Mask assembly conveying device

Abstract

A mask assembly transfer device is provided. The mask assembly transfer device includes a platform for supporting a mask assembly, a magnetic member disposed on the platform, and a plate disposed between the platform and the magnetic member. The mask assembly includes a plurality of masks arranged in a first direction and a plurality of support bars arranged in the first direction, each of the plurality of support bars extending in a second direction. The magnetic member includes a support member and first and second magnets coupled to the support member and arranged in the second direction, each of the first and second magnets extending in the first direction. The first magnets and the second magnets have different polarities from each other and are alternately arranged in the second direction.

Description

[0001] Cross Reference to Related Applications

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2024-0022036, filed on February 15, 2024, in the Korean Intellectual Property Office (KIPO), the entire contents of which are incorporated herein by reference. TECHNICAL FIELD

[0003] The present disclosure relates to a mask assembly transfer apparatus for transferring a mask assembly including a large-area mask, and a mask assembly transfer method using the same. BACKGROUND

[0004] Generally, a light emitting element is disposed in each pixel of a light emitting display apparatus. The light emitting element can include a light emitting pattern disposed between electrodes spaced apart from each other. The light emitting pattern included in each pixel can be divided into a plurality of groups.

[0005] A mask assembly can be used to deposit a pixel on a deposition base. A functional layer can be formed by disposing the deposition base on the mask assembly and depositing a deposition material onto the deposition base. As large-size panels develop, the size of a mask increases, and a device for safely transferring a mask assembly including a large-area mask is needed. SUMMARY

[0006] Embodiments provide a mask assembly transfer apparatus for transferring a mask assembly including a large-area mask without deformation, and a mask assembly transfer method using the same.

[0007] However, embodiments of the present disclosure are not limited to those set forth herein. The above-mentioned and other embodiments will become more apparent by reference to the detailed description of the present disclosure given below, by reference to the attached drawings.

[0008] Embodiments can include a mask assembly transfer apparatus including a platform to support a mask assembly, a magnetic member disposed on the platform, and a plate disposed between the platform and the magnetic member, wherein the mask assembly has a plurality of masks arranged in a first direction and disposed on the platform, and a plurality of support bars disposed between the plurality of masks and arranged in the first direction, each of the plurality of support bars extends in a second direction crossing the first direction, the magnetic member has a support part, and a first magnet and a second magnet coupled to the support part and arranged in the second direction, each of the first magnet and the second magnet extends in the first direction, and the first magnet and the second magnet have different polarities from each other and are alternately arranged in the second direction.

[0009] In embodiments, the plate can include at least one of glass and acrylic.

[0010] In embodiments, the plate can be moved downward to be in contact with the mask assembly.

[0011] In embodiments, the magnetic member can be moved downward to be in contact with the plate.

[0012] In embodiments, the mask assembly can be attached to the plate in a case where a magnetic force is applied to the first magnet and the second magnet.

[0013] In embodiments, the mask assembly can be attached to the magnetic member by the magnetic force, the plate is disposed between the mask assembly and the magnetic member, and the magnetic member can transfer the mask assembly from the platform.

[0014] In embodiments, the first magnet and the second magnet can be each separable from the support part and each replaceable.

[0015] In embodiments, each of the plurality of masks can include a deposition part in which a deposition opening is formed, and a body part surrounding the deposition part, and among the body parts of the plurality of masks, the body parts adjacent to each other in the first direction can be coupled to the support bar.

[0016] In embodiments, the body part can be coupled to the support bar by a welding process.

[0017] In embodiments, in a plan view, the first magnet and the second magnet can each cross the support bar.

[0018] In an embodiment, each of the plurality of masks can have a width in the first direction ranging from about 400 mm to about 1000 mm.

[0019] In an embodiment, each of the plurality of masks disposed at an outermost side among the plurality of masks in the first direction can further include a clamping member coupled to the body member.

[0020] In an embodiment, the mask assembly transfer device can further include an additional support bar overlapping the clamping member and the body member, wherein the clamping member and the body member can be coupled to the additional support bar through a welding process.

[0021] In an embodiment, the plurality of support bars can be disposed between the plurality of masks and the platform.

[0022] In an embodiment, the plurality of masks and the plurality of support bars can include Invar steel.

[0023] In an embodiment, a mask assembly transfer method includes: disposing a mask assembly on a platform; moving a plate downward such that the plate comes into contact with the mask assembly; moving a magnetic member downward such that the magnetic member comes into contact with the plate; attaching the mask assembly to the magnetic member by applying a magnetic force to the magnetic member, wherein the plate is disposed between the mask assembly and the magnetic member; and transferring the magnetic member outside of the platform while the mask assembly is attached to the magnetic member, wherein the mask assembly can include a plurality of masks arranged in a first direction and disposed on the platform, and a plurality of support bars disposed between the plurality of masks and arranged in the first direction, each of the plurality of support bars extending in a second direction crossing the first direction, the magnetic member having a first magnet and a second magnet arranged in the second direction, each of the first magnet and the second magnet extending in the first direction, and the first magnet and the second magnet having different polarities from each other and being alternately arranged in the second direction.

