Deposition apparatus

Abstract

A deposition apparatus includes: a mask frame; a mask disposed on the mask frame, extending in a first direction, and arranged in a second direction intersecting the first direction; a first plate disposed on the mask; a magnet unit disposed on the first plate, arranged in a first direction, and including a magnet arranged in a second direction; and a rotation driver disposed on the magnet and rotating the magnet. Each of the magnets includes a first portion and a second portion having different polarities, the magnets of the (2n-1) th magnet unit with respect to the first direction are arranged in order of the first portion and the second portion in the first direction, where "n" is a natural number greater than zero, and n is a natural number greater than zero. The magnets of the 2n-th magnet unit with respect to the first direction are arranged in the order of the second portion and the first portion in the first direction.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2024-0022392, filed on February 16, 2024, with the Korean Intellectual Property Office, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The embodiments relate to deposition equipment used in deposition processes for manufacturing display panels. Background Technology

[0004] In recent years, organic light-emitting diode (OLED) displays have become the focus of next-generation flat panel display devices due to their excellent brightness and wide viewing angles. Unlike liquid crystal displays (LCDs), OLED displays do not require a separate light source, allowing for thinner and lighter designs. For example, OLED displays possess properties such as low power consumption, high brightness, and fast response times.

[0005] In the fabrication of organic light-emitting elements, a mask is placed on a substrate, and an organic material for forming the organic light-emitting layer is deposited on the substrate through openings penetrating the mask. Because the mask comprises metal and is formed very thin, it does not remain flat. A mask frame that holds the mask in place and magnets that keep the mask flat relative to the substrate are used to maintain the flatness of the mask.

[0006] However, depending on the arrangement of the magnets, a repulsive force is generated between the mask and the magnets, and the substrate and the mask are not tightly attached to each other. Utility Model Content

[0007] The implementation provides a deposition apparatus that can easily change the direction of magnet alignment according to the direction of mask extension.

[0008] However, the implementation methods are not limited to those described herein. The above and other embodiments will become more apparent to those skilled in the art upon which this disclosure pertains from the following detailed description of the present disclosure.

[0009] Embodiments provide a deposition apparatus including a mask frame, a mask disposed on the mask frame, extending in a first direction, and arranged in a second direction intersecting the first direction, a first plate disposed on the mask, a magnet unit disposed on the first plate, arranged in the first direction, and including magnets arranged in the second direction, and a rotation driver disposed on the magnets and rotating the magnets. Each of the magnets can include a first portion and a second portion having a polarity different from a polarity of the first portion. Magnets of an (2n-1)th magnet unit with respect to the first direction can be arranged in the first direction in an order of the first portion and the second portion, where "n" can be a natural number greater than zero. Magnets of a 2nth magnet unit with respect to the first direction can be arranged in the first direction in an order of the second portion and the first portion.

[0010] The first portion of the magnets can be arranged in the second direction in a first line. The second portion of the magnets can be arranged in the second direction in a second line.

[0011] Each of the magnets can have a rotation axis substantially parallel to a direction perpendicular to the first direction and the second direction, and rotate about the rotation axis.

[0012] Each of the magnets has a circular shape in a plan view.

[0013] Each of the magnets has a polygonal shape in a plan view. An outer circle of the polygonal shape of one magnet does not overlap an outer circle of the polygonal shape of another magnet.

[0014] The magnets of the 2nth magnet unit with respect to the first direction can be obtained by shifting the magnets of the (2n-1)th magnet unit with respect to the first direction toward a diagonal direction between the first direction and the second direction.

[0015] The magnets in which the first portion faces the first direction can be alternately arranged with the magnets in which the second portion faces the first direction in the diagonal direction.

[0016] The deposition apparatus can further include drive gears respectively disposed on the magnets and combined with the magnets. The rotation driver can be engaged with at least one of the drive gears.

[0017] The rotation driver can be engaged with four drive gears.

[0018] Each of the magnets can include an insertion space extending from an upper surface of each of the magnets to a lower surface of each of the magnets. Each of the drive gears can include a protruding portion protruding toward a direction perpendicular to the first direction and the second direction and inserted into and fixed to the insertion space.

[0019] The drive gears engaged with the rotary driver among the drive gears and the magnets connected to the drive gears can rotate together by rotation of the rotary driver.

[0020] The direction in which the magnets rotate can be opposite to the direction in which the rotary driver rotates.

[0021] The first plate can include an electrostatic chuck or a cooling plate.

[0022] The deposition apparatus can further include a second plate disposed on the rotary driver.

[0023] The deposition apparatus can further include a lift driver connected to the second plate on the second plate. The lift driver moves in a third direction perpendicular to the first direction and the second direction.

[0024] Each of the masks can be a fine metal mask, and can be magnetic.

[0025] Embodiments provide a deposition apparatus including a mask frame, a mask disposed on the mask frame, extending in a first direction, and arranged in a second direction intersecting the first direction, a first plate disposed on the mask, and a magnetic module disposed on the first plate. Each of the magnetic modules can include two first magnets arranged apart from each other in the first direction, two second magnets arranged apart from each other between the first magnets and in the second direction, and a rotary driver disposed on the first magnets and the second magnets. The first magnets and the second magnets can rotate substantially simultaneously by rotation of the rotary driver.

[0026] The first magnets can have the same polarity alignment direction. The second magnets can have the same polarity alignment direction. An N-pole portion of each of the first magnets faces an N-pole portion of one of the second magnets.

[0027] An S-pole portion of each of the first magnets can face an S-pole portion of one of the second magnets.

[0028] Each of the magnetic modules can further include drive gears disposed on the first magnets and the second magnets, respectively.

