Cooling module for domain controller, domain controller and vehicle
The modularly designed cooling module solves the problems of high redundancy and long development cycle of water-cooled domain controllers in existing technologies, and achieves efficient heat dissipation and flexible adaptation for different domain controllers, reducing development costs and time.
Patent Information
- Application Number
- CN202423238842.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-26
- Publication Date
- 2026-01-27
- Estimated Expiration
- 2034-12-26
AI Technical Summary
The existing water-cooling structure of domain controllers requires custom mold design based on size and chip location, resulting in high redundancy, long development cycle, high cost, and limited heat dissipation effect.
Design a cooling module for domain controllers with a modular structure, including a centrally symmetrical housing, detachable cooling medium inlet and outlet pipes, baffles and turbulence columns. It is suitable for domain controllers of different sizes and shapes. Flexible installation is achieved through the centrally symmetrical structure and detachable connection. Thermal conductive adhesive and heat dissipation bosses are combined to improve heat dissipation efficiency.
It achieves broad compatibility with different domain controllers and efficient heat dissipation, reducing product development time and costs while ensuring the reliability and flexibility of cooling.
Smart Images
Figure CN223844090U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to a cooling module, and more particularly to a cooling module for a domain controller. Background Technology
[0002] Currently, with the continuous improvement of domain controller computing power, its heat consumption is also increasing. Passive cooling can no longer meet the heat dissipation requirements of domain controllers, while air cooling faces problems of noise and vibration. Therefore, mainstream heat dissipation solutions mostly adopt channel-type liquid cooling.
[0003] Currently, most common water-cooling structures are set inside the domain controller's casing, and they all require custom mold design based on the size of the domain controller and the location of the chips. This results in high redundancy, long development cycles, and high costs. Utility Model Content
[0004] One of the objectives of this invention is to provide a cooling module for domain controllers, which has a simple and compact structure, adopts a modular design, and can be adapted to domain controllers of various sizes and shapes, thereby greatly improving its applicability and convenience, and significantly reducing product development time and costs.
[0005] To achieve the above objectives, this utility model proposes a cooling module for a domain controller, which is detachably connected to the outer surface of the domain controller housing. The cooling module includes:
[0006] The housing has a cooling medium cavity inside, and the surface of the housing for connecting to the outer shell of the domain controller has a centrally symmetrical structure.
[0007] A cooling medium supply pipeline is connected to a cooling medium inlet on the housing;
[0008] A cooling medium outlet pipe is connected to a cooling medium outlet on the housing;
[0009] A baffle wall is provided inside the cooling medium cavity and is located between the cooling medium inlet and the cooling medium outlet.
[0010] Furthermore, in the cooling module described in this utility model, the cooling medium cavity also has several vertically arranged turbulence columns.
[0011] Furthermore, in the cooling module described in this utility model, the cooling medium inlet pipe and the cooling medium outlet pipe are located on the same side of the housing.
[0012] Furthermore, in the cooling module described in this utility model, at least one of the cooling medium supply pipe and the cooling medium outflow pipe is a bent pipe.
[0013] Furthermore, in the cooling module described in this utility model, at least one of the cooling medium supply pipe and the cooling medium outflow pipe is a straight pipe.
[0014] Furthermore, in the cooling module described in this utility model, the housing is provided with outwardly extending connecting lugs, and each connecting lug is centrally symmetrically distributed on the housing.
[0015] Another objective of this invention is to provide a cooling module for a domain controller, which has a simple structure, good heat dissipation performance, and low manufacturing cost.
[0016] To achieve the above objectives, the present invention also provides a domain controller, which includes a housing and a printed circuit board assembly disposed within the housing. The printed circuit board assembly includes a printed circuit board and at least one electronic device disposed thereon. Furthermore, the domain controller also includes a cooling module as described above, which is detachably connected to the outer surface of the housing and is thermally exchanged with the outer surface of the housing.
[0017] Furthermore, in the domain controller described in this utility model, the outer shell is provided with a plurality of positioning ribs that are symmetrically distributed around each other, and the housing of the cooling module falls within the area enclosed by the plurality of positioning ribs.
[0018] Furthermore, in the domain controller described in this utility model, when the cooling module is provided with the connecting lugs, the housing is provided with connecting seats corresponding to each connecting lug.