[0024] In an embodiment, the plate can include at least one of glass and acrylic.

[0025] In an embodiment, in a plan view, the first magnet and the second magnet can each cross the support bar.

[0026] In an embodiment, the plurality of support bars can be disposed between the plurality of masks and the platform.

[0027] In an embodiment, each of the plurality of masks can have a width in the first direction ranging from about 400 mm to about 1000 mm. Attached Figure Description

[0028] The accompanying drawings are included to provide a further understanding of the embodiments and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the present disclosure and, together with the description, serve to explain the principles of the disclosure. In the drawings:

[0029] Figure 1 This is a schematic cross-sectional view of a deposition apparatus according to an embodiment;

[0030] Figure 2 This is a schematic plan view of the mask sheet according to an embodiment;

[0031] Figure 3 This is a schematic plan view of the initial mask assembly according to an embodiment;

[0032] Figure 4 This is a schematic plan view of the initial mask assembly according to an embodiment;

[0033] Figures 5 to 9 This is a schematic cross-sectional view illustrating a mask assembly transfer method according to an embodiment;

[0034] Figure 10 This is a schematic plan view of the mask assembly and magnet according to an embodiment;

[0035] Figure 11 It is a schematic plan view of the mask assembly and magnet based on the comparative example;

[0036] Figure 12 It is along Figure 11 A schematic cross-sectional view taken from line I-I' in the diagram;

[0037] Figure 13 It is along Figure 11 A schematic cross-sectional view taken from line II-II' in the diagram;

[0038] Figure 14 A schematic perspective view of a display panel according to an embodiment; and

[0039] Figure 15 This is a schematic cross-sectional view of the display panel according to an embodiment. Detailed Implementation

[0040] In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of various embodiments or implementations of the present disclosure. As used herein, "embodiments" and "implementations" are non-limiting terms used to merely mean an example of the apparatus or method disclosed herein. However, it will be apparent to those skilled in the art that various embodiments can be practiced without these specific details, or with one or more equivalent arrangements. In other instances, well-known structures and functions have not been described in detail in order to avoid obscuring the concepts of the various embodiments. Various embodiments need not always exhibit all benefits or features described herein. For example, a particular shape, configuration, and characteristic of an embodiment can be used or implemented in another embodiment.

[0041] Unless otherwise indicated, embodiments shown are understood to provide features of the present disclosure. Thus, features, components, modules, layers, films, panels, regions, and / or aspects of various embodiments, etc., (hereinafter referred to collectively as "elements") can be combined, separated, interchanged, and / or rearranged, unless otherwise indicated, without departing from the disclosure.

[0042] Generally, the use of cross-hatching and / or shading in the drawings is for clarity and is not a critical feature. Accordingly, the presence or absence of cross-hatching or shading is not intended to convey or dictate any preference or requirement for particular materials, material properties, dimensions, ratios, commonality between illustrated elements, and / or any other characteristic, attribute, property, etc. of the elements. Furthermore, the size and relative sizes of elements in the drawings can be exaggerated for clarity and / or descriptive purposes. When an embodiment can be implemented differently, a specific order in the description of processes can not necessarily be implemented in the same order as described. For example, two sequentially described processes can be executed substantially concurrently or in the reverse order described. Additionally, the same reference numerals and / or characters can represent the same elements.

[0043] When an element or layer is referred to as being “on”, “connected to”, or “coupled to” another element or layer, it can be directly on, directly connected to, or directly coupled to the other element or layer, or one or more intervening elements or layers can be present. In contrast, when an element or layer is referred to as being “directly on”, “directly connected to”, or “directly coupled to” another element or layer, there are no intervening elements or layers present. To this end, the term “connected” can refer to physical, electrical, and / or fluidic connections made with or without intervening elements. In addition, the first direction DR1, the second direction DR2, and the third direction DR3 are not limited to three axes of a rectangular coordinate system such as an x-axis, a y-axis, and a z-axis, and can be interpreted in a broader sense. For example, the x-axis, the y-axis, and the z-axis can be perpendicular to each other, or can represent different directions that are not perpendicular to each other. For the purpose of the present disclosure, “at least one of A and B” can be interpreted as only A, only B, or any combination of A and B. In addition, “at least one of X, Y, and Z” and “at least one selected from the group consisting of X, Y, and Z” can be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items.

[0044] Throughout the specification, when an element is referred to as being “connected” to another element, it can be “directly connected” to the other element, or “electrically connected” to the other element with one or more intervening elements interposed therebetween. In addition, when an element is referred to as being in “contact” or “contacting” another element, etc., the element can be in “electrical contact” or “physical contact” with the other element; or in “indirect contact” or “direct contact” with the other element.

[0045] Although the terms “first”, “second”, etc. can be used herein to describe various types of elements, the elements should not be limited by these terms. These terms are used to distinguish one element from another element. Thus, a first element discussed below could be termed a second element without departing from the teachings of the present disclosure.

