Material feeding adjusting device

Abstract

The utility model discloses a material feeding adjusting device which comprises a machine body, and a base plate motion platform module, a material transferring module and a turnover module are arranged on the machine body. The substrate movement platform module comprises a mounting seat, a substrate axial movement assembly, a substrate first longitudinal movement assembly, a substrate second longitudinal movement assembly, a moving seat and a placement platform; the base plate axial movement assembly is used for driving the moving seat to move in the axial direction, and the base plate first longitudinal movement assembly is used for driving the moving seat to move in the longitudinal direction. The material transfer module comprises a linear motor and a suction nozzle, and the suction nozzle is used for adsorbing materials and moves in the axial direction of the linear motor; the overturning module comprises an overturning motor and an overturning block, the overturning block is connected with a rotating shaft of the overturning motor, and a material containing groove is formed in the overturning block and used for containing materials. According to the feeding adjusting device in the scheme, the face, needing glue dipping and pasting treatment, of a material can be automatically adjusted to the position corresponding to the glue dipping head, and the purpose of conducting glue dipping and pasting treatment on the side face of the material is achieved.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip patch technology field, concretely relates to a material's feeding adjusting device. BACKGROUND

[0002] The dip glue patching machine is a kind of equipment for accurately patching chip to printed circuit board (or material). It is coated with glue (usually epoxy resin or conductive silver paste etc.) by dipping, and then chip is patched to material to realize the fixation and electrical connection of chip.

[0003] The dip glue patching machine mainly includes dip glue head, patching head, conveying system and control system etc., when carrying out dip glue patching, first, dip glue head carries out dip glue treatment to material surface, then patching head is adhered to chip on material surface, realizes the dip glue patching treatment to material surface. However, when carrying out dip glue patching treatment to material surface in the prior art, since the movement freedom degree of dip glue head and patching head is limited, just makes dip glue head and patching head can only carry out dip glue or patching treatment to the front of material, when needing to carry out dip glue and patching treatment to the side of material, the existing dip glue patching machine often cannot be completed, therefore, an urgent need for a feeding adjusting device that can automatically adjust the side of material to the position directly opposite dip glue head and patching head when needing to carry out dip glue patching treatment to the side of material. SUMMARY

[0004] In view of the above-mentioned deficiencies in the prior art, the technical problem to be solved by the utility model is: how to provide a feeding adjusting device that can automatically adjust the side of material to the position directly opposite dip glue head and patching head when needing to carry out dip glue patching treatment to the side of material.

[0005] In order to solve the above technical problem, the utility model adopts the following technical scheme:

[0006] A kind of material's feeding adjusting device, including machine body, base plate motion platform module, material transfer module and turnover module are equipped on the machine body;

[0007] The base plate motion platform module includes mounting seat, base plate axial movement component, base plate first longitudinal movement component, base plate second longitudinal movement component, moving seat and placement platform, the turnover module, the placement platform and base plate second longitudinal movement component are all arranged on the moving seat, and the placement platform is used to place base plate;

[0008] The base plate axial movement component is used to drive the moving seat to move along the axis, and the base plate first longitudinal movement component is used to drive the turnover module on the moving seat to move along the longitudinal direction, so that the turnover module moves along the axis and the longitudinal direction by the base plate axial movement component and base plate first longitudinal movement component.

[0009] The material transfer module comprises a linear motor and an axially movable suction nozzle, and the linear motor drives the suction nozzle to suck the material;

[0010] The turnover module comprises a turnover motor and a turnover block, the turnover motor is installed on the first longitudinal movement assembly of the base plate through a motor mounting seat, and the turnover block is connected with the rotating shaft of the turnover motor to drive the turnover block to rotate through the rotation of the turnover motor, a material placing groove is arranged on the turnover block, the material placing groove is used for placing the material, and the material is always kept in the material placing groove during the rotation of the turnover block.

