Chemical mechanical polishing equipment and chemical mechanical polishing system

Abstract

The embodiment of the utility model provides chemical mechanical polishing equipment and a chemical mechanical polishing system, and the chemical mechanical polishing equipment comprises a main shaft; the cover plate is connected with the main shaft; the cross plate is located below the cover plate and can rotate around the main shaft, and each supporting plate of the cross plate is provided with a hole used for being connected with a polishing head; the cover plate is provided with a plurality of holes, each nozzle assembly is arranged around the corresponding hole, and nozzles in the nozzle assemblies face the lower surface of the cover plate so as to clean liquid splashed to the lower surface. By the adoption of the technical scheme, the problem that grinding liquid is sputtered to the cover plate to form crystals is solved.

Description

Technical Field

[0001] This disclosure relates to the field of chemical mechanical polishing technology, and more particularly to a chemical mechanical polishing device and a chemical mechanical polishing system. Background Technology

[0002] After the chemical mechanical polishing (CMP) equipment finishes polishing, the polishing pad surface is cleaned with high-pressure water to prevent the polishing slurry from remaining on the pad and forming crystals. During the polishing process or while cleaning the polishing pad surface with high-pressure water, the polishing slurry may splash onto the lower surface of the cover plate, where it may condense into large, sea salt-like crystals. These crystals can fall onto the polishing pad during wafer polishing, scratching the wafer and rendering it unusable.

[0003] Therefore, how to provide a technical solution to solve the problem of crystal formation caused by polishing slurry splashing onto the cover plate has become an urgent technical problem to be solved. Utility Model Content

[0004] In view of this, embodiments of the present disclosure provide a chemical mechanical polishing apparatus and a chemical mechanical polishing system that can solve the problem of polishing slurry splashing onto the cover plate and forming crystals.

[0005] To address the aforementioned technical problems, this disclosure provides a chemical mechanical grinding apparatus, comprising:

[0006] spindle;

[0007] Cover plate, connected to the main shaft;

[0008] A cross plate, located below the cover plate and rotatable about the main axis, each support plate of the cross plate having holes for connecting a polishing head;

[0009] Multiple sets of nozzle assemblies, each set of nozzle assemblies arranged around a single hole, with the nozzles in the nozzle assemblies facing the lower surface of the cover plate to clean up liquid splashed onto the lower surface.

[0010] Optionally, the nozzle assembly includes: a retainer;

[0011] The fastener has a fixing part that fits against the support plate of the cross plate and is provided with a first adjustment hole for inserting a bolt to fix the fastener to the support plate.

[0012] Optionally, the fastener also has a connecting portion;

[0013] The connecting part has a first end and a second end. The first end of the connecting part is connected to the fixing part, and the second end of the connecting part extends toward the cover plate and has a second adjustment hole.

[0014] Optionally, the nozzle assembly includes: a connecting adjustment member;

[0015] The connecting adjustment member has a first end and a second end. The first end of the connecting adjustment member has an adjustment hole and is coupled to the second end of the connecting part.

[0016] The second end of the connecting adjustment member is provided with a mounting hole for the nozzle component.

[0017] Optionally, the nozzle assembly further includes: a fastener;

[0018] The fastener passes through the adjustment hole of the connecting adjustment member and the second adjustment hole of the connecting part, and is used to fix the adjusted connecting adjustment member and the adjusted connecting part after adjusting the angle between the plane where the connecting adjustment member and the fixed part are located.

[0019] Optionally, the nozzle assembly further includes: a nozzle;

[0020] The nozzle passes through the mounting hole and is connected to an external water supply pipe for spraying cleaning liquid onto the lower surface of the cover plate.

[0021] Optionally, the number of nozzle assemblies in each support plate of the cross plate is four.

[0022] Optionally, a single polishing head is connected below some or all of the support plates of the cross plate.

[0023] A chemical mechanical grinding system, optionally comprising:

[0024] The aforementioned chemical mechanical grinding equipment;

[0025] Water supply pipes are coupled to the nozzle assembly and are used to supply cleaning liquid to the nozzle assembly.

[0026] Optionally, each of the water supply pipes is equipped with a flow regulating valve to regulate the flow rate of the liquid in the water supply pipe or to cut off the liquid flow.