[0046] Spatially relative terms, such as "beneath", "below", "lower", "under", "above", "upper", "on", "over", and "side", for example in the context of "side wall", are described herein with reference to the orientation of the apparatus as shown in the drawings. Spatially relative terms are intended to encompass different orientations of the device in use, operation, and / or manufacture in addition to the orientations depicted in the drawings. For example, if the device in the drawings is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. The terms "below" and "above" can encompass both orientations "above" and "below". Thus, the term "below" can encompass both the orientations "above" and "below". Moreover, the device can be otherwise oriented (e.g., rotated 90 degrees or at other orientations) and the spatially relative terms used herein interpreted accordingly.

[0047] It will be understood that when an element, such as a layer, film, region, or substrate, is referred to as being "on" or "over" another element, it can be directly on the other element or intervening elements can also be present.

[0048] The term overlap can include layer, stack, facing or facing, extending throughout, covering or partially covering, or any other suitable term that will be appreciated and understood by one of ordinary skill in the art.

[0049] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. Furthermore, to the extent that the terms "including", "includes", "having", "has", "with", and / or "contains" are used in the detailed description and / or claims, such terms are intended to be inclusive (i.e., in a manner that says that a stated feature, integer, step, operation, element, component, and / or group thereof is present), but not limiting (i.e., in a manner that allows for the inclusion of additional or

[0050] Various embodiments are described herein with reference to cross-sectional and / or exploded illustrations that are schematic illustrations of embodiments and / or intermediate structures. As such, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and / or tolerances, are to be expected. Thus, embodiments disclosed herein should not necessarily be construed as limited to the particular shapes of regions as illustrated herein but are to include deviations in shapes that result from, for example, manufacturing. In this manner, regions illustrated in the figures can have original shapes, and the shapes of the regions can not necessarily reflect actual shapes of the regions in a device and, as such, are not necessarily intended to limit the scope of embodiments.

[0051] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0052] In the following, embodiments will be described with reference to the drawings.

[0053] Figure 1 is a schematic cross-sectional view of a deposition apparatus according to an embodiment. Figure 2 is a schematic plan view of a mask sheet according to an embodiment.

[0054] With reference to Figure 1 A deposition apparatus EA according to an embodiment can include a chamber CH, a deposition source ES, a mask sheet MSS, a deposition substrate BS, a pressing member PM, and a transfer member DD. The deposition apparatus EA can be an apparatus for depositing an organic material or a conductive material onto the deposition substrate BS.

[0055] The chamber CH provides an inner space in which a deposition process can be performed. The deposition source ES, the mask sheet MSS, the deposition substrate BS, the pressing member PM, and the transfer rod ML of the transfer member DD can be disposed in the inner space. A support member SP can be disposed inside the chamber CH. The mask sheet MSS can be placed on the support member SP.

[0056] The deposition source ES can provide a deposition material to the deposition substrate BS. For example, the deposition source ES can evaporate a deposition material including at least any one of an inorganic material and an organic material, and inject the evaporated deposition material in a direction toward the mask sheet MSS. The deposition material can pass through the mask sheet MSS to be deposited onto the deposition substrate BS. The deposition source ES can be implemented in a manner of heating and evaporating the deposition material at a high temperature. According to an embodiment, the deposition apparatus EA can further include a transfer unit for moving the deposition source ES in the first direction DR1 and the second direction DR2.

[0057] The pressing member PM can include a magnetic plate MP and a support plate YK. According to an embodiment, the pressing member PM can further include a cooling plate disposed between the deposition substrate BS and the support plate YK.

[0058] The magnetic plate MP can be disposed inside the support plate YK. When the deposition substrate BS and the mask sheet MSS are in close contact with each other, the magnetic plate MP can generate a magnetic force, and can pull the mask MS. The magnetic plate MP can prevent a lifting phenomenon caused by a difference in curvature between the deposition substrate BS and the mask MS, and thus prevent occurrence of a shadowing effect as a deposition defect. The magnetic plate MP can be provided as at least one of a permanent magnet and an electromagnet.

[0059] Accordingly, a coupling force between the deposition substrate BS and the mask sheet MSS can be increased. The arrangement position, shape, and number of the magnetic plate MP are not limited to any one embodiment, as long as the magnetic plate MP is disposed on the mask sheet MSS and allows the mask MS included in the mask sheet MSS to be coupled to the deposition substrate BS by a magnetic force.

[0060] The support plate YK can accommodate the magnetic plate MP. The support plate YK can be coupled to the transfer member DD, and can bring the magnetic plate MP into close contact with or separation from the deposition substrate BS.

[0061] The cooling plate can be disposed between the deposition substrate BS and the support plate YK. The cooling plate can provide a function for cooling the deposition substrate BS or the mask MS, thereby preventing the deposition substrate BS or the mask MS from overheating during a deposition process. Accordingly, deformation of the deposition substrate BS can be prevented. A cooling line, etc. that injects cooling water or cooling air can be provided inside the cooling plate.

[0062] The transfer member DD can be connected to the pressing member PM. The transfer member DD can include a transfer rod ML and a transfer body MC. The transfer body MC can transfer the pressing member PM in a third direction DR3 (e.g., in an upward direction or in a downward direction) through the transfer rod ML.