[0011] The working principle of the present application is as follows: when the feeding adjusting device is used, the substrate with material needing to be treated by dip coating and patching is placed on the placing substrate, then the moving seat is moved by the substrate axial movement assembly, the movement of the moving seat further drives the substrate on the placing platform to move, until the material on the substrate moves to the position opposite to the suction nozzle, then the material on the substrate is sucked by the suction nozzle, and the material is transferred to the turnover module. When the side of the material needs to be treated by dip coating and patching, on the one hand, the turnover block is driven to rotate by the rotation of the turnover motor of the turnover module, the rotation of the turnover block further realizes the rotation of the material, so that the surface of the material needing to be treated by dip coating and patching can be opposite to the dip coating head, and the material placing groove on the turnover block can avoid the situation that the material falls off after being turned over; on the other hand, the first longitudinal movement assembly of the base plate further drives the turnover module to move longitudinally during the rotation of the turnover module, so that the material on the turnover module moves longitudinally to the terminal position of the movement track of the dip coating head, so that the surface of the material on the turnover module needing to be treated by dip coating and patching can be opposite to the dip coating head, so that the feeding adjusting device can automatically adjust the surface of the material needing to be treated by dip coating and patching to the position corresponding to the dip coating head, and the purpose of treating the side of the material by dip coating and patching is realized.

[0012] Preferably, the machine body is further provided with an upper and lower material module, the upper and lower material module comprises a material placing assembly, the material placing assembly comprises a material placing plate and a plurality of material placing boxes arranged in the axial direction, a plurality of material placing grooves are arranged on the material placing boxes in the vertical direction, the material placing grooves are used for placing the substrate, and a plurality of materials are placed on the substrate.

[0013] In this way, by arranging the material placing plate, a plurality of material placing boxes are arranged on the material placing plate, and a plurality of material placing grooves are arranged on the material placing boxes, one substrate can be placed in each material placing groove, and a plurality of materials can be placed on each substrate, so that the upper and lower material module is used to store a plurality of substrates needing to be treated by dip coating and patching or collect the substrates having completed dip coating and patching.

[0014] Preferably, a feeding module is further arranged on the machine body, the feeding module comprises a push rod and a first longitudinal movement assembly, the push rod is connected with the first longitudinal movement assembly, the first longitudinal movement assembly is used to drive the push rod to move longitudinally, and the push rod can extend into the feeding groove and abut against the substrate at the corresponding position during the longitudinal movement of the push rod, and the push rod is used to transport the substrate at the corresponding position in the feeding groove to the substrate movement platform module through the longitudinal movement of the push rod.

[0015] The feeding module further comprises a first axial movement assembly and a first vertical movement assembly, the first vertical movement assembly is used to drive the feeding assembly to move vertically, and the first axial movement assembly is used to drive the feeding assembly to move axially, so that the feeding module corresponds to the substrates at different positions through the vertical movement and the axial movement of the feeding assembly, and the feeding module transports the substrates at different positions to the substrate movement platform module.

[0016] In this way, by arranging the feeding module and the feeding and discharging module, the feeding and discharging module is used to store the substrates which need to be dipped and pasted or collect the substrates which have been dipped and pasted, and the feeding module is used to transport the substrates on the feeding and discharging module to the substrate movement platform module in sequence, so as to improve the feeding and discharging efficiency of the substrates.

[0017] The push rod is used to abut against the substrate at the corresponding position, when the push rod abuts against the substrate at the corresponding position, the first longitudinal movement assembly drives the push rod to continuously move longitudinally, so that the push rod pushes the substrate at the corresponding position away from the feeding assembly and moves to the substrate movement platform module.

[0018] In addition, since the feeding assembly is arranged with a plurality of substrates, the first vertical movement assembly and the first axial movement assembly are arranged, when it is needed to move the substrates at different positions to the feeding module, the movement of the first vertical movement assembly and the first axial movement assembly is used to drive the movement of the feeding assembly, so that the substrates at different positions on the feeding assembly correspond to the positions of the feeding module, and the substrates at different positions are transported to the substrate movement platform module for the purpose of being dipped and pasted.

