Carrying device

Abstract

The utility model provides a carrying device, and aims to solve the technical problems that silicon wafers are easy to damage due to manual carrying of the existing silicon wafers or the carrying cost of a manipulator is high and the flexibility is poor. The device comprises a rack; the conveying mechanism is mounted on the rack; the negative pressure feeding mechanism is arranged at one end of the conveying mechanism; the feeding mechanism is arranged below the negative pressure feeding mechanism; wherein the negative pressure feeding mechanism sucks materials entering a feeding range, and the conveying mechanism generates negative pressure adsorption on the materials sucked by the negative pressure feeding mechanism and conveys the materials to a preset position. According to the utility model, the silicon wafers on the feeding mechanism are sucked to the conveying mechanism through the negative pressure feeding mechanism, and the conveying mechanism conveys the silicon wafers to a designated position in a negative pressure adsorption manner, so that the silicon wafers are flexibly sucked and conveyed, the damage risk caused by overweight silicon wafer conveying is reduced, the silicon wafers do not need to be additionally turned over, and the production efficiency is improved. The action continuity is good, the carrying efficiency is high, and the overall cost is low.

Description

TECHNICAL FIELD

[0001] The utility model relates to silicon wafer technical field especially, be related to a carrying device. BACKGROUND

[0002] In the semiconductor production process, the raw materials such as silicon wafer need to be frequently carried, processed and assembled. Because of the special physical and chemical properties of silicon wafer, its surface and internal structure are very fragile. At present, the silicon wafer is mostly taken from the conveying belt by artificial or mechanical hand and placed in the designated box or tray. Artificial carrying not only has high labor intensity, but also easily causes the damage, pollution or scratch of silicon wafer, which affects the product quality. The mechanical hand carrying has high equipment cost and complex maintenance, and has the limitation in use. For example, when carrying silicon wafers with different shapes, sizes or weights, or when a single silicon wafer needs to be placed in different positions, different end effectors or the parameters of the mechanical hand need to be adjusted, which requires high skills of the operator. SUMMARY

[0003] In view of the above problems, the utility model aims at providing a carrying device, which is mainly used for flip carrying of silicon wafers, and solves the technical problems of easy damage of silicon wafers in artificial carrying and high cost and poor flexibility of mechanical hand carrying.

[0004] To achieve the above object, the utility model provides the following technical scheme.

[0005] A carrying device comprises a rack, a conveying mechanism installed on the rack, a negative pressure feeding mechanism arranged at one end of the conveying mechanism, and a feeding mechanism arranged below the negative pressure feeding mechanism. The negative pressure feeding mechanism sucks the materials entering the feeding range, and the conveying mechanism generates negative pressure adsorption on the materials sucked by the negative pressure feeding mechanism and moves the materials to a preset position.

[0006] The negative pressure feeding mechanism sucks the silicon wafers on the feeding mechanism to the conveying mechanism, and the conveying mechanism moves the silicon wafers to the designated position by the mode of negative pressure adsorption. On the one hand, the silicon wafers are flexibly sucked and conveyed, which can reduce the damage risk of the silicon wafers caused by collision or friction in heavy carrying, better protect the surface of the silicon wafers, and avoid the generation of surface defects such as scratch and crack. On the other hand, the inverted carrying mode can realize the rapid and accurate carrying of the silicon wafers, the silicon wafers do not need to be additionally turned over, the manual operation link is reduced, the motion continuity is good, the carrying efficiency is high, and the overall cost is low.

[0007] Optionally, the conveying mechanism includes: a negative pressure box mounted on the frame; a plurality of negative pressure holes communicating with the negative pressure chamber inside the negative pressure box are provided at the bottom of the negative pressure box; a conveyor belt wound around the negative pressure box and driven by a first drive motor; and a first negative pressure generating device communicating with the negative pressure chamber; wherein, under the action of the first negative pressure generating device, a negative pressure zone is formed at the bottom of the negative pressure box to adsorb materials, and the conveyor belt drives the materials absorbed by the negative pressure feeding mechanism to move.

