Liquid flow type heat dissipation device

Abstract

The utility model discloses a liquid flow type heat dissipation device which is used for dissipating heat of a heat source. The liquid flow type heat dissipation device comprises a pump body and a water cooling head. The pump body comprises a pump shell and an impeller, the pump shell is provided with a liquid flow chamber, and the impeller is rotatably located in the liquid flow chamber. The water cooling head is arranged on the pump shell and is provided with a heat exchange cavity and a heat contact surface. The heat exchange chamber is in communication with the liquid flow chamber of the pump housing, and the thermal contact surface faces away from the heat exchange chamber. Wherein the axis of the impeller is perpendicular to the normal of the thermal contact surface. Wherein the water cooling head comprises a plurality of heat dissipation fins, and the heat dissipation fins are located in the heat exchange cavity. The radiating fins comprise a plurality of dense radiating fins and a plurality of sparse radiating fins, the dense radiating fins are adjacent to each other and arranged side by side, the sparse radiating fins are adjacent to each other and arranged side by side, the dense radiating fins are located on one side of the sparse radiating fins, and the interval between any two adjacent dense radiating fins is smaller than that between any two adjacent sparse radiating fins.

Description

Technical Field

[0001] This utility model relates to a heat dissipation device, and more particularly to a liquid flow heat dissipation device. Background Technology

[0002] When a computer is operating, internal heat sources, such as the central processing unit (CPU), generate heat due to high-speed computation. Therefore, computers must be equipped with cooling systems to quickly and effectively remove the heat generated by these heat sources and maintain their temperature within the manufacturer's specified design range. Cooling systems are generally divided into air cooling and liquid cooling. Air cooling systems involve installing heat sinks on the heat source and a fan in the computer to dissipate heat through airflow. However, because fans generate noise and are difficult to use for high-heat-generating components, such as the processor in gaming computers, liquid cooling is now commonly used in gaming computers. Liquid cooling systems consist of a water block and a radiator. The water block is in hot contact with the heat source and is connected to the radiator via tubing. A pump installed on the water block drives the coolant, which absorbs heat, from the water block to the radiator, where it is cooled before returning to the water block.

[0003] However, in existing liquid cooling devices, since the pump impeller is horizontally positioned relative to the water cooling head, the flow channel connecting the pump chamber and the water cooling head chamber needs to have multiple bends to guide the coolant from the pump chamber to the water cooling head chamber. This results in a significant pressure loss when the coolant flows through, which in turn affects the heat dissipation efficiency of the heat source. Utility Model Content

[0004] The present invention provides a liquid flow cooling device to solve the problem in the prior art where the flow channel connecting the pump chamber and the water cooling head chamber has multiple bends, resulting in a large pressure loss when the coolant flows through, thus affecting the heat dissipation efficiency.

[0005] An embodiment of this invention discloses a liquid flow cooling device for dissipating heat from a heat source. The liquid flow cooling device includes a pump body and a water-cooling head. The pump body includes a pump housing and an impeller. The pump housing has a liquid flow chamber, and the impeller is rotatably located within the liquid flow chamber. The water-cooling head is mounted on the pump housing and has a heat exchange chamber and a heat contact surface. The heat exchange chamber is connected to the liquid flow chamber of the pump housing, and the heat contact surface faces away from the heat exchange chamber. The axis of the impeller is perpendicular to the normal to the heat contact surface. The water-cooling head includes multiple heat dissipation fins located within the heat exchange chamber. These heat dissipation fins include multiple dense heat dissipation fins and multiple sparse heat dissipation fins, with the dense heat dissipation fins located on one side of the sparse heat dissipation fins. These dense heat dissipation fins are arranged side by side adjacent to each other, and these sparse heat dissipation fins are arranged side by side adjacent to each other, and the interval between any two adjacent dense heat dissipation fins is smaller than the interval between any two adjacent sparse heat dissipation fins.

[0006] Another embodiment of this invention discloses a liquid flow cooling device for dissipating heat from a heat source. The liquid flow cooling device includes a pump body and a water-cooling head. The pump body includes a pump housing and an impeller. The pump housing has a liquid flow chamber, and the impeller is rotatably located within the liquid flow chamber. The water-cooling head is mounted on the pump housing and has a heat exchange chamber and a thermal contact surface. The heat exchange chamber is connected to the liquid flow chamber of the pump housing, and the thermal contact surface faces away from the heat exchange chamber. The axis of the impeller is perpendicular to the normal to the thermal contact surface. The water-cooling head includes a heat-conducting element and a cover, the cover being integrated with the heat-conducting element and surrounding the heat exchange chamber. The thermal contact surface is located on the side of the heat-conducting element away from the cover. The cover has an inflow communication structure connecting the heat exchange chamber and the liquid flow chamber, and the inflow communication structure is an array-type porous structure.

