Motor controller of foot-type robot and foot-type robot

Abstract

The utility model discloses a motor controller of a foot type robot and the foot type robot. The motor controller of the foot type robot comprises a weak current circuit board assembly and a strong current circuit board assembly electrically connected with the weak current circuit board assembly, the strong current circuit board assembly and the weak current circuit board assembly are arranged in an up-down stacked mode, and a first heat dissipation channel is arranged between the strong current circuit board assembly and the weak current circuit board assembly. The motor controller of the foot type robot further comprises a supporting column supported between the strong current circuit board assembly and the weak current circuit board assembly, and the supporting column is used for fixing the height of the first heat dissipation channel between the strong current circuit board assembly and the weak current circuit board assembly. The utility model further discloses a foot type robot which adopts the motor controller. The device has the advantages that the vertical space is effectively utilized, and the whole device is more compact in structure. The size of the device can be reduced, layout and installation in the robot are facilitated, meanwhile, lightweight design of the whole robot is facilitated, and the movement flexibility of the robot is improved.

Description

Technical Field

[0001] This utility model relates to the field of intelligent manufacturing technology, specifically to a motor controller for a legged robot and a legged robot. Background Technology

[0002] Legged robots, like humanoid robots, possess humanoid structures and are similar in shape and size to humans, which allows them to adapt well to human living and working environments. For example, in a home environment, they can use furniture and appliances like humans, easily move between rooms, climb stairs, sit in chairs, or open the refrigerator to retrieve items.

[0003] Existing legged robots typically have three motors per leg: a thigh motor and a knee joint motor located at the upper part of the thigh, and a lower leg motor at the hinge point between the lower leg and thigh. For example, Chinese Patent Publication No. CN118810959A, entitled "A Bipedal Legged Robot," has a leg structure similar to most current robots. In this patent, the thigh motor drives the thigh to rotate relative to the pelvis, with the rotation axis of the thigh coinciding with the output shaft of the thigh motor. The rotation of the thigh relative to the pelvis simultaneously moves the lower leg. A cavity is provided within the thigh, housing a linkage mechanism. The knee joint motor drives this linkage mechanism, which in turn drives the lower leg to rotate relative to the thigh. In this structure, all three motors are disc-shaped, resulting in a concentration of motors at the pelvic area, leading to a large pelvic region. Furthermore, due to the flat, round shape of the disc motors, there is insufficient space to assemble the controller within the motors. Consequently, the controller circuit board is placed within the space enclosed in the middle of the stator, affecting heat dissipation. Furthermore, due to space constraints, the size of the circuit board is also affected, making it impossible to arrange more electronic components, which ultimately leads to insufficient output voltage and current, thus preventing the motor power from increasing.

[0004] Therefore, motors can be installed inside the legs to make full use of the leg space. However, due to the limited space in the joint area, the size of the motor controller will affect the motor design. If the motor controller is too large, it will reduce the size of the motor power components, resulting in insufficient motor output power and reduced motor output torque, leading to poor robot performance. On the other hand, if the controller is too small, it will not be able to provide sufficient voltage and current to the motor. In addition, heat dissipation of the circuit board is also a problem in the confined space. If the circuit board temperature is too high, it will affect the normal operation of the circuit board and still lead to a decrease in output voltage and current. Utility Model Content

[0005] The purpose of this invention is to provide a motor controller for a legged robot and a legged robot, which can effectively solve the problems that current motor controllers for legged robots cannot be adapted to confined spaces or provide insufficient driving voltage and current, and have poor heat dissipation performance.

[0006] To solve the above-mentioned technical problems, this utility model is achieved through the following technical solution:

[0007] The motor controller of the legged robot includes a low-voltage circuit board assembly and a high-voltage circuit board assembly electrically connected to the low-voltage circuit board assembly. The high-voltage circuit board assembly and the low-voltage circuit board assembly are stacked one on top of the other and a first heat dissipation channel is provided between them. The motor controller of the legged robot also includes a support column supported between the high-voltage circuit board assembly and the low-voltage circuit board assembly to fix the height of the first heat dissipation channel between the high-voltage circuit board assembly and the low-voltage circuit board assembly.

[0008] In the motor controller of the aforementioned legged robot, the high-voltage circuit board assembly includes a first circuit board and a second circuit board. The first circuit board is used to control the voltage and current input to the power component, and the second circuit board is used to reduce voltage fluctuations during the operation of the drive motor.

[0009] In the motor controller of the aforementioned legged robot, the first circuit board includes a PCB substrate, a first component group, and a second component group. The PCB substrate includes a first end face and a second end face. The first component group is disposed on the first end face, and the second component group is disposed on the second end face.

[0010] In the motor controller of the aforementioned legged robot, the first component group includes multiple groups of MOSFETs. The height of all components in the first component group except for the MOSFETs is lower than the height of the MOSFETs protruding from the first end face. All MOSFETs share a single heat sink.

[0011] In the motor controller of the aforementioned legged robot, the first component group includes multiple sets of MOSFETs and a current-carrying copper block protruding from the first end face, and the second circuit board includes a copper substrate, which is attached to the second end face for heat dissipation of the MOSFETs and the current-carrying copper block.

[0012] In the motor controller of the aforementioned legged robot, the second component group avoids the projection area of ​​all MOS transistors and current-carrying copper blocks on the second end face. The copper substrate has a clearance hole to avoid the second component group, and the copper substrate at least covers the projection area of ​​all MOS transistors and current-carrying copper blocks on the second end face.

[0013] In the motor controller of the aforementioned legged robot, the number of conductive layers on the second circuit board is greater than the number of conductive layers on the first circuit board.

[0014] In the motor controller of the aforementioned legged robot, the width of the conductor layer on the second circuit board is smaller than the width of the conductor layer on the first circuit board.

[0015] In the motor controller of the aforementioned legged robot, the high-voltage circuit board assembly includes multiple sets of MOSFETs, a MOSFET driver corresponding to each set of MOSFETs, and a first power chip. The first power chip converts the power supply voltage into the operating voltage required by the MOSFET driver and the low-voltage circuit board assembly.

[0016] In the motor controller of the aforementioned legged robot, the low-voltage circuit board assembly includes a low-voltage circuit board and an isolation power conversion module that electrically isolates the low-voltage circuit board from the high-voltage circuit board assembly. The isolation power conversion module is electrically connected to a first power chip to convert the voltage provided by the first power chip into the operating voltage required by the low-voltage circuit board.

[0017] In the motor controller of the aforementioned legged robot, the low-voltage circuit board assembly includes a low-voltage circuit board and an isolation power conversion module that electrically isolates the low-voltage circuit board from the high-voltage circuit board assembly. The low-voltage circuit board is equipped with an MCU chip. The high-voltage circuit board assembly includes multiple sets of MOSFETs, MOSFET drivers corresponding to each set of MOSFETs, and digital isolation chips corresponding to the multiple MOSFET drivers. The MCU chip establishes signal interaction with the MOSFET drivers through the digital isolation chips.

[0018] In the motor controller of the aforementioned legged robot, one of the high-voltage circuit board assembly and the low-voltage circuit board assembly is provided with electrical connection pins, and the other is provided with an electrical connection socket that mates with the electrical connection pins.

[0019] In the motor controller of the aforementioned legged robot, the electrical connection pins include voltage signal pins that transmit different voltage signals from the high-voltage circuit board assembly to the low-voltage circuit board assembly for detection.

[0020] The legged robot uses a motor controller as described above for the drive motors of its joints.