[0063] For example, the transfer body MC can be disposed outside the chamber CH. The transfer body MC can be implemented as a gas cylinder or a motor. For example, in a case where the transfer body MC is a cylinder, the transfer rod ML can be a piston. In a case where the transfer body MC is a motor, the transfer rod ML can be implemented as a ball screw shaft that can move upward or downward according to rotation of the motor. However, embodiments are not limited to any one embodiment, as long as the transfer member DD is a device capable of moving the pressing member PM.

[0064] A mask sheet MSS can be disposed inside the chamber CH, and a deposition base BS can be disposed on the mask sheet MSS. The mask sheet MSS can include a frame FR, a mask MS, and a support bar SS. The frame FR, the mask MS, and the support bar SS can include at least one of invar and stainless steel.

[0065] The frame FR can be placed on the support member SP to support the mask MS and the support bar SS. A frame opening F-OP can be defined in the frame FR. The shape, position, and number of the frame FR are not limited to any one embodiment.

[0066] Figure 2 A schematic plan view of a mask sheet MSS is illustrated. The mask sheet MSS according to an embodiment can include a frame FR, a first mask MS1, a second mask MS2, a third mask MS3, and a fourth mask MS4, and a first support bar SS1, a second support bar SS2, and a third support bar SS3. In an embodiment, the first mask MS1, the second mask MS2, the third mask MS3, and the fourth mask MS4 can be a fine metal mask (FMM).

[0067] The first mask MS1, the second mask MS2, the third mask MS3, and the fourth mask MS4 can be arranged along a first direction DR1 and can extend along a second direction DR2. Figure 2 Four masks (e.g., the first mask MS1, the second mask MS2, the third mask MS3, and the fourth mask MS4) are illustrated to be disposed in the frame FR, but the number and shape of the masks are not limited to any one embodiment.

[0068] The first mask MS1, the second mask MS2, the third mask MS3, and the fourth mask MS4 can each include a deposition part DA and a body part NDA adjacent to the deposition part DA.

[0069] A deposition opening M-OP passing through the deposition part DA can be defined in the deposition part DA. The deposition opening M-OP can overlap the frame opening F-OP. From Figure 1 The deposition material ejected from the deposition source ES illustrated in FIG. 1A can pass through the frame opening F-OP and the deposition opening M-OP to be deposited on the deposition base BS (see FIG. 1B). Figure 1 ).

[0070] According to an embodiment, the first mask MS1, the second mask MS2, the third mask MS3, and the fourth mask MS4 for manufacturing a large-area display panel can each have a width WD in a range of about 400 mm to about 1000 mm in the first direction DR1. The first mask MS1, the second mask MS2, the third mask MS3, and the fourth mask MS4 can each include invar.

[0071] The first mask MS1, the second mask MS2, the third mask MS3, and the fourth mask MS4 can be coupled to the frame FR through a welding process. Accordingly, a first welding protrusion WBO formed through the welding process can be formed in a portion of the body part NDA of each of the first mask MS1, the second mask MS2, the third mask MS3, and the fourth mask MS4.

[0072] The first support bar SS1, the second support bar SS2, and the third support bar SS3 can be disposed under the first mask MS1, the second mask MS2, the third mask MS3, and the fourth mask MS4. The first support bar SS1, the second support bar SS2, and the third support bar SS3 can be disposed between the body parts NDA disposed adjacent to each other along the first direction DR1 among the body parts NDA included in the first mask MS1, the second mask MS2, the third mask MS3, and the fourth mask MS4.

[0073] For example, the first support bar SS1 can be disposed between the body part NDA of the first mask MS1 and the body part NDA of the second mask MS2. The second support bar SS2 can be disposed between the body part NDA of the second mask MS2 and the body part NDA of the third mask MS3. The third support bar SS3 can be disposed between the body part NDA of the third mask MS3 and the body part NDA of the fourth mask MS4.

[0074] The body parts NDA adjacent to each other can be coupled to the first support bar SS1, the second support bar SS2, and the third support bar SS3 through a welding process. Accordingly, a second welding protrusion WMO formed through the welding process can be formed on the body parts NDA overlapping the first support bar SS1, the second support bar SS2, and the third support bar SS3.

[0075] Figure 3 is a schematic plan view of an initial mask assembly according to an embodiment. Figure 4 is a schematic plan view of an initial mask assembly according to an embodiment. Reference is made to Figure 3 and Figure 4 The mask assembly MSA and MSA-a described can be a mask assembly to be transferred, conveyed, or stored by a mask assembly transfer device MVS according to an embodiment to be described with reference to Figure 5 The mask assembly MSA or MSA-a can be defined, before being coupled to the frame FR shown in FIG. 1A, as a mask assembly (e.g., the first mask MS1, the second mask MS2, the third mask MS3, and the fourth mask MS4) and a support bar (e.g., the first support bar SS1, the second support bar SS2, and the third support bar SS3) coupled to each other. Figure 2 The mask assembly MSA or MSA-a can be defined, before being coupled to the frame FR shown in FIG. 1A, as a mask assembly (e.g., the first mask MS1, the second mask MS2, the third mask MS3, and the fourth mask MS4) and a support bar (e.g., the first support bar SS1, the second support bar SS2, and the third support bar SS3) coupled to each other. Figure 2The mask assembly MSS is shown in the diagram. Therefore, the mask assembly MSA or MSA-a can be in a state where the mask assembly MSA or MSA-a only includes the mask and the support strip.