[0007] In the aforementioned liquid flow cooling device, the pump housing includes a first housing and a second housing. The first housing includes a base and a vertical portion. The vertical portion protrudes from the base, and the second housing and the vertical portion of the first housing are combined to surround the liquid flow chamber.

[0008] In the aforementioned liquid flow cooling device, the pump housing further includes an impeller cover, which is located in the liquid flow chamber and divides the liquid flow chamber into an inlet chamber and a drive chamber that are connected to each other, and the impeller is rotatably located in the drive chamber.

[0009] In the aforementioned liquid flow cooling device, the impeller cover has a plurality of connecting holes, and these connecting holes connect the inlet chamber and the drive chamber.

[0010] In the aforementioned liquid flow cooling device, the first housing has a connecting channel that extends from the base to the upright portion, and the opposite ends of the connecting channel are respectively connected to the drive chamber and the heat exchange chamber.

[0011] In the aforementioned liquid flow cooling device, the pump housing further includes a vortex structure, which is disposed on the vertical part and located in the drive chamber. The vortex structure surrounds a vortex channel, the impeller is located at the center of the vortex channel, and an outlet of the vortex channel is connected to the channel.

[0012] In the aforementioned liquid flow cooling device, the pump housing further includes a vortex structure, which is disposed on the impeller cover and located in the drive chamber. The vortex structure surrounds a vortex channel, the impeller is located at the center of the vortex channel, and an outlet of the vortex channel is connected to the channel.

[0013] In the aforementioned liquid flow cooling device, the pump housing further includes an outlet chamber, and the water cooling head further includes a heat-conducting element and a cover. The cover is combined with the heat-conducting element to surround the heat exchange chamber. The thermal contact surface is located on the side of the heat-conducting element away from the cover. The cover has an inflow communication structure and an outflow communication structure. The inflow communication structure connects the heat exchange chamber and the liquid flow chamber, and the outflow communication structure connects the heat exchange chamber and the outflow chamber.

[0014] In the aforementioned liquid flow cooling device, the inflow connection structure is either a single-hole structure or an array of multi-hole structures.

[0015] In the aforementioned liquid flow cooling device, the pump housing further has an outlet chamber, the cover further has an outlet communication structure, and the outlet communication structure connects the heat exchange chamber and the outlet chamber.

[0016] In the aforementioned liquid flow cooling device, the water cooling head further includes multiple heat dissipation fins, which are disposed on the heat-conducting element and located in the heat exchange chamber.

[0017] In the aforementioned liquid flow cooling device, the water cooling head further includes a flow baffle, which is located in the heat exchange chamber and sandwiched between the heat dissipation fins and the cover. The flow baffle has an opening that corresponds to the inflow communication structure of the cover, and the opening exposes part of the heat dissipation fins.

[0018] The aforementioned liquid flow cooling device further includes an inlet connector and an outlet connector. The pump housing includes a first housing, a second housing, and an impeller cover. The first housing includes a base and an upright portion, with the upright portion protruding from the base. The second housing and the upright portion of the first housing are combined to surround the liquid flow chamber. The impeller cover is located in the liquid flow chamber and divides the liquid flow chamber into a connected inlet chamber and a drive chamber. The impeller is rotatably located in the drive chamber. The inlet connector and the outlet connector are located on adjacent sides of the pump body, with the inlet connector connected to the inlet chamber and the outlet connector connected to the outlet chamber.

[0019] In the aforementioned liquid flow cooling device, the liquid inlet connector is disposed on the second housing or the vertical portion of the first housing of the pump housing.

[0020] According to the liquid flow cooling device disclosed in the above embodiments, by arranging the impeller vertically relative to the water cooling head, the axis of the impeller is perpendicular to the normal of the heat contact surface of the water cooling head. Therefore, when the impeller rotates, it drives the coolant to flow around the impeller's axis. Furthermore, the coolant can directly enter the heat exchange chamber of the water cooling head along the tangential direction at the outlet of the liquid flow chamber. Thus, the coolant does not need to undergo multiple turns during its flow from the liquid flow chamber to the heat exchange chamber, thereby avoiding pressure loss caused by curved flow channels, maintaining the coolant flow rate, and ensuring the heat dissipation efficiency of the liquid flow cooling device.