[0021] Compared with the prior art, the advantages of this utility model are:

[0022] Low-voltage circuit board assemblies and high-voltage circuit board assemblies require different operating voltages. The operating voltage required by the high-voltage circuit board assembly is much higher than that required by the low-voltage circuit board assembly. The main electronic components on the low-voltage circuit board assembly (excluding conventional components such as resistors and capacitors) are all low-voltage components, while the main electronic components on the high-voltage circuit board assembly are all high-voltage components. Typically, both low-voltage and high-voltage components are arranged on the same PCB board. Low-voltage components are generally used for signal processing and communication, while high-voltage components are generally used to control the output voltage and current. High-voltage components generate significantly more heat than low-voltage components. By physically separating the high-voltage and low-voltage components and maintaining a distance between them, the heat generated by the high-voltage components will not affect the normal operation of the low-voltage components. Furthermore, the separate arrangement of the low-voltage and high-voltage circuit board assemblies also provides physical isolation between the low-voltage and high-voltage components, avoiding potential electrical interference and the risk of electric shock.

[0023] By stacking the low-voltage and high-voltage circuit board assemblies vertically, vertical space is effectively utilized, resulting in a more compact overall structure. This is crucial for installation in space-constrained areas such as the legs of legged robots, helping to reduce the device's size, facilitating layout and installation within the robot, and also contributing to the overall lightweight design of the robot, improving its mobility. This also allows for a smaller spacing and higher output voltage and current for the entire motor controller.

[0024] The first heat dissipation channel, positioned between the high-voltage and low-voltage circuit board assemblies, provides a dedicated path for heat dissipation. During motor control, electronic components on both the high-voltage and low-voltage circuit board assemblies generate heat. If this heat cannot be dissipated in time, it will affect component performance and lifespan. The first heat dissipation channel guides heat out, preventing heat accumulation and ensuring the device operates within a suitable temperature environment. This improves the device's reliability and stability, reduces the risk of malfunctions due to overheating, and thus guarantees the continuous and normal operation of the leg motor control system of the legged robot.

[0025] The presence of the support column further enhances the stability of the device. It not only fixes the height of the first heat dissipation channel, ensuring the stable operation of the heat dissipation function, but also supports and positions the high-voltage and low-voltage circuit board assemblies, preventing the circuit boards from shifting or loosening due to vibration, collisions, or other factors during robot movement. This ensures the reliability of electrical connections and the normal operation of the circuits, reducing the potential for electrical faults caused by mechanical factors.

[0026] Furthermore, the high-voltage circuit board assembly includes a first circuit board and a second circuit board. The first circuit board controls the voltage and current input to the power component, while the second circuit board reduces voltage fluctuations during motor operation. By assigning voltage and current control and voltage fluctuation suppression functions to different circuit boards, each circuit board focuses on a specific function, improving the accuracy and stability of function implementation. The first circuit board can more precisely adjust the voltage and current according to the motor's operating requirements. During robot operation, its joints are in a reciprocating motion state, resulting in high-frequency and reciprocating forward and reverse rotation of the motor. During these reciprocating rotations, the voltage can fluctuate drastically. The second circuit board specifically addresses voltage fluctuations, preventing damage caused by voltage fluctuations exceeding the controller's rated voltage, thereby improving the smoothness of motor operation.

[0027] Furthermore, the first circuit board includes a PCB substrate, a first component group, and a second component group. The PCB substrate includes a first end face and a second end face. The first component group is disposed on the first end face, and the second component group is disposed on the second end face. This double-sided layout fully utilizes the space on both surfaces of the PCB substrate, increases the component density, helps disperse heat sources, and avoids excessive heat concentration on one side of the PCB substrate, thereby improving the overall heat dissipation of the circuit board and reducing potential performance degradation or damage to components due to overheating. This helps maintain the stable operation of the legged robot's motor controller. Simultaneously, because high-voltage components can be arranged on both the upper and lower surfaces of the PCB substrate, the size of the PCB substrate and the volume of the controller can be further reduced.

[0028] Furthermore, the first component group includes multiple sets of MOSFETs. The height of all components in the first component group, except for the MOSFETs, is lower than the height of the MOSFETs protruding from the first end face. All MOSFETs share a single heatsink. This design, where the height of all components in the first component group is lower than the height of the MOSFETs protruding from the first end face, helps to form a more regular layout structure on the circuit board, avoiding potential space waste or mutual interference problems caused by inconsistent component heights. This makes the use of circuit board space more rational. The shared heatsink for multiple MOSFETs in the first component group allows for centralized heat dissipation of the MOSFETs. Since MOSFETs typically generate a lot of heat during operation, sharing a heatsink increases the heat dissipation area, enhances the heat dissipation effect, effectively reduces the temperature of the MOSFETs, ensures they operate within a suitable temperature range, reduces performance degradation or failure due to overheating, and improves the stability and reliability of the entire device, thereby ensuring the continuous and stable operation of the leg motor control of the legged robot.

[0029] Furthermore, the first component group includes multiple sets of MOSFETs and a current-carrying copper block protruding from the first end face. The second circuit board includes a copper substrate, which is attached to the second end face for heat dissipation of the MOSFETs and the current-carrying copper block. Copper has good thermal conductivity, which can quickly conduct the heat generated by the MOSFETs and the current-carrying copper block away. Although the PCB substrate itself also has a layer of copper on its surface, it is too thin to bear high voltage and current. The current-carrying copper block protrudes from the first end face, thus having a larger volume and heat dissipation area. The large volume gives the current-carrying copper block better voltage and current carrying capacity, thereby enabling the controller to output larger voltage and current to the motor while miniaturizing, allowing the motor to output greater torque and improving the robot's operating performance. The large heat dissipation area allows the high temperature generated by the current-carrying copper block when carrying voltage and current to radiate outward more quickly. Both the MOSFET and the current-carrying copper block generate significant heat. Since they are in direct contact with the PCB substrate, some of this heat is transferred to the PCB. The copper substrate, attached to the second end face, also transfers some of the heat generated by the MOSFET and copper block to it. Because the copper substrate is primarily made of copper, it can quickly dissipate heat, thus improving heat dissipation efficiency. This design creates an efficient heat conduction path from the heat-generating components to the heat dissipation substrate, effectively reducing the temperature of the MOSFET and copper block, ensuring the stable operation of these critical components, and thereby improving the reliability and durability of the legged robot's motor controller.

[0030] Furthermore, the second component group avoids the projection areas of all MOSFETs and current-carrying copper blocks on the second end face. The copper substrate has clearance holes that avoid the second component group, and the copper substrate at least covers the projection areas of all MOSFETs and current-carrying copper blocks on the second end face. This layout ensures the normal installation and operation of the second component group, avoids mutual interference with the heat dissipation structure, and ensures that the copper substrate can dissipate heat from the heat-generating components to the maximum extent. This achieves a rational and compact structural layout, improves the space utilization of the circuit board, and helps reduce the overall size and weight of the device, meeting the design requirements of legged robots for miniaturized and lightweight components.

[0031] Furthermore, the second circuit board has a greater number of conductive layers than the first circuit board. In the motor controller of a legged robot, the second circuit board is responsible for reducing voltage fluctuations during motor operation. Its main electrical component is a capacitor. In contrast, the first circuit board needs to control the output voltage and current, and it needs to handle relatively complex circuit connections and signal transmissions. A greater number of conductive layers provides more wiring space and path selection, making the circuit design more flexible. It allows for better layout of various electronic components and connection lines, effectively avoiding line crossings and interference, thereby improving the stability and reliability of the circuit and ensuring the accuracy of the motor control process.

[0032] Furthermore, the conductor layer width on the second circuit board is smaller than that on the first circuit board. In the motor controller of a legged robot, the second circuit board needs to accommodate more complex circuitry, but space is limited. A smaller conductor layer width allows for denser wiring within a limited circuit board area, increasing circuit integration and making more efficient use of board space. This helps reduce the overall size of the control device, meeting the robot's design requirements for miniaturized components and making it easier to install within the limited space of the leg. For some high-frequency signals or signals requiring high transmission accuracy, a narrower conductor layer width can reduce the adverse effects of parasitic capacitance and inductance during signal transmission, improving signal transmission quality and speed, and enhancing signal integrity. This is crucial for ensuring the accuracy and timeliness of motor control signals, improving motor control precision and response performance, and ultimately enhancing the stability and coordination of the legged robot's movements.