[0076] Reference Figure 3 According to the embodiment, the mask assembly MSA may include a first mask MS1, a second mask MS2, a third mask MS3 and a fourth mask MS4, as well as a first support bar SS1, a second support bar SS2 and a third support bar SS3.

[0077] First mask MS1, second mask MS2, third mask MS3, and fourth mask MS4 can be arranged along a first direction DR1 and can extend along a second direction DR2. Each of the first mask MS1, second mask MS2, third mask MS3, and fourth mask MS4 can include a deposition component DA and a body component NDA adjacent to the deposition component DA. A deposition opening M-OP passing through the deposition component DA can be defined within the deposition component DA. First support bar SS1, second support bar SS2, and third support bar SS3 can be disposed below the first mask MS1, second mask MS2, third mask MS3, and fourth mask MS4. The first support bar SS1, second support bar SS2, and third support bar SS3 can be disposed between adjacent body components NDAs arranged along the first direction DR1 within the body components NDAs included in the first mask MS1, second mask MS2, third mask MS3, and fourth mask MS4. Adjacent body components NDAs can be coupled to the first support bar SS1, second support bar SS2, and third support bar SS3 via a welding process. Therefore, the second weld protrusion WMO formed by the welding process can be formed on the body component NDA that overlaps with the first support bar SS1, the second support bar SS2 and the third support bar SS3.

[0078] According to this embodiment, the outermost first mask MS1 and fourth mask MS4 may each include a main component DM having a deposition component DA and a body component NDA, and either a clamping component CM-L or CM-R protruding from the main component DM. The clamping components CM-L and CM-R may each include a protruding pattern CP protruding from the main component DM along a first direction DR1. A shape recessed towards the main component DM may be formed along a second direction DR2 between adjacent protruding patterns CP.

[0079] To prevent the first mask MS1, the second mask MS2, the third mask MS3, and the fourth mask MS4 from interfering with the soldering of the mask assembly MSA to... Figure 2The protrusion pattern C-P can be grabbed by a separate device such as a clamping device and stretched along the first direction DR1 while the welding process is performed on the frame FR, which is deformed during the process of the frame FR shown in FIG. 1 and is welded to the frame FR.

[0080] According to this embodiment, the main part DM of the first mask MS1 and the first clamping part CM-L can be provided as an integrated pattern. A cutting line C-L can be defined in the first mask MS1. When the main part DM of the first mask MS1 is coupled to the frame FR by the welding process, the first clamping part CM-L can be removed from the main part DM along the cutting line C-L. This can also be similarly applied to the main part DM included in the fourth mask MS4 and the second clamping part CM-R.

[0081] In describing the mask assembly MSA-a in Figure 4 , the difference from the mask assembly MSA shown in Figure 3 will be explained. The mask assembly MSA-a according to this embodiment can include the first clamping part CM-L coupled to the first mask MS1 and the second clamping part CM-R coupled to the fourth mask MS4.

[0082] According to this embodiment, an additional support bar CS can also be included to couple the first mask MS1 and the fourth mask MS4 to the first clamping part CM-L and the second clamping part CM-R. The first mask MS1 and the first clamping part CM-L can be coupled to the additional support bar CS by a welding process. Accordingly, a third welding protrusion WCO can be formed on the first mask MS1 and the first clamping part CM-L. The fourth mask MS4 and the second clamping part CM-R can be coupled to the additional support bar CS by a welding process. Accordingly, a third welding protrusion WCO can be formed on the fourth mask MS4 and the second clamping part CM-R.

[0083] According to this embodiment, a cutting line C-L can be defined in each of the first clamping part CM-L and the second clamping part CM-R. When the first mask MS1 and the fourth mask MS4 are coupled to the frame FR by a welding process, the first clamping part CM-L and the second clamping part CM-R can be removed along the cutting line C-L.

[0084] Figures 5 to 9 is a schematic cross-sectional view illustrating a mask assembly transfer method according to an embodiment. Figures 5 to 9 illustrates a transfer method of the mask assembly MSA shown in Figure 3 , but the transfer method can also be applied to the mask assembly MSA-a shown in Figure 4 , and the present disclosure is not limited to any one embodiment. Repetitive explanation of the mask assembly MSA shown in Figure 3 may be omitted.

[0085] Referring to Figure 5 The mask assembly transfer device MVS can include a stage ST on which the mask assembly MSA is disposed, a plate PL disposed on the stage ST, and a magnetic member MM disposed on the plate PL.

[0086] The mask assembly MSA can be disposed on the stage ST. The stage ST can be provided in a cuboid shape. According to an embodiment, the stage ST can further include a suction hole for securing the mask assembly MSA by forming an air flow.

[0087] The plate PL can be disposed on the stage ST. The plate PL can include a driving motor that is separated from the magnetic member MM and performs upward or downward movement along the third direction DR3 or horizontal movement along the first direction DR1 and the second direction DR2.