[0019] Preferably, the substrate movement platform module further comprises a substrate second longitudinal movement assembly, the substrate second longitudinal movement assembly is connected with the placement platform and is used to drive the placement platform to move longitudinally, and the substrate axial movement assembly and the substrate second longitudinal movement assembly are used to drive the placement platform to move axially and longitudinally.

[0020] In this way, since multiple materials are placed on each substrate, when one of the materials on the substrate is completed with the dip-paste patching process, the placing platform is driven by the second longitudinal movement assembly of the substrate to move in the longitudinal direction by a set distance, so as to move the next material on the substrate which needs to be processed by the dip-paste patching to the position corresponding to the material transfer module, so as to process the next material by the dip-paste patching. In this way, the continuous dip-paste patching process of the materials at different positions on the substrate is completed, and the efficiency of the dip-paste patching is further improved. BRIEF DESCRIPTION OF DRAWINGS

[0021] BRIEF DESCRIPTION OF DRAWINGS Figure 1 FIG. 1 is a structural schematic diagram of a dip-paste patching machine with a material feeding and adjusting device according to the present application;

[0022] BRIEF DESCRIPTION OF DRAWINGS Figure 2 FIG. 2 is a front view of the dip-paste patching machine with the material feeding and adjusting device according to the present application;

[0023] BRIEF DESCRIPTION OF DRAWINGS Figure 3 FIG. 3 is a structural schematic diagram of a substrate movement platform module in the material feeding and adjusting device according to the present application;

[0024] BRIEF DESCRIPTION OF DRAWINGS Figure 4 FIG. 4 is a structural schematic diagram of a material transfer module in the material feeding and adjusting device according to the present application;

[0025] BRIEF DESCRIPTION OF DRAWINGS Figure 5 FIG. 5 is a structural schematic diagram of a turnover module in the material feeding and adjusting device according to the present application;

[0026] BRIEF DESCRIPTION OF DRAWINGS Figure 6 FIG. 6 is a structural schematic diagram of a feeding and discharging module in the material feeding and adjusting device according to the present application;

[0027] BRIEF DESCRIPTION OF DRAWINGS Figure 7 FIG. 7 is a local enlarged schematic diagram of a discharging box in the material feeding and adjusting device according to the present application;

[0028] BRIEF DESCRIPTION OF DRAWINGS Figure 8 FIG. 8 is a structural schematic diagram of a feeding module in the material feeding and adjusting device according to the present application.

[0029] BRIEF DESCRIPTION OF DRAWINGS: machine body 1, substrate movement platform module 2, mounting seat 201, moving seat 202, substrate axial movement assembly 203, first longitudinal movement assembly 204 of substrate, second longitudinal movement assembly 205 of substrate, placing platform 206, material transfer module 3, linear motor 301, suction nozzle 302, turnover module 4, turnover motor 401, turnover block 402, material placing groove 403, feeding and discharging module 5, first axial movement assembly 501, first vertical movement assembly 502, discharging plate 503, discharging box 504, feeding module 6, first longitudinal movement assembly 601, push rod 602, substrate 7, material 8. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in combination with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, rather than all the embodiments. The components of the embodiments of the utility model described and shown in the drawings herein can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the utility model provided in the drawings is not intended to limit the scope of the claimed utility model, but only represents selected embodiments of the utility model. Based on the embodiments in the utility model, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of protection of the utility model.

[0031] In the specific embodiment, the material feeding adjusting device of the present scheme can be used on a glue-dipping patching machine, as shown in the accompanying drawings Figure 1 and the accompanying drawings Figure 2 The glue-dipping patching machine with the material feeding adjusting device of the present scheme is shown, and the material feeding adjusting device (including the base plate movement platform module 2, the material transfer module 3, the turnover module 4, the feeding and discharging module 5 and the feeding module 6 in the accompanying drawings Figure 1 of the present scheme is mainly to move the material to the position directly opposite to the glue-dipping head of the glue-dipping patching machine according to the requirements of glue-dipping patching, and then the glue-dipping head performs glue-dipping treatment on the surface of the material, and the patching head performs patching treatment on the surface of the material.