[0021] In some embodiments, by configuring heat dissipation fins with different densities on different areas of the corresponding thermal contact surface, a single thermal contact surface can have multiple heat transfer surface features, which can be used to improve the heat dissipation problem of local hot spots and at the same time reduce the flow resistance caused by the heat transfer surface features.

[0022] In some embodiments, by configuring the inflow connection structure of the cover as an array of porous structures, the uniform distribution of coolant can be improved, the generation of local high-temperature hot spots can be reduced, and the flow pattern of coolant can also be improved to increase the heat transfer area and reduce the noise when coolant enters the narrow opening.

[0023] The above description of the present utility model and the following description of the embodiments are used to demonstrate and explain the principle of the present utility model, and to provide a further explanation of the scope of the patent application of the present utility model. Attached Figure Description

[0024] Figure 1 This is a perspective view of the liquid flow cooling device and frame according to the first embodiment of the present invention.

[0025] Figure 2 for Figure 1An exploded view of the pump body, inlet connector, and outlet connector of the liquid flow cooling device.

[0026] Figure 3 for Figure 1 An exploded view of the water cooling head of a liquid flow cooling device.

[0027] Figure 4 for Figure 3 A top view of the cooling fins of a water block.

[0028] Figure 5 for Figure 1 A cross-sectional schematic diagram of a liquid flow cooling device.

[0029] Figure 6 for Figure 1 Another cross-sectional schematic diagram of the liquid flow cooling device.

[0030] Figure 7 This is a perspective view of the liquid flow cooling device and frame according to the second embodiment of the present invention.

[0031] Figure 8 for Figure 7 An exploded view of the pump body, inlet connector, and outlet connector of the liquid flow cooling device.

[0032] Figure 9 for Figure 7 An exploded view of the water cooling head of a liquid flow cooling device.

[0033] Figure 10 for Figure 7 A cross-sectional schematic diagram of a liquid flow cooling device.

[0034] Figure 11 for Figure 7 Another cross-sectional schematic diagram of the liquid flow cooling device.

[0035] In the attached figures, the following labels are used:

[0036] 1,2: Liquid flow cooling device

[0037] 10,20: Pump body

[0038] 12,22: Liquid inlet connector

[0039] 14,24: Liquid outlet connector

[0040] 16,26: Water cooling block

[0041] 100, 200: Pump housing

[0042] 102,202: First shell

[0043] 104,204: Second shell

[0044] 106,206: Impeller Cover

[0045] 108, 208: Spool structure

[0046] 109, 209: Impeller

[0047] 160, 260: Thermal conductive components

[0048] 162,262: Cover

[0049] 164,264: Heatsink fins

[0050] 164D: Dense heat dissipation fins

[0051] 164T: Spacious heat dissipation fins

[0052] 166,266: Baffles

[0053] B1, B2: Base

[0054] C1, C2: Fluid flow chambers

[0055] DF1, DF2: Drive chambers

[0056] F1, F2: Frame

[0057] G1, G2: Heat exchange chambers

[0058] H1, H2: Connecting holes

[0059] IF1, IF2: Inflow chambers

[0060] J1, J2: Outflow connection structure

[0061] L1, L2: Axis

[0062] M1, M2: Inflow-connected structures

[0063] N1, N2: Normal lines

[0064] OF1, OF2: Outflow chambers

[0065] P1, P2: Connecting channels

[0066] R1, R2: Openings

[0067] S1, S2: Thermal contact surfaces

[0068] U1, U2: Erect parts

[0069] V1, V2: Export Detailed Implementation

[0070] The following detailed description of the embodiments of this invention outlines its features and advantages, sufficient to enable anyone skilled in the art to understand and implement the technical content of these embodiments. Furthermore, based on the disclosure, claims, and drawings herein, anyone skilled in the art can easily understand the related objectives and advantages of this invention. The following embodiments further illustrate the principles of this invention but are not intended to limit its scope in any way.

[0071] <First Embodiment>

[0072] Please see Figures 1 to 3 ,in Figure 1 This is a perspective view of the liquid flow cooling device and frame according to the first embodiment of the present invention. Figure 2 for Figure 1 An exploded view of the pump body, inlet connector, and outlet connector of the liquid flow cooling device. Figure 3 for Figure 1 An exploded view of the water cooling head of a liquid flow cooling device.