[0027] Optionally, the chemical mechanical grinding system further includes:

[0028] High-pressure water pipelines are connected to each water supply pipe separately;

[0029] The pneumatic valve, located upstream of the connection between the water supply pipeline and the high-pressure water pipeline, is used to regulate the flow rate of liquid in the high-pressure water pipeline or to cut off the flow of liquid.

[0030] Compared with the prior art, the technical solution of the present disclosure has the following advantages:

[0031] In the liquid level monitoring pipeline provided in this embodiment, a chemical mechanical polishing (CMP) device and a CMP system are used to clean the lower surface of the cover plate. The CMP device contains multiple nozzle assemblies that spray liquid onto the cover plate above their respective cross-shaped plates to clean the polishing fluid splashed onto the cover plate during the polishing process and the cleaning of the polishing pad. This solves the problem of polishing fluid splashing onto the cover plate and forming crystals. Attached Figure Description

[0032] To more clearly illustrate the technical solutions of the embodiments of this specification, the drawings used in the description of the embodiments of this specification or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this specification. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0033] Figure 1 A top view schematic diagram of a partial structure of a chemical mechanical grinding apparatus according to an embodiment of the present disclosure is shown;

[0034] Figure 2 A simplified schematic diagram of a partial structure of a chemical mechanical grinding apparatus according to an embodiment of the present disclosure is shown;

[0035] Figure 3 A cross-sectional schematic diagram of a nozzle assembly fixture for a chemical mechanical grinding apparatus according to an embodiment of the present disclosure is shown;

[0036] Figure 4 A side view of a nozzle assembly of a chemical mechanical grinding apparatus according to an embodiment of the present disclosure is shown;

[0037] Figure 5 A cross-sectional schematic diagram of the connection adjustment component of a nozzle assembly in a chemical mechanical grinding apparatus according to an embodiment of the present disclosure is shown;

[0038] Figure 6 This invention discloses a schematic diagram showing the connection between the connecting portion of the fixing member and the connecting adjustment member in three nozzle assemblies according to embodiments of the present disclosure;

[0039] Figure 7 A schematic diagram of some piping connections of a chemical mechanical grinding system according to an embodiment of the present disclosure is shown.

[0040] Explanation of reference numerals in the attached figures:

[0041] Spindle 100;

[0042] Crossboard 200;

[0043] Hole 300;

[0044] Polishing head 400;

[0045] Nozzle assembly 500;

[0046] Fixing part 511, first adjusting hole 512, connecting part 513, second adjusting hole 514;

[0047] Connecting adjustment component 520, adjustment hole 521, mounting hole 522;

[0048] Nozzle 530, fastener 540;

[0049] Abrasive pad 600;

[0050] Grinding pad dresser 700;

[0051] High-pressure water pipeline 811, water supply pipeline 812, pneumatic valve 821, flow regulating valve 822. Detailed Implementation

[0052] The technical solutions described herein will be described in detail below with reference to specific embodiments and accompanying drawings. The embodiments described herein are specific implementations of this disclosure and are used to illustrate the concept of this disclosure; these descriptions are illustrative and exemplary and should not be construed as limiting the implementation methods or the scope of protection of this disclosure. In addition to the embodiments described herein, those skilled in the art can employ other obvious technical solutions based on the content disclosed in the claims and specification of this application. These technical solutions include those that make any obvious substitutions and modifications to the embodiments described herein.

[0053] It should be noted that the accompanying drawings in this embodiment are schematic diagrams used to illustrate the concept of this disclosure, and to schematically show the shapes of the various parts and their interrelationships. It should be understood that, in order to clearly show the structure of the various components of this disclosure, the drawings are not drawn to the same scale, and the same reference numerals are used to indicate the same parts in the drawings.

[0054] As described in the background section, after the chemical mechanical polishing (CMP) equipment finishes polishing, the surface of the polishing pad is cleaned with high-pressure water to prevent the polishing slurry from remaining on the pad and forming crystals. During the polishing process or while cleaning the polishing pad surface with high-pressure water, the polishing slurry may splash onto the lower surface of the cover plate, where it condenses into large, sea salt-like crystals. These crystals can fall onto the polishing pad during wafer polishing, scratching the wafer and rendering it unusable.