[0032] Specifically, the material feeding adjusting device of the present scheme includes a machine body 1, and the machine body 1 is provided with a base plate movement platform module 2, a material transfer module 3, a turnover module 4, a feeding and discharging module 5 and a feeding module 6.

[0033] As shown in the accompanying drawings Figure 3 In the specific embodiment, the base plate movement platform module 2 includes a mounting seat 201, a base plate axial movement assembly 203, a base plate first longitudinal movement assembly 204, a base plate second longitudinal movement assembly 205, a moving seat 202 and a placing platform 206, the turnover module 4 and the placing platform 206 are both arranged on the moving seat 202, and the placing platform 206 is used for placing a base plate 7; the base plate axial movement assembly 203 is used for driving the moving seat 202 to move along the axial direction, the base plate first longitudinal movement assembly 204 is used for driving the turnover module 4 on the moving seat 202 to move along the longitudinal direction, so as to drive the turnover module 4 to move along the axial direction and the longitudinal direction through the base plate axial movement assembly 203 and the base plate first longitudinal movement assembly 204; the base plate second longitudinal movement assembly 205 is connected with the placing platform 206 and is used for driving the placing platform 206 to move along the vertical direction, and the placing platform 206 moves along the axial direction and the longitudinal direction through the base plate axial movement assembly 203 and the base plate second longitudinal movement assembly 205.

[0034] As attached Figure 4 As shown, in this specific embodiment, the material transfer module 3 includes a linear motor 301 and an axially movable suction nozzle 302. The linear motor 301 is used to drive the suction nozzle 302 to pick up the material 8 and transfer the material 8 to the flipping module 4. At the same time, after the material 8 has completed the adhesive application process, the suction nozzle 302 will also pick up the material 8 from the flipping module 4 and transfer it back to the corresponding position on the substrate 7.

[0035] As attached Figure 5 As shown, in this specific embodiment, the flipping module 4 includes a flipping motor 401 and a flipping block 402. The flipping motor 401 is mounted on the first longitudinal motion component 204 of the substrate via a motor mounting base, and the flipping block 402 is connected to the rotating shaft of the flipping motor 401. The rotation of the flipping motor 401 drives the flipping block 402 to rotate. The maximum rotation angle of the flipping motor 401 can be set as needed. By limiting the rotation angle of the flipping motor 401, adhesive application and patching processing can be achieved on a larger area of ​​the material 8 surface in different directions. A material placement groove 403 is provided on the flipping block 402. The material placement groove 403 is used to place the material 8 and keeps the material 8 within the material placement groove 403 during the rotation of the flipping block 402.

[0036] As attached Figure 6 As shown and attached Figure 7As shown, in this specific embodiment, the loading and unloading module 5 includes a feeding component, a first axial motion component 501, and a first vertical motion component 502. The feeding component includes a feeding plate 503 and a plurality of feeding boxes 504 arranged along the axial direction. The feeding boxes 504 are provided with a plurality of feeding slots in the vertical direction. The feeding slots are used to place substrates 7. A plurality of materials 8 are placed on the substrates 7. By setting the feeding plate 503, setting a plurality of feeding boxes 504 on the feeding plate 503, and opening a plurality of feeding slots on the feeding boxes 504, a substrate 7 can be placed in each feeding slot, and a plurality of materials 8 can be placed on each substrate 7. Thus, the loading and unloading module 5 can store a plurality of substrates 7 that need to be dipped in adhesive and mounted or collect substrates 7 that have been dipped in adhesive and mounted. The first vertical motion component 502 drives the unloading component to move vertically, and the first axial motion component 501 drives the unloading component to move axially. Through the vertical and axial movements of the unloading component, the feeding module 6 aligns with substrates 7 at different positions, and the feeding module 6 transports substrates 7 from different positions to the substrate motion platform module 2. Since multiple substrates 7 are placed on the unloading component, the first vertical motion component 502 and the first axial motion component 501 are provided. When it is necessary to move substrates 7 from different positions to the feeding module 6, the movement of the first vertical motion component 502 and the first axial motion component drives the movement of the unloading component, thereby aligning the substrates 7 at different positions on the unloading component with the positions of the feeding module 6, achieving the purpose of transporting substrates 7 from different positions to the substrate motion platform module 2 for adhesive application and mounting.