[0029] According to the deposition apparatus of the present disclosure, the magnets can be arranged to allow portions of the magnets having the same polarity to be aligned in a direction intersecting the direction of extension of the mask. Accordingly, repulsive force can not be generated or can be reduced between the magnetic unit and the mask. Thus, defects in deposition caused by a lifting phenomenon of the mask can be prevented or reduced. BRIEF DESCRIPTION OF DRAWINGS

[0030] The above and other advantages of the present disclosure will become readily apparent by reference to the following detailed description when considered in connection with the following drawings, in which:

[0031] Figure 1A is a schematic cross-sectional view of a deposition apparatus according to an embodiment;

[0032] Figure 1B is an exploded schematic perspective view of a deposition apparatus according to an embodiment;

[0033] Figure 2 is a schematic cross-sectional view of a deposition apparatus taken along the line I-I’ of Figure 1B

[0034] Figure 3 is a schematic cross-sectional view of a deposition apparatus taken along the line I-I’ of Figure 1B

[0035] Figure 4 is a schematic perspective view of a magnetic module according to an embodiment;

[0036] Figure 5 is a schematic perspective cross-sectional view of a magnetic module taken along the line II-II’ of Figure 4

[0037] Figure 6 is a schematic plan view of an arrangement of magnets according to an embodiment;

[0038] Figure 7 is a schematic plan view of an arrangement of magnets according to an embodiment;

[0039] Figure 8 is an exploded schematic perspective view of a deposition apparatus according to an embodiment;

[0040] Figure 9 is a schematic plan view of a display panel manufactured using a deposition apparatus according to an embodiment;

[0041] Figure 10 is a schematic cross-sectional view of a pixel shown in Figure 9

[0042] Figure 11 is a schematic cross-sectional view of a pixel shown in Figure 10

[0043] Figure 12 and Figure 13 is a schematic plan view of an arrangement of magnets according to an embodiment; and

[0044] Figure 14 is a schematic plan view of an arrangement of magnets according to an embodiment. DETAILED DESCRIPTION

[0045] ​​​​​In the following description, numerous specific details are set forth for illustrative purposes in order to provide a thorough understanding of various embodiments or implementations of this disclosure. As used herein, “implementation” and “method” are interchangeable terms and are non-limiting examples of the apparatus or methods disclosed herein. However, it will be apparent, however, that various embodiments may be practiced without these specific details or with one or more equivalent arrangements. Herein, the various embodiments are not necessarily exclusive nor do they limit this disclosure. For example, a particular shape, configuration, and characteristic of an embodiment may be used or implemented in another embodiment.

[0046] Unless otherwise specified, the embodiments shown should be understood as providing features of this disclosure. Therefore, unless otherwise specified, features, components, modules, layers, films, panels, regions and / or aspects of various embodiments (hereinafter individually or collectively referred to as “elements”) may be combined, separated, interchanged and / or rearranged in other ways without departing from the scope of this disclosure.

[0047] Crosshairs and / or shading are typically used in the accompanying drawings to clarify the boundaries between adjacent elements. Therefore, unless otherwise specified, the presence or absence of crosshairs or shading does not convey or indicate any preference or requirement for particular materials, material properties, dimensions, scale, commonalities between illustrated elements, and / or any other characteristics, properties, etc., of the elements. Furthermore, in the accompanying drawings, the dimensions and relative dimensions of elements may be exaggerated for clarity and / or descriptive purposes. When embodiments can be implemented differently, a particular process sequence may be performed differently than the sequence described. For example, two consecutively described processes may be performed substantially simultaneously, or in the reverse order of their description. Additionally, similar reference numerals denote similar elements.

[0048] When an element or layer is referred to as being "on" another element or layer, "connected to," or "attached to" another element or layer, it can be directly on, directly connected to, or directly attached to the other element or layer, or there may be an intervening element or layer. However, when an element or layer is referred to as being "directly on" another element or layer, "directly connected to," or "directly attached to" another element or layer, there is no intervening element or layer. Therefore, the term "connection" can refer to a physical connection, electrical connection, and / or fluid connection with or without an intervening element. Furthermore, the axis of the first direction DR1, the axis of the second direction DR2, and the axis of the third direction DR3 are not limited to the three axes of a Cartesian coordinate system such as the X-axis, Y-axis, and Z-axis, and can be interpreted in a broader sense. For example, the axis of the first direction DR1, the axis of the second direction DR2, and the axis of the third direction DR3 can be perpendicular to each other, or can represent different directions that are not perpendicular to each other. For the purposes of this disclosure, "at least one of A and B" can be understood to mean only A, only B, or any combination of A and B. Furthermore, "at least one of X, Y, and Z" and "at least one selected from the group consisting of X, Y, and Z" can be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z. As used herein, the term "and / or" includes any and all combinations of one or more of the related listed items.

[0049] Although the terms “first,” “second,” etc., may be used herein to describe various types of elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another. Therefore, without departing from the teachings of this disclosure, the first element discussed below may be referred to as the second element.

[0050] For descriptive purposes, spatial relative terms such as “below,” “under,” “below,” “down,” “above,” “above,” “higher,” and “side” (e.g., as in “sidewall”) may be used herein to describe the relationship between one element and another(s) as shown in the accompanying drawings. In addition to the orientations depicted in the drawings, spatial relative terms are intended to encompass different orientations of the device in use, operation, and / or manufacture. For example, if the device in the drawings is flipped, an element described as “below” or “under” other elements or features will be oriented “above” those elements or features. Thus, the term “below” can encompass both above and below orientations. Furthermore, the device may be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and therefore, the spatial relative descriptive terms used herein should be interpreted accordingly.

[0051] The terminology used herein is for the purpose of describing particular embodiments and is not intended to be limiting. As used herein, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. Furthermore, the terms “comprising,” “including,” “containing,” and / or “comprising” as used in this specification designate the presence of stated features, integrals, steps, operations, elements, components, and / or groups thereof, but do not preclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or groups thereof. It should also be noted that, as used herein, the terms “substantially,” “about,” and other similar terms are used as approximate terms and not as terms of degree, and therefore are used to explain inherent deviations in measured, calculated, and / or provided values ​​that would be recognized by one of ordinary skill in the art.

[0052] Various embodiments are described herein with reference to cross-sectional views and / or exploded views that serve as schematic diagrams of implementations and / or intermediate structures. Therefore, variations in the shape of the figures should be expected, for example, due to manufacturing techniques and / or tolerances. Consequently, the embodiments disclosed herein should not necessarily be construed as limited to the shape of the specific areas shown, but should include, for example, deviations in shape due to manufacturing processes. In this way, the areas shown in the figures may be schematic in nature, and the shapes of these areas may not reflect the actual shapes of the areas of the device, and are therefore not necessarily intended to be limiting.

[0053] As is customary in the art, some embodiments are described and illustrated in the accompanying drawings with respect to functional blocks, units, and / or modules. Those skilled in the art will understand that these blocks, units, and / or modules are physically implemented by electrical circuits (or optical circuits) such as logic circuits, discrete components, microprocessors, hardwired circuits, memory elements, wiring connectors, etc., which can be formed using semiconductor-based manufacturing techniques or other manufacturing techniques. Where blocks, units, and / or modules are implemented by microprocessors or other similar hardware, they can be programmed and controlled using software (e.g., microcode) to perform the various functions discussed herein, and can be selectively driven by firmware and / or software. It is also contemplated that each block, unit, and / or module can be implemented by dedicated hardware, or can be implemented as a combination of dedicated hardware for performing some functions and a processor (e.g., one or more programmable microprocessors and associated circuitry) for performing other functions. Furthermore, without departing from the scope of this disclosure, each block, unit, and / or module in some embodiments may be physically separated into two or more interactive and discrete blocks, units, and / or modules. Furthermore, without departing from the scope of this disclosure, blocks, units, and / or modules in some embodiments may be physically combined into more complex blocks, units, and / or modules.