[0008] Optionally, the negative pressure box has driven rollers at both ends via first mounting blocks, and a driving roller via a second mounting block. Guide rollers are provided on both sides below the driving roller. The conveyor belt is wound around the driven roller and the driving roller. The first drive motor is mounted on the outside of the second mounting block, and the power output end of the first drive motor is driven to the driving roller. The first drive motor drives the conveyor belt to rotate around the driven roller and the driving roller.

[0009] Optionally, the conveying device further includes a material box, disposed at the bottom of the negative pressure chamber and away from the negative pressure feeding mechanism; wherein the negative pressure of the negative pressure zone is adjustable via a first negative pressure generating device to allow the adsorbed material to fall into the material box. The material box being located at the bottom of the negative pressure chamber saves space, and the inverted conveying method allows for precise control of the silicon wafer's placement, preventing displacement during transport and reducing damage. The negative pressure generated in the negative pressure zone can be adjusted according to the specifications and weight of the silicon wafers, which not only facilitates the handling of silicon wafers of different specifications but also reduces the contact pressure between the silicon wafer and the conveyor belt, thus minimizing damage.

[0010] Optionally, the negative pressure zone includes an adsorption zone, a first negative pressure zone, and a second negative pressure zone arranged sequentially along the material travel direction. The negative pressure feeding mechanism is located in the adsorption zone, and the material box is located below the second negative pressure zone. The material entering the second negative pressure zone falls into the material box under the action of the first negative pressure generating device.

[0011] Optionally, the negative pressure chamber is provided with a first partition and a second partition, which divide the negative pressure chamber into a first negative pressure chamber, a second negative pressure chamber and a third negative pressure chamber. The bottom of the negative pressure chamber, corresponding to the first negative pressure chamber, the second negative pressure chamber and the third negative pressure chamber, is an adsorption area, a first negative pressure area and a second negative pressure area.

[0012] Optionally, one or more secondary partitions may be provided in the negative pressure chamber corresponding to the second negative pressure chamber and / or the third negative pressure chamber.

[0013] Optionally, the negative pressure feeding mechanism includes: suction cups disposed on both sides of the negative pressure box, and a second negative pressure generating device connected to the internal cavity of the suction cups; the suction cups suck up the material entering the feeding range under the action of the second negative pressure generating device.

[0014] Optionally, the suction cups are mounted on both sides of the negative pressure chamber via suction plates. The suction plates have suction holes communicating with the internal cavities of the suction cups, and the lower surface of the suction plates is flush with the lower surface of the bottom plate of the negative pressure chamber. By providing a suction cup on each side of the adsorption area, the contact area with the silicon wafer is increased while simultaneously adsorbing the silicon wafer, thus improving the adsorption effect.

[0015] Optionally, the feeding mechanism includes: a transmission frame, which is mounted on the machine frame via a connecting block; two sets of parallel and spaced belts are arranged on the transmission frame via conveyor rollers; the belts are driven by a second drive motor located below the transmission frame.

[0016] The beneficial effects of this utility model are:

[0017] This invention utilizes a negative pressure feeding mechanism to draw silicon wafers from the feeding mechanism onto a conveyor mechanism. The conveyor mechanism, employing a conveyor belt and negative pressure, transports the wafers into a hopper. This flexible feeding and conveying method reduces the risk of damage caused by collisions or friction during heavy wafer handling, better protecting the wafer surface and preventing scratches, cracks, and other surface defects. Furthermore, the inverted handling method allows for rapid and accurate wafer transport, eliminating the need for additional flipping, reducing manual operations, improving continuity of operations, increasing handling efficiency, and lowering overall cost. Simultaneously, the negative pressure generated in the negative pressure zone can be adjusted according to the different specifications and weights of the wafers, facilitating the handling of wafers of varying sizes and reducing contact pressure between the wafers and the conveyor belt, thus minimizing damage. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the structure of this utility model.