[0033] Furthermore, the high-voltage circuit board assembly includes multiple sets of MOSFETs, MOSFET drivers corresponding to each set of MOSFETs, and a first power supply chip. The first power supply chip converts the power supply voltage into the operating voltage required by the MOSFET drivers and the low-voltage circuit board assembly. The first power supply chip can convert the externally input power supply voltage to generate the specific operating voltage required by the MOSFET drivers and the low-voltage circuit board assembly, ensuring that each component can operate stably under appropriate voltage conditions, maintaining the normal operation of the entire motor controller, and avoiding component failures or performance degradation caused by voltage mismatch.

[0034] Furthermore, the low-voltage circuit board assembly includes a low-voltage circuit board and an isolation power conversion module that electrically isolates the low-voltage circuit board from the high-voltage circuit board assembly. The isolation power conversion module is electrically connected to a first power chip to convert the voltage provided by the first power chip into the operating voltage required by the low-voltage circuit board. The low-voltage circuit board assembly and the high-voltage circuit board assembly are physically isolated, and their reference grounds are different. The voltage converted by the first power chip cannot directly power the low-voltage components on the low-voltage circuit board assembly. The isolation power conversion module achieves electrical isolation between the high-voltage and low-voltage areas, and the voltage converted by the isolation power conversion module has the same reference ground as the low-voltage circuit board, thereby enabling it to power the low-voltage components on the low-voltage circuit board.

[0035] Furthermore, the low-voltage circuit board assembly includes a low-voltage circuit board and an isolation power conversion module that electrically isolates the low-voltage circuit board from the high-voltage circuit board assembly. The low-voltage circuit board is equipped with an MCU chip, and the high-voltage circuit board assembly includes multiple sets of MOSFETs, MOSFET drivers corresponding to each set of MOSFETs, and digital isolation chips corresponding to the multiple MOSFET drivers. The MCU chip establishes signal interaction with the MOSFET drivers through the digital isolation chips. In a motor controller, if the high-voltage and low-voltage components are directly electrically connected, interference from the high-voltage circuit may affect the signal processing accuracy and stability of the low-voltage component. Isolating the high-voltage and low-voltage circuits through the isolation power conversion module effectively avoids the transmission of such interference, ensures the normal operation of the low-voltage component, and improves the reliability and stability of the entire device. High-voltage circuits typically handle higher voltages and larger currents, and the resulting electromagnetic interference and voltage spikes may damage sensitive components in the low-voltage circuits. Digital isolation chips transmit signals through coupling methods such as light, magnetism, or capacitance, cutting off electrical connections and preventing interference signals from the high-voltage side from entering the low-voltage side. This protects sensitive components in low-voltage circuits from high voltage and high current surges, preventing damage and extending their service life.

[0036] Furthermore, one of the high-voltage circuit board assembly and the low-voltage circuit board assembly is provided with electrical connection pins, and the other is provided with an electrical connection socket that mates with the electrical connection pins. By providing electrical connection pins and sockets, the assembly of the high-voltage and low-voltage circuit board assemblies becomes more convenient and faster. Compared to complex soldering and wiring methods, simply inserting the electrical connection pins into the corresponding electrical connection sockets achieves electrical connection, reducing assembly difficulty and cost, and improving assembly efficiency. Especially in large-scale production, it can significantly reduce the complexity and error rate of manual operations. The mating of the electrical connection pins and sockets provides a more reliable electrical connection. Through precise design, they ensure good contact, avoiding electrical performance instability caused by loose connections or poor connections. During the operation of the legged robot's motor controller, it is subjected to mechanical stresses such as vibration and impact. This connection method ensures good electrical conduction even under certain mechanical stresses, reducing signal transmission interruptions and circuit failures caused by poor connections, thus improving the reliability and stability of the entire device.

[0037] Furthermore, the electrical connection pins include voltage signal pins that transmit different voltage signals from the high-voltage circuit board assembly to the low-voltage circuit board assembly for detection. Monitoring the voltage signals of the high-voltage circuit board assembly can provide data support for system optimization. The motor control strategy can be adjusted based on the monitored voltage signals, such as adjusting motor speed, torque, and other parameters according to voltage changes to adapt to different workloads and operating conditions.

[0038] This utility model also discloses a legged robot with a motor controller that combines small size and high output voltage and current, and has good heat dissipation performance, ensuring that the legged robot has good motion performance. Attached Figure Description

[0039] Figure 1 An exploded view of the motor controller for the legged robot of this utility model;

[0040] Figure 2 The three-dimensional representation of the high-voltage circuit board assembly of this utility model Figure 1 ;

[0041] Figure 3 The three-dimensional representation of the high-voltage circuit board assembly of this utility model Figure 2 ;

[0042] Figure 4 The three-dimensional representation of the low-voltage circuit board assembly in this utility model Figure 1 ;

[0043] Figure 5 The three-dimensional representation of the low-voltage circuit board assembly in this utility model Figure 2 ;

[0044] Figure 6 This is a schematic diagram of the structure of the present invention after combining two high-voltage circuit board assemblies and one low-voltage circuit board assembly.

[0045] Figure 7 A schematic diagram of the leg motor of the legged robot using this utility model;

[0046] Figure 8 This is a schematic diagram of the structure of the first receiving cavity and the end cap in the leg motor of the leg robot using this utility model when they are separated;

[0047] Figure 9 This is a structural view of the first receiving cavity in the leg motor of the legged robot of this utility model;

[0048] Figure 10 This is a schematic diagram of the structure of the heat sink and the first receiving cavity in the leg motor of the legged robot using this utility model.

[0049] Figure 11 A cross-sectional view of the leg motor of the legged robot using this utility model;

[0050] Figure 12 This is a schematic diagram of the lower body structure of the legged robot using this utility model;

[0051] Figure 13 This is a cross-sectional view of the first receiving cavity of the legged robot using this invention.

[0052] The attached figures are labeled as follows:

[0053] Drive motor 100, housing 110, power chamber 111, first receiving cavity 112, fixing post 113, wiring harness channel 114, fixing groove 115, power assembly 120, rotating shaft 121, gear 122, end cover 130, second receiving cavity 131, wiring notch 132, motor controller 200, high-voltage control assembly 210, high-voltage circuit board assembly 211, first circuit board 2111, first end face 21111, second end face 21112, MOSFET 21113, current-carrying copper block 21114, MOSFET driver 21115, first electrical... Source chip 21116, second component group 21117, digital isolation chip 21118, second circuit board 2112, clearance hole 21121, capacitor 21122, heat sink 212, low-voltage circuit board assembly 220, speed sensor 221, low-voltage circuit board 222, isolated power conversion module 223, MCU chip 224, isolated analog-to-digital converter chip 225, electrical connection pin 226, electrical connection socket 227, voltage signal pin 228, first heat dissipation channel 230, second heat dissipation channel 231, support column 240, robot leg 1000. Detailed Implementation

[0054] The motor controller of the legged robot includes a low-voltage circuit board assembly 220 and a high-voltage circuit board assembly 211 electrically connected to the low-voltage circuit board assembly 220. The high-voltage circuit board assembly 211 and the low-voltage circuit board assembly 220 are stacked vertically and a first heat dissipation channel 230 is provided between them. The motor controller of the legged robot also includes a support column 240 supported between the high-voltage circuit board assembly 211 and the low-voltage circuit board assembly 220 to fix the height of the first heat dissipation channel 230 between the high-voltage circuit board assembly 211 and the low-voltage circuit board assembly 220.

[0055] These two components are arranged in a stacked manner, with a first heat dissipation channel 230 reserved between them. The height of the first heat dissipation channel 230 is fixed by support columns 240 to ensure the stability of the heat dissipation effect. The support columns 240 are evenly distributed between the high-voltage circuit board assembly 211 and the low-voltage circuit board assembly 220, which can provide support without hindering the flow of heat dissipation air.