[0054] In the following description, embodiments will be described with reference to the accompanying drawings.

[0055] Figure 1A This is a schematic cross-sectional view of a deposition apparatus PDA according to an embodiment, and Figure 1B This is an exploded schematic perspective view of the deposition apparatus PDA according to the embodiment. For ease of explanation, in... Figure 1B The sedimentation chamber CM and sedimentation source DN are omitted.

[0056] refer to Figure 1A A deposition equipment PDA may include a deposition chamber CM, a deposition source DN, a mask frame MFS, a mask MK, a first plate PT1, a second plate PT2, and a lift drive unit (or lift actuator) DU. The deposition source DN, mask frame MFS, mask MK, first plate PT1, second plate PT2, and lift drive unit DU may be located inside the deposition chamber CM. For example, the deposition equipment PDA may also include additional mechanical equipment to enable an online system. For ease of description, in Figure 1A The components located between the first board PT1 and the second board PT2 are omitted from the text and will be referenced later. Figure 1B Describe the omitted components.

[0057] A deposition chamber CM can provide an enclosed space for performing deposition processes on a substrate SUB. The deposition chamber CM can set and provide a vacuum state. The deposition chamber CM may include a bottom surface, a top surface, and sidewalls. In one embodiment, the bottom surface of the deposition chamber CM may be substantially parallel to a plane defined by a first direction DR1 and a second direction DR2 intersecting the first direction DR1. The normal direction of the bottom surface of the deposition chamber CM may be substantially parallel to a third direction DR3. However, the shape of the deposition chamber CM is not limited to the shape shown in FIG. 1, as long as the deposition chamber CM provides an enclosed space for the deposition process.

[0058] The deposition source DN can be located in the deposition chamber CM. The deposition source DN can provide the deposition material EM. The deposition material EM can be a sublimable or evaporable material, and can include at least one of metallic, inorganic, and organic materials. As an example, the deposition material EM can include a luminescent material.

[0059] exist Figure 1A In the diagram, the movement of the vapor-deposited material (DPM) is indicated by dashed arrows. The DPM can be deposited on the substrate SUB in a selected pattern after penetrating the mask MK and mask frame MFS. The substrate SUB can be defined (or formed) as used for fabricating a reference. Figure 9 The substrate in the intermediate stage of the described display panel DP.

[0060] refer to Figure 1A and Figure 1BThe mask frame MFS can be a component disposed below and supporting the mask MK. The mask frame MFS can have a quadrilateral frame shape having edge portions extending in a first direction DR1 and edge portions extending in a second direction DR2. The mask frame MFS can comprise a metallic material. As an example, the mask frame MFS can comprise Invar alloy or stainless steel.

[0061] The mask opening (SOP) can penetrate the mask frame (MFS). The mask opening (SOP) can be defined (or formed) as a space surrounded by the edge portion of the mask frame (MFS). The mask (MK) can be positioned on the same plane as the mask frame (MFS), and the mask (MK) can be tightly attached to the substrate (SUB) during the deposition process.

[0062] A mask MK can be mounted on a mask frame MFS. Both sides of the mask MK (e.g., opposite sides) can be connected to the mask frame MFS. As an example, the mask MK can be connected to the mask frame MFS by welding.

[0063] The mask MK can extend in one direction and can be arranged in directions intersecting that direction. In this disclosure, the direction in which the mask MK extends can be referred to as the extending direction, and the direction intersecting the extending direction can be referred to as the intersecting direction. Figure 1B As shown, the extension direction of the mask MK corresponds to the first direction DR1, and the intersection direction corresponds to the second direction DR2.

[0064] The mask MK can include metallic materials. As an example, each of the masks MK can be a fine metal mask (FMM). Therefore, the mask MK can be magnetic and can be affected by the magnetic force of the magnet MG.

[0065] The mask MK may include a cell region CEA defined within the mask MK. The cell region CEA may overlap with the mask opening SOP. The cell region CEA may be used in a deposition process using a PDA deposition apparatus to form a display panel DP within a substrate SUB (see reference). Figure 9 The area corresponding to the area of ​​a single display panel (DP). Figure 9 The light-emitting elements can be formed using a single cell area CEA. (Refer to the display panel DP). Figure 9 The corresponding unit region can be defined within the substrate SUB. After the light-emitting element is formed in the unit region, the unit region can be cut and used to manufacture the display panel DP (reference). Figure 9 ).like Figure 1B As shown, three cell regions CEA can be defined in each of the masks MK. However, the number of cell regions CEA defined in a mask MK is not limited to this.

[0066] Cell openings (MOPs) can be defined (or formed) within cell regions (CEAs). Masks (MKs) can include open and closed regions to allow vapor deposition material (DPM) to be deposited at specific locations on the substrate (SUB), and the cell openings (MOPs) can correspond to the open regions of the mask (MK). Cell openings (MOPs) can be arranged in a first direction (DR1) and a second direction (DR2). In a plan view, cell openings (MOPs) can overlap with mask openings (SOPs).

[0067] The area within the cell region CEA, excluding the cell opening MOP, can be defined (or formed) as a closed region of the mask MK. The vapor-deposited material DPM can penetrate the cell opening MOP of the mask MK, but may not penetrate the area outside the cell opening MOP. Therefore, the vapor-deposited material DPM can be deposited on the substrate SUB at a location corresponding to (or overlapping with) the cell opening MOP using a mask MK in which the shape and position of the cell opening MOP are adjusted.

[0068] The first plate PT1 can be disposed on the mask frame MFS and the mask MK. The first plate PT1 can have a hexahedral shape (or plate shape), which has the following characteristics: Figure 1B The upper and lower surfaces are defined by the first direction DR1 and the second direction DR2, as shown. However, the shape of the first plate PT1 is not limited to this or by it, as long as the first plate PT1 provides an upper and lower surface on which the magnet MG is disposed.

[0069] The first plate PT1 can press the substrate SUB to ensure that the substrate SUB is tightly attached to the mask MK. The first plate PT1 may include a material that does not impede the transmission of magnetic force from the magnet MG to the mask MK. As an example, the first plate PT1 may include a non-magnetic material.