[0055] To address the aforementioned technical problems, this disclosure provides a chemical mechanical polishing (CMP) apparatus. By configuring the CMP apparatus, multiple sets of nozzle assemblies are installed on a cross-shaped plate below the cover plate for cleaning liquid splashed onto the lower surface of the cover plate. The multiple sets of nozzle assemblies in the CMP apparatus can spray liquid onto the lower surface of the cover plate above the support plate of their respective cross-shaped plates to clean the polishing fluid splashed onto the lower surface of the cover plate during the polishing process and / or cleaning of the polishing pad. Therefore, it effectively addresses the problem of polishing fluid splashing onto the cover plate and forming crystals.

[0056] To make the above-described objects, features and advantages of this disclosure more apparent and understandable, a clear and complete illustrative description of this disclosure is provided below in conjunction with the accompanying drawings.

[0057] See Figure 1 , Figure 1 A top view schematic diagram of a partial structure of a chemical mechanical grinding apparatus according to an embodiment of the present disclosure is shown.

[0058] In this embodiment, the chemical mechanical polishing equipment may include: a spindle 100, a cover plate (not shown), a cross plate 200, a hole 300, a polishing head 400, and a nozzle assembly 500.

[0059] The cover plate is connected to the main shaft 100; the cross plate 200 is located below the cover plate and can rotate around the main shaft 100; each support plate of the cross plate 200 has a hole 300 for connecting the polishing head 400; the polishing head 400 can be used to pick up the wafer, apply pressure to the wafer and contact it with the polishing pad 600, and drive the wafer to rotate.

[0060] In addition, a polishing pad conditioner 700 is provided above the polishing pad 600. The polishing pad conditioner 700 can be used to repair the polishing pad, remove particles and reaction byproducts generated during the chemical mechanical polishing process on the polishing pad 600, and prevent these substances from damaging the wafer.

[0061] In some embodiments, the cross-shaped plate 200 is provided with a plurality of nozzle assemblies 500, each nozzle assembly 500 being arranged around a single hole 300, and the nozzles in the nozzle assembly 500 facing the lower surface of the cover plate. The nozzles are capable of spraying cleaning fluid to clean up liquid splashed onto the lower surface of the cover plate.

[0062] In some embodiments, the nozzle corresponds one-to-one with the nozzle assembly 500.

[0063] Specifically, each nozzle assembly 500 has only a single nozzle and other components directly connected or coupled to that nozzle, in order to improve the control flexibility of the nozzle in each nozzle assembly 500.

[0064] In some embodiments, each group of nozzle assemblies 500 corresponds to the support plate of the cross plate 200, and the number of nozzle assemblies 500 is four groups.

[0065] Furthermore, each nozzle assembly 500 can correspond one-to-one with the support plate of the cross plate 200, and the cross plate 200 can have four support plates, each corresponding to one of the four protruding ends of the cross.

[0066] Specifically, during the cleaning of the abrasive pad 600, multiple sets of nozzle assemblies 500 provided on each of the supports of the cross plate 200 can spray cleaning fluid onto the lower surface of the cover plate through the nozzles to clean the liquid splashed onto the lower surface of the cover plate.

[0067] Combined with reference Figures 1 to 7 ,in, Figure 2 A simplified schematic diagram of a partial structure of a chemical mechanical grinding apparatus according to an embodiment of the present disclosure is shown; Figure 3 A cross-sectional schematic diagram of a nozzle assembly fixture for a chemical mechanical grinding apparatus according to an embodiment of the present disclosure is shown; Figure 4 A side view of a nozzle assembly of a chemical mechanical grinding apparatus according to an embodiment of the present disclosure is shown; Figure 5 A cross-sectional schematic diagram of the connection adjustment component of a nozzle assembly in a chemical mechanical grinding apparatus according to an embodiment of the present disclosure is shown; Figure 6 This invention discloses a schematic diagram showing the connection between the connecting portion of the fixing member and the connecting adjustment member in three nozzle assemblies according to embodiments of the present disclosure; Figure 7 A schematic diagram of some piping connections of a chemical mechanical grinding system according to an embodiment of the present disclosure is shown.

[0068] Combination Figure 1 and Figure 7 In some embodiments, a chemical mechanical grinding system is provided, comprising: a chemical mechanical grinding apparatus; and a water supply pipe 812 (see reference). Figure 7 The water supply pipe 812 is connected to the nozzle assembly 500 (see reference). Figure 1 It is coupled to supply cleaning fluid to the nozzle assembly 500 in the chemical mechanical grinding apparatus to clean the liquid splashed onto the lower surface of the cover plate.