[0020] Figure 2 This is the front view of the present invention.

[0021] Figure 3 This is a side view of the present invention.

[0022] Figure 4 This is a top view of the present invention.

[0023] Figure 5 This is a schematic diagram of the conveying mechanism in this utility model.

[0024] Figure 6 This is a schematic diagram of the negative pressure box in this utility model.

[0025] Figure 7 This is a schematic diagram of the negative pressure box from another angle in this utility model.

[0026] Figure 8 This is a schematic diagram of the internal structure of the negative pressure box in this utility model.

[0027] Figure 9 This is a schematic diagram of the feeding mechanism in this utility model.

[0028] Figure label:

[0029] 1. Frame; 11. Connecting base;

[0030] 2. Conveying mechanism; 21. Negative pressure box; 211. Negative pressure chamber; 211a. First negative pressure chamber; 211b. Second negative pressure chamber; 211c. Third negative pressure chamber; 212. Base plate; 2121. Negative pressure hole; 213. First partition; 214. Second partition; 215. Secondary partition; 22. Conveyor belt; 23. First negative pressure generating device; 24. Pipeline; 25. First drive motor; 26. First mounting block; 27. Driven roller; 28. Second mounting block; 29. ​​Driven roller;

[0031] 3. Negative pressure feeding mechanism; 31. Suction cup; 32. Second negative pressure generating device; 33. Suction plate; 331. Adsorption hole;

[0032] 4. Feeding mechanism; 41. Connecting block; 42. Transmission frame; 43. Conveyor roller; 44. Belt; 45. Second drive motor;

[0033] 5. Material box; 6. Silicon wafer. Detailed Implementation

[0034] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of the embodiments of this utility model application. Therefore, the drawings and description are considered to be exemplary in nature and not restrictive.

[0035] In the description of the embodiments of this utility model application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", "end", "side" etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, are only for the convenience of describing the embodiments of this utility model application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the embodiments of this utility model application.

[0036] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of this utility model application, "multiple" means two or more, unless otherwise explicitly specified.

[0037] In the embodiments of this utility model application, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this utility model application according to the specific circumstances.

[0038] In the embodiments of this utility model application, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0039] The following disclosure provides many different implementations or examples for carrying out different structures of the embodiments of this utility model application. To simplify the disclosure of the embodiments of this utility model application, specific examples of components and arrangements are described below. Of course, these are merely examples and are not intended to limit the embodiments of this utility model application. Furthermore, reference numerals and / or reference letters may be repeated in different examples of the embodiments of this utility model application; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various implementations and / or arrangements discussed.

[0040] The embodiments of this utility model will now be described in detail with reference to the accompanying drawings.

[0041] like Figures 1-9 As shown in the figure, this utility model application provides a handling device, which is mainly used for inverting and handling silicon wafers. The handling device includes a frame 1, a conveying mechanism 2, a negative pressure feeding mechanism 3, and a feeding mechanism 4.

[0042] The conveying mechanism 2 is mounted on the frame 1, the negative pressure feeding mechanism 3 is mounted on the feed end of the conveying mechanism 2, and the feeding mechanism 4 is located below the negative pressure feeding mechanism 3. The feeding mechanism 4 is used to convey silicon wafers. When the feeding mechanism 4 carries the silicon wafers into the negative pressure feeding range of the negative pressure feeding mechanism 3, the negative pressure feeding mechanism 3 picks up the silicon wafers that have entered the feeding range. The bottom of the conveying mechanism 2 has a negative pressure zone, which can generate negative pressure for adsorbing silicon wafers. By generating negative pressure in the negative pressure zone, the silicon wafers adsorbed by the negative pressure feeding mechanism 3 are conveyed to a preset position. That is, the first position is when the negative pressure feeding mechanism 3 picks up the silicon wafers from the feeding mechanism 4, and the conveying mechanism 2 transports the silicon wafers located at the first position to a preset second position.