[0070] The first plate PT1 may include a cooling plate. Channels through which coolant flows may be disposed within the cooling plate. During the deposition process, the substrate SUB contacts the first plate PT1, and the substrate SUB is formed by heated gaseous deposition of the material DPM (reference). Figure 11 Under heating, the substrate SUB may thermally deform. However, since coolant is supplied to the first plate PT1 in contact with the substrate SUB, the heated substrate SUB can be cooled by the coolant. Therefore, the deformation caused by heated gaseous deposited material DPM (refer to...) can be prevented. Figure 11 Thermal deformation of the substrate SUB caused by )

[0071] The first plate PT1 may include an electrostatic chuck. The electrostatic chuck can be a component that attaches an object using electrostatic force. When a potential is applied to the electrostatic chuck, the object can be conversely charged and can be fixed to the electrostatic chuck by the attractive force due to electrostatic force. When the first plate PT1 includes an electrostatic chuck, the first plate PT1 can possess electrostatic force. For example, a mask MK can be attached to a substrate SUB by the attractive electrostatic force of the first plate PT1.

[0072] refer to Figure 1B The deposition apparatus PDA may include a magnet MG, a drive gear DG, and a rotary drive unit (or rotary driver) RD disposed between a first plate PT1 and a second plate PT2. For ease of description, in Figure 1B In the diagram, the drive gear DG and the rotary drive unit RD, which are mounted on the magnet MG, are omitted in the area other than the dashed rectangular area.

[0073] A magnet MG can be disposed on a first plate PT1. The magnet MG can apply an attractive magnetic force to the mask MK to allow the mask MK and the substrate SUB to be tightly attached to the first plate PT1. For example, the magnet MG can provide a magnetic force on a third direction DR3 to the magnetic mask MK, and the mask MK and the substrate SUB can be attached to the lower surface of the first plate PT1 by magnetic force.

[0074] refer to Figure 1B The image shows twenty-five magnets MG as an example. Some of the twenty-five magnets MG that are obscured by the second plate PT2 are indicated by dashed lines. However, this is just an example to illustrate the arrangement of the magnets MG, and the number of magnets MG is not limited to this.

[0075] The magnet MG may include a first portion PR1 having a first polarity and a second portion PR2 having a second polarity. The first polarity and the second polarity may be different from each other. As an example, if the first polarity is N, the second polarity may be S, and if the first polarity is S, the second polarity may be N.

[0076] A magnet MG can have a cylindrical or polygonal cylindrical shape. Therefore, each magnet MG can have a circular or polygonal shape in a planar view. Figure 1B In the diagram, each of the magnets MG with a cylindrical shape is shown as a representative example. However, there are no restrictions on the shape of the magnet MG, as long as the magnet MG can be rotated as described later.

[0077] The drive gear DG can be mounted on the magnet MG. The drive gear DG can be used to transmit power received from the rotary drive unit RD to the magnet MG.

[0078] The rotary drive unit RD can be disposed between the drive gears DG. The rotary drive unit RD can be a component that meshes with the drive gears DG to provide power for rotating the magnet MG.

[0079] The second plate PT2 can be disposed on the first plate PT1. The second plate PT2 can have a hexahedral shape (or plate shape), which has the following characteristics: Figure 1B The upper and lower surfaces are defined by the first direction DR1 and the second direction DR2, as shown. However, the shape of the second plate PT2 is not limited to this or thus, and can have various shapes.

[0080] The lifting drive unit DU can be disposed on the second plate PT2. The lifting drive unit DU can be connected to the upper surface of the second plate PT2. The lifting drive unit DU can move in a direction substantially parallel to the third direction DR3. The lifting drive unit DU can have a cylindrical shape extending in the third direction DR3. However, the implementation is not limited to this or thus limited. The lifting drive unit DU can have various shapes.

[0081] Traditional (or typical) deposition equipment includes a magnet that attaches a mask to a substrate. However, due to the magnetic field generated by the magnet, a partial repulsive force is produced between the mask and the magnet. This repulsive force causes a "lifting phenomenon" that interferes with proper adhesion between the mask and the substrate during the deposition process. Defects appear in the substrate during the deposition process due to this substrate lifting phenomenon.

[0082] The following describes a deposition apparatus PDA that easily prevents lifting by rotating and aligning the magnet MG set on the first plate PT1.

[0083] Figure 2 and Figure 3 It is along Figure 1B A schematic cross-sectional view of the deposition equipment PDA taken by line I-I'. Figure 3 This shows the lifting drive unit DU from Figure 2 A schematic cross-sectional view of the state of decline.

[0084] The drive gear DG can be a rotating component whose central axis is fixed to the lower surface of the second plate PT2. For example, the drive gear DG can rotate in place about the central axis, which is the axis of rotation fixed to the lower surface of the second plate PT2.

[0085] The drive gear DG can mesh with the rotary drive unit RD (reference). Figure 6Furthermore, the rotation of the rotary drive unit RD can be transmitted to each of the magnets MG. For example, due to the rotation of the rotary drive unit RD, the drive gear DG meshing with the rotary drive unit RD and the magnet MG connected to the drive gear DG can rotate together. (See reference...) Figure 6 Describe in detail the rotation of the drive gear DG.

[0086] Because the mask MK is not subjected to the normal (or vertical) force caused by the mask frame MFS in the portion overlapping with the mask opening SOP, the mask MK may bend in the direction of gravity due to attraction. As an example, the mask MK may bend in the opposite direction to the substrate SUB.

[0087] refer to Figure 3 When the lifting drive unit DU descends, the second plate PT2 and the magnet MG disposed below the second plate PT2 can also descend or lower. Therefore, the magnet MG can come into contact with the upper surface of the first plate PT1.

[0088] With the lifting drive unit DU lowered, the magnet MG and the mask MK can be positioned closer to each other.

[0089] Therefore, the magnetic force supplied from the magnet MG to the mask MK on the third-party DR3 can be increased. This magnetic force can counteract (or neutralize) the gravity applied to the mask MK, and thus, the mask MK can remain flat and can remain unbent.

[0090] However, even if the mask MK is not bent, a lifting phenomenon may occur, where the mask MK may not be tightly attached to the substrate SUB. This lifting phenomenon may be caused by the magnetic field generated between the magnets MG arranged on the second plate PT2.

[0091] For example, when the extension direction of the mask MK and the polarity alignment direction of the magnet MG are parallel to each other, a partial repulsive force may occur between the mask MK and the magnet MG due to the magnetic field generated by the magnet MG. The repulsive force may cause a lift phenomenon that disrupts the adhesion between the mask MK and the substrate SUB during the deposition process, and deposition defects may occur in the substrate SUB due to the lift phenomenon.