[0056] The embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0057] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0058] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0059] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0060] Example 1:

[0061] See Figures 1 to 6 In one embodiment of this utility model, the motor controller of the legged robot includes a low-voltage circuit board assembly 220 and a high-voltage circuit board assembly 211, which are electrically connected. Separating the high-voltage circuit board assembly 211 and the low-voltage circuit board assembly 220 effectively avoids interference from high voltage to low-voltage signals, preventing malfunctions or data transmission errors in the low-voltage signals. For example, in the control of the 1000 motors in the robot's legs, interference with the low-voltage signals may lead to incorrect motor control commands, affecting the robot's motion stability and accuracy. Separation also reduces safety risks caused by high-voltage faults. If a short circuit occurs in the high-voltage section, isolation from the low-voltage circuit board assembly 220 reduces the impact on the low-voltage section, preventing damage to the control core (such as low-voltage components like the MCU chip), thus ensuring the safety of the entire control device and preventing further escalation of the fault.

[0062] Separate circuit board designs allow engineers to optimize for high-voltage and low-voltage characteristics separately. The high-voltage circuit board can focus on the layout and heat dissipation design of high-power components to meet the power supply requirements of high-power loads such as motors; the low-voltage circuit board assembly 220 can focus on signal processing and control logic implementation, employing finer wiring and component selection to ensure signal accuracy and stability. Furthermore, both the high-voltage and low-voltage circuit board assemblies 220 can be modularized, allowing for flexible combinations of high-voltage circuit boards or matching of different types of low-voltage circuit board assemblies 220 according to varying power requirements, reducing the difficulty of redesign.

[0063] Separate circuit board layouts help reduce electromagnetic compatibility issues. The electromagnetic fields generated by high-voltage circuitry do not directly affect the performance of low-voltage circuitry, making signal transmission in the low-voltage section more reliable and improving the overall control system's anti-interference capability. For example, during signal transmission, the attenuation and distortion of low-voltage signals are reduced, thus ensuring the quality of control signals and enabling motors to operate more precisely according to instructions, improving the accuracy and smoothness of the robot's leg movements. Separating high-voltage and low-voltage circuitry allows for better optimization of their respective electrical performance. The high-voltage circuit board can be optimized for high-voltage, high-current transmission, using thicker wires and suitable power components; the low-voltage circuit board assembly 220 can be optimized for low-voltage, low-current signal processing, such as using high-precision resistors and capacitors, thereby improving the overall performance of the entire control device.

[0064] The high-voltage circuit board assembly 211 and the low-voltage circuit board assembly 220 are stacked vertically, with a first heat dissipation channel 230 between them. This stacked layout significantly saves internal space in the robot leg 1000. Within the limited space of the leg, this compact structure avoids the space waste caused by scattered circuit board placement, allowing the control device to better adapt to the leg's structural shape and providing more installation space for motors and other components. This facilitates the miniaturization and lightweight design of the robot leg 1000. Compared to other possible layouts, such as side-by-side circuit board arrangement, the stacked structure reduces horizontal space occupation, resulting in a more regular internal layout of the leg, facilitating wiring and overall structural optimization. If the motor has a long, narrow structure, its long, narrow shape can be fully utilized.

[0065] A specially designed first heat dissipation channel 230 between the high-voltage circuit board assembly 211 and the low-voltage circuit board assembly 220 provides an effective way for heat dissipation. During motor operation, the high-voltage circuit board assembly 211 generates a large amount of heat, which, if not dissipated in time, may affect the performance and lifespan of electronic components. The first heat dissipation channel 230 guides the flow of hot air, enhances the air convection cooling effect, and prevents heat from accumulating near the circuit board assembly. The design of the support column 240 fixing the height of the first heat dissipation channel 230 ensures the stability and unobstructed flow of the channel. It ensures that hot air can pass smoothly through the channel, avoiding reduced heat dissipation efficiency due to channel deformation or blockage, thereby improving the reliability and stability of the entire control device and helping the motor to operate continuously and efficiently in a suitable temperature environment.

[0066] The following are specific examples of the structure of the high-voltage circuit board and low-voltage circuit board assembly 220, including but not limited to the following examples:

[0067] The high-voltage circuit board assembly 211 includes a first circuit board 2111 and a second circuit board 2112. The first circuit board 2111 controls the voltage and current input to the motor, while the second circuit board 2112 reduces voltage fluctuations during motor operation. The first circuit board 2111 focuses on controlling the motor's voltage and current, enabling more precise adjustment of the power supply according to the operating needs of the robot leg 1000 motor, ensuring a stable and suitable power input, and improving motor operating efficiency and stability. The second circuit board 2112 handles voltage fluctuations during motor operation, effectively reducing interference from voltage fluctuations to the motor and the entire control system, lowering the risk of equipment failure, extending equipment lifespan, and improving the reliability and accuracy of the robot leg 1000's movements. When a functional module malfunctions, the first circuit board 2111 or the second circuit board 2112 can be specifically inspected, repaired, or replaced without requiring extensive troubleshooting and processing of the entire high-voltage circuit board assembly 2111, reducing maintenance costs and complexity. During technology upgrades, if new voltage and current control algorithms or better voltage fluctuation suppression technologies are available, improvements and optimizations can be made on the corresponding circuit boards without affecting the normal operation of other parts, thus improving the scalability of the system.

[0068] Furthermore, the first circuit board 2111 includes a PCB substrate, a first component group, and a second component group 21117. The PCB substrate includes a first end face 21111 and a second end face 21112. For ease of description, Figure 1Taking the PCB substrate as an example, the side facing upwards, away from the low-voltage circuit board assembly 220, is the first end face 21111, and the side facing downwards, closer to the low-voltage circuit board assembly 220, is the second end face 21112. A first component group is positioned on the first end face 21111, and a second component group 21117 is positioned on the second end face 21112. Positioning the first component group on the first end face 21111 and the second component group 21117 on the second end face 21112 achieves a three-dimensional layout of components on the circuit board, effectively utilizing the double-sided space of the PCB substrate. Compared to a single-sided layout, this significantly increases the number of components that can be accommodated, making it possible to implement more complex circuit functions. Simultaneously, this double-sided layout naturally creates functional partitions. Components on different end faces can each undertake different sub-functions or process different types of signals, reducing mutual interference between components and making the circuit operation more stable and reliable. For example, components related to power processing can be placed on one side, while control signal processing components can be placed on the other side, making the power circuit and control circuit relatively independent, reducing the impact of electromagnetic interference on the control signal, and improving control accuracy. From a heat dissipation perspective, the double-sided layout disperses component distribution, avoiding the problem of localized overheating caused by excessive concentration of components on a single side. Heat can be dissipated more evenly to the surrounding environment, helping to maintain the normal operating temperature of components and improving their reliability and lifespan. In terms of maintenance, when a component malfunctions and needs replacement or adjustment, the double-sided layout allows maintenance personnel to more clearly identify and operate the relevant component, reducing maintenance difficulty and the risk of damage to other components during maintenance, thus improving equipment maintainability.

[0069] Because the robot's leg motor 1000 is limited by space and is elongated, with limited heat dissipation space, this embodiment focuses more on the layout of the entire motor controller 200 from the perspective of heat dissipation.

[0070] Furthermore, the first component group includes multiple sets of MOSFETs 21113, with two MOSFETs in each set. Since it connects to three-phase power, in this embodiment, the first component group includes three sets of MOSFETs 21113. The height of all components in the first component group, except for the MOSFETs 21113, is lower than the height of the MOSFETs 21113 protruding from the first end face 21111. All MOSFETs 21113 share a single heat sink 212. Compared to previous structures, the above arrangement of the first component group requires attaching a heat sink 212 to each MOSFET 21113 to prevent the heat sink 212 from contacting components higher than the MOSFETs 21113, which greatly increases the mounting time and reduces the total heat dissipation area. However, with the solution in this embodiment, the heat sink 212 does not need to avoid the components in the first component group; it can cover the entire first end face 21111, expanding the heat dissipation area, improving heat dissipation efficiency, ensuring the MOSFETs operate within a suitable temperature range, thereby stabilizing their electrical performance and ensuring the accuracy and reliability of motor control. At the same time, this relatively regular layout helps simplify the assembly process and reduce production costs during the production process.

