is close to 400℃, which can cause significant damage to the jade and gemstone materials. Utility Model Content

[0006] To address the problems mentioned in the background art, this utility model provides the following technical solution: a structure for jade, gemstone, and gold and silver inlaid ornaments, comprising a seed layer, a conductive layer, and an electroforming layer.

[0007] Preferably, the seed layer is made of one of the metal or alloy particles such as silver, palladium, gold, or titanium, and is evenly covered in the grooves and surrounding areas of the jade or gemstone that have been pre-cut.

[0008] Preferably, the metal or alloy particles such as silver, palladium, gold, and titanium selected for the seed layer can be obtained through non-metallic chemical plating, vacuum ion plating, or magnetron sputtering.

[0009] Preferably, the conductive layer can be one or a combination of two metal layers selected from copper, nickel, silver or gold. When gold is inlaid, the conductive layer is preferably a pure gold layer, and when silver is inlaid, the conductive layer is preferably a pure silver layer. The thickness of the gold or silver conductive layer is not less than 0.1 micrometers.

[0010] Preferably, the pure gold conductive layer and the pure silver conductive layer can be achieved by electroplating, vacuum ion plating or magnetron sputtering.

[0011] Preferably, when gold is inlaid, the electroformed layer is formed by electroforming in a pure gold plating bath, and when silver is inlaid, the electroformed layer is formed by electroforming in a pure silver plating bath. The Vickers hardness of the electroformed gold or silver layer does not exceed 130 HV.

[0012] Preferably, the thickness of the electroplated gold or silver layer should exceed the maximum depth of the inlaid gold and silver grooves. Electroplated gold and silver layers that exceed the height of the jade or gemstone surface should be filed or ground flat using a high-hardness carbon steel file.

[0013] Compared with the prior art, the beneficial effects of this utility model are:

[0014] This invention provides a structure for jade and gemstone inlaid gold and silver ornaments. Compared with traditional jade and gemstone surface inlay and gilding methods for inlaid gold and silver ornaments, the gold and silver inlaid ornaments provided by this invention reduce the skill requirements of technicians, shorten the construction cycle, and greatly reduce labor costs; even more complex and intricate patterns can easily achieve a perfect gold and silver inlay effect; it greatly reduces the risk of worker errors during construction, and even if mistakes occur, rework can be easily carried out without the need for recarving. Attached Figure Description

[0015] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:

[0016] Figure 1 This is a cross-sectional view of Hetian black jade inlaid with gold.

[0017] Figure 2 This is a cross-sectional view of black jade inlaid with silver.

[0018] Figure 3 These are renderings of Hetian jade black jade "No Worries" pendants inlaid with gold and black jadeite "No Worries" pendants inlaid with silver.

[0019] Figure 4 This is a rendering of the effect after laser engraving grooves on jade.

[0020] Among them, 31 is the palladium seed layer; 32 is the nickel-gold combined conductive layer; 33 is the gold electroforming layer; and 34 is the Hetian jade black jade "no worries" plaque.

[0021] 41. Silver seed layer; 42. Silver conductive layer; 43. Silver electroforming layer; 44. Black jade pendant. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.

[0023] Depend on Figure 1-4 The present invention discloses a structure for jade, gemstone and gold and silver inlaid ornaments, including a seed layer, a conductive layer and an electroforming layer.

[0024] Example 1:

[0025] In this embodiment, a Hetian jade pendant with a black background is used for gold inlay. The pattern is a galloping horse. Grooves are carved using laser engraving, with a depth of approximately 200 micrometers. A uniform 31 palladium seed layer is deposited in and around the grooves of the galloping horse using a non-metallic chemical plating process. The 32 conductive layer in this embodiment uses a combination of nickel and gold plating. First, the 34 Hetian jade pendant with the 31 palladium seed layer is immediately immersed in a nickel plating solution to deposit a nickel conductive layer approximately 1 micrometer thick. Then, a pure gold conductive layer of at least 0.1 micrometers is deposited in an acid gold plating solution. Finally, a 33 pure gold electroforming layer of at least 220 micrometers thick is electroformed in a cyanide-free electroforming gold solution. Excess gold layer exceeding the 34 Hetian jade surface is manually filed down with a high-hardness carbon steel file, and the finished product is obtained after polishing. The average Vickers hardness of the 33 pure gold electroforming layer is tested to be 102 HV.

[0026] Example 2:

[0027] In this embodiment, a black jade pendant with a galloping horse design was selected for the silver inlay process. Grooves were laser-engraved to a depth of approximately 220 micrometers. A uniform 41 silver seed layer was deposited within and around the grooves of the galloping horse using a non-metallic chemical plating process. The 44 black jade pendant with the deposited silver seed layer was immediately immersed in a chemical silver plating solution to deposit a 42 silver conductive layer approximately 2 micrometers thick. Then, a 43 pure silver electroforming layer with a thickness of at least 250 micrometers was electroformed in a cyanide-free electroforming silver bath. Excess silver layer exceeding the surface of the 44 black jade pendant was manually filed down with a high-hardness carbon steel file, and the finished product was obtained after polishing. The average Vickers hardness of the 43 pure silver electroforming layer was tested to be 85 HV.

[0028] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0029] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A structure for jade, gemstone, and gold / silver inlaid ornaments, characterized in that: Includes seed layer, conductive layer, and electroformed layer; The seed layer can be made of silver, palladium, gold, titanium metal or alloy particles, and can be achieved by non-metallic chemical plating, vacuum ion plating or magnetron sputtering. The conductive layer can be selected from one or a combination of two metal conductive layers, namely copper, nickel, silver, and gold. The conductive layer can be achieved by electroplating, vacuum ion plating, or magnetron sputtering. The thickness of the electroformed layer should exceed the maximum depth of the gold and silver inlay grooves. It should be filed or ground smooth with a steel file. When inlaying gold, the electroformed layer is electroformed in a pure gold plating bath, and when inlaying silver, the electroformed layer is electroformed in a pure silver plating bath.

2. The structure of a jade, gemstone, and gold / silver inlaid ornament according to claim 1, characterized in that: When gold is inlaid, the conductive layer is preferably a pure gold layer; when silver is inlaid, the conductive layer is preferably a pure silver layer. The thickness of the gold or silver conductive layer is not less than 0.1 micrometers.