[0019] Furthermore, in the domain controller described in this utility model, an adhesive layer is provided between the housing of the cooling module and the outer shell.
[0020] Furthermore, in the domain controller described in this utility model, the adhesive layer includes thermally conductive adhesive.
[0021] Furthermore, in the domain controller described in this utility model, the inner top surface of the housing has at least one heat dissipation protrusion that is thermally connected to the corresponding electronic device; and / or the inner bottom surface of the housing has at least one heat dissipation protrusion that is thermally connected to the corresponding electronic device.
[0022] Another object of this invention is to provide a vehicle having a domain controller as described above.
[0023] The cooling module described in this invention has strong reusability and adaptability, and can be adapted to domain controllers of various sizes.
[0024] The cooling module described in this invention is located outside the domain controller's housing and is detachably connected to it, thus offering high configuration flexibility. Furthermore, due to the housing's centrally symmetrical structure, its installation angle and position on the domain controller housing can be adjusted according to requirements.
[0025] The cooling module described in this invention adopts an integrated design and is installed outside the domain controller's housing. Therefore, there is no need to worry about the impact of cooling medium leakage on electronic components, resulting in high reliability.
[0026] Based on this, the domain controller described in this utility model can greatly reduce product design and manufacturing costs and development time while having excellent heat dissipation performance. Attached Figure Description
[0027] Figure 1 This diagram shows a structural schematic of the cooling module according to one embodiment of the present invention.
[0028] Figure 2 The diagram shows a split structure of the cooling module described in this invention in one embodiment.
[0029] Figure 3 , Figure 4 and Figure 5 The images show the cooling module described in this invention installed on a domain controller at different angles in one embodiment.
[0030] Figure 6 This diagram shows a structural schematic of the cooling module described in another embodiment of the present invention.
[0031] Figure 7 A schematic diagram of the domain controller described in this utility model is shown from one perspective in one embodiment.
[0032] Figure 8 This invention presents a schematic diagram of the domain controller in one embodiment, shown from another perspective.
[0033] Figure 9 The diagram shows a split structure of the domain controller described in this invention in one embodiment.
[0034] Figure 10 The cooling module of this utility model is shown in a split configuration, showing its adaptive connection to the outer casing. Detailed Implementation
[0035] The cooling module, domain controller, and vehicle described in this utility model will be further explained and described below with reference to the accompanying drawings and specific embodiments. However, this explanation and description do not constitute an undue limitation on the technical solution of this utility model.
[0036] Currently, the common water-cooling structures for domain controllers are mostly set inside the domain controller's casing, and each requires custom mold design based on the size of the domain controller and the location of the chips. This results in high redundancy, long development cycles, and high costs.
[0037] Based on this, in one embodiment of the present invention, a cooling module for a domain controller is proposed, which aims to solve the above-mentioned problems.
[0038] Figure 1 This diagram shows a structural schematic of the cooling module according to one embodiment of the present invention.
[0039] Figure 2 The diagram shows a split structure of the cooling module described in this invention in one embodiment.
[0040] like Figure 1 and Figure 2 As shown, in some embodiments, the cooling module is detachably attached to the outer surface of the domain controller housing, and includes:
[0041] The housing 100 has a cooling medium cavity 101 inside. The surface 103 of the housing for connecting to the outer shell of the domain controller has a centrally symmetrical structure, that is, the shape of the surface is a centrally symmetrical figure, for example, as shown in the figure. Figure 1 and Figure 2 The square shown is an example. It should be noted that in some other embodiments, the centrally symmetric figure can also be a pentagon, a regular hexagon, or other centrally symmetric figures.
[0042] A cooling medium supply pipe 104 is connected to a cooling medium inlet 105 on the housing. In some more specific embodiments, the cooling medium supply pipe 104 can be detachably connected to the housing by plugging or snapping. In other more specific embodiments, it can also be detachably connected to the housing by a connector, such as a screw. With this arrangement, cooling medium supply pipes of different lengths, shapes, diameters, and materials can be installed on the housing as needed, thereby expanding the adaptability of the cooling module.
[0043] A cooling medium outlet pipe 106 is connected to a cooling medium outlet 107 on the housing. In some more specific embodiments, the cooling medium outlet pipe 106 can be detachably connected to the housing by plugging or snapping. In other more specific embodiments, it can also be detachably connected to the housing by a connector, such as a screw. With this arrangement, cooling medium outlet pipes of different lengths, shapes, diameters, and materials can be installed on the housing as needed, thereby expanding the adaptability of the cooling module.