[0073] The liquid flow cooling device 1 of this embodiment is used to dissipate heat from a heat source (not shown). The liquid flow cooling device 1 includes a pump body 10, a liquid inlet connector 12, a liquid outlet connector 14, and a water cooling head 16. The pump body 10 is, for example, locked to a frame F1 and fixed to a motherboard (not shown) by the frame F1.

[0074] The pump body 10 includes a pump housing 100 and an impeller 109. The pump housing 100 has a liquid flow chamber C1 and an outlet chamber OF1, and the impeller 109 is rotatably located in the liquid flow chamber C1.

[0075] In detail, the pump housing 100 includes a first housing 102, a second housing 104, an impeller cover 106, and a vortex structure 108. The first housing 102 includes a base B1 and an upright portion U1, with the upright portion U1 protruding from the base B1. The second housing 104 and the upright portion U1 of the first housing 102 are combined to surround the liquid flow chamber C1. The impeller cover 106 is located in the liquid flow chamber C1 and divides the liquid flow chamber C1 into an inlet chamber IF1 and a drive chamber DF1. In addition, the impeller cover 106 has a plurality of connecting holes H1, which connect the inlet chamber IF1 and the drive chamber DF1, thereby allowing coolant to enter the drive chamber DF1 from the inlet chamber IF1. The impeller 109 is rotatably located in the drive chamber DF1.

[0076] The inlet connector 12 and the outlet connector 14 are located on adjacent sides of the pump body 10, respectively. The inlet connector 12 is connected to the inlet chamber IF1 in the liquid flow chamber C1, and the outlet connector 14 is connected to the outlet chamber OF1 of the pump housing 100. The inlet connector 12 is used to guide coolant from the outside into the inlet chamber IF1, and the outlet connector 14 is used to discharge coolant from the outlet chamber OF1. In the first embodiment, the inlet connector 12 is a second housing 104 disposed on the pump housing 100.

[0077] A water-cooled head 16 is mounted on the base B1 of the first housing 102 of the pump housing 100, and the water-cooled head 16 has a heat exchange chamber G1 and a heat contact surface S1. The heat exchange chamber G1 is connected to the liquid flow chamber C1 of the pump housing 100, and the heat contact surface S1 faces away from the heat exchange chamber G1. The first housing 102 of the pump housing 100 has a connecting channel P1 extending from the base B1 to the upright portion U1, and the opposite ends of the connecting channel P1 are respectively connected to the liquid flow chamber C1 and the heat exchange chamber G1.

[0078] Specifically, the water-cooling head 16 includes a heat-conducting element 160, a cover 162, multiple heat dissipation fins 164, and a flow-blocking element 166. The cover 162 is integrated with the heat-conducting element 160 to surround the heat exchange chamber G1. Furthermore, the thermal contact surface S1 is located on the side of the heat-conducting element 160 away from the cover 162. The cover 162 has an inflow connection structure M1 and an outflow connection structure J1. The inflow connection structure M1 connects the heat exchange chamber G1 to the driving chamber DF1 in the liquid flow chamber C1 of the pump housing 100, and the outflow connection structure J1 connects the heat exchange chamber G1 to the outflow chamber OF1 of the pump housing 100. The inflow connection structure M1 connects to the driving chamber DF1 through a connecting channel P1. In the first embodiment, the inflow connection structure M1 of the cover 162 is a single-opening structure, and the outflow connection structure J1 is also a single-opening structure, but this invention is not limited to this. For example, in some implementations, the inflow connection structure can be an array-type porous structure.