[0069] In some embodiments, the nozzle assembly 500 includes: a fixing member; the fixing member having a fixing portion 511 that abuts against the support plate of the cross plate 200.

[0070] In some embodiments, the fastener is provided with a first adjustment hole 512, which is used to pass a bolt to fix the nozzle assembly 500 to the support plate.

[0071] Furthermore, in some embodiments, the nozzle assembly 500 can be rotated about a bolt passing through the first adjustment hole 512 to adjust the direction and / or angle of the nozzle assembly 500, so that the cleaning fluid sprayed by each set of nozzle assemblies 500 can clean a larger area of ​​the lower surface of the cover plate.

[0072] In some embodiments, the fixing part 511 has a plurality of the first adjustment holes 512 for threading bolts, which can fix the nozzle assembly 500 on the support plate.

[0073] In some embodiments, the fixing part 511 can also be fixed and / or rotated by a detachable connection such as snap-fit, or fixed on the support plate by a non-detachable connection such as welding, bonding, or integral molding.

[0074] In some embodiments, the fastener further includes a connecting portion 513; the connecting portion 513 has a first end and a second end, the first end of the connecting portion 513 is connected to the fastener 511, the second end of the connecting portion 513 extends toward the cover plate and has a second adjustment hole 514.

[0075] Specifically, the first end of the connecting part 513 is connected to the fixing part 511, and the connecting part 513 and the fixing part 511 are integrally formed. The connecting part 513 extends a second end from the fixing part 511 toward the cover plate, and the second end of the connecting part 513 is provided with a second adjustment hole 514 for connecting and fixing other components of the nozzle assembly 500.

[0076] It should be noted that the connecting part 513 can be perpendicular to the fixing part 511, or it can be at a certain angle to the fixing part 511.

[0077] In practical implementation, by setting the connecting part 513 perpendicular to the fixing part 511, external forces from different directions can be effectively dispersed and resisted, thereby enhancing the stability of the entire structure.

[0078] In some embodiments, one of the fasteners has a plurality of the connecting portions 513.

[0079] In one specific embodiment, one of the fasteners has two connecting portions 513, and the two connecting portions 513 are parallel to each other.

[0080] In practical implementation, by setting the two connecting parts 513 to be parallel to each other, the force at the connection point of the connecting part 513 with other components can be more evenly distributed, thereby increasing the stability of the components and improving the quality of the product.

[0081] In some embodiments, the nozzle assembly 500 includes a connecting adjustment member 520; the connecting adjustment member 520 has a first end and a second end, the first end of the connecting adjustment member 520 has an adjustment hole 521 and is coupled to the second end of the connecting portion 513.

[0082] The adjustment hole 521 at the first end of the connecting adjustment member 520 is the same size as the second adjustment hole 514 at the second end of the connecting part 513.

[0083] It should be noted that the connecting adjustment member 520 has one or more first ends, as described in some embodiments, see [link to previous section]. Figure 6 The parts connected by the dashed lines and the double-headed arcs are the same components, and the number of connecting parts 513 is one or two. As shown in the middle sub-figure, the first end of one of the connecting adjustment members 520 is located between the two connecting parts 513, and the fastener 540 passes through the connecting part 513 and the connecting adjustment member 520, fixing the connecting part 513 and the connecting adjustment member 520 together.

[0084] The connecting part 513 and the connecting adjustment member 520 are fitted together. This arrangement allows for adjustment of the relative angle between the connecting adjustment member 520 and the connecting part 513, and also allows the two components to be fixed together.

[0085] In some embodiments, the fixing member and the connecting adjustment member 520 are integrally formed. The nozzle 530, installed in the mounting hole 522 of the connecting adjustment member 520, faces the lower surface of the cover plate. The integrally formed structure of the fixing member and the connecting adjustment member 520 enhances the structural strength and stability of the nozzle assembly 500.

[0086] In some embodiments, the second end of the connecting adjustment member 520 is provided with a mounting hole 522 for a nozzle component. The size and shape of the mounting hole 522 are adapted to the nozzle 530 and can be used to install the nozzle 530.