[0044] The baffle 108 is located in the cooling medium cavity and between the cooling medium inlet 105 and the cooling medium outlet 107, thereby dividing the cooling medium cavity into a cooling medium inlet cavity and a cooling medium outlet cavity, thereby increasing the flow path length of the cooling medium in the cooling medium cavity and improving the cooling effect.
[0045] Because the surface 103 of the housing 100 used for connection with the domain controller's housing 200 has a centrally symmetrical structure, the water-cooling module 1 can be installed on the domain controller's housing 200 at different angles according to actual needs. For example... Figure 4 The cooling module 1 in the middle is relative to Figure 3 The cooling module inside rotated 90 degrees. Figure 5 The cooling module 1 in the middle is relative to Figure 4 The cooling module 1 in the middle has rotated another 180°. This configuration allows it to be adapted to different installation spaces and requirements.
[0046] In this manner, the cooling medium enters the cooling medium cavity from the cooling medium supply line via the cooling medium inlet 105, bypasses the baffle 108, and flows out from the cooling medium outlet line 106 via the cooling medium outlet 107. During this process, the cooling medium cools the domain controller through the surface of the housing used to connect with the domain controller's outer shell.
[0047] It should be noted that in this invention, the cooling medium can be a liquid cooling medium, such as water, oil or other coolant, or a gaseous cooling medium, such as dry ice.
[0048] like Figure 2 As shown, in some more specific embodiments, the cooling medium cavity 101 has several vertically arranged turbulence columns 109, which are used to turbulent the cooling medium and increase the contact area between the cooling medium and the cooling module, thereby further improving the cooling effect.
[0049] In some more specific implementations, such as Figure 2As shown, for ease of installation, housing 100 may include an upper end cover 110 and a lower housing 120 connected thereto. In some more specific embodiments, the upper end cover 110 and the lower housing 120 may be connected together by brazing, friction stir welding or bonding to form a closed cooling medium cavity.
[0050] In some more specific embodiments, the housing 100 may be made of aluminum alloy, sheet metal or plastic.
[0051] like Figure 1 and Figure 2 As shown, in some more specific embodiments, the cooling medium inlet pipe 104 and the cooling medium outlet pipe 106 are located on the same side of the housing, that is, the cooling medium inlet 105 and the cooling medium outlet are located on the same side of the housing. This arrangement can increase the flow path of the cooling medium in the housing and has a better cooling effect than having the cooling medium inlet pipe 104 and the cooling medium outlet pipe 106 located on two different sides or opposite sides of the housing.
[0052] In some more specific implementations, such as Figure 1 and Figure 2 As shown, both the cooling medium inlet pipe 104 and the cooling medium outlet pipe 106 are bent pipes.
[0053] Figure 6 A schematic diagram of another embodiment of the cooling module described in this utility model is shown. Figure 6 As shown, in this embodiment, both the cooling medium inlet pipe 104 and the cooling medium outlet pipe 106 are straight pipes.
[0054] In addition, from Figure 6 It can also be seen that in this embodiment, both the cooling medium supply pipe 104 and the cooling medium outlet pipe 106 are integrally formed with the housing 100. It should be noted that this embodiment still belongs to the case where the cooling medium supply pipe 104 and the cooling medium outlet pipe 106 are connected to the housing 100 through the cooling medium inlet and cooling medium outlet respectively, except that they are non-detachable connections.
[0055] In some more specific implementations, such as Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 As shown, the housing 100 has outwardly extending connecting lugs 111, which are centrally symmetrically distributed on the housing. That is, one connecting lug is provided on each side, and these connecting lugs are centrally symmetrically distributed with respect to each other. Furthermore, from... Figure 6As can be seen, although in this embodiment the connecting lugs are not located on the sides of the housing, but rather at the four corners of the housing, these connecting lugs 111 are still centrally symmetrically distributed. These centrally symmetrical connecting lugs 111 are used to mate with the housing of the domain controller, thereby facilitating the adjustment of the mounting angle of the cooling module on the housing as needed.
[0056] In one embodiment, this invention also provides a domain controller having the cooling module described above.