[0079] Please refer to the above as well. Figure 3 and Figure 4 ,in Figure 4 for Figure 3This is a top view schematic diagram of the heat dissipation fins of a water-cooled head. These heat dissipation fins 164 are disposed on the heat-conducting element 160 and located in the heat exchange chamber G1. In the first embodiment, these heat dissipation fins 164 include a plurality of dense heat dissipation fins 164D and a plurality of sparse heat dissipation fins 164T, with the dense heat dissipation fins 164D located on one side of the sparse heat dissipation fins 164T. The dense heat dissipation fins 164D are arranged adjacent to each other side-by-side, and the sparse heat dissipation fins 164T are arranged adjacent to each other side-by-side, with the spacing between any two adjacent dense heat dissipation fins 164D being smaller than the spacing between any two adjacent sparse heat dissipation fins 164T. Thus, by configuring heat dissipation fins of different densities on different regions of the corresponding thermal contact surface, a single thermal contact surface can have multiple heat transfer surface features, which can improve the heat dissipation problem of local hot spots and simultaneously reduce the flow resistance caused by the heat transfer surface features. For example, if the location of localized high-temperature hotspots and the corresponding thermal contact area are known, a denser distribution of heat dissipation fins can be designed in that area, while a sparser distribution can be configured in other locations. In this embodiment, the thickness of these heat dissipation fins 164 is, for example, the same. However, this invention is not limited to this. In other embodiments, the heat dissipation fins of the water block may have the same and consistent fin spacing. Furthermore, in some embodiments, the thickness of these heat dissipation fins may differ from one another.

[0080] The flow deflector 166 is located in the heat exchange chamber G1 and sandwiched between the heat dissipation fins 164 and the cover 162. The flow deflector 166 has an opening R1, which corresponds to the inflow communication structure M1 of the cover 162, and the opening R1 exposes part of the heat dissipation fins 164.

[0081] Please refer to Figure 5 and Figure 6 ,in Figure 5 for Figure 1 A cross-sectional schematic diagram of a liquid flow cooling device, and Figure 6 for Figure 1 Another cross-sectional schematic diagram of the liquid flow cooling device.

[0082] The volute structure 108 of the pump housing 100 is located in the drive chamber DF1 and surrounds a volute channel, with one outlet V1 of the volute channel communicating with the connecting channel P1. The impeller 109 is located at the center of the volute channel, and the axis L1 of the impeller 109 is perpendicular to the normal N1 of the thermal contact surface S1 of the water-cooling head 16. In the first embodiment, the volute structure 108 is disposed on the vertical portion U1 of the first housing 102, but this invention is not limited thereto. In other embodiments, the volute structure may be disposed on the impeller cover.

[0083] By arranging the impeller 109 perpendicular to the water-cooling head 16, with its axis L1 perpendicular to the normal N1 of the heat contact surface S1 of the water-cooling head 16, the impeller 109, when rotating, drives the coolant to flow along the axis L1 of the impeller 109 in the drive chamber DF1 along the volute channel. Furthermore, when the coolant finally reaches the outlet V1 of the volute channel, it can directly enter the heat exchange chamber G1 of the water-cooling head 16 via the connecting channel P1 along the tangent direction of the volute structure 108 at the outlet V1. In other words, because the impeller 109 is configured such that its axis L1 is perpendicular to the normal N1 of the heat contact surface S1 of the water-cooling head 16, the outlet V1 of the volute channel can substantially face the water-cooling head 16. Therefore, the coolant does not need to undergo multiple turns during its flow from the outlet V1 of the volute channel to the heat exchange chamber G1. This avoids pressure loss caused by the curved flow channel, thus maintaining the flow rate of the coolant and ensuring the heat dissipation efficiency of the liquid flow cooling device 1.

[0084] Next, as Figure 3 , Figure 5 and Figure 6 As shown, the coolant flows sequentially through the inlet communication structure M1 of the cover 162 and the opening R1 of the baffle 166 into the gap between the heat dissipation fins 164 to absorb the heat from the heat dissipation fins 164. Finally, the coolant leaves the heat exchange chamber G1 through the outlet communication structure J1 of the cover 162 and flows to the outlet chamber OF1 of the pump housing 100, and is discharged from the outlet chamber OF1 through the outlet connector 14.

[0085] <Second Embodiment>

[0086] Please see Figures 7 to 9 ,in Figure 7 This is a perspective view of the liquid flow cooling device and frame according to the second embodiment of the present invention. Figure 8 for Figure 7 An exploded view of the pump body, inlet connector, and outlet connector of the liquid flow cooling device. Figure 9 for Figure 7 An exploded view of the water cooling head of a liquid flow cooling device.

[0087] The liquid flow cooling device 2 in this embodiment is used to dissipate heat from a heat source (not shown). The liquid flow cooling device 2 includes a pump body 20, a liquid inlet connector 22, a liquid outlet connector 24, and a water cooling head 26. The pump body 20 is, for example, locked to a frame F2 and fixed to a motherboard (not shown) by the frame F2.

[0088] The pump body 20 includes a pump housing 200 and an impeller 209. The pump housing 200 has a liquid flow chamber C2 and an outlet chamber OF2, and the impeller 209 is rotatably located in the liquid flow chamber C2.