[0037] As attached Figure 8 As shown, in this specific embodiment, the feeding module 6 includes a push rod 602 and a first longitudinal motion component 601. The push rod 602 is connected to the first longitudinal motion component 601, which drives the push rod 602 to move longitudinally. During the longitudinal movement, the push rod 602 can extend into the feeding slot and abut against the substrate 7 at the corresponding position. The longitudinal movement of the push rod 602 transports the substrate 7 at the corresponding position in the feeding slot to the substrate motion platform module 2. By setting up the feeding module 6 and the loading / unloading module 5, the loading / unloading module 5 stores the substrate 7 that needs to be dipped and glued or collects the substrate 7 that has been dipped and glued. The feeding module 6 transports the substrate 7 on the loading / unloading module 5 to the substrate motion platform module 2 in sequence, thereby improving the loading / unloading efficiency of the substrate 7. The push rod 602 is used to abut against the substrate 7 at the corresponding position. When the push rod 602 abuts against the substrate 7 at the corresponding position, the first longitudinal motion component 601 drives the push rod 602 to move continuously in the longitudinal direction, so that the push rod 602 pushes the substrate 7 at the corresponding position away from the feeding component and moves it to the substrate motion platform module 2.

[0038] It should be noted that the substrate axial movement assembly 203, the first axial movement assembly 501, the substrate first longitudinal movement assembly 204, the substrate second longitudinal movement assembly 205, the first longitudinal movement assembly 601 and the first vertical movement assembly 502 respectively realize linear motion in the axial direction, the longitudinal direction and the vertical direction. The linear motion can be achieved by using a linear motor plus a linear guide structure, or a slider plus a guide structure. These linear motion structures belong to the prior art. Those skilled in the art can select a specific structure according to actual design needs. The implementation form of the linear structure does not substantially affect the present scheme and is not a technical solution to be protected. Therefore, detailed description is not given in the present scheme.

[0039] The working principle of the feeding device of the present scheme will be described in detail below.

[0040] The feeding adjusting device of the utility model in use, through first axial movement subassembly 501 and first vertical movement subassembly 502 drive material discharging subassembly movement, make the position of having base plate 7 in material discharging groove and push rod 602 position of feeding module 6 correspond, then by first longitudinal movement subassembly 601 drive push rod 602 longitudinal movement, push rod 602 in longitudinal movement process stretches into material discharging groove and with the base plate 7 of corresponding position and reach, and through the longitudinal movement of push rod 602 base plate 7 in corresponding position in material discharging groove is transported to the base plate 7 on base plate movement platform module 2 and is placed.When the base plate 7 of material 8 needing dip glue and patch processing is transported to the base plate 7 after being placed, through base plate axial movement subassembly 203 drive moving seat 202 movement, moving seat 202 movement further drive the base plate 7 on placing platform 206 movement, until the material 8 on base plate 7 moves to the position of directly facing suction nozzle 302, then by suction nozzle 302 adsorb the material 8 on base plate 7, and material 8 is transferred to turnover module 4.When needing to dip glue and patch processing to the side of material 8, on the one hand, turnover module 4 drives turnover block 402 rotation through the rotation of turnover motor 401, the rotation of turnover block 402 further realizes the rotation of material 8, so that the face of material 8 needing dip glue and patch processing can directly face dip glue head, and material placing groove 403 on turnover block 402 can avoid the situation that material 8 falls after turning over;On the other hand, base plate first longitudinal movement subassembly 204 also drives turnover module 4 longitudinal movement during the rotation of turnover module 4, so that material 8 on turnover module 4 moves to the terminal position of dip glue head movement track setting along the longitudinal direction, so that the face of material 8 on turnover module 4 needing dip glue and patch processing can directly face dip glue head, so that the face of material 8 needing dip glue and patch processing can be automatically adjusted to the position corresponding to dip glue head through the feeding adjusting device of the scheme, realize the purpose of dip glue and patch processing to the side of material 8, after dip glue and patch processing to material 8, turnover module 4 drives the material 8 to reset, then by suction nozzle 302 the material 8 is moved to base plate 7 again.At the same time, since multiple materials 8 are placed on each base plate 7, when one of the materials 8 on base plate 7 completes dip glue and patch processing, base plate second longitudinal movement subassembly 205 drives placing platform 206 to move a set distance along the longitudinal direction, so as to move the next material 8 on base plate 7 needing dip glue and patch processing to the position corresponding to material transfer module 3, so as to dip glue and patch process the next material 8.Thus, continuous dip glue and patch processing of different positions of materials 8 on base plate 7 is completed, and the efficiency of dip glue and patch is further improved.