[0043] In one embodiment, the conveying mechanism 2 includes a negative pressure box 21 and a conveyor belt 22 disposed on the negative pressure box 21. The negative pressure box 21 is disposed on the frame 1 via multiple connecting seats 11, and the conveyor belt 22 for conveying silicon wafers is wound around the negative pressure box 21. The negative pressure box 21 has a negative pressure cavity 211 inside, and a plurality of negative pressure holes 2121 communicating with the negative pressure cavity 211 are provided on the lower surface of the bottom plate 212 of the negative pressure box 21. By providing negative pressure holes 2121 on the lower surface of the negative pressure box 21, a negative pressure area is formed at the bottom of the negative pressure box 21. The conveying mechanism 2 also includes a first negative pressure generating device 23 that is connected to the internal negative pressure cavity of the negative pressure box 21 via a pipe 24. In use, under the action of the first negative pressure generating device 23, a negative pressure area with negative pressure is generated at the bottom of the negative pressure box 21. Under the action of negative pressure, the silicon wafers are adsorbed onto the conveyor belt 22. When the conveyor belt 22 is running, the silicon wafers adsorbed on the conveyor belt 22 move together with the conveyor belt 22 to the target location.

[0044] Optionally, the conveyor belt 22 is driven by the first drive motor 25, which moves the conveyor belt 22 to move the silicon wafer to a designated position. In one implementation scenario, the negative pressure box 21 has driven rollers 27 mounted on the first mounting block 26 at both ends, and a drive roller 29 mounted on the negative pressure box 21 via a second mounting block 28. Guide rollers are mounted on both sides below the drive roller 29. The conveyor belt 22 is wound around the driven rollers 27 and the drive roller 29. The first drive motor 25 is mounted on the outside of the second mounting block 28, and its power output is driven by the drive roller 29. The first drive motor 25 drives the drive roller 29 to rotate, thereby driving the conveyor belt 22 to rotate around the driven rollers 27 and the drive roller 29, thus transporting the silicon wafers adsorbed on the conveyor belt 22. Optionally, during setup, the conveyor belt 22 located at the bottom of the negative pressure box 21 is basically attached to the lower surface of the negative pressure box 21, and there is a gap between the conveyor belt 22 located at the top of the negative pressure box 21 and the upper surface of the negative pressure box 21. That is, the top of the first mounting block 26 protrudes from the negative pressure box 21, and a driven wheel is installed on its protruding part. The second mounting block 28 is installed at the middle position of the top of the negative pressure box 21 through a mounting horizontal plate. The bottom of the mounting horizontal plate is aligned with the upper surface of the negative pressure box 21. Two second mounting blocks 28 are arranged opposite each other on both sides of the upper surface of the mounting horizontal plate. The driving roller 29 is installed on the top between the two second mounting blocks 28.

[0045] In one embodiment, the conveying device further includes a material box 5 disposed at the bottom of the negative pressure box 21. The negative pressure zone includes an adsorption zone, a first negative pressure zone, and a second negative pressure zone arranged sequentially along the silicon wafer traveling direction. The negative pressure feeding mechanism 3 is disposed at the adsorption zone, and the material box 5 is disposed below the second negative pressure zone. The material box 5 is located between the oppositely disposed connecting seats 11. The bottom of the material box 5 is disposed on the frame 1, and its top is open. In use, the negative pressure feeding mechanism 3 adsorbs the silicon wafers on the feeding mechanism 4 onto the adsorption zone. As the conveyor belt 22 runs, the silicon wafers enter the first negative pressure zone from the adsorption zone. When the silicon wafers enter the designated position of the second negative pressure zone from the first negative pressure zone, the negative pressure of the second negative pressure zone is adjusted by the first negative pressure generating device 23 so that the silicon wafers entering the second negative pressure zone fall into the material box 5. By placing the material box 5 below the second negative pressure zone, not only is it beneficial to save space, but it is also possible to accurately control the falling position of the silicon wafers, avoid displacement during silicon wafer handling, and reduce damage to the silicon wafers.

