Bagged silicon wafer conveying mechanism

By designing a bagged silicon wafer conveying mechanism, the problem of loose bag openings during the conveying process was solved by using conveying components and limiting components. This achieved tight sealing and accurate positioning of the silicon wafers, avoided damage to the wafers, and provided a simple and efficient limiting solution.

CN223891365UActive Publication Date: 2026-02-10WUXI AUTOWELL TECH
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Patent Information

Application Number
CN202520208888.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-02-10
Publication Date
2026-02-10
Estimated Expiration
2035-02-10

AI Technical Summary

Technical Problem

In photovoltaic module production, the bag openings of bagged silicon wafers are prone to loosening during transportation, causing the stacked wafers to become loose and easily damaged during handling.

Method used

A bagged silicon wafer conveying mechanism was designed, comprising a conveying component and a limiting component. By pressing the bag fold on the conveying component and setting the limiting component at the unloading station, the bagged silicon wafer is prevented from falling off, ensuring that the bag fold is tightly attached to the silicon wafer surface, achieving tight sealing, and ensuring the accuracy of the silicon wafer position with the cooperation of the limiting component.

Benefits of technology

This invention enables the tight sealing of bagged silicon wafers, preventing damage to the wafers, ensuring the accuracy of wafer position detection, and providing a simple and space-saving limiting solution.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a bagged silicon wafer conveying mechanism, a bagged silicon wafer comprises a bag body and a plurality of stacked silicon wafers loaded in the bag body, the conveying mechanism comprises a conveying assembly and a limiting assembly, the conveying assembly is configured to convey the bagged silicon wafers to a discharging station, and the limiting assembly is configured to limit the bagged silicon wafers. The folding opening of the bag body of the bagged silicon wafer received by the conveying assembly is pressed on the conveying surface of the conveying assembly by the silicon wafer, and the direction of the folding opening of the bag body is the same as the conveying direction of the conveying assembly; the limiting assembly is at least configured to prevent the bagged silicon wafers from being separated from the discharging station in the conveying direction of the conveying assembly. After the conveying assembly conveys the bagged silicon wafers to the discharging station, the conveying assembly drives the folding opening of the bag body to move in the conveying direction of the conveying assembly so that the folding opening of the bag body can be tensioned and tightly attached to the lower surface of the bag body. According to the bagged silicon wafer conveying mechanism, through cooperation of the conveying assembly and the limiting assembly, the folded opening of the bag body can be tensioned and tightly attached to the lower surface of the bag body while the bagged silicon wafers are conveyed, and the multiple silicon wafers are tightly sealed and stored in the bag body.
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Description

Technical Field

[0001] This application belongs to the technical field of photovoltaic module production equipment, and in particular relates to a bagged silicon wafer conveying mechanism. Background Technology

[0002] The solar cells of photovoltaic modules are made from silicon wafers. After the silicon wafers are produced, they are usually stacked vertically to form a stack. The stacks are then packed into bags, and several bags of stacks are packed into boxes. The boxes are used to store the bagged stacks, ensuring that the silicon wafers are not damaged during transportation to the photovoltaic module production equipment.

[0003] However, in actual production, after the wafers are bagged, the bag opening needs to be folded up to prevent the excess bag from affecting the boxing process and to seal the wafers inside the bag. But because the bag itself is not adhesive, the folded-up bag opening can easily loosen during the transport of the bagged silicon wafers, resulting in the wafers not being tightly sealed and gaps remaining between the wafers and the bag. When the wafers are loosely sealed in the bag, they can easily move within the bag during handling, preventing them from being accurately stacked. Subsequently, when the loosely bagged silicon wafers are loaded into the box, some wafers may bump against the box, causing damage. Utility Model Content

[0004] The purpose of this application is to provide a bagged silicon wafer conveying mechanism to solve the problem that the folds of the packaging bags are prone to loosening during the conveying process of existing bagged silicon wafers.

[0005] To achieve this objective, the following technical solution is adopted in this application:

[0006] This application discloses a bagged silicon wafer conveying mechanism. The bagged silicon wafer includes a bag body and a plurality of stacked silicon wafers placed inside the bag body. The mechanism includes a conveying component and a limiting component. The conveying component is configured to receive the bagged silicon wafer and convey it to a unloading station. The fold of the bag body of the received bagged silicon wafer is pressed against the conveying surface of the conveying component by the silicon wafer. The fold of the bag body faces the same direction as the conveying direction of the conveying component. The limiting component is disposed at the unloading station and is configured to at least prevent the bagged silicon wafer from leaving the unloading station along the conveying direction of the conveying component. After the conveying component conveys the bagged silicon wafer to the unloading station, the conveying component drives the fold of the bag body to move along the conveying direction of the conveying component to tighten the fold of the bag body and press it tightly against the lower surface of the bag body.

[0007] The bagged silicon wafer conveying mechanism proposed in this application has a folded opening of the bag body pressed against the conveying surface of the conveying component by the silicon wafer, with the folded opening facing the same direction as the conveying component. By setting a limiting component at the unloading station of the conveying component, when the conveying component conveys the bagged silicon wafer to the unloading station, the limiting component blocks the bagged silicon wafer from moving forward. Under the action of the conveying surface of the conveying component, the folded opening of the bag will continue to move forward relative to the bagged silicon wafer, thereby tightening the folded opening of the bag and pressing it tightly against the surface of the bag, so that the bag is tightly attached to the surface of the silicon wafer, thus achieving the tight sealing of multiple silicon wafers in the bag. Moreover, the tight attachment of the bag to the surface of the silicon wafer also ensures the accuracy of the sensor when determining the location of the bagged silicon wafer by detecting the side position of the silicon wafer, and avoids the clamping parts of the handling mechanism from damaging or crushing the silicon wafer when picking it up.

[0008] Optionally, the limiting assembly includes two limiting members, which are respectively arranged on both sides of the unloading station along the conveying direction of the conveying assembly, wherein:

[0009] The limiting component includes a mounting plate and a stop plate disposed on the mounting plate. The stop plate is disposed above the conveying surface of the conveying assembly and extends along the conveying direction perpendicular to the conveying assembly and is located on the moving path of the bagged silicon wafer.

[0010] After the conveying assembly delivers the bagged silicon wafers to the unloading station, two stop plates abut against the first end of the bagged silicon wafers located at the unloading station to prevent the bagged silicon wafers from leaving the unloading station.

[0011] Two limiting components are set on both sides of the unloading station along the conveying direction of the conveying assembly. The stop plates of the two limiting components block the bagged silicon wafers on both sides of the unloading station along the conveying direction of the conveying assembly, providing a limiting component with a simple structure and small space occupation; at the same time, it can also avoid the bagged silicon wafers when the clamping parts of the subsequent handling mechanism pick up the bagged silicon wafers on the unloading station.

[0012] Optionally, the limiting component also includes a limiting plate, which is set on the mounting plate along the conveying direction of the conveying assembly, and a stop plate is set vertically on the limiting plate. The two limiting plates are respectively set on both sides of the conveying assembly along the conveying direction of the conveying assembly, and there is space between the two limiting plates for the bagged silicon wafers to slide in and adhere.

[0013] By setting a limiting plate on the mounting plate along the conveying direction of the conveying component, the bagged silicon wafers are limited on both sides of the conveying direction of the conveying component at the unloading station. In conjunction with the stop plate, the bagged silicon wafers are positioned at the preset position at the unloading station, ensuring the consistency of the position of the bagged silicon wafers at the unloading station and facilitating the subsequent handling mechanism to pick up the bagged silicon wafers.

[0014] Optionally, a guide plate is provided at the end of the limiting plate away from the stop plate, and the guide plate is inclined outward towards the conveying assembly.

[0015] By setting a guide plate at the end of the limiting plate away from the stop plate, the bagged silicon wafers on the conveying assembly are guided to enter between the two limiting plates, which is conducive to the smooth entry of the bagged silicon wafers into the space between the two limiting plates.

[0016] Optionally, the conveying assembly includes a mounting frame, a first drive assembly, and two conveyor belts, wherein:

[0017] Two conveyor belts are rotatably mounted on the mounting frame along the conveying direction of the conveying assembly, and the two conveyor belts cooperate to carry the bagged silicon wafers received by the conveying assembly;

[0018] The drive end of the first drive assembly is connected to two conveyor belts. The first drive assembly is configured to drive the two conveyor belts to rotate synchronously to transport bagged silicon wafers carried by the two conveyor belts.

[0019] By rotatably mounting two conveyor belts on the mounting frame, the bagged silicon wafers are supported and avoidance occurs when the clamping parts of the subsequent handling mechanism pick up the bagged silicon wafers at the unloading station; the bagged silicon wafers are transported by the synchronous rotation of the two conveyor belts through the first drive assembly, providing a simple and reliable conveying assembly.

[0020] Optionally, the mounting plate is adjustablely mounted on the mounting frame along the conveying direction of the conveying assembly. The mounting plate has a waist-shaped hole extending along the conveying direction of the conveying assembly. The mounting frame has several threaded holes. Fixing screws pass through the waist-shaped hole and are locked in the threaded holes to fix the mounting plate on the mounting frame.

[0021] The mounting plate is fixed to the mounting frame by the cooperation of fixing screws, oblong holes and threaded holes; by adjusting the installation position of the fixing screws in the oblong holes, the installation position of the mounting plate along the conveying direction of the conveying assembly can be adjusted, which improves the adaptability of the limiting component.

[0022] Optionally, the first drive assembly includes a motor, a transmission assembly, and two sets of drive pulleys, each set of drive pulleys corresponding to a conveyor belt, wherein:

[0023] Each set of drive pulleys includes a first pulley and a second pulley. The first pulley and the second pulley are rotatably mounted on the mounting frame at intervals along the conveying direction of the conveying assembly. The conveyor belt is sleeved on the first pulley and the second pulley in the same set.

[0024] The drive end of the motor is connected to the transmission assembly, and the motor is configured to drive the first pulley of two sets of transmission pulleys to rotate synchronously through the transmission assembly.

[0025] By cooperating with the motor, transmission components and two sets of transmission pulleys, a first drive component with a simple structure, high drive efficiency and high drive precision is achieved by using one motor to drive two conveyor belts to rotate synchronously.

[0026] Optionally, the transmission assembly includes a shaft and two third pulleys, wherein:

[0027] The rotating shaft is rotatably mounted below the mounting bracket, the motor is mounted below the mounting bracket, and the motor's drive shaft is coaxially connected to the rotating shaft;

[0028] Two third pulleys are installed at intervals above the rotating shaft, each third pulley corresponding to a conveyor belt, and the conveyor belt is fitted onto the corresponding third pulley, first pulley and second pulley;

[0029] The motor drives the shaft to rotate along its own axis, thereby driving the two third pulleys to rotate synchronously, and then driving the corresponding conveyor belt to rotate through the cooperation of the first and second pulleys.

[0030] By cooperating with the rotating shaft and two third pulleys, the two first pulleys are driven to rotate synchronously, providing a transmission component with a simple structure, high synchronization, and stable and reliable operation; at the same time, the rotating shaft and motor are set below the mounting frame, which is reasonable in layout and occupies little space.

[0031] Optionally, the conveying assembly is provided with a first detection element, which is configured to detect the side of the bagged silicon wafer at the unloading station to determine whether the bagged silicon wafer is in a preset position at the unloading station.

[0032] By setting a first detection component, the system automatically detects whether the bagged silicon wafers at the unloading station are in the preset position of the unloading station, and controls the subsequent handling mechanism to pick up the bagged silicon wafers at the unloading station based on the detection result.

[0033] Optionally, a second detection element is provided on the mounting bracket, which is configured to detect whether there are bagged silicon wafers at the receiving ends of the two conveyor belts.

[0034] By setting a second detection component, the system can automatically detect whether there are bagged silicon wafers at the receiving ends of the two conveyor belts, thereby controlling the operation of the first drive component. Attached Figure Description

[0035] Figure 1 This is a first-view perspective three-dimensional structural schematic diagram of the bagged silicon wafer conveying mechanism provided in the embodiments of this application;

[0036] Figure 2 This is a logic diagram of the bagged silicon wafers being transported on the transport assembly in the bagged silicon wafer transport mechanism provided in the embodiments of this application;

[0037] Figure 3This is a second-view perspective three-dimensional structural schematic diagram of the bagged silicon wafer conveying mechanism provided in the embodiments of this application;

[0038] Figure 4 This is a three-dimensional structural diagram of the limiting component of the bagged silicon wafer conveying mechanism provided in the embodiments of this application.

[0039] Figures 1 to 4 The following reference numerals are included:

[0040] Conveying assembly 10: mounting bracket 11, threaded hole 110, first drive assembly 12, motor 120, first pulley 121, second pulley 122, rotating shaft 123, third pulley 124, guide wheel 125, conveyor belt 13;

[0041] Limiting component 20: limiting member 21, mounting plate 210, stop plate 211, limiting plate 212, guide plate 213, waist-shaped hole 214;

[0042] 30 material unloading stations;

[0043] Bagged silicon wafers 40: bag body 41, folded opening 410, silicon wafer 42;

[0044] First test piece 50, second test piece 51. Detailed Implementation

[0045] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0046] The solar cells of photovoltaic modules are made from silicon wafers. After the silicon wafers are produced, they are usually stacked vertically to form a stack. The stacks are then packed into bags, and several bags of stacks are packed into boxes. The boxes are used to store the bagged stacks, ensuring that the silicon wafers are not damaged during transportation to the photovoltaic module production equipment.

[0047] However, in actual production, after the wafers are bagged, the bag opening needs to be folded up to prevent the excess bag from affecting the boxing process and to seal the wafers inside the bag. But because the bag itself is not adhesive, the folded-up bag opening can easily loosen during the transport of the bagged silicon wafers, resulting in the wafers not being tightly sealed and gaps remaining between the wafers and the bag. When the wafers are loosely sealed in the bag, they can easily move within the bag during handling, preventing them from being accurately stacked. Subsequently, when the loosely bagged silicon wafers are loaded into the box, some wafers may bump against the box, causing damage.

[0048] Therefore, this application provides a bagged silicon wafer conveying mechanism, please refer to [link / reference]. Figure 1 and Figure 2 As shown, the bagged silicon wafer 40 of the bagged silicon wafer conveying mechanism provided in this application embodiment includes a bag body 41 and a plurality of stacked silicon wafers 42 placed in the bag body 41. The bagged silicon wafer conveying mechanism includes a conveying assembly 10 and a limiting assembly 20. The conveying assembly 10 is configured to receive the bagged silicon wafers 40 and convey the bagged silicon wafers 40 to the unloading station 30. The fold 410 of the bag body 41 of the bagged silicon wafers 40 received by the conveying assembly 10 is pressed by the silicon wafers 42 against the conveying surface of the conveying assembly 10. The fold 410 of the bag 40 faces the same direction as the conveying direction of the conveying assembly 10; the limiting assembly 20 is provided at the unloading station 30, and the limiting assembly 20 is configured to at least prevent the bagged silicon wafer 40 from leaving the unloading station 30 along the conveying direction of the conveying assembly 10; after the conveying assembly 10 conveys the bagged silicon wafer to the unloading station, the conveying assembly 10 drives the fold 410 of the bag body 41 to move along the conveying direction of the conveying assembly 10, so as to tighten the fold 410 of the bag body 41 and stick it tightly to the lower surface of the bag body 41.

[0049] As can be seen, the fold 410 of the bag body 41 of the bagged silicon wafer 40 on the conveying component 10 is pressed by the silicon wafer 42 onto the conveying surface of the conveying component 10, and the fold 410 of the bag body 41 faces the same direction as the conveying direction of the conveying component 10. By setting a limiting component 20 at the unloading station 30 of the conveying component 10, when the conveying component 10 conveys the bagged silicon wafer 40 to the unloading station 30, the limiting component 20 blocks the bagged silicon wafer 40 from continuing to move forward. Under the action of the conveying surface of the conveying component 10, the fold 410 of the bag body 41 will continue to move forward relative to the bagged silicon wafer 40, thereby tightening the fold 410 of the bag body 41 and sticking it tightly to the surface of the bag body 41, so that the bag body 41 is tightly attached to the surface of the silicon wafer 42, thus realizing the tight sealing of multiple silicon wafers 42 in the bag body 41. The bag 41 is in close contact with the surface of the silicon wafer 42, which also ensures the accuracy of the sensor in determining the location of the bagged silicon wafer 40 by detecting the side position of the silicon wafer 42, and avoids the clamping parts of the handling mechanism from damaging or crushing the silicon wafer when picking up the bagged silicon wafer 40.

[0050] Please see Figure 1 , Figure 3 and 4As shown, in one embodiment, the limiting component 20 includes two limiting members 21, which are respectively disposed on both sides of the unloading station 30 along the conveying direction of the conveying component 10. The limiting member 21 includes a mounting plate 210 and a stop plate 211 disposed on the mounting plate 210. The stop plate 211 is disposed above the conveying surface of the conveying component 10 and extends along the conveying direction perpendicular to the conveying component 10 and is located on the moving path of the bagged silicon wafer 40. After the conveying component 10 conveys the bagged silicon wafer 40 to the unloading station 30, the two stop plates 211 respectively abut against the first end of the bagged silicon wafer 40 located at the unloading station 30 to prevent the bagged silicon wafer 40 from leaving the unloading station 30.

[0051] As can be seen, two limiting members 21 are provided on both sides of the unloading station 30 along the conveying direction of the conveying assembly 10. The stop plates 211 of the two limiting members 21 block the bagged silicon wafers 40 on both sides of the unloading station 30 along the conveying direction of the conveying assembly 10, providing a limiting assembly 20 with a simple structure and small space occupation; at the same time, it can also avoid the bagged silicon wafers 40 when the clamping parts of the subsequent handling mechanism pick up the bagged silicon wafers 40 on the unloading station 30.

[0052] In one embodiment, the limiting member 21 also includes a limiting plate 212, which is disposed on the mounting plate 210 along the conveying direction of the conveying assembly 10. A stop plate 211 is disposed vertically on the limiting plate 212. The two limiting plates 212 are respectively disposed on both sides of the conveying assembly 10 along the conveying direction of the conveying assembly 10, and there is a space between the two limiting plates 212 for the bagged silicon wafer 40 to slide into and fit.

[0053] As can be seen, by setting a limiting plate 212 on the mounting plate 210 along the conveying direction of the conveying assembly 10, the bagged silicon wafers 40 are limited on both sides of the conveying direction of the conveying assembly 10 at the unloading station 30. In turn, the stop plate 211 keeps the bagged silicon wafers 40 at the preset position of the unloading station 30, ensuring the consistency of the position of the bagged silicon wafers 40 at the unloading station 30, which is convenient for the subsequent handling mechanism to pick up the bagged silicon wafers 40.

[0054] In one embodiment, a guide plate 213 is provided at the end of the limiting plate 212 away from the stop plate 211, and the guide plate 213 is inclined outward towards the conveying assembly 10.

[0055] Specifically, the limiting component 21 is formed by integral stamping and bending of a metal sheet.

[0056] As can be seen, by setting a guide plate 213 at the end of the limiting plate 212 away from the stop plate 211, the bagged silicon wafer 40 on the conveying assembly 10 is guided to enter between the two limiting plates 212, which is conducive to the smooth entry of the bagged silicon wafer 40 into the space between the two limiting plates 212.

[0057] Please see Figure 1 As shown, in one embodiment, the conveying assembly 10 includes a mounting frame 11, a first drive assembly 12, and two conveyor belts 13, wherein: the two conveyor belts 13 are rotatably mounted on the mounting frame 11 along the conveying direction of the conveying assembly 10, and the two conveyor belts 13 cooperate to carry the bagged silicon wafers 40 received by the conveying assembly 10; the drive end of the first drive assembly 12 is connected to the two conveyor belts 13, and the first drive assembly 12 is configured to drive the two conveyor belts 13 to rotate synchronously to convey the bagged silicon wafers 40 carried by the two conveyor belts 13.

[0058] As can be seen, by rotatably mounting two conveyor belts 13 on the mounting frame 11, the bagged silicon wafers 40 are supported and avoidance is achieved when the clamping parts of the subsequent handling mechanism pick up the bagged silicon wafers 40 on the unloading station 30; by synchronously rotating the two conveyor belts 13 through the first drive assembly 12, the bagged silicon wafers 40 are conveyed, providing a conveying assembly 10 with a simple structure and stable and reliable conveying.

[0059] Please see Figures 1 to 4 As shown, in one embodiment, the mounting plate 210 is adjustablely mounted on the mounting frame 11 along the conveying direction of the conveying assembly 10. The mounting plate 210 has a waist-shaped hole 214 extending along the conveying direction of the conveying assembly 10. The mounting frame 11 has a plurality of threaded holes 110. Fixing screws (not shown in the figure) pass through the waist-shaped hole 214 and are locked in the threaded holes 110 to fix the mounting plate 210 on the mounting frame 11.

[0060] As can be seen, by using the fixing screw, the oblong hole 214 and the threaded hole 110, the mounting plate 210 is fixed on the mounting bracket 11; by adjusting the installation position of the fixing screw in the oblong hole 214, the installation position of the mounting plate 210 along the conveying direction of the conveying assembly 10 is adjustable, which improves the adaptability of the limiting member 21.

[0061] In one embodiment, the first drive assembly 12 includes a motor 120, a transmission assembly, and two sets of transmission pulleys. Each set of transmission pulleys corresponds to a conveyor belt 13. Each set of transmission pulleys includes a first pulley 121 and a second pulley 122. The first pulley 121 and the second pulley 122 are rotatably and spaced apart on the mounting frame 11 along the conveying direction of the conveying assembly 10. The conveyor belt 13 is sleeved on the first pulley 121 and the second pulley 122 of the same set. The drive end of the motor 120 is connected to the transmission assembly, and the motor 120 is configured to drive the first pulley 121 of the two sets of transmission pulleys to rotate synchronously through the transmission assembly.

[0062] Specifically, the first pulley 121 and the second pulley 122 are synchronous pulleys, and the inner surface of the conveyor belt 13 is provided with teeth that mesh with the synchronous pulleys.

[0063] It can be seen that by cooperating with the motor 120, the transmission assembly and the two sets of transmission pulleys, the synchronous rotation of the two conveyor belts 13 by one motor 120 is achieved, providing a first drive assembly 12 with simple structure, high drive efficiency and high drive precision.

[0064] In one embodiment, the transmission assembly includes a rotating shaft 123 and two third pulleys 124. The rotating shaft 123 is rotatably disposed below the mounting frame 11, and the motor 120 is disposed below the mounting frame 11. The drive shaft of the motor 120 is coaxially connected to the rotating shaft 123. The two third pulleys 124 are spaced apart and mounted above the rotating shaft 123. Each third pulley 124 corresponds to a conveyor belt 13, and the conveyor belt 13 is sleeved on the corresponding third pulley 124, the first pulley 121, and the second pulley 122. The motor 120 drives the rotating shaft 123 to rotate along its own axis, thereby driving the two third pulleys 124 to rotate synchronously, and then driving the corresponding conveyor belt 13 to rotate through the cooperation of the first pulley 121 and the second pulley 122.

[0065] Specifically, the third pulley 124 is a synchronous pulley, and the inner surface of the conveyor belt 13 is provided with teeth that mesh with the synchronous pulley.

[0066] Specifically, the mounting frame 11 is also equipped with two sets of guide wheels 125. Each set of guide wheels 125 corresponds to a conveyor belt 13. Each set of guide wheels 125 includes two guide wheels 125 that are spaced apart on the mounting frame 11. The two guide wheels 125 are located above the third pulley 124. The two sides of the conveyor belt 13 that pass over the third pulley 124 abut against the wheel surfaces of the two guide wheels 125 respectively.

[0067] As can be seen, the synchronous rotation of the two first pulleys 121 is achieved by the cooperation of the rotating shaft 123 and the two third pulleys 124, providing a transmission component with simple structure, high synchronization and stable and reliable operation; at the same time, the rotating shaft 123 and the motor 120 are set below the mounting bracket 11, which is reasonable and occupies little space.

[0068] Please see Figure 1 As shown, in one embodiment, the conveying assembly 10 is provided with a first detection element 50, which is configured to detect the side of the bagged silicon wafer 40 at the unloading station 30 to determine whether the bagged silicon wafer 40 is at a preset position of the unloading station 30.

[0069] Specifically, the first inspection piece 50 is disposed at at least one end of the unloading station 30 along the conveying direction of the conveying assembly 10.

[0070] Specifically, the first detection element 50 is installed between the two conveyor belts 13. The first detection element 50 is a photoelectric sensor, and the detection end of the first detection element 50 is set upward.

[0071] As can be seen, by setting the first detection component 50, the automatic detection of whether the bagged silicon wafer 40 at the unloading station 30 is in the preset position of the unloading station 30 is realized, and the subsequent handling mechanism is controlled to pick up the bagged silicon wafer 40 at the unloading station 30 according to the detection result.

[0072] In one implementation, a second detection element 51 is provided on the mounting frame 11, which is configured to detect whether there are bagged silicon wafers 40 at the receiving ends of the two conveyor belts 13.

[0073] Specifically, the second detection element 51 is set on one side of the receiving end of the two conveyor belts 13.

[0074] Specifically, the second detection element 51 is a photoelectric sensor, and the detection end of the first detection element 50 faces the receiving end of the two conveyor belts 13.

[0075] As can be seen, by setting the second detection element 51, the automatic detection of whether there are bagged silicon wafers 40 at the receiving end of the two conveyor belts 13 is realized, so as to control the operation of the first drive component 12.

[0076] Please see Figure 1 and Figure 2 As shown, the general working principle of the bagged silicon wafer conveying mechanism proposed in this application embodiment is as follows: After the second detection element 51 detects that the receiving end of the two conveyor belts 13 has received the bagged silicon wafer 40, the first drive component 12 works to convey the bagged silicon wafer 40 received by the two conveyor belts 13 to the unloading station 30. The limiting component 20 at the unloading station 30 blocks the bagged silicon wafer 40 from moving forward. Under the drive of the conveying surface of the conveying component 10, the fold 410 of the bag body 41 will continue to move forward relative to the bagged silicon wafer 40, thereby tightening the fold 410 of the bag body 41 and sticking it tightly to the surface of the bag body 41.

[0077] The bagged silicon wafer conveying mechanism provided in this application has the following advantages:

[0078] 1) While conveying the bagged silicon wafers 40, the fold 410 of the bag body 41 can be tightened and pressed against the surface of the bag body 41, so that the bag body 41 is pressed against the surface of the silicon wafers 42, thereby sealing multiple silicon wafers 42 tightly in the bag body 41.

[0079] 2) It ensures the accuracy of the sensor in determining the location of the bagged silicon wafer 40 by detecting the side position of the silicon wafer, and avoids the clamping parts of the handling mechanism from damaging or crushing the silicon wafer 40 when picking it up.

[0080] 3) The limiting component 21 has the functions of blocking, limiting and guiding, and has a simple structure and ingenious design;

[0081] 4) The conveying assembly 10 uses two conveyor belts 13 to convey the bagged silicon wafers 40. While ensuring the smoothness of the conveying, it also avoids the bagged silicon wafers 40 at the subsequent handling mechanism's picking and unloading station 30. At the same time, the overall layout of the conveying assembly 10 is reasonable and occupies little space.

[0082] 5) The conveying assembly 10 is equipped with a first detection element 50 and a second detection element 51, which realizes automatic detection of whether the bagged silicon wafer 40 is in the preset position of the unloading station 30 and automatic detection of whether there is a bagged silicon wafer 40 at the receiving end of the two conveyor belts 13.

[0083] The above embodiments merely illustrate the basic principles and characteristics of this application. This application is not limited to the above examples. Various changes and modifications can be made to this application without departing from the spirit and scope thereof, and all such changes and modifications fall within the scope of this application as claimed. The scope of protection of this application is defined by the appended claims and their equivalents.

Claims

1. A bagged silicon wafer conveying mechanism, wherein the bagged silicon wafers include a bag body and a plurality of stacked silicon wafers contained in the bag body, characterized in that, The bagged silicon wafer conveying mechanism includes a conveying component and a limiting component, wherein: The conveying assembly is configured to receive the bagged silicon wafers and convey the bagged silicon wafers to the unloading station. The fold of the bag body of the bagged silicon wafer received by the conveying assembly is pressed by the silicon wafer onto the conveying surface of the conveying assembly, and the fold of the bag body faces the same direction as the conveying direction of the conveying assembly. The limiting component is disposed at the unloading station, and the limiting component is configured to at least prevent the bagged silicon wafer from leaving the unloading station along the conveying direction of the conveying component; After the conveying assembly conveys the bagged silicon wafers to the unloading station, the conveying assembly drives the fold of the bag to move along the conveying direction of the conveying assembly, so as to tighten the fold of the bag and stick it tightly to the lower surface of the bag.

2. The bagged silicon wafer conveying mechanism according to claim 1, characterized in that, The limiting assembly includes two limiting members, which are correspondingly disposed on both sides of the unloading station along the conveying direction of the conveying assembly, wherein: The limiting member includes a mounting plate and a stop plate disposed on the mounting plate. The stop plate is disposed above the conveying surface of the conveying assembly and extends along the conveying direction perpendicular to the conveying assembly and is located on the moving path of the bagged silicon wafer. After the conveying assembly conveys the bagged silicon wafer to the unloading station, the two stop plates respectively abut against the first end of the bagged silicon wafer located at the unloading station to prevent the bagged silicon wafer from leaving the unloading station.

3. The bagged silicon wafer conveying mechanism according to claim 2, characterized in that, The limiting component also includes a limiting plate, which is disposed on the mounting plate along the conveying direction of the conveying assembly. The stop plate is disposed perpendicularly on the limiting plate. The two limiting plates are respectively disposed on both sides of the conveying assembly along the conveying direction of the conveying assembly, and there is space between the two limiting plates for the bagged silicon wafer to slide into and adhere.

4. The bagged silicon wafer conveying mechanism according to claim 3, characterized in that, The end of the limiting plate away from the stop plate is provided with a guide plate, which is inclined outward toward the conveying assembly.

5. The bagged silicon wafer conveying mechanism according to claim 2, characterized in that, The conveying assembly includes a mounting frame, a first drive assembly, and two conveyor belts, wherein: The two conveyor belts are rotatably mounted on the mounting frame along the conveying direction of the conveying assembly, and the two conveyor belts cooperate to carry the bagged silicon wafers received by the conveying assembly; The drive end of the first drive assembly is connected to the two conveyor belts, and the first drive assembly is configured to drive the two conveyor belts to rotate synchronously to convey the bagged silicon wafers carried by the two conveyor belts.

6. The bagged silicon wafer conveying mechanism according to claim 5, characterized in that, The mounting plate is adjustablely mounted on the mounting frame along the conveying direction of the conveying assembly. The mounting plate has a waist-shaped hole extending along the conveying direction of the conveying assembly. The mounting frame has a plurality of threaded holes. Fixing screws pass through the waist-shaped hole and are locked in the threaded holes to fix the mounting plate on the mounting frame.

7. The bagged silicon wafer conveying mechanism according to claim 5, characterized in that, The first drive assembly includes a motor, a transmission assembly, and two sets of transmission pulleys, each set of transmission pulleys corresponding to one of the conveyor belts, wherein: Each group of drive pulleys includes a first pulley and a second pulley, the first pulley and the second pulley are rotatably mounted on the mounting frame at intervals along the conveying direction of the conveying assembly, and the conveyor belt is sleeved on the first pulley and the second pulley in the same group; The drive end of the motor is connected to the transmission assembly, and the motor is configured to drive the first pulley of two sets of transmission pulleys to rotate synchronously through the transmission assembly.

8. The bagged silicon wafer conveying mechanism according to claim 7, characterized in that, The transmission assembly includes a rotating shaft and two third pulleys, wherein: The rotating shaft is rotatably disposed below the mounting bracket, the motor is disposed below the mounting bracket, and the drive shaft of the motor is coaxially connected to the rotating shaft; Two third pulleys are installed at intervals above the rotating shaft, each third pulley corresponds to one conveyor belt, and the conveyor belt is sleeved on the corresponding third pulley, first pulley and second pulley; The motor drives the rotating shaft to rotate along its own axis, thereby driving the two third pulleys to rotate synchronously, and then driving the corresponding conveyor belt to rotate through the cooperation of the first pulley and the second pulley.

9. The bagged silicon wafer conveying mechanism according to claim 1, characterized in that, The conveying assembly is equipped with a first detection element, which is configured to detect the side of the bagged silicon wafer at the unloading station to determine whether the bagged silicon wafer is at a preset position of the unloading station.

10. The bagged silicon wafer conveying mechanism according to claim 5, characterized in that, The mounting frame is equipped with a second detection element, which is configured to detect whether the bagged silicon wafers are present at the receiving ends of the two conveyor belts.