[0087] In some embodiments, the nozzle assembly 500 further includes a fastener 540; the fastener 540 passes through the adjustment hole 521 of the connecting adjustment member 520 and the second adjustment hole 514 of the connecting portion 513.

[0088] In some embodiments, the fastener 540 is a bolt and a nut.

[0089] Specifically, the bolt passes through the adjustment hole 521 of the connecting adjustment member 520 and the second adjustment hole 514 of the connecting part 513. After adjusting the angle between the plane where the connecting adjustment member 520 and the fixed part 511 are located, the nut is used to fix the adjusted connecting adjustment member 520 and the adjusted connecting part 513.

[0090] It should be noted that the above examples do not constitute a limitation on the fastener 540. In some embodiments, the fastener 540 may also be a pin and a nut.

[0091] Combined with reference Figure 4 and Figure 7 In some embodiments, the nozzle assembly 500 further includes: a nozzle 530 ( Figure 4 The nozzle 530 passes through the mounting hole 522 and is connected to the external water supply pipe 812 (see reference). Figure 7 A connection is provided for spraying cleaning liquid onto the lower surface of the cover plate.

[0092] The nozzle 530 has a first end and a second end. The first end of the nozzle 530 is connected to an external water supply pipe 812, which supplies cleaning liquid to the nozzle 530. The second end of the nozzle 530 faces the lower surface of the cover plate, and can spray cleaning liquid onto the lower surface of the cover plate to clean liquid splashed onto the lower surface of the cover plate.

[0093] In some embodiments, the nozzle assembly 500 is made of one or more of the following materials: rubber, polyethylene, polyvinyl chloride, polytetrafluoroethylene, polyvinylidene fluoride, and polycarbonate.

[0094] In some embodiments, the number of nozzle assemblies 500 on each support plate of the cross plate 200 is four.

[0095] It should be noted that the above examples do not constitute a limitation on the number of nozzle assemblies 500 on each support plate of the cross plate 200. In addition to the four shown in the above examples, the number of nozzle assemblies 500 on each support plate of the cross plate 200 can also be multiple, such as two, three, or five.

[0096] In some embodiments, refer to Figure 1 Each of the cross plates 200 has a single polishing head 400 connected to the underside of some or all of the support plates.

[0097] In one specific embodiment, a polishing pad 600 is provided below the polishing head 400 of each support plate of the cross plate 200, and one of the polishing heads 400 does not have the polishing pad 600 below it. The cross plate 200 rotates along the main shaft 100 to adjust its position.

[0098] Specifically, each support plate of the cross plate 200 is connected to a polishing head 400, and the polishing pad 600 is disposed below three of the polishing heads 400. This design ensures maximum efficiency in wafer polishing, enabling the polishing of three wafers at once, or the use of different polishing methods on the three polishing pads 600. Furthermore, by omitting the polishing pad 600 below one of the polishing heads 400, the wafer can be retrieved or held below the polishing head 400 without the polishing pad 600, effectively reducing the impact on the ongoing polishing process during wafer retrieval or holding, and improving production efficiency.

[0099] In some embodiments, refer to Figure 7 A chemical mechanical grinding system also includes a high-pressure water pipeline 811, which is connected to each water supply pipeline 812.

[0100] In one specific embodiment, there are four high-pressure water pipes 811, that is, each support plate of the cross plate 200 corresponds to one high-pressure water pipe 811, which is used to supply cleaning fluid to clean the liquid splashed onto the lower surface of the cover plate.

[0101] In some embodiments, the high-pressure water pipe 811 is equipped with a pneumatic valve 821 located upstream of the connection between the water supply pipe 812 and the high-pressure water pipe 811, for adjusting the flow rate of liquid in the high-pressure water pipe 811 or cutting off the liquid flow. This arrangement allows for precise control of the flow rate of liquid in the high-pressure water pipe 811 on each support of the cross plate 200.

[0102] In some embodiments, see continue to see Figure 7 (The arrow points to the direction of liquid flow). Each of the water supply pipes 812 is equipped with a flow regulating valve 822, which is used to regulate the flow rate of the liquid in the water supply pipe 812 or to cut off the liquid flow.

[0103] In one specific embodiment, each support plate of the cross plate 200 is provided with four water supply pipes 812, and the four water supply pipes 812 are connected to the high-pressure water pipe 811 corresponding to the support plate.