[0089] In detail, the pump housing 200 includes a first housing 202, a second housing 204, an impeller cover 206, and a vortex structure 208. The first housing 202 includes a base B2 and an upright portion U2, the upright portion U2 protruding from the base B2. The second housing 204 and the upright portion U2 of the first housing 202 are combined to surround the liquid flow chamber C2. The impeller cover 206 is located in the liquid flow chamber C2 and divides the liquid flow chamber C2 into an inlet chamber IF2 and a drive chamber DF2. In addition, the impeller cover 206 has a plurality of connecting holes H2, and these connecting holes H2 connect the inlet chamber IF2 and the drive chamber DF2, so that coolant can enter the drive chamber DF2 from the inlet chamber IF2. The impeller 209 is rotatably located in the drive chamber DF2.

[0090] The inlet connector 22 and the outlet connector 24 are located on adjacent sides of the pump body 20, respectively. The inlet connector 22 is connected to the inlet chamber IF2 in the liquid flow chamber C2, and the outlet connector 24 is connected to the outlet chamber OF2 of the pump housing 200. The inlet connector 22 is used to guide coolant from the outside into the inlet chamber IF2, and the outlet connector 24 is used to discharge coolant from the outlet chamber OF2. In the second embodiment, the inlet connector 22 is an upright portion U2 provided on the first housing 202 of the pump housing 200.

[0091] A water-cooled head 26 is mounted on the base B2 of the first housing 202 of the pump housing 200, and the water-cooled head 26 has a heat exchange chamber G2 and a heat contact surface S2. The heat exchange chamber G2 is connected to the liquid flow chamber C2 of the pump housing 200, and the heat contact surface S2 faces away from the heat exchange chamber G2. The first housing 202 of the pump housing 200 has a connecting channel P2 extending from the base B2 to the upright portion U2, and the opposite ends of the connecting channel P2 are respectively connected to the liquid flow chamber C2 and the heat exchange chamber G2.

[0092] Specifically, the water-cooling head 26 includes a heat-conducting element 260, a cover 262, multiple heat dissipation fins 264, and a flow-blocking element 266. The cover 262 is integrated with the heat-conducting element 260 to surround the heat exchange chamber G2. Furthermore, the thermal contact surface S2 is located on the side of the heat-conducting element 260 away from the cover 262. The cover 262 has an inflow communication structure M2 and an outflow communication structure J2. The inflow communication structure M2 connects the heat exchange chamber G2 to the drive chamber DF2 in the liquid flow chamber C2 of the pump housing 200, and the outflow communication structure J2 connects the heat exchange chamber G2 to the outflow chamber OF2 of the pump housing 200. The inflow communication structure M2 connects to the drive chamber DF2 via a connecting channel P2. In the second embodiment, the inflow communication structure M2 of the cover 262 is an array-type porous structure, which can improve the uniform distribution of coolant, reduce the generation of local high-temperature hot spots, and also improve the flow pattern of coolant to increase the heat transfer area and reduce the noise when coolant enters the narrow opening.

[0093] These heat dissipation fins 264 are disposed on the heat-conducting element 260 and located in the heat exchange chamber G2. These heat dissipation fins 264 are arranged adjacent to each other side-by-side, and the spacing between any two adjacent heat dissipation fins 264 is the same. Furthermore, the thickness of these heat dissipation fins 264 is, for example, the same. However, this invention is not limited to the aforementioned configuration of the spacing between the heat dissipation fins and the configuration of the heat dissipation fin thickness.

[0094] The flow deflector 266 is located in the heat exchange chamber G2 and sandwiched between the heat dissipation fins 264 and the cover 262. The flow deflector 266 has an opening R2, which corresponds to the inflow communication structure M2 of the cover 262, and the opening R2 exposes part of the heat dissipation fins 264.

[0095] Please refer to Figure 10 and Figure 11 ,in Figure 10 for Figure 7 A cross-sectional schematic diagram of a liquid flow cooling device, and Figure 11 for Figure 7 Another cross-sectional schematic diagram of the liquid flow cooling device.

[0096] The volute structure 208 of the pump housing 200 is located in the drive chamber DF2 and surrounds a volute channel, with one outlet V2 of the volute channel connected to the connecting channel P2. The impeller 209 is located at the center of the volute channel, and the axis L2 of the impeller 209 is perpendicular to the normal N2 of the thermal contact surface S2 of the water-cooling head 26. In the second embodiment, the volute structure 208 is disposed on the impeller cover 206, but this invention is not limited thereto. In other embodiments, the volute structure may be disposed on the vertical portion of the first housing.