[0088] The plate PL can be disposed between the mask assembly MSA and the magnetic member MM, and can prevent the mask assembly MSA from being deformed in the case where a magnetic force is applied to the magnetic member MM. Accordingly, the plate PL can include a non-magnetic material. For example, the plate PL can include at least one of glass and acrylic.

[0089] The magnetic member MM can be disposed on the plate PL. In the case where a magnetic force is formed in the magnetic member MM, the mask assembly MSA and the magnetic member MM can not directly contact each other but be indirectly coupled to each other with the plate PL interposed therebetween and integrally transferred.

[0090] The magnetic member MM can include a magnet MG and a support part SL. The magnet MG can include a first magnet M1 and a second magnet M2, each of which extends along the first direction DR1 and is arranged along the second direction DR2. The first magnet M1 and the second magnet M2 can be separated from the support part SL and be individually replaced.

[0091] The first magnet M1 and the second magnet M2 can be alternately arranged along the second direction DR2. In an embodiment, the first magnet M1 and the second magnet M2 can have different polarities from each other.

[0092] According to this embodiment, the extending directions of the first magnet M1 and the second magnet M2 can cross the extending direction of the support bar SS. For example, the first magnet M1 and the second magnet M2 can extend along the first direction DR1, and the support bar SS can extend along the second direction DR2. Accordingly, as a force applied to the support bar SS from the first magnet M1 and the second magnet M2 along the second direction DR2, a repulsive force and an attractive force can be alternately applied.

[0093] Hereinafter, a mask assembly transfer method using the foregoing mask assembly transfer apparatus MVS will be described. Figures 5 to 9 Hereinafter, a mask assembly transfer method using the foregoing mask assembly transfer apparatus MVS will be described.

[0094] Referring to Figure 5 , the mask assembly transfer method can include a step of setting the mask assembly MSA on the platform ST.

[0095] Thereafter, referring to Figure 6 , the mask assembly transfer method can include a step of moving the plate PL downward. The plate PL can be moved along the third direction DR3 by a separate transfer apparatus provided with a motor. The plate PL can be moved downward to be in contact with (or attached to) the mask assembly MSA.

[0096] Thereafter, referring to Figure 7 , the mask assembly transfer method can include a step of moving the magnetic member MM downward and attaching the mask assembly MSA to the magnetic member MM with the plate PL interposed therebetween. The magnetic member MM can be moved along the third direction DR3 by a separate transfer apparatus provided with a motor. The magnetic member MM can be moved downward to be in contact with (or attached to) the plate PL.

[0097] Thereafter, referring to Figure 8 , the mask assembly transfer method can include a step of raising the magnetic member MM.

[0098] The first and second magnets M1 and M2 included in the magnetic member MM can be arranged along the second direction DR2. The first and second magnets M1 and M2 can each extend along the first direction DR1. The first and second magnets M1 and M2 can be alternately arranged along the second direction DR2. The support bar SS for coupling the mask MS can extend along the second direction DR2.

[0099] In the case where a magnetic force is applied to the magnetic member MM, different magnetic forces can be applied to the first and second magnets M1 and M2. For example, the first magnet M1 can have an N pole, and the second magnet M2 can have an S pole, or the first magnet M1 can have an S pole, and the second magnet M2 can have an N pole. Since the mask MS and the support bar SS can include invar, in the case where a magnetic force is applied to the magnetic member MM, the mask assembly MSA can be attached to the magnetic member MM with the plate PL interposed therebetween. While the plate PL and the mask assembly MSA are coupled to the magnetic member MM, the magnetic member MM can be moved upward along the third direction DR3.

[0100] Thereafter, referring to Figure 9The mask assembly transfer method may include the step of transferring the magnetic component MM to the outside of the platform ST. The mask assembly MSA attached to the magnetic component MM may be in a position where the mask assembly MSA is not coupled to... Figure 2 The frame FR shown is transmitted, stored, or transported in its current state. The mask assembly MSA can be coupled to... Figure 2 The frame FR is shown, and can be used Figure 1 The deposition apparatus EA shown performs the deposition process on the deposition substrate BS.

[0101] Figure 10 This is a schematic plan view of the mask assembly and magnet according to an embodiment. Figure 11 It is a schematic plan view of the mask assembly and magnet based on the comparative example. Figure 12 It is along Figure 11 A schematic cross-sectional view taken from line I-I' in the diagram. Figure 13 It is along Figure 11 A schematic cross-sectional view taken from line II-II' in the diagram.

[0102] like Figure 10 As shown, according to the embodiment, the first magnet M1 and the second magnet M2 can be arranged in a direction intersecting the first support bar SS1 and the second support bar SS2. Accordingly, the magnetic force applied to the first support bar SS1 and the second support bar SS2 along the second direction DR2 can be uniform.

[0103] On the other hand, refer to Figures 11 to 13 According to the comparative example, the first magnet M1 and the second magnet M2 can extend along the second direction DR2 in the same direction as the first support bar SS1 and the second support bar SS2, and can be arranged along the first direction DR1.