[0092] In conventional (or typical) deposition equipment, to prevent lift-up phenomena, the deposition process is stopped while separating and rearranging the magnets to allow the mask extension direction and the magnet polarity alignment direction to be perpendicular to each other. However, according to the deposition equipment PDA, the polarity alignment direction of the magnet MG can be easily adjusted by rotating the magnet MG. A method for modifying the polarity alignment direction of the magnet MG by rotating it is described below.

[0093] Figure 4This is a schematic perspective view of the magnetic module MM according to the embodiment, and Figure 5 It is along Figure 4 A schematic three-dimensional sectional view of the magnetic module MM cut off by line II-II'.

[0094] In the following text, reference will be made to Figure 4 and Figure 5 Describe the structure and function of the magnetic module MM.

[0095] The magnetic module MM may include first magnets MG1-1 and MG1-2 arranged spaced apart from each other in the first direction DR1, second magnets MG2-1 and MG2-2 arranged between the first magnets MG1-1 and MG1-2 and spaced apart from each other in the second direction DR2, drive gears DG respectively disposed on the first magnets MG1-1 and MG1-2 and the second magnets MG2-1 and MG2-2, and a rotary drive unit RD disposed between the drive gears DG on the first magnets MG1-1 and MG1-2 and the second magnets MG2-1 and MG2-2.

[0096] The magnet MG may have a rotation axis RX that is substantially parallel to a third direction DR3 that is perpendicular to the first direction DR1 and the second direction DR2.

[0097] The rotary drive unit RD can mesh with the drive gear DG. As an example, the rotary drive unit RD can mesh with four of the drive gears in the drive gear DG. The teeth RT of the rotary drive unit RD can mesh with the teeth DT of the drive gear DG.

[0098] For example, the rotary drive unit RD can receive rotational force from a separate power source. As an example, it is placed on the second plate PT2 (reference). Figure 3 The internal electric motor can receive power to rotate the rotary drive unit RD. However, the type and location of the power source that provides rotational force to the rotary drive unit RD are not limited to or restricted by this.

[0099] Since the rotary drive unit RD meshes with the drive gear DG, the rotational force of the rotary drive unit RD can be transmitted to the drive gear DG.

[0100] refer to Figure 5 The insertion space IP can be defined as passing through (or penetrating) the magnet MG and can extend from the upper surface of the magnet MG to the lower surface of the magnet MG.

[0101] Each of the drive gears DG may include a first part DG1 and a second part DG2 disposed on the first part DG1. For ease of description, the first part DG1 and the second part DG2 are separate; however, each of the drive gears DG may be configured as a single body.

[0102] The first part DG1 can be inserted into the insertion space IP to secure the drive gear DG to the magnet MG. In the following description, the first part DG1 may be referred to as the protruding part.

[0103] The protruding portion DG1 can be inserted into the insertion space IP to assemble the drive gear DG to the magnet MG. However, the implementation is not limited to this or thus restricted, as long as the magnet MG is assembled with the drive gear DG. As an example, the drive gear DG may not include the protruding portion DG1, and the lower surface of the drive gear DG and the upper surface of the magnet MG may be attached to each other by an adhesive material disposed between them.

[0104] As described above, the rotational force of the drive gear DG can be transmitted to each of the magnets MG that are combined with the drive gear DG.

[0105] In this embodiment, since the rotary drive unit RD included in the magnetic module MM meshes with four drive gears DG, the four magnets MG can rotate simultaneously when a single rotary drive unit RD rotates. Therefore, the arrangement of the magnets MG can be easily changed.

[0106] like Figure 6 As shown, the N pole portion of each of the first magnets MG1-1 and MG1-2 can face the N pole portion of one of the second magnets MG2-1 and MG2-2, and the S pole portion of each of the first magnets MG1-1 and MG1-2 can face the S pole portion of one of the second magnets MG2-1 and MG2-2.

[0107] Figure 6 This is a schematic plan view of the arrangement of the magnet MG according to the embodiment. Figure 7 This is a schematic plan view of the arrangement of the magnet MG according to the embodiment. Figure 7 The rotary drive unit RD is shown from Figure 6 The state shown is the state rotated approximately 90° clockwise.

[0108] For ease of description, Figure 6 and Figure 7 The diagram shows a rotary drive unit RD and four drive gears DG within a magnetic module MM, with other rotary drive units and drive gears omitted. For example, the outline of a mask MK with an extension direction perpendicular to the polarity alignment direction of the magnet MG is shown by dashed lines.

[0109] The deposition apparatus PDA may include magnet units MU disposed on a first plate PT1 and arranged in a first direction DR1, and each of the magnet units MU may include a magnet MG arranged in a second direction DR2.

[0110] The 2n-th magnet unit MU relative to the first direction DR1 can be obtained by shifting the (2n-1)-th magnet unit MU relative to the first direction DR1 towards the diagonal direction SR between the first direction DR1 and the second direction DR2. Here, "n" can be a natural number greater than zero.

[0111] refer to Figure 6 The magnet MG of the first part PR1 facing the first direction DR1 can be arranged alternately with the magnet MG of the second part PR2 facing the first direction DR1 along the diagonal direction SR.

[0112] The first portion PR1 and the second portion PR2 of the magnet MG included in the (2n-1)th magnet unit MU relative to the first direction DR1 can be aligned along the first direction DR1 in the order of the first portion PR1 and the second portion PR2. The first portion PR1 and the second portion PR2 of the magnet MG included in the 2nth magnet unit MU relative to the first direction DR1 can be aligned along the first direction DR1 in the order of the second portion PR2 and the first portion PR1.

[0113] like Figure 6 As shown, the first portion PR1 and the second portion PR2 of the magnet MG included in each of the first magnet unit MU1, the third magnet unit MU3, the fifth magnet unit MU5, and the seventh magnet unit MU7 arranged on the first direction DR1 can be aligned in the order of the second portion PR2 and the first portion PR1 along a direction opposite to the first direction DR1. Furthermore, the first portion PR1 and the second portion PR2 of the magnet MG included in each of the second magnet unit MU2, the fourth magnet unit MU4, and the sixth magnet unit MU6 arranged on the first direction DR1 can be aligned in the order of the first portion PR1 and the second portion PR2 along a direction opposite to the first direction DR1.

[0114] The rotation direction of the magnet MG can be opposite to the rotation direction of the rotation drive unit RD. Figure 6 The diagram shows a structure in which the drive gear DG rotates counterclockwise when the rotary drive unit RD, which meshes with the drive gear DG, rotates clockwise.

[0115] refer to Figure 6 The first portion PR1 included in the magnet MG can be aligned in a straight line along the second direction DR2, and the second portion PR2 included in the magnet MG can be aligned in a straight line along the second direction DR2. Therefore, the magnet MG can have polarities aligned in the second direction DR2. In this disclosure, the statement that the magnet MG has polarities aligned in one direction can mean that portions of the magnet MG having the same polarity are aligned in that direction.

[0116] Figure 7 The magnet MG is shown from Figure 6 The magnet MG is in a state where it is rotated approximately 90° counterclockwise.

[0117] refer to Figure 7 The first portion PR1 included in the magnet MG can be arranged in a straight line along the first direction DR1, and the second portion PR2 included in the magnet MG can be arranged in a straight line along the first direction DR1. Therefore, the magnet MG can have polarities aligned in the first direction DR1.

[0118] In the polarity alignment direction of magnet MG and mask MK (reference) Figure 1A When the extension direction of the mask is perpendicular, the mask MK can be reduced or minimized (see reference). Figure 1A The phenomenon of improvement.

[0119] Therefore, in mask MK (reference) Figure 1A When the extension direction of the magnet MG is the first direction DR1, the magnet MG can have a polarity aligned in the second direction DR2, and in the mask MK (reference) Figure 1A When the extension direction of the magnet MG is the second direction DR2, the magnet MG can have a polarity aligned in the first direction DR1.

[0120] For example, the polarity alignment directions of the first magnets MG1-1 and MG1-2 can be substantially the same as each other, and the polarity alignment directions of the second magnets MG2-1 and MG2-2 can be substantially the same as each other.

[0121] Since the deposition apparatus PDA can rotate the rotary drive unit RD and therefore the magnet MG, the polarity alignment direction of the magnet MG can be easily changed. Therefore, by considering the mask MK (reference...) Figure 1A The extension direction of the mask MK can effectively prevent or reduce the lifting phenomenon of the mask MK.

[0122] Figure 8 This is an exploded schematic perspective view of the deposition apparatus PDA according to the embodiment. Figure 8 This is an exploded schematic perspective view of a magnet MG having polarity aligned in the first direction DR1, with the extension direction of the mask MK being the second direction DR2. Figure 8 The alignment of the magnet MG shown can be with Figure 7 The alignment of the magnet MG in the middle is the same.

[0123] Therefore, even if the magnet MG is arranged on the first plate PT1, the lifting phenomenon of the mask MK can be prevented.

[0124] Figure 9This is a schematic plan view of a display panel DP manufactured using a deposition apparatus according to an embodiment.

[0125] refer to Figure 9 The display panel DP may have a rectangular shape defined by a short side extending in a first direction DR1 and a long side extending in a second direction DR2. However, the shape of the display panel DP is not limited to this or by it. The display panel DP may include a display area DA and a non-display area NDA surrounding the display area DA.

[0126] Display panel DP can be a light-emitting display panel. For example, display panel DP can be an organic light-emitting display panel or a quantum dot light-emitting display panel. The light-emitting layer of an organic light-emitting display panel can include organic light-emitting materials. The light-emitting layer of a quantum dot light-emitting display panel can include quantum dots or quantum rods. In the following, organic light-emitting display panels will be described as representative examples of display panel DP.

[0127] The display panel DP may include pixels PX, scan lines SL1 to SLm, data lines DL1 to DLn, transmit lines EL1 to ELm, first control line CSL1 and second control line CSL2, first power line PL1 and second power line PL2, connection line CNL, and pads PD. Each of "m" and "n" here is a natural number greater than 1.

[0128] Pixels (PX) can be arranged in the display area (DA). Scan driver (SDV) and transmit driver (EDV) can be positioned in the non-display area (NDA) adjacent to the long sides of the display panel (DP), respectively. Data driver (DDV) can be positioned in the non-display area (NDA) adjacent to one of the short sides of the display panel (DP). In a plan view, the data driver (DDV) can be positioned adjacent to the lower portion of the display panel (DP).

[0129] Scan lines SL1 to SLm can extend in the first direction DR1 and can be connected to the pixel PX and the scan driver SDV. Data lines DL1 to DLn can extend in the second direction DR2 and can be connected to the pixel PX and the data driver DDV. Transmit lines EL1 to ELm can extend in a direction parallel to the first direction DR1 and can be connected to the pixel PX and the transmit driver EDV.

[0130] The first power line PL1 may extend along the second direction DR2 and may be disposed in the non-display area NDA. The first power line PL1 may be disposed between the display area DA and the transmit driver EDV. However, the implementation is not limited to this or by this limitation. According to one implementation, the first power line PL1 may be disposed between the display area DA and the scan driver SDV.

[0131] The connecting line CNL can extend along the first direction DR1 and can be arranged along the second direction DR2. The connecting line CNL can be connected to the first power line PL1 and the pixel PX. A first voltage can be applied to the pixel PX through the first power line PL1 and the connecting line CNL connected to the first power line PL1.

[0132] The second power line PL2 can be located in the non-display area NDA. The second power line PL2 can extend along the long side of the display panel DP and the other short side of the display panel DP where the data driver DDV is not located. The second power line PL2 can be located outside the scan driver SDV and the transmit driver EDV.

[0133] For example, the second power line PL2 can extend to the display area DA and can be connected to the pixel PX. A second voltage with a level lower than the first voltage can be applied to the pixel PX through the second power line PL2.

[0134] The first control line CSL1 can be connected to the scan driver SDV and can extend towards the lower part of the display panel DP in the plan view. The second control line CSL2 can be connected to the transmit driver EDV and can extend towards the lower part of the display panel DP in the plan view. The data driver DDV can be positioned between the first control line CSL1 and the second control line CSL2.

[0135] The pad PD can be set on the display panel DP. The pad PD can be positioned closer to the lower part of the display panel DP than the data driver DDV. The data driver DDV, the first power line PL1, the second power line PL2, the first control line CSL1, and the second control line CSL2 can be connected to the pad PD. Data lines DL1 to DLn can be connected to the data driver DDV, and the data driver DDV can be connected to the pad PD corresponding to the data lines DL1 to DLn.

[0136] For example, a timing controller can control the operation of the scan driver (SDV), data driver (DDV), and transmit driver (EDV), and control a voltage generator to produce a first voltage and a second voltage, and can be mounted on a printed circuit board. The timing controller and voltage generator can be connected to corresponding pads (PD) via the printed circuit board.

[0137] The scan driver SDV generates a scan signal, which is applied to pixel PX via scan lines SL1 to SLm. The data driver DDV generates a data voltage, which is applied to pixel PX via data lines DL1 to DLn. The transmit driver EDV generates a transmit signal, which is applied to pixel PX via transmit lines EL1 to ELm.