[0057] Figure 7 A schematic diagram of the domain controller described in this utility model is shown from one perspective in one embodiment.
[0058] Figure 8 This invention presents a schematic diagram of the domain controller in one embodiment, shown from another perspective.
[0059] Figure 9 The diagram shows a split structure of the domain controller described in this invention in one embodiment.
[0060] like Figure 7 , Figure 8 and Figure 9 As shown, in some embodiments, the domain controller includes a housing 200 and a printed circuit board assembly 300 disposed within the housing, the printed circuit board assembly 300 including a printed circuit board 301 and at least one electronic device disposed thereon. A cooling module 1 is detachably connected to the outer surface of the housing 200 and is thermally exchange-connected to the outer surface of the housing 200.
[0061] In some more specific embodiments, for ease of installation, the housing 200 includes a top cover 201 and a bottom cover 202 connected thereto. In some more specific embodiments, the bottom cover 202 is connected to the top cover 201 by a connecting element 203, such as a screw.
[0062] In some more specific embodiments, the top cover 201 and / or the bottom cover 202 may be made of die-cast aluminum alloy.
[0063] In some more specific implementations, such as Figure 9 As shown, a heat-conducting element 204 is provided between the top cover 201 and the printed circuit board.
[0064] In some more specific embodiments, the thermally conductive element 204 may include a thermally conductive silicone grease layer. Those skilled in the art can select the thermal conductivity of the silicone grease according to actual needs; generally, the higher the thermal conductivity of the silicone grease, the more beneficial it is for heat dissipation. Of course, in other more specific embodiments, the thermally conductive element may also include thermally conductive putty, thermally conductive gel, thermally conductive double-sided adhesive, thermally conductive graphite sheet, or similar thermally conductive elements.
[0065] like Figure 10 As shown, in some embodiments, the outer casing, such as the upper cover 201 of the outer casing, may be provided with a plurality of positioning ribs 205 that are symmetrically distributed to each other. The housing 100 of the cooling module 1 falls within the area enclosed by the plurality of positioning ribs 205, thereby achieving installation positioning with the outer casing 200.
[0066] like Figure 9 As shown, in some more specific embodiments, an adhesive layer 2 is provided between the housing of the cooling module 1 and the outer shell, that is, the cooling module 1 is connected to the outer shell 200 through the adhesive layer.
[0067] In some more specific embodiments, the adhesive layer 2 may include a thermally conductive adhesive. That is, the adhesive layer 2 not only has an adhesive and fixing function, but also a thermally conductive function. In some more specific embodiments, the thermally conductive adhesive may include thermally conductive silicone grease. Those skilled in the art can select the thermal conductivity of the thermally conductive silicone grease according to actual needs. Generally speaking, the higher the thermal conductivity of the thermally conductive silicone grease, the more beneficial it is for heat dissipation.
[0068] Of course, in some other embodiments, the water-cooling module 1 can also be connected to the housing 200 by brazing.
[0069] Furthermore, in some embodiments, when the cooling module 1 is provided with a connecting lug 111, such as Figure 10 As shown, the outer casing, such as the top cover 201, is also provided with connecting seats 206 corresponding to each connecting lug 111. The connecting bolts pass through the connecting holes on the connecting lugs 111 and the connecting seats 206, which can further realize a stable connection between the cooling module and the outer casing. It can be understood that since the connecting lugs 111 are arranged in a centrally symmetrical manner, the connecting seats 206 on the outer casing are also arranged in a centrally symmetrical manner.
[0070] In addition, to further improve the cooling effect, the inner top surface of the housing, such as the inner surface of the top cover, may also have at least one heat dissipation protrusion that is connected to the corresponding electronic device for heat exchange. Figure 9(Not visible in the middle). Similarly, the inner bottom surface of the housing, such as the bottom cover 202, may also have at least one heat dissipation protrusion 207 that is connected to the corresponding electronic device for heat exchange. With this arrangement, the various electronic devices on the printed circuit board 301 can be cooled in a targeted manner almost simultaneously, which improves cooling efficiency and ensures cooling uniformity.
[0071] Therefore, the cooling module described in this utility model not only ensures the cooling effect on the domain controller, but also has strong reusability and adaptability, and can be adapted to domain controllers of various sizes and with various requirements.