[0104] like Figure 12 As shown, the first support bar SS1 can be positioned at the center of the first magnet M1 and can receive uniform magnetic force from the first magnet M1. However, as Figure 13 As shown, the second magnet M2 can be biased from the center of the second support bar SS2 toward the first direction DR1, and thus a repulsive force can be generated on the second support bar SS2. Due to the repulsive force, a lifting phenomenon LP may occur, in which the first mask MS1 is lifted from the second support bar SS2, thereby passing through Figure 1 Deposition defects can occur when the deposition equipment EA performs the deposition process.

[0105] according to Figure 10In the embodiment shown in FIG. 1, the magnetic force applied from the magnets M1 and M2 to the first support bar SS1 and the second support bar SS2 can be uniform because the first support bar SS1 and the second support bar SS2 and the magnets M1 and M2 are arranged to cross each other. Accordingly, a mask assembly transfer device MVS that does not deform the shape of a mask assembly MSA, and a mask assembly transfer method using the same can be provided.

[0106] Figure 14 is a schematic perspective view of a display panel according to an embodiment. Figure 15 is a schematic cross-sectional view of a display panel according to an embodiment. Figure 14 and Figure 15 shows a cross-section corresponding to one of the plurality of pixels, and a cross-section corresponding to the transistor T1 and the light emitting element OL. Figure 1 is an example of a display panel DP formed by the deposition apparatus EA and the mask sheet MSS shown in FIG. 1.

[0107] Referring to Figure 14 and Figure 15 , the display panel DP can display an image through a display surface DP-IS. A top surface of a member disposed at an uppermost side of the display panel DP can be defined as the display surface DP-IS.

[0108] The display surface DP-IS can be parallel to a plane defined by the first direction DR1 and the second direction DR2. A normal direction of the display surface DP-IS (e.g., a thickness direction of the display panel DP) can indicate a third direction DR3. A front surface (or a top surface) and a rear surface (or a bottom surface) of each of the layers or units to be described below can be distinguished based on the third direction DR3.

[0109] The display panel DP can include a display area PA and a non-display area NPA. An emission layer included in a pixel (e.g., a pixel unit PXU) can be disposed in the display area PA, and the emission layer of the pixel can not be disposed in the non-display area NPA. The non-display area NPA can be defined along an edge of the display surface DP-IS. The non-display area NPA can surround the display area PA. In an embodiment, the non-display area NPA can be omitted or can be disposed at one side of the display area PA.

[0110] Referring to Figure 15 , in an embodiment, the display panel DP can be a light emitting display panel. Figure 15 shows a cross-section corresponding to one of the plurality of pixels, and a cross-section corresponding to the transistor T1 and the light emitting element OL.

[0111] The display panel DP can include a base layer BL, a circuit element layer DP-CL disposed on the base layer BL, a display element layer DP-OL disposed on the circuit element layer DP-CL, and a sealing layer TFL disposed on the display element layer DP-OL.

[0112] The base layer BL can include a synthetic resin layer. The base layer BL can be formed by forming a synthetic resin layer on a support substrate used at the time of manufacturing the display panel DP, forming a conductive layer and an insulating layer on the synthetic resin layer, and removing the support substrate.

[0113] The circuit element layer DP-CL can include at least one insulating layer and a circuit element. The circuit element can include a signal line, or a driving circuit of a pixel, and the like. The circuit element layer DP-CL can be formed by a process for forming an insulating layer, a semiconductor layer, and a conductive layer by coating or deposition, and the like, and a process for patterning the insulating layer, the semiconductor layer, and the conductive layer by photolithography.

[0114] In this embodiment, the circuit element layer DP-CL can include a buffer layer BFL and a first insulating layer 10, a second insulating layer 20, a third insulating layer 30, a fourth insulating layer 40, a fifth insulating layer 50, and a sixth insulating layer 60. The first insulating layer 10, the second insulating layer 20, the third insulating layer 30, the fourth insulating layer 40, the fifth insulating layer 50, and the sixth insulating layer 60 can include at least one of an inorganic film and an organic film. The buffer layer BFL can include an inorganic film. At least one of the fifth insulating layer 50 and the sixth insulating layer 60 can include an organic film.

[0115] Figure 15 The arrangement relationship of the active region Aa, the gate electrode Ga, the source electrode Sa, and the drain electrode Da constituting the transistor T1 is shown.

[0116] The active region Aa can include a polysilicon semiconductor. However, the embodiment is not limited thereto, and the active region Aa can include a metal oxide semiconductor. The source electrode Sa and the drain electrode Da can be regions having a large doping concentration than the active region Aa, and thus can be used as electrodes. Further, the gate electrode Ga forms a capacitor with the upper electrode UE.

[0117] The circuit element layer DP-CL can include a first connection electrode CNE1 and a second connection electrode CNE2 connecting the signal line SCL and the anode AE. The first connection electrode CNE1 can be connected to the signal line SCL via a first contact hole CNT-1, and the second connection electrode CNE2 can be connected to the first connection electrode CNE1 via a second contact hole CNT-2. The anode AE can be connected to the second connection electrode CNE2 via a third contact hole CNT-3.