[0138] Pixel PX can receive data voltage in response to a scan signal. Pixel PX can emit light with a brightness corresponding to the data voltage in response to a transmit signal, and therefore, an image can be displayed. The emission time of pixel PX can be controlled by the transmit signal.

[0139] Figure 10 yes Figure 9 A schematic cross-sectional view of pixel PX shown.

[0140] refer to Figure 9 and Figure 10 The pixel PX can be set on the base substrate BS and can include transistors TR and light-emitting elements OLED. As an example, in Figure 10 The diagram shows a transistor TR. However, a pixel PX may include multiple transistors for driving the light-emitting element OLED and at least one capacitor.

[0141] An OLED (Optical Display Cell) may include a first electrode AE, a second electrode CE, a hole control layer HCL, an electron control layer ECL, and an emissive layer EML. The first electrode AE ​​may be an anode electrode, and the second electrode CE may be a cathode electrode.

[0142] The display area DA may include a light-emitting area PA corresponding to a pixel PX and a non-light-emitting area NPA surrounding the light-emitting area PA. The light-emitting element OLED may be disposed in the light-emitting area PA.

[0143] The base substrate BS may include a flexible plastic substrate. As an example, the base substrate BS may include transparent polyimide (PI). A buffer layer BFL may be disposed on the base substrate BS, and the buffer layer BFL may be an inorganic layer.

[0144] Semiconductor patterns can be disposed on the buffer layer BFL. The semiconductor pattern may include polycrystalline silicon. However, embodiments are not limited thereto or thereby restricted. According to embodiments, the semiconductor pattern may include amorphous silicon or metal oxide.

[0145] Semiconductor patterns can be doped with N-type or P-type dopants. Semiconductor patterns can include highly doped and lightly doped regions. Highly doped regions can have higher conductivity than lightly doped regions and can essentially serve as the source and drain electrodes of a transistor TR. Lightly doped regions can essentially correspond to the active region (or channel) of the transistor TR.

[0146] The source region S, active region A, and drain region D of transistor TR can be formed from a semiconductor pattern. A first insulating layer INS1 can be disposed on the semiconductor pattern. The gate G of transistor TR can be disposed on the first insulating layer INS1. The gate G can overlap with the active region A. A second insulating layer INS2 can be disposed on the gate G. A third insulating layer INS3 can be disposed on the second insulating layer INS2.

[0147] The connecting electrode CNE can be disposed between the transistor TR and the light-emitting element OLED to connect the transistor TR to the light-emitting element OLED. The connecting electrode CNE may include a first connecting electrode CNE1 and a second connecting electrode CNE2.

[0148] The first connecting electrode CNE1 may be disposed on the third insulating layer INS3 and may be connected to the drain region D via a first contact hole CH1 defined (or formed) to pass through the first insulating layer INS1, the second insulating layer INS2, and the third insulating layer INS3. A fourth insulating layer INS4 may be disposed on the first connecting electrode CNE1. A fifth insulating layer INS5 may be disposed on the fourth insulating layer INS4.

[0149] The second connecting electrode CNE2 may be disposed on the fifth insulating layer INS5. The second connecting electrode CNE2 may be connected to the first connecting electrode CNE1 via a second contact hole CH2 defined (or formed) through the fourth insulating layer INS4 and the fifth insulating layer INS5. A sixth insulating layer INS6 may be disposed on the second connecting electrode CNE2. Each of the first insulating layer INS1 to the sixth insulating layer INS6 may be an inorganic layer or an organic layer.

[0150] A first electrode AE ​​may be disposed on a sixth insulating layer INS6. The first electrode AE ​​may be connected to a second connection electrode CNE2 via a third contact hole CH3 defined (or formed) through the sixth insulating layer INS6. A pixel defining layer PDL may be disposed on the first electrode AE ​​and the sixth insulating layer INS6 to expose a selected portion of the first electrode AE. The pixel defining layer PDL may include an opening PX_OP defined (or formed) through the pixel defining layer PDL to expose a portion of the first electrode AE.

[0151] The hole control layer (HCL) can be disposed on the first electrode (AE) and the pixel definition layer (PDL). The hole control layer (HCL) is commonly disposed in the light-emitting region (PA) and the non-light-emitting region (NPA). The hole control layer (HCL) may include a hole transport layer and a hole injection layer.

[0152] The luminescent layer (EML) can be disposed on the hole control layer (HCL). The EML can be disposed in the region corresponding to the opening (PX_OP). The EML can comprise organic and / or inorganic materials. The EML can produce light with one of the following colors: red, green, and blue.

[0153] The electronic control layer (ECL) can be disposed on the light-emitting layer (EML) and the hole control layer (HCL). The ECL is commonly disposed within the light-emitting region (PA) and the non-light-emitting region (NPA). The ECL may include an electron transport layer and an electron injection layer.

[0154] The second electrode CE can be disposed on the electronic control layer ECL. The second electrode CE can be disposed in a common manner throughout the pixel PX. The layer from the buffer layer BFL to the light-emitting element OLED can be referred to as the pixel layer.

[0155] A thin-film encapsulation layer (TFE) can be disposed on the light-emitting element (OLED). The TFE can also be disposed on the second electrode (CE) to cover the pixel (PX). The TFE may include at least two inorganic layers and an organic layer disposed between the inorganic layers. The inorganic layers protect the pixel (PX) from moisture and oxygen. The organic layers protect the pixel (PX) from foreign matter such as dust particles.

[0156] A first voltage can be applied to the first electrode AE ​​via transistor TR, and a second voltage with a lower level than the first voltage can be applied to the second electrode CE. Holes and electrons injected into the light-emitting layer EML can recombine to generate excitons, and the light-emitting element OLED can emit light by excitons returning from the excited state to the ground state.

[0157] Figure 11 It shows including Figure 10 A schematic cross-sectional view of the deposition process of the display panel DP of the pixel PX shown.

[0158] The layers stacked from the base substrate BS to the first electrode AE ​​can correspond to Figure 1A The substrate SUB. However, the implementation is not limited to this or thus limited. According to the implementation, the substrate SUB (refer to Figure 1A The components can vary depending on the object to be formed through the deposition process.

[0159] The mask MK can be set to face the substrate SUB (see reference). Figure 1A The light-emitting layer (EML) is formed through a deposition process. The mask (MK) can be connected to the substrate (SUB) (see reference). Figure 1A Adjacent settings.