[0041] Finally, it should be noted that the above examples are only used to illustrate the technical solutions of the utility model, but not to limit the technical solutions. Those skilled in the art should understand that any modification or equivalent replacement of the technical solutions of the utility model without departing from the spirit and scope of the technical solutions should be covered in the scope of the claims of the utility model.

Claims

1. A material feeding and adjusting device, characterized in that, The machine body is provided with a substrate motion platform module, a material transfer module and a turnover module; The substrate motion platform module comprises a mounting seat, a substrate axial motion assembly, a substrate first longitudinal motion assembly, a substrate second longitudinal motion assembly, a moving seat and a placing platform, the turnover module and the placing platform are arranged on the moving seat, and the placing platform is used for placing a substrate; The substrate axial motion assembly is used to drive the moving seat to move along the axial direction, and the substrate first longitudinal motion assembly is used to drive the turnover module on the moving seat to move along the longitudinal direction, so that the turnover module moves along the axial direction and the longitudinal direction through the substrate axial motion assembly and the substrate first longitudinal motion assembly. The material transfer module comprises a linear motor and an axial motion suction nozzle, and the linear motor drives the suction nozzle to adsorb materials. The turnover module comprises a turnover motor and a turnover block, the turnover motor is installed on the substrate first longitudinal motion assembly through a motor mounting seat, the turnover block is connected with the rotating shaft of the turnover motor, the turnover block is driven to rotate through the rotation of the turnover motor, a material placing groove is arranged on the turnover block, the material placing groove is used for placing materials, and the materials are always kept in the material placing groove during the rotation of the turnover block.

2. The material loading conditioning device of claim 1, wherein, An upper and lower material module is further arranged on the machine body, the upper and lower material module comprises a material placing assembly, the material placing assembly comprises a material placing plate and a plurality of material placing boxes arranged along the axial direction, a plurality of material placing grooves are arranged on the material placing boxes in the vertical direction, the material placing grooves are used for placing substrates, and a plurality of materials are placed on the substrates.

3. The material loading conditioning device of claim 2, wherein, A feeding module is further arranged on the machine body, the feeding module comprises a push rod and a first longitudinal motion assembly, the push rod is connected with the first longitudinal motion assembly, the first longitudinal motion assembly is used to drive the push rod to move along the longitudinal direction, the push rod can extend into the material placing groove and abut against the substrate at the corresponding position during the longitudinal movement of the push rod, and the substrate at the corresponding position in the material placing groove is conveyed to the substrate motion platform module through the longitudinal movement of the push rod. The upper and lower material module further comprises a first axial motion assembly and a first vertical motion assembly, the first vertical motion assembly is used to drive the material placing assembly to move vertically, and the first axial motion assembly is used to drive the material placing assembly to move axially, so that the feeding module corresponds to the substrates at different positions through the vertical movement and the axial movement of the material placing assembly, and the feeding module conveys the substrates at different positions to the substrate motion platform module.

4. The material feeding conditioning device according to claim 1, wherein The substrate motion platform module further comprises a substrate second longitudinal motion assembly, the substrate second longitudinal motion assembly is connected with the placing platform and is used to drive the placing platform to move along the longitudinal direction, and the placing platform moves along the axial direction and the longitudinal direction through the substrate axial motion assembly and the substrate second longitudinal motion assembly.

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