[0097] By arranging the impeller 209 perpendicular to the water-cooling head 26, with its axis L2 perpendicular to the normal N2 of the heat contact surface S2 of the water-cooling head 26, the impeller 209, when rotating, drives the coolant to flow along the axis L2 of the impeller 209 in the drive chamber DF2 along the volute channel. Furthermore, when the coolant finally reaches the outlet V2 of the volute channel, it can directly enter the heat exchange chamber G2 of the water-cooling head 26 via the connecting channel P2, following the tangential direction of the volute structure 208 at the outlet V2. In other words, because the impeller 209 is configured such that its axis L2 is perpendicular to the normal N2 of the heat contact surface S2 of the water-cooling head 26, the outlet V2 of the volute channel can substantially face the water-cooling head 26. Therefore, the coolant does not need to undergo multiple turns during its flow from the outlet V2 of the volute channel to the heat exchange chamber G2. This avoids pressure loss caused by the curved flow channel, thus maintaining the flow rate of the coolant and ensuring the heat dissipation efficiency of the liquid flow cooling device 2.

[0098] Next, the coolant flows sequentially through the inlet communication structure M2 of the cover 262 and the opening R2 of the baffle 266 into the gap between the heat dissipation fins 264 to absorb the heat from the heat dissipation fins 264. Finally, the coolant leaves the heat exchange chamber G2 through the outlet communication structure J2 of the cover 262 and flows to the outlet chamber OF2 of the pump housing 200, and is discharged from the outlet chamber OF2 through the outlet connector 24.

[0099] According to the liquid flow cooling device of the above embodiment, by arranging the impeller perpendicularly to the water cooling head, the axis of the impeller is perpendicular to the normal of the heat contact surface of the water cooling head. Therefore, when the impeller rotates, it drives the coolant to flow around the axis of the impeller, and the coolant can directly enter the heat exchange chamber of the water cooling head along the tangential direction at the outlet of the liquid flow chamber. Thus, the coolant does not need to undergo multiple turns during its flow from the liquid flow chamber to the heat exchange chamber, thereby avoiding pressure loss caused by curved flow channels, maintaining the coolant flow rate, and ensuring the heat dissipation efficiency of the liquid flow cooling device.

[0100] In some embodiments, by configuring heat dissipation fins with different densities on different areas of the corresponding thermal contact surface, a single thermal contact surface can have multiple heat transfer surface features, which can be used to improve the heat dissipation problem of local hot spots and at the same time reduce the flow resistance caused by the heat transfer surface features.

[0101] In some embodiments, by configuring the inflow connection structure of the cover as an array of porous structures, the uniform distribution of coolant can be improved, the generation of local high-temperature hot spots can be reduced, and the flow pattern of coolant can also be improved to increase the heat transfer area and reduce the noise when coolant enters the narrow opening.

[0102] Although the present invention has been disclosed above with reference to the foregoing embodiments, it is not intended to limit the present invention. Any person skilled in the art may make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be determined by the scope of protection of the appended claims.

Claims

1. A liquid flow cooling device, characterized in that, The liquid flow cooling device, used to dissipate heat from a heat source, includes: A pump body includes a pump housing and an impeller, the pump housing having a liquid flow chamber, and the impeller rotatably located within the liquid flow chamber; and A water cooling head is installed on the pump housing. The water cooling head has a heat exchange chamber and a heat contact surface. The heat exchange chamber is connected to the liquid flow chamber, and the heat contact surface faces away from the heat exchange chamber. The axis of the impeller is perpendicular to the normal to the thermal contact surface; and The water cooling head includes multiple heat dissipation fins located in the heat exchange chamber. The heat dissipation fins include multiple dense heat dissipation fins and multiple sparse heat dissipation fins. The dense heat dissipation fins are located on one side of the sparse heat dissipation fins. The dense heat dissipation fins are arranged adjacent to each other and side by side. The sparse heat dissipation fins are arranged adjacent to each other and side by side. The distance between any two adjacent dense heat dissipation fins is smaller than the distance between any two adjacent sparse heat dissipation fins.