[0160] It can be on the substrate SUB via a cell opening MOP defined (or formed) through the mask MK (refer to)Figure 1A ) Set the vapor deposition material DPM. The vapor deposition material DPM can be used on the substrate SUB (reference) Figure 1A An EML (Emitting Microsphere) is formed on the surface.

[0161] Figure 12 This is a schematic plan view of the arrangement of the magnet MG according to the embodiment. Figure 13 This is a schematic plan view of the arrangement of the magnet MG according to the embodiment. Figure 13 It shows the effect of rotation Figure 12 A schematic diagram illustrating the state obtained by changing the polarity alignment direction of the magnet MG. Figure 12 and Figure 13 In the figures, the same / similar reference numerals indicate Figures 1A-11 The same / similar elements are used, and therefore, for ease of description, detailed descriptions of the same / similar elements will be omitted.

[0162] For ease of description, Figure 12 and Figure 13 In the diagram, the outline of the mask MK, which extends in a direction perpendicular to the polarity alignment direction of the magnet MG, is shown by dashed lines.

[0163] refer to Figure 12 The magnets MG can be arranged to be spaced apart from each other in the first direction DR1 and the second direction DR2.

[0164] Rotary drive units RD-1 can be individually mounted on the magnet MG. For example, according to the embodiment, the rotary drive units RD-1 can be individually mounted on the magnet MG, and can rotate (e.g., directly rotate) the magnet MG separately. In the embodiment, the deposition apparatus PDA-1 may not include the drive gear DG (see reference). Figure 1B Furthermore, the rotation drive unit RD-1 can transmit (e.g., directly transmit) rotational force to the magnet MG.

[0165] refer to Figure 12 The magnet MG can have polarity aligned in the second direction DR2. Therefore, it is possible to prevent the mask MK (referencing) from having a shape extending in the first direction DR1. Figure 1A The phenomenon of improvement.

[0166] Each of the rotation drive units RD-1 can rotate a magnet MG, and allows magnets MG adjacent to each other in the second direction DR2 to face the same magnetic poles. As an example, in the dashed rectangular area, magnets MG located at the upper left and lower right ends can rotate approximately 90° clockwise, and magnets MG located at the upper right and lower left ends can rotate approximately 90° counterclockwise.

[0167] Figure 13The magnet MG shown can have polarities aligned in the first direction DR1. Therefore, even when using a mask MK with a shape extending in the second direction DR2 in the deposition process, it is possible to prevent the mask MK (reference) from being damaged. Figure 1A The phenomenon of improvement.

[0168] Figure 14 This is a schematic plan view of the arrangement of the magnet MGa according to the embodiment. Figure 14 In the figures, the same / similar reference numerals indicate Figures 1A-11 The same / similar elements in the text, and therefore, for ease of description, detailed descriptions of the same / similar elements will be omitted.

[0169] For ease of description, Figure 14 In the diagram, the outline of the mask MK, which has an extension direction perpendicular to the polarity alignment direction of the magnet MGa, is shown by dashed lines.

[0170] In an implementation, each of the magnets MGa can have a polygonal shape in a plan view. Figure 14 The diagram shows magnets MGa, each having a hexagonal shape in a plan view. However, the shape of the magnets MGa is not limited to this or thus restricted. In an embodiment, the magnets MGa included in the deposition apparatus PDA-2 may include a first portion PT1a and a second portion PT2a.

[0171] Magnets MGa can be arranged spaced apart from each other. When magnets MGa rotate about the axis of rotation RXa, they do not obstruct each other. For ease of description, Figure 14 Two circles of rotation, C1 and C2, defined by the rotational trajectory of the magnet MGa, are shown as representative examples. The circles of rotation C1 and C2 may not overlap each other.

[0172] Since the magnets MGa do not contact each other while rotating, the rotating circles C1 and C2 can be spaced apart by a distance DS.

[0173] The circles of rotation C1 and C2 can correspond to the circumcircles of the polygonal shape of the magnet MGa. For example, the circumcircles defined by the magnet MGa can be non-overlapping.

[0174] In concluding this detailed description, those skilled in the art will appreciate that many variations and modifications can be made to the embodiments without substantially departing from the principles, spirit, and scope of this disclosure. Therefore, the disclosed embodiments are used in a general and descriptive sense only and are not intended to be limiting.

Claims

1. A deposition apparatus, characterized in that, include: Mask frame; A mask is disposed on the mask frame, extends in a first direction, and is arranged in a second direction intersecting the first direction; The first plate is disposed on the mask; A magnet unit is disposed on the first plate, arranged in the first direction, and includes a magnet arranged in the second direction; as well as A rotary actuator, mounted on the magnet, rotates the magnet. Each of the magnets comprises a first part and a second part, wherein the second part has a polarity different from that of the first part. The magnets of the (2n-1)th magnet unit relative to the first direction are arranged in the first direction in a first order of the first portion and the second portion, where "n" is a natural number greater than zero, and The magnets of the 2nth magnet unit relative to the first direction are arranged in the first direction in a second order of the second part and the first part.

2. The deposition apparatus according to claim 1, characterized in that, The first portion of the magnet is arranged in a first line in the second direction, and The second portion of the magnet is arranged in a second line in the second direction.

3. The deposition apparatus according to claim 1, characterized in that, Each of the magnets has a rotation axis parallel to a direction perpendicular to the first direction and the second direction, and rotates about the rotation axis.

4. The deposition apparatus according to claim 1, characterized in that, Each of the magnets has a circular shape in the plan view.

5. The deposition apparatus according to claim 1, characterized in that, Each of the magnets has a polygonal shape in the plan view, and The circumcircle of the polygonal shape of one magnet does not overlap with the circumcircle of the polygonal shape of other magnets.

6. The deposition apparatus according to claim 1, characterized in that, The magnet of the 2nth magnet unit relative to the first direction is obtained by shifting the magnet of the (2n-1)th magnet unit relative to the first direction in a diagonal direction between the first direction and the second direction.

7. The deposition apparatus according to claim 6, characterized in that, The magnets, with the first portion facing the first direction and the magnets with the second portion facing the first direction, are arranged alternately in the diagonal direction.

8. The deposition apparatus according to claim 1, characterized in that, Also includes: Drive gears are respectively disposed on the magnet and combined with the magnet. The rotary drive meshes with at least one of the drive gears.

9. The deposition apparatus according to claim 8, characterized in that, The rotary drive meshes with four drive gears.

10. The deposition apparatus according to claim 8, characterized in that, Each of the magnets includes an insertion space extending from the upper surface of each of the magnets to the lower surface of each of the magnets, and Each of the drive gears includes a protruding portion that protrudes in a direction perpendicular to the first direction and the second direction and is inserted into and fixed to the insertion space.

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