[0118] The display element layer DP-OL can include a pixel definition film PDL and a light emitting element OL. The light emitting element OL can be an organic light emitting diode or a quantum dot light emitting diode. An anode AE can be disposed on the sixth insulating layer 60. A pixel opening OP-PX of the pixel definition film PDL can expose at least a portion of the anode AE. The pixel opening OP-PX of the pixel definition film PDL can define a light emitting area PXA. A non-light emitting area NPXA can surround the light emitting area PXA.

[0119] The hole control layer HCL and the electron control layer ECL can be commonly disposed in the light emitting area PXA and the non-light emitting area NPXA. The light emitting layer EML can include a light emitting substance, and can be provided in a pattern form to correspond to the pixel opening OP-PX. The light emitting layer EML can be deposited by a method different from a method for the hole control layer HCL having a film shape and the electron control layer ECL having a film shape. The hole control layer HCL and the electron control layer ECL can be commonly formed in the pixel using an opening mask.

[0120] The light emitting layer EML can be formed by Figure 1 a deposition substrate BS shown in FIG. 1B. Figure 1 The deposition substrate BS shown in FIG. 1B can be defined as a state in which Figure 15 from the base layer BL to the layers of the pixel definition film PDL, the anode AE, and the hole control layer HCL shown in FIG. 1B.

[0121] A cathode CE can be disposed on the electron control layer ECL. An encapsulation layer TFL can be disposed on the cathode CE. The encapsulation layer TFL can be a thin film encapsulation layer for encapsulating the display element layer DP-OL. The encapsulation layer TFL can include a plurality of thin films. The thin films can include inorganic films EN1 and EN3 and an organic film EN2. The encapsulation layer TFL can include an insulating layer for encapsulating the display element layer DP-OL and a plurality of insulating layers for improving emission efficiency.

[0122] According to an embodiment, in the case of transferring a large-area mask assembly, the magnets are arranged in a direction perpendicular to the support bars, and thus a repulsive force is not applied to the mask assembly, thereby stably transferring the mask assembly.

[0123] In summarizing the detailed description, those skilled in the art will appreciate that many changes and modifications can be made to the embodiments without substantially departing from the principles, spirit, and scope of the disclosure. Therefore, the disclosed embodiments are for the general and descriptive purposes only and are not for the purpose of limitation.

[0124] Although embodiments have been disclosed for illustrative purposes, those skilled in the art will appreciate that various modifications, additions and substitutions are possible, without departing from the scope and spirit of the disclosure as disclosed in the following claims and their equivalents.

[0125] The accompanying drawings and detailed description are described of the disclosure only as examples of the disclosure, only for describing the disclosure, and are not intended to limit the meaning and scope of the disclosure described in the claims. Therefore, those skilled in the art can understand that various modifications and other embodiments equivalent to the disclosure are possible according to the teachings of the disclosure.

Claims

1. A mask assembly transfer device, characterized by, The mask assembly transfer apparatus includes: a platform supporting a mask assembly; a magnetic member disposed on the platform; and a plate disposed between the platform and the magnetic member, the mask assembly includes: a plurality of masks arranged in a first direction and disposed on the platform, and a plurality of support bars disposed between the plurality of masks and arranged in the first direction, each of the plurality of support bars extending in a second direction crossing the first direction, the magnetic member includes: a support part; and first and second magnets coupled to the support part and arranged in the second direction, each of the first and second magnets extending in the first direction, the first and second magnets have different polarities from each other, and the first and second magnets are alternately arranged in the second direction.

2. The mask assembly transfer device of claim 1, wherein, the plate moves downward to be in contact with the mask assembly; the magnetic member moves downward to be in contact with the plate; in a case where a magnetic force is applied to the first and second magnets, the mask assembly is attached to the plate. 3.The mask assembly transfer apparatus of claim 2, wherein the mask assembly is attached to the magnetic member by the magnetic force, the plate is disposed between the mask assembly and the magnetic member, and the magnetic member transfers the mask assembly from the platform.

4. The mask assembly transfer device of claim 2, wherein, the first and second magnets are each detachable from the support part and are each replaceable. 5.The mask assembly transfer apparatus of claim 1, wherein each of the plurality of masks includes a deposition part in which a deposition opening is formed, and a body part surrounding the deposition part, and among the body parts of the plurality of masks, the body parts adjacent to each other in the first direction are coupled to the support bars.

6. The mask assembly transfer device of claim 5, wherein, the body parts are coupled to the support bars by a welding process.

7. The mask assembly transfer device of claim 1, wherein, each of the plurality of masks has a width in the first direction in a range of 400mm to 1000mm.

8. The mask assembly transfer device of claim 5, wherein, among the plurality of masks, each of a plurality of masks disposed at an outermost side in the first direction further includes a clamping part connected to the body part.

9. The mask assembly transfer device of claim 8, wherein, The mask assembly transfer apparatus further includes an additional support bar overlapping the clamping part and the body part, wherein the clamping part and the body part are coupled to the additional support bar by a welding process.

10. The mask assembly transfer device of claim 1, wherein, the plurality of support bars are disposed between the plurality of masks and the platform.

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