2. The liquid flow cooling device as described in claim 1, characterized in that, The pump housing further includes an outlet chamber, and the water cooling head further includes a heat-conducting element and a cover. The cover is combined with the heat-conducting element to surround the heat exchange chamber. The thermal contact surface is located on the side of the heat-conducting element away from the cover. The cover has an inlet communication structure and an outlet communication structure. The inlet communication structure connects the heat exchange chamber and the liquid flow chamber, and the outlet communication structure connects the heat exchange chamber and the outlet chamber.

3. The liquid flow cooling device as described in claim 2, characterized in that, The inflow connection structure can be a single-aperture structure or an array of porous structures.

4. A liquid flow cooling device, characterized in that, The liquid flow cooling device, used to dissipate heat from a heat source, includes: A pump body includes a pump housing and an impeller, the pump housing having a liquid flow chamber, and the impeller rotatably located within the liquid flow chamber; and A water cooling head is installed on the pump housing. The water cooling head has a heat exchange chamber and a heat contact surface. The heat exchange chamber is connected to the liquid flow chamber, and the heat contact surface faces away from the heat exchange chamber. The axis of the impeller is perpendicular to the normal to the thermal contact surface; and The water cooling head includes a heat-conducting element and a cover. The cover is combined with the heat-conducting element to surround the heat exchange chamber. The heat contact surface is located on the side of the heat-conducting element away from the cover. The cover has an inflow communication structure that connects the heat exchange chamber and the liquid flow chamber. The inflow communication structure is an array-type porous structure.

5. The liquid flow cooling device as described in claim 1 or claim 4, characterized in that, The pump housing includes a first housing and a second housing. The first housing includes a base and an upright portion. The upright portion protrudes from the base, and the second housing and the upright portion of the first housing are combined to surround the liquid flow chamber.

6. The liquid flow cooling device as described in claim 5, characterized in that, The pump housing further includes an impeller cover located in the flow chamber and dividing the flow chamber into an inlet chamber and a drive chamber that are connected to each other, and the impeller is rotatably located in the drive chamber.

7. The liquid flow cooling device as described in claim 6, characterized in that, The impeller cover has multiple connecting holes, and these connecting holes connect the inlet chamber and the drive chamber.

8. The liquid flow cooling device as described in claim 7, characterized in that, The first housing has a connecting channel that extends from the base to the upright portion, and the opposite ends of the connecting channel are respectively connected to the drive chamber and the heat exchange chamber.

9. The liquid flow cooling device as described in claim 8, characterized in that, The pump housing further includes a volute structure disposed on the vertical part and located in the drive chamber. The volute structure surrounds a volute channel, the impeller is located at the center of the volute channel, and an outlet of the volute channel is connected to the channel.

10. The liquid flow cooling device as described in claim 8, characterized in that, The pump housing further includes a volute structure disposed on the impeller cover and located in the drive chamber. The volute structure surrounds a volute channel, the impeller is located at the center of the volute channel, and an outlet of the volute channel is connected to the channel.

11. The liquid flow cooling device as described in claim 4, characterized in that, The pump housing further has an outlet chamber, and the cover further has an outlet communication structure, which connects the heat exchange chamber and the outlet chamber.

12. The liquid flow cooling device as described in claim 4, characterized in that, The water block further includes multiple heat dissipation fins, which are disposed on the heat-conducting element and located in the heat exchange chamber.

13. The liquid flow cooling device as described in claim 2 or claim 12, characterized in that, The water block further includes a flow deflector located in the heat exchange chamber and sandwiched between the heat dissipation fins and the cover. The flow deflector has an opening corresponding to the inflow communication structure of the cover, and the opening exposes part of the heat dissipation fins.

14. The liquid flow cooling device as described in claim 2 or claim 11, characterized in that, It further includes an inlet connector and an outlet connector. The pump housing includes a first housing, a second housing, and an impeller cover. The first housing includes a base and an upright portion. The upright portion protrudes from the base. The second housing and the upright portion of the first housing are combined to surround the liquid flow chamber. The impeller cover is located in the liquid flow chamber and divides the liquid flow chamber into an inlet chamber and a drive chamber that are connected. The impeller is rotatably located in the drive chamber. The inlet connector and the outlet connector are located on adjacent sides of the pump body. The inlet connector is connected to the inlet chamber, and the outlet connector is connected to the outlet chamber.

15. The liquid flow cooling device as described in claim 14, characterized in that, The liquid inlet connector is located in the second housing or the vertical part of the first housing of the pump housing.

Images