[0072] In this invention, the domain controller can be a vehicle domain controller, which is used to perform vehicle status control and status monitoring, including but not limited to an in-vehicle mobile data center, a hardware monitor (HMI) that implements human-machine interface controller functions, an in-vehicle entertainment (IVI) controller, a body control module (BCM), and a vehicle control unit (VCU).
[0073] The domain controller described in this invention can be used in vehicles, for example, in the automated driving of intelligent vehicles. Intelligent vehicles may include electric vehicles or gasoline-powered vehicles that support unmanned driving, driver assistance systems (ADAS), intelligent driving, connected driving, intelligent network driving, and carsharing.
[0074] Therefore, in another embodiment, this invention also provides a vehicle having the domain controller described above. Since this invention does not improve other components of the vehicle, these components will not be described in detail here.
[0075] It should be noted that the prior art within the scope of protection of this utility model is not limited to the embodiments given in this utility model document. All prior art that does not contradict the solution of this utility model, including but not limited to prior patent documents, prior publications, prior public uses, etc., can be included in the scope of protection of this utility model.
[0076] Furthermore, the combination of the technical features in this case is not limited to the combination methods described in the claims of this case or the combination methods described in the specific embodiments. All technical features described in this case can be freely combined or combined in any way, unless they contradict each other.
[0077] It should also be noted that the embodiments listed above are merely specific embodiments of this utility model. Obviously, this utility model is not limited to the above embodiments, and any similar changes or modifications made thereto that can be directly derived or easily conceived by those skilled in the art from the content disclosed in this utility model should fall within the protection scope of this utility model.
Claims
1. A cooling module for a domain controller, characterized in that, It is used for detachable connection to the outer surface of the domain controller housing, and the cooling module includes: The housing (100) has a cooling medium cavity (101) therein, and the surface (103) of the housing for connecting to the outer shell of the domain controller has a centrally symmetrical structure; A cooling medium supply pipe (104) is connected to a cooling medium inlet (105) on the housing; A cooling medium outlet pipe (106) is connected to a cooling medium outlet (107) on the housing; A baffle (108) is provided in the cooling medium cavity and is located between the cooling medium inlet and the cooling medium outlet.
2. The cooling module as described in claim 1, characterized in that, The cooling medium cavity also has several vertically arranged turbulence columns (109).
3. The cooling module as described in claim 1, characterized in that, The cooling medium inlet pipe and the cooling medium outlet pipe are located on the same side of the shell.
4. The cooling module as described in claim 1, characterized in that, At least one of the cooling medium inlet pipe and the cooling medium outlet pipe is a bend pipe.
5. The cooling module as described in claim 1, characterized in that, At least one of the cooling medium inlet pipe and the cooling medium outlet pipe is a straight pipe.
6. The cooling module as described in claim 1, characterized in that, The housing is provided with outwardly extending connecting lugs (111), and each connecting lug is centrally symmetrically distributed on the housing.
7. A domain controller comprising a housing (200) and a printed circuit board assembly (300) disposed within the housing, the printed circuit board assembly comprising a printed circuit board (301) and at least one electronic device disposed thereon, characterized in that, The domain controller further includes a cooling module (1) as described in any one of claims 1-6, the cooling module being detachably connected to the outer surface of the housing and thermally connected to the outer surface of the housing.
8. The domain controller as claimed in claim 7, characterized in that, The outer shell is provided with a number of positioning ribs (205) that are symmetrically distributed to each other, and the housing of the cooling module falls within the area enclosed by the number of positioning ribs.
9. The domain controller as claimed in claim 7, characterized in that, When the cooling module is provided with the connecting lug (111), the outer casing is provided with a connecting seat (206) corresponding to each connecting lug.
10. The domain controller as claimed in claim 7, characterized in that, An adhesive layer (2) is provided between the housing of the cooling module and the outer shell.
11. The domain controller as claimed in claim 10, characterized in that, The adhesive layer includes a thermally conductive adhesive.
12. The domain controller as claimed in claim 7, characterized in that, The inner top surface of the housing has at least one heat dissipation protrusion that is heat-exchangeably connected to the corresponding electronic device; and / or the inner bottom surface of the housing has at least one heat dissipation protrusion (207) that is heat-exchangeably connected to the corresponding electronic device.
13. A vehicle, characterized in that, It has a domain controller as described in any one of claims 7-12.