[0046] As an implementation scenario, in this scenario, refer to the appendix. Figure 8As shown, a first partition 213 and a second partition 214 are provided inside the negative pressure chamber 211 of the negative pressure box 21. The first partition 213 and the second partition 214 divide the negative pressure chamber 211 into a first negative pressure chamber 211a, a second negative pressure chamber 211b, and a third negative pressure chamber 211c. This forms an adsorption area, a first negative pressure area, and a second negative pressure area at the bottom of the negative pressure box 21, corresponding to the first negative pressure chamber 211a, the second negative pressure chamber 211b, and the third negative pressure chamber 211c. That is, the first partition 213 is aligned with the conveyor belt 22. The distance between the ends is the adsorption zone. The negative pressure feeding mechanism 3 is set in the adsorption zone. The distance between the first partition 213 and the second partition 214 is the first negative pressure zone. The distance between the second partition 214 and the other end of the conveyor belt 22 is the second negative pressure zone. When the silicon wafer enters the designated position of the second negative pressure zone from the first negative pressure zone through the adsorption zone, the adsorbed silicon wafer can be made to fall into the material box 5 below by adjusting the first negative pressure generating device 23 (reducing the negative pressure or turning off the negative pressure generating device), so as to achieve precise control of the silicon wafer falling position.

[0047] In another implementation scenario, one or more secondary partitions 215 may be provided within the second negative pressure chamber 211b and / or the second negative pressure chamber 211c. For example, refer to the attached... Figure 8 As shown, two secondary partitions 215 are spaced apart between the first partition 213 and the second partition 214, and between the second partition 214 and the side plate of the negative pressure box 21. Through the arrangement of the secondary partitions 215, the second negative pressure chambers 211b and 211c are further divided into multiple negative pressure chambers. Correspondingly, each negative pressure chamber is connected to a pipeline connected to the first negative pressure generating device 23. Each negative pressure chamber generates negative pressure through a separately arranged pipeline, which helps to improve the adsorption effect of the negative pressure zone on the silicon wafer, ensuring that the silicon wafer is subjected to uniform adsorption force during transportation, thereby ensuring the stability and reliability of the silicon wafer during transportation.

[0048] Optionally, the first negative pressure generating device 23 can be a variable frequency fan. The fan draws negative pressure, and the negative pressure of the adsorption zone, the first negative pressure zone, and the second negative pressure zone can be adjusted by changing the air volume output of the fan. That is, when the silicon wafer enters the designated position of the second negative pressure zone, the negative pressure is reduced to make the silicon wafer fall into the material box 5; or, when the silicon wafer enters the designated position of the second negative pressure zone, the fan is turned off to make the silicon wafer fall into the material box 5.

[0049] In one embodiment, the negative pressure feeding mechanism 3 is disposed above the feeding mechanism 4 and is used to pick up the silicon wafers on the feeding mechanism 4 to complete the feeding of the conveying mechanism 2.

[0050] In this implementation scenario, the negative pressure feeding mechanism 3 includes suction cups 31 arranged on both sides of the negative pressure box 21. The suction cups 31 are positioned corresponding to the feeding mechanism 4. The lower surface of the suction cups 31 is provided with adsorption holes that communicate with the internal cavity. The suction cups 31 generate negative pressure through the second negative pressure generating device 32. The adsorption force generated by the negative pressure can adsorb the silicon wafers on the feeding mechanism 4. In use, the surface of the feeding mechanism 4 corresponding to the suction cups 31 is the feeding range / adsorption range. When the silicon wafer enters the feeding range, the suction cups 31 generate negative pressure for adsorbing the silicon wafer under the action of the second negative pressure generating device 32. The silicon wafer is adsorbed into the adsorption area. After entering the adsorption area, the silicon wafer enters the first negative pressure area with the movement of the conveