TO structure of high-power laser
By using oxygen-free copper material and an improved connection structure, the heat dissipation problem of the TO structure in high-power lasers was solved, improving luminous efficiency and lifespan while reducing costs.
Patent Information
- Application Number
- CN202423290369.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-31
- Publication Date
- 2026-01-23
- Estimated Expiration
- 2034-12-31
AI Technical Summary
Existing high-power laser TO structures have poor heat dissipation, resulting in low luminous efficiency and short lifespan. Furthermore, expensive metal BOX structures or materials with low thermal conductivity cannot meet the low-cost requirements.
Oxygen-free copper is used as the socket and heat sink. The LD chip is horizontally mounted. A metal connecting ring is provided between the Kovar material cap and the oxygen-free copper socket to improve the heat dissipation path and avoid the problem of material incompatibility.
It improves the luminous efficiency and lifespan of the laser, while reducing costs and achieving good heat dissipation.
Smart Images
Figure CN223828893U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of optoelectronics, specifically to the field of high-power lasers. Background Technology
[0002] As is well known, the heat dissipation effect of a laser affects its luminous efficiency and lifespan. Figure 1 As shown, the existing laser TO structure consists of an LD chip, heat sink, socket, and cap. The LD chip is vertically mounted, and the LD emits light vertically. Existing designs either use an expensive metal box structure or use SPCC (cold-rolled carbon steel plate) with low thermal conductivity (50-55 W / (m·K)) as the substrate for heat conduction. According to the thermal resistance formula: Θ = length L / (thermal conductivity * area), this vertical mounting method results in a long heat dissipation path and low heat dissipation efficiency (the heat dissipation principle is as follows). Figure 2 The two issues mentioned above are acceptable for high-power laser packaging with low cost and high heat dissipation requirements. Utility Model Content
[0003] The purpose of this invention is to provide a high-power laser TO structure with good heat dissipation and low cost.
[0004] To achieve the above objectives, this utility model provides a high-power laser TO structure, which consists of an LD chip, a heat sink, a socket, and a cap. The socket and heat sink are made of oxygen-free copper. The LD chip is horizontally attached to the heat sink, and the light-emitting port of the LD chip faces the light-emitting window opened on the side wall of the cap. A Kovar metal connecting ring is provided between the socket and the cap.
[0005] After adopting the above solution, the structure of this utility model has good heat dissipation effect, improves the luminous efficiency of the laser and reduces the impact of waste heat accumulation on the power efficiency, lifespan and thermal failure of the laser; since it does not use an expensive metal BOX structure, the cost is low. Attached Figure Description
[0006] Figure 1 This is a schematic diagram of an existing laser TO structure;
[0007] Figure 2 Schematic diagram of heat dissipation principle for an existing laser (TO);
[0008] Figure 3 This is a sectional view showing the structure of this utility model;
[0009] Figure 4 This is a schematic diagram of the external structure of this utility model.
[0010] Label Explanation:
[0011] 1. Tube socket; 2. Tube cap; 21. Light-emitting window; 3. LD chip; 4. Heat sink; 5. Connecting ring. Detailed Implementation
[0012] To explain in detail the technical content, structural features, objectives and effects of this utility model, the following description is provided in conjunction with the embodiments and accompanying drawings.
[0013] Please see Figure 3 as well as Figure 4 This utility model discloses a high-power laser TO structure, which consists of a tube base 1 and a tube cap 2, an LD chip 3, and a heat sink 4. The tube base 1 and the heat sink 4 are made of oxygen-free copper material with high thermal conductivity (391W / m·K). The LD chip 3 is changed to a horizontal mounting method, and the light emission port of the LD chip 3 is directly opposite the light emission window 21 opened on the side wall of the tube cap 2. A Kovar metal connecting ring 5, which is pre-programmed on the tube base 1 by a brazing process, is provided between the oxygen-free copper tube base 1 and the Kovar material tube cap 2. The existence of the connecting ring 5 solves the problem of mismatch between the Kovar material tube cap and the oxygen-free copper resistance welding. The table below is a comparison of heat dissipation data between this application (left) and the prior art (right).
[0014]
[0015] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent shape or structural transformations made based on the description and drawings of this utility model, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.
Claims
1. A high-power laser TO structure, comprising an LD chip, a heat sink, a socket, and a cap, characterized in that: The tube socket and heat sink are made of oxygen-free copper. The LD chip is horizontally attached to the heat sink. The light-emitting port of the LD chip is directly opposite the light-emitting window opened on the side wall of the tube cap. A Kovar metal connecting ring is provided between the tube socket and the tube cap (2).