[0071] The second circuit board 2112 includes a copper substrate with capacitors 21122 mounted on it to reduce bus voltage fluctuations. The copper substrate also has excellent thermal conductivity to dissipate heat. The first component group includes multiple MOSFETs 21113 and a current-carrying copper block 21114 protruding from the first end face 21111. The current-carrying copper block 21114 enhances current carrying capacity, increases the voltage and current capacity of the PCB board, and improves heat dissipation. The copper substrate is attached to the second end face 21112 for heat dissipation of the MOSFETs 21113 and the current-carrying copper block 21114. The placement of the current-carrying copper block 21114 and the copper substrate attachment design of the second circuit board 2112 achieve a good structural fit. The copper substrate not only serves heat dissipation but also provides mechanical support and electrical connection assistance to a certain extent. This structural design makes the connection between the first circuit board 2111 and the second circuit board 2112 tighter and more stable, which helps to improve the integration of the entire high-voltage circuit board assembly 211, reduces the problems that may be caused by loose connections or poor contact between circuit boards, improves the reliability and shock resistance of the system, and provides a guarantee for the stable operation of the robot leg 1000 in complex motion environments.

[0072] Furthermore, to facilitate faster heat transfer from the MOSFET 21113 and the current-carrying copper block 21114 to the copper substrate, the copper substrate needs to be in close contact with the second end face 21112. This requires that the area of ​​the second end face 21112 covered by the copper substrate cannot contain the second component group 21117. Therefore, the second component group 21117 avoids the projection areas of all MOSFETs 21113 and the current-carrying copper block 21114 on the second end face 21112. The copper substrate has clearance holes 21121 to avoid the second component group 21117, and the copper substrate at least covers the projection areas of all MOSFETs 21113 and the current-carrying copper block 21114 on the second end face 21112. Through the above structural design, the requirement for the copper substrate to be in close contact with the second end face 21112 for heat conduction is met without affecting the placement of the second component group 21117 on the second end face 21112.

[0073] The first circuit board 2111 and the second circuit board 2112 perform different functions and have different requirements. The second circuit board 2112 has more conductive layers than the first circuit board 2111. The second circuit board 2112 undertakes key functions such as reducing voltage fluctuations during motor operation. It needs to handle relatively complex circuit connections and signal transmissions. More conductive layers provide more wiring space and path selection, making the circuit design more flexible, allowing for better placement of various electronic components and connection lines, effectively avoiding line crossings and interference, thereby improving circuit stability and reliability, and ensuring the accuracy of motor control. The width of the conductor layers on the second circuit board 2112 is smaller than the width of the conductor layers on the first circuit board 2111. The first circuit board 2111 has a relatively high power because it controls the voltage and current of the input motor. A wider conductor layer helps to reduce line loss and heat generation. The second circuit board 2112 needs to lay out more complex circuits, but space is limited. A smaller conductor layer width can achieve denser wiring on a limited circuit board area, increasing the integration of the circuit and making more efficient use of the circuit board space. This helps to reduce the size of the entire control device, meet the robot's design requirements for miniaturized parts, and make it easier to install in the limited space of the legs.

[0074] In addition to multiple sets of MOSFETs 21113, the high-voltage circuit board assembly 211 also includes a MOSFET driver 21115 corresponding to each set of MOSFETs 21113 and a first power supply chip 21116. Each MOSFET driver 21115 controls the switching of a set of MOSFETs 21113, and the first power supply chip 21116 converts the power supply voltage into the operating voltage required by the MOSFET driver 21115 and the low-voltage circuit board assembly 220. The high-voltage and low-voltage components are electrically isolated and voltage-matched through the first power supply chip 21116. This effectively prevents interference and damage to the low-voltage circuits that may be caused by high voltage, avoids the low-voltage system from going out of control due to high-voltage failure, ensures the safety of the robot control system, reduces the risk of electrical accidents, and protects the sensitive electronic components inside the robot and the stable operation of the entire system.

[0075] Based on the above embodiments, the low-voltage circuit board assembly 220 includes a low-voltage circuit board 222 and an isolation power conversion module 223 that electrically isolates the low-voltage circuit board 222 from the high-voltage circuit board assembly 211. The isolation power conversion module 223 is electrically connected to the first power chip 21116 to convert the voltage provided by the first power chip 21116 into the operating voltage required by the low-voltage circuit board 222. The first power chip 21116 converts 48V to 12V and outputs this 12V voltage to all MOSFET drivers 21115, and also outputs it to the isolation power conversion module 223. The isolation power conversion module 223 converts the 12V voltage to 5V to power other electrical components of the low-voltage circuit board assembly 220, ensuring that the low-voltage circuit board assembly 220 obtains a suitable and stable power supply. This effectively avoids problems such as component performance degradation, damage, or system failure caused by voltage mismatch, provides a reliable operating voltage environment for key components such as the MCU chip in the low-voltage area, ensures the stable operation of the low-voltage part, and thus improves the stability and reliability of the entire motor controller 200. Electrical isolation is achieved by making the reference ground the same as the PCB in the low-voltage area, significantly reducing electromagnetic interference from the high-voltage area to the low-voltage area. Interference factors such as voltage fluctuations and current changes in the high-voltage section are effectively blocked, preventing signal distortion, malfunctions, and other abnormalities caused by interference signals entering the low-voltage area, thus improving the system's anti-interference capability. Simultaneously, electrical isolation significantly enhances system safety, reducing the risk of safety accidents caused by high-voltage faults affecting the low-voltage section, providing strong protection for the safe operation of the legged robot. This design clearly delineates the high-voltage and low-voltage areas, offering significant advantages in system maintenance and upgrades. When problems occur, technicians can quickly locate whether the fault lies in the high-voltage or low-voltage section, and then perform targeted repairs or module replacements without large-scale system-wide troubleshooting and disassembly. This not only improves the efficiency of fault diagnosis and repair and reduces maintenance costs, but also facilitates functional expansion or upgrades without affecting the overall architecture, enhancing the system's flexibility and scalability.

[0076] In addition to the low-voltage circuit board 222 and the isolation power conversion module 223 that electrically isolates the low-voltage circuit board 222 from the high-voltage circuit board assembly 211, the low-voltage circuit board 222 is also equipped with an MCU chip 224, which is powered by a 5V to 3.3V power chip on the low-voltage circuit board 222. The high-voltage circuit board assembly 211 includes multiple sets of MOSFETs 21113, MOSFET drivers 21115 corresponding to each set of MOSFETs 21113, and digital isolation chips 21118 corresponding to the multiple MOSFET drivers 21115. The MCU chip 224 establishes signal interaction with the MOSFET drivers 21115 through the digital isolation chip 21118. The MOSFET is essentially a switching element, and the function of the MOSFET driver is to control the on and off of the MOSFET. By controlling the switching between multiple sets of MOSFETs, the motor can run normally. The MCU chip establishes signal interaction with the MOSFET drivers through the digital isolation chip 21118, so that the MCU chip can send signals to the MOSFET drivers to control the on and off of the MOSFETs, avoiding the MCU chip misinterpreting the switching signals of the MOSFETs due to the inconsistency of the reference ground between the low-voltage circuit board assembly and the high-voltage circuit board assembly.

[0077] Because the low-voltage circuit board assembly 220 and the high-voltage circuit board assembly 211 are physically isolated and have different reference grounds, the voltage converted by the first power chip 21116 cannot directly power the low-voltage components on the low-voltage circuit board assembly 211. The isolation power conversion module 223 achieves electrical isolation between the high-voltage and low-voltage areas, effectively preventing high-voltage interference with low-voltage signals. Furthermore, the voltage converted by the isolation power conversion module has the same reference ground as the low-voltage circuit board, thus powering the low-voltage components on the low-voltage circuit board and ensuring stable operation of components such as the MCU chip in the low-voltage section. Simultaneously, the digital isolation chip 21118 enables signal interaction between the MCU chip and the MOSFET driver, further enhancing the isolation effect between high and low voltage while ensuring signal transmission accuracy, thereby improving system reliability and anti-interference capabilities. Multiple MOSFETs and drivers in the high-voltage section are responsible for motor drive control, while the MCU chip in the low-voltage section can precisely control the signals of the high-voltage section through the digital isolation chip 21118. This structure enables close functional collaboration between the high-voltage and low-voltage components. The MCU chip can precisely control the MOSFET driver according to the robot's motion requirements, thereby achieving precise control of the motor and improving the accuracy and flexibility of the robot's leg movements. Clearly defining and modularizing the functions and connections of the high-voltage and low-voltage components facilitates system assembly, debugging, and maintenance. If a module malfunctions, it's possible to quickly pinpoint whether the problem lies with the high-voltage or low-voltage module, allowing for targeted repair or replacement, reducing maintenance difficulty and cost, and improving the maintainability and availability of the entire motor controller.

[0078] An isolation analog-to-digital converter chip 225 is also provided on the low-voltage circuit board 222. The isolation analog-to-digital converter chip 225 has two interfaces, one of which is connected to the 5V voltage converted from the isolation power conversion module 223, and the other is connected to the 12V to 5V voltage on the high-voltage circuit board assembly 211.

[0079] Based on the above embodiments, for the electrical connection between the high-voltage circuit board assembly 211 and the low-voltage circuit board assembly 220, this embodiment employs an electrical connection pin 226 on one of them and an electrical connection socket 227 that mates with the electrical connection pin 226 on the other. Specifically, the electrical connection pin 226 is provided on the low-voltage circuit board assembly 220, and the electrical connection socket 227 is provided on the high-voltage circuit board assembly 211, which is closest to the low-voltage circuit board assembly 220. Figure 6 As shown, if there are multiple sets of high-voltage circuit board assemblies 211, adjacent high-voltage circuit board assemblies 211 are also interconnected via electrical connection pins 226 and electrical connection sockets 227. This design of the electrical connection pins 226 and their mating electrical connection sockets 227 simplifies and facilitates the connection between them. During assembly, electrical connections can be achieved quickly and accurately, improving production efficiency and reducing assembly difficulty and time costs. When maintenance, inspection, or replacement of the high-voltage or low-voltage circuit board assembly 220 is required, this connection method facilitates disassembly and reinstallation. Technicians can easily separate or connect two circuit board assemblies without causing excessive interference or damage to other parts, which improves equipment maintainability and component replaceability, and reduces the difficulty of maintenance and upgrades.

[0080] Furthermore, the electrical connection pin 226 includes voltage signal pins 228 that transmit different voltage signals from the high-voltage circuit board assembly 211 to the low-voltage circuit board assembly 220 for detection. There are three sets of voltage signal pins 228, transmitting 48V, 12V, and 5V voltages respectively. By setting the voltage signal pins 228 to transmit different voltage signals from the high-voltage circuit board assembly 211 to the low-voltage circuit board assembly 220 for detection, effective monitoring of the voltage in the high-voltage section is achieved. This helps to promptly detect voltage anomalies in the high-voltage circuit, such as overvoltage and undervoltage, allowing for early adjustments or repairs, preventing equipment failures caused by voltage problems, and improving the safety and reliability of the entire device.

[0081] In addition to the above-mentioned technical solutions, a CAN chip and / or a 485 communication chip can also be installed on the low-voltage circuit board 222 of the low-voltage circuit board assembly 220 to facilitate communication connection between the user and the low-voltage circuit board assembly 220 as needed. A FLESH chip can also be installed on the low-voltage circuit board 222 for data storage after power failure.

[0082] This utility model also discloses a legged robot, which uses a drive motor equipped with the aforementioned motor controller to ensure that the legged robot has good motion performance.

[0083] Example 2

[0084] like Figures 7 to 12 The following is a second embodiment of the present invention, which is a legged robot using the motor controller described in the first embodiment. It includes a robot leg 1000 and a drive motor 100 disposed in the robot leg 1000. The drive motor 100 adopts the motor controller 200 of the technical solution in the first embodiment.

[0085] The drive motor 100 includes a housing 110 with a power cavity 111 inside and a power assembly 120 disposed in the power cavity 111. The entire housing 110 is cylindrical, and the power cavity 111 is located in the middle of the housing 110. The power assembly 120 includes a stator and a mover disposed in the power cavity 111. The drive axis of the mover extends out from the top of the housing 110 and connects to a set of bevel gears 122. The entire drive motor 100 is arranged along the length of the robot leg 1000, making full use of the space of the robot leg 1000.

[0086] A first receiving cavity 112 is provided at the tail of the housing 110. The opening of the first receiving cavity 112 is located on the end face of the tail of the housing 110. The motor controller 200 is fixed in the first receiving cavity 112 and is electrically connected to the power component 120 to control the power component 120. The motor controller 200 includes a high-voltage control component 210 and a low-voltage circuit board component 220 stacked along the rotation axis of the power component 120. The high-voltage control component 210 and the low-voltage circuit board component 220 are electrically connected and a first heat dissipation channel 230 is provided between them. This makes full use of the space along the length of the robot leg 1000, leaving sufficient space for the drive motor 100. Furthermore, placing the motor controller 200 in the first receiving cavity 112 at the tail of the housing 110 will not affect the operation and power output of the power component 120. The first heat dissipation channel 230 between the high-voltage control component 210 and the low-voltage circuit board component 220 can dissipate the heat generated during generator operation in a timely manner. Effective heat dissipation can prevent circuit failures and component damage caused by excessive temperature, improve the stability and service life of motors and control devices, and ensure the reliability of the robot leg 1000 device during long-term operation.

[0087] The high-voltage control component 210 includes at least one set of high-voltage circuit board components 211. The specific number of high-voltage circuit board components 211 is determined according to the requirements of the power component 120. Therefore, the high-voltage circuit board components 211 can be modularly configured to facilitate power adjustment and matching. The specific structures of the high-voltage circuit board components 211 and the low-voltage circuit board components 220 can refer to the scheme of Embodiment 1.

[0088] A removable end cap 130 is provided at the rear of the housing 110 to close the first receiving cavity 112. The depth of the first receiving cavity 112 can be set to accommodate a set of high-voltage circuit board assemblies 211 and a set of low-voltage circuit board assemblies 220. When at least two sets of high-voltage circuit board assemblies 211 are provided, the high-voltage circuit board assemblies 211 are still stacked along the rotation axis of the power assembly 120. At this time, part of the entire motor controller 200 will protrude from the first receiving cavity 112. A second receiving cavity 131 can be provided on the end cap 130 to accommodate the high-voltage control assembly 210 protruding from the first receiving cavity 112, that is, by replacing the end cap 130 with one containing the second receiving cavity 131. In this way, even if different numbers of high-voltage circuit board assemblies 211 are used, the housing 110 does not need to be replaced; only the matching end cap 130 needs to be replaced to meet the protection requirements of the motor controller 200.

[0089] Furthermore, a wiring notch 132 is provided on the end cap 130 to connect the second receiving cavity 131 to the outside, facilitating the wiring connection inside the robot leg 1000 device. This allows wires, cables, and other wire harnesses to pass through the second receiving cavity 131 more neatly and orderly to connect with other external devices, avoiding messy tangling of wire harnesses at the end cap 130. This simplifies installation and subsequent maintenance, and also reduces the risk of wear and short circuits caused by messy wiring. The wiring notch 132 design, while meeting wiring requirements, allows the end cap 130 to better fit with the housing 110, maintaining a relatively enclosed space environment in the second receiving cavity 131. This helps protect the high-voltage control components 210 inside the receiving cavity from external dust, moisture, and other impurities, reducing damage to the high-voltage control components 210 caused by external environmental factors and extending the service life of the device.

[0090] like Figure 8 , Figure 9As shown, the first receiving cavity 112 is provided with a wiring harness channel 114 communicating with the power cavity 111. The motor controller 200 and the power component 120 are electrically connected through the wiring harness channel 114. This design allows for orderly arrangement of the connecting wires, avoiding messy tangling inside the device. The clear and standardized wiring structure facilitates installation and maintenance, allowing staff to more easily inspect and replace the wiring, reducing maintenance difficulty and cost. Furthermore, the wiring harness channel 114 is located inside the housing 110, preventing the connecting wires between the motor controller 200 and the power component 120 from being exposed. The wiring harness channel 114 provides a relatively stable and safe space for the wires, preventing damage such as squeezing and friction during the movement of the robot leg 1000. This reduces the risk of circuit failure due to wire harness damage, ensuring the stability and reliability of electrical signal transmission between the motor controller 200 and the power component 120, thereby improving the overall operational stability of the leg device.

[0091] Furthermore, the cross-section of the motor controller 200 is adapted to the cross-section of the first receiving cavity 112. In this embodiment, the cross-section of the first receiving cavity 112 is circular, so the cross-section of the motor controller 200 is also circular. That is, both the high-voltage circuit board assembly 211 and the low-voltage circuit board assembly 220 are circular. Of course, in order to facilitate wiring and component arrangement, the cross-sections of the high-voltage circuit board assembly 211 and the low-voltage circuit board assembly 220 can also be roughly circular. For example, in this embodiment, the cross-section of the high-voltage circuit board assembly 211 is a semi-circular arc. However, it is also necessary to adapt to the cross-sectional shape of the first receiving cavity 112 as much as possible. This ensures that the motor controller 200 can be tightly installed in the first receiving cavity 112, improves space utilization, avoids loosening of internal wiring connections due to device shaking or displacement, ensures the stability of the electrical connection between the motor controller 200 and the power assembly 120, and thus ensures the reliability of the entire leg device operation. The first receiving cavity 112 has a groove on its side wall, and the groove passes through the power cavity 111 to form the wire harness channel 114. Compared with a simple connected structure, this groove design further standardizes the wire harness routing, allowing the wire harness to be arranged in an orderly manner along the groove, reducing mutual interference between wire harnesses, improving the stability of electrical signal transmission, and facilitating the inspection and management of the wire harness during installation and maintenance.

[0092] Based on the above embodiments, in order to ensure that a first heat dissipation channel 230 is maintained between the high-voltage control component 210 and the low-voltage circuit board component 220, a support column 240 can be provided between the high-voltage control component 210 and the low-voltage circuit board component 220; alternatively, a support column 240 can be provided within the first receiving cavity 112, with a through groove on the low-voltage circuit board component 220 to avoid the support column 240, and the high-voltage control component 210 abutting against the top of the support column 240, thereby achieving the purpose of separating the high-voltage control component 210 and the low-voltage circuit board component 220 from the first heat dissipation channel 230. When the high-voltage control component 210 includes at least two sets of high-voltage circuit board components 211, a support column 240 can also be provided between adjacent high-voltage circuit board components 211, or support columns 240 with different cross-sections can be used on the first receiving cavity 112 to achieve spacing, so that a second heat dissipation channel 231 is formed between adjacent high-voltage circuit board components 211, ensuring that there is also sufficient heat dissipation space between adjacent high-voltage circuit board components 211.

[0093] Although the low-voltage circuit board assembly 220 generates low heat, it still produces heat during operation and requires some heat dissipation. Therefore, a heat dissipation space is provided between the low-voltage circuit board 222 and the bottom surface of the first receiving cavity 112. Specifically, a fixing post 113 is provided on the end face of the first receiving cavity 112 near the power cavity 111, that is, the bottom surface of the first receiving cavity 112. The motor controller 200 is fixed on the fixing post 113, which ensures a stable connection between the motor controller 200 and the housing 110, and also provides heat dissipation space for the low-voltage circuit board assembly 220 located at the bottom. At least two fixing posts 113 can be provided to ensure that the motor controller 200 can be stably fixed to the housing 110.

[0094] Based on the above embodiments, the power assembly 120 is provided with a rotating shaft 121 extending into the first receiving cavity 112. This rotating shaft 121 rotates coaxially with the output shaft of the mover. The low-voltage circuit board 222 is provided with a speed sensor 221 for detecting the rotational speed of the rotating shaft 121. By setting the speed sensor 221 on the low-voltage circuit board assembly 220 to detect the rotational speed of the rotating shaft 121, the rotational speed information of the rotating shaft 121 in the power assembly 120 can be obtained in real time. This information can be fed back to the robot's control system, enabling the system to adjust the operating state of the drive motor 100 in a timely manner based on the rotational speed data, such as adjusting the output power and torque of the motor. In this way, the movement speed and force of the robot's legs 1000 can be precisely controlled, thereby achieving more precise and natural and smooth movements, and performing better in complex movement scenarios such as walking, running, and climbing.

[0095] Furthermore, a gear 122 can be installed on the rotating shaft 121 within the first receiving cavity 112. The speed sensor 221 is a Hall sensor that detects the speed of the gear 122. During the rotation of the gear 122, the change in the magnetic field between its teeth is accurately captured by the Hall sensor and then converted into an electrical signal output. This detection method can provide high-precision speed measurement results. Compared with other detection methods, it can more accurately reflect the actual speed of the rotating shaft 121, providing more accurate data support for the motion control of the robot's legs 1000 and ensuring the accuracy of the robot's movements.

[0096] By providing a first receiving cavity 112 at the tail of the housing 110 to house the motor controller 200, the spatial advantage of the drive motor 100 located within the robot leg 1000 in the longitudinal direction is fully utilized. Given the limited space in the robot leg 1000, the high-voltage control component 210 and the low-voltage circuit board component 220 of the motor controller 200 are stacked along the rotation axis of the power component 120, making full use of the space in the longitudinal direction of the drive motor 100. This layout avoids the dispersed arrangement of components in the horizontal or other directions, making the entire drive motor 100 structure more compact. Taking the example of a legged robot walking in narrow passages, the compact leg structure reduces the risk of collisions and improves the robot's maneuverability.

[0097] Other content not described in this embodiment can be found in Embodiment 1.

[0098] Example 3

[0099] like Figure 9 , Figure 10 , Figure 13 The following is a third embodiment of the present invention, which adds a heat dissipation structure to the motor controller 200 based on embodiments one and / or two.

[0100] The motor controller 200 generates a significant amount of heat during operation. If this heat cannot be dissipated promptly, the device temperature will continue to rise. Excessive temperature can severely impact the performance of electronic components, such as causing changes in their resistance, leading to alterations in circuit parameters and affecting control accuracy. It can also significantly shorten the lifespan of components, increasing the probability of malfunctions. The motor controller 200 is equipped with a heat sink 212, which is thermally connected to the housing 110. This heat sink quickly transfers the heat generated by the motor controller 200 to the housing 110, and then dissipates it into the surrounding environment, effectively reducing the device temperature, maintaining the normal operating environment for electronic components, and ensuring the stable operation of the motor controller 200. A stably operating motor controller 200 can precisely control the operation of the drive motor 100. For example, it can precisely adjust parameters such as motor speed and torque, making the leg movements of the legged robot smoother and more natural, with better accuracy and coordination. In complex motion scenarios, such as walking, running, and jumping, it can quickly respond to commands, improving the legged robot's motion performance and work efficiency.

[0101] By integrating the heat sink 212 with the motor controller 200 and directly connecting it to the housing 110 for thermal conductivity, a large additional space for heat dissipation is eliminated in the robot leg 1000, saving valuable internal space. This design makes the entire leg device more compact, allowing more functional modules to be integrated within a limited space, improving space utilization, and also helping to reduce the weight of the leg device, thereby improving the energy efficiency and mobility of the legged robot.

[0102] Furthermore, a fixing groove 115 is formed on the side wall of the first receiving cavity 112. The fixing groove 115 extends from the opening of the first receiving cavity 112 along the rotation shaft 121 of the drive motor 100 toward the bottom of the fixing groove 115. The fixing groove 115 cannot be arranged in a ring along the side wall of the first receiving cavity 112. There needs to be a partition in the middle. That is, in the circumference of the first receiving cavity 112, the fixing groove 115 can be an arc or multiple arcs arranged at intervals. In this way, the motor controller 200 can also play a limiting role in the circumference of the first receiving cavity 112. The heat sink 212 extends out of the drive assembly toward the side wall of the first receiving cavity 112. The portion of the heat sink 212 that extends beyond the drive assembly is slidably disposed in the fixing groove 115 along the axial direction of the power assembly 120. This facilitates the installation of the motor controller 200 into the first receiving cavity 112 along the axial direction of the power assembly 120. The fixing groove 115 serves as a guide for the installation of the motor controller 200. During the installation process, the installer can more easily and accurately install the heat sink 212 into the designated position, reducing the installation difficulty, improving the installation efficiency, reducing heat dissipation problems caused by improper installation, and helping to improve the overall assembly quality of the robot leg 1000 device.

[0103] Furthermore, the sidewall of the heat sink 212 is tightly attached to the inner sidewall of the fixing groove 115, transferring heat from the heat sink 212 to the fixing groove 115. This tight attachment can be achieved by increasing the roughness of the sidewall of the heat sink 212 and the inner sidewall of the fixing groove 115, or by adding thermal grease between the two to eliminate gaps, allowing heat from the heat sink 212 to be quickly transferred to the fixing groove 115 and dissipated through the housing 110. This tight-fitting design reduces thermal resistance during heat transfer, significantly improving heat dissipation efficiency compared to situations where there are gaps between the heat sink 212 and the fixing groove 115. Stable heat dissipation ensures that the motor controller 200 operates within a suitable temperature range, preventing performance degradation or malfunction due to overheating, thereby guaranteeing the stable operation of the robot leg 1000 device.

[0104] Based on the above embodiments, the motor controller 200 includes at least two circuit boards equipped with heat sinks 212. For example, the motor controller 200 includes two sets of high-voltage circuit board assemblies 211, each of which is equipped with a heat sink 212. In this case, it is necessary to separate the two sets of high-voltage circuit board assemblies 211 to ensure that their heat can be dissipated. To separate the two sets of high-voltage circuit boards, in addition to using support columns 240, a fixing groove 115 can also be used. The fixing groove 115 can be set as a stepped groove, extending axially from the opening of the first receiving cavity 112. The stepped groove includes multiple sections of grooves with decreasing widths. In this way, the upper heat sink 212 can abut against the steps, thereby increasing the distance between it and the lower heat sink 212, and realizing the separation of the two layers of high-voltage circuit board assemblies 211. Of course, when there are multiple sets of high-voltage circuit board assemblies 211, the number of steps in the fixing groove 115 can be increased accordingly.

[0105] A well-designed heat dissipation system reduces the risk of malfunctions in the motor controller 200 due to overheating, thus lowering maintenance frequency and costs. Simultaneously, because electronic components operate at suitable temperatures, their aging process is slowed, extending the lifespan of the motor controller 200 and the entire leg assembly. This reduces the hassle and expense of frequent component replacements, improving the reliability and economy of the legged robot.

[0106] Other content not described in this embodiment can be found in Embodiment 1 or Embodiment 2.

[0107] The above description is only a specific embodiment of the present utility model, but the technical features of the present utility model are not limited thereto. Any changes or modifications made by those skilled in the art within the scope of the present utility model are covered by the patent scope of the present utility model.

Claims

1. A motor controller for a legged robot, characterized in that, The system includes a low-voltage circuit board assembly and a high-voltage circuit board assembly electrically connected to the low-voltage circuit board assembly. The high-voltage circuit board assembly and the low-voltage circuit board assembly are stacked one on top of the other and a first heat dissipation channel is provided between them. The motor controller of the legged robot also includes a support column supported between the high-voltage circuit board assembly and the low-voltage circuit board assembly to fix the height of the first heat dissipation channel between the high-voltage circuit board assembly and the low-voltage circuit board assembly.

2. The motor controller for the legged robot as described in claim 1, characterized in that, The high-voltage circuit board assembly includes a first circuit board and a second circuit board. The first circuit board is used to control the voltage and current input to the power component, and the second circuit board is used to reduce voltage fluctuations during the operation of the drive motor.

3. The motor controller for the legged robot as described in claim 2, characterized in that, The first circuit board includes a PCB substrate, a first component group, and a second component group. The PCB substrate includes a first end face and a second end face. The first component group is disposed on the first end face, and the second component group is disposed on the second end face.

4. The motor controller for the legged robot as described in claim 3, characterized in that, The first component group includes multiple groups of MOSFETs. The height of all components in the first component group except for the MOSFETs is lower than the height of the MOSFETs protruding from the first end face. All MOSFETs share a single heat sink.

5. The motor controller for the legged robot as described in claim 3, characterized in that, The first component group includes multiple sets of MOSFETs and a current-carrying copper block protruding from the first end face. The second circuit board includes a copper substrate, which is attached to the second end face for heat dissipation of the MOSFETs and the current-carrying copper block.

6. The motor controller for the legged robot as described in claim 5, characterized in that, The second component group avoids the projection area of ​​all MOS transistors and current-carrying copper blocks on the second end face. The copper substrate has a clearance hole to avoid the second component group. The copper substrate at least covers the projection area of ​​all MOS transistors and current-carrying copper blocks on the second end face.

7. The motor controller for the legged robot as described in claim 2, characterized in that, The second circuit board has a greater number of conductive layers than the first circuit board.

8. The motor controller for the legged robot as described in claim 2, characterized in that, The width of the conductive layer on the second circuit board is smaller than the width of the conductive layer on the first circuit board.

9. The motor controller for the legged robot as described in claim 1, characterized in that, The high-voltage circuit board assembly includes multiple sets of MOSFETs, a MOSFET driver corresponding to each set of MOSFETs, and a first power chip. The first power chip converts the power supply voltage into the operating voltage required by the MOSFET driver and the low-voltage circuit board assembly.

10. The motor controller for the legged robot as described in claim 9, characterized in that, The low-voltage circuit board assembly includes a low-voltage circuit board and an isolation power conversion module that electrically isolates the low-voltage circuit board from the high-voltage circuit board assembly. The isolation power conversion module is electrically connected to a first power chip to convert the voltage provided by the first power chip into the operating voltage required by the low-voltage circuit board.

11. The motor controller for the legged robot as described in claim 1, characterized in that, The low-voltage circuit board assembly includes a low-voltage circuit board and an isolation power conversion module that electrically isolates the low-voltage circuit board from the high-voltage circuit board assembly. The low-voltage circuit board is equipped with an MCU chip. The high-voltage circuit board assembly includes multiple sets of MOSFETs, MOSFET drivers corresponding to each set of MOSFETs, and digital isolation chips corresponding to the multiple MOSFET drivers. The MCU chip establishes signal interaction with the MOSFET drivers through the digital isolation chips.

12. The motor controller for the legged robot as described in claim 1, characterized in that, One of the high-voltage circuit board assembly and the low-voltage circuit board assembly is provided with electrical connection pins, and the other is provided with an electrical connection socket that mates with the electrical connection pins.

13. The motor controller for the legged robot as described in claim 12, characterized in that, The electrical connection pins include voltage signal pins that transmit different voltage signals from the high-voltage circuit board assembly to the low-voltage circuit board assembly for detection.

14. A legged robot, characterized in that, The drive motors for the joints of the legged robot use the motor controller described in any one of claims 1 to 13.

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