[0104] Specifically, when cleaning the polishing pad 600, while the high-pressure water pipe 811 corresponding to each support plate of the cross plate 200 is cleaning the polishing pad 600, the four water supply pipes 812 connected to the high-pressure water pipe 811 provide cleaning liquid to the water spray assembly, which can clean the liquid splashed onto the lower surface of the cover plate while cleaning the polishing pad 600.

[0105] It should be understood that the term "and / or" in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this article indicates that the preceding and following related objects have an "or" relationship.

[0106] In the embodiments of this application, "multiple" refers to two or more.

[0107] The descriptions of "first," "second," etc., appearing in the embodiments of this application are for illustrative purposes and to distinguish the objects being described. They have no order and do not indicate any special limitation on the number of devices in the embodiments of this application, nor do they constitute any limitation on the embodiments of this application.

[0108] It should be noted that the sequence number of each step in this embodiment does not represent a limitation on the execution order of each step.

[0109] While the embodiments disclosed herein are as described above, this disclosure is not limited thereto. Any person skilled in the art can make various alterations and modifications without departing from the spirit and scope of this disclosure; therefore, the scope of protection of this disclosure should be determined by the scope defined in the claims.

Claims

1. A chemical mechanical grinding apparatus, characterized in that, include: spindle; Cover plate, connected to the main shaft; A cross plate, located below the cover plate and rotatable about the main axis, each support plate of the cross plate having holes for connecting a polishing head; Multiple sets of nozzle assemblies, each set of nozzle assemblies arranged around a single hole, with the nozzles in the nozzle assemblies facing the lower surface of the cover plate to clean up liquid splashed onto the lower surface.

2. The chemical mechanical grinding apparatus according to claim 1, characterized in that, The nozzle assembly includes: a retainer; The fastener has a fixing part that fits against the support plate of the cross plate and is provided with a first adjustment hole for inserting a bolt to fix the fastener to the support plate.

3. The chemical mechanical grinding apparatus according to claim 2, characterized in that, The fastener also has a connecting portion; The connecting part has a first end and a second end. The first end of the connecting part is connected to the fixing part, and the second end of the connecting part extends toward the cover plate and has a second adjustment hole.

4. The chemical mechanical grinding apparatus according to claim 3, characterized in that, The nozzle assembly includes: a connecting adjustment element; The connecting adjustment member has a first end and a second end. The first end of the connecting adjustment member has an adjustment hole and is coupled to the second end of the connecting part. The second end of the connecting adjustment member is provided with a mounting hole for the nozzle component.

5. The chemical mechanical grinding apparatus according to claim 4, characterized in that, The nozzle assembly further includes: fasteners; The fastener passes through the adjustment hole of the connecting adjustment member and the second adjustment hole of the connecting part, and is used to fix the adjusted connecting adjustment member and the adjusted connecting part after adjusting the angle between the plane where the connecting adjustment member and the fixed part are located.

6. The chemical mechanical grinding apparatus according to claim 4, characterized in that, The nozzle assembly further includes: a nozzle; The nozzle passes through the mounting hole and is connected to an external water supply pipe for spraying cleaning liquid onto the lower surface of the cover plate.

7. The chemical mechanical grinding apparatus according to claim 1, characterized in that, The number of nozzle assemblies in each support plate of the cross plate is four.

8. The chemical mechanical grinding apparatus according to claim 1, characterized in that, Each of the cross plates has a single polishing head connected to the underside of some or all of its support plates.

9. A chemical mechanical grinding system, characterized in that, include: The chemical mechanical grinding apparatus as described in any one or more of claims 1 to 8; Water supply pipes are coupled to the nozzle assembly and are used to supply cleaning liquid to the nozzle assembly.

10. The chemical mechanical grinding system according to claim 9, characterized in that, Each of the aforementioned water supply pipes is equipped with a flow regulating valve, which is used to regulate the flow rate of the liquid in the water supply pipe or to cut off the liquid flow.

11. The chemical mechanical grinding system according to claim 9, characterized in that, Also includes: High-pressure water pipelines are connected to each water supply pipe separately; The pneumatic valve, located upstream of the connection between the water supply pipeline and the high-pressure water pipeline, is used to regulate the flow rate of liquid in the high-pressure water pipeline or to cut off the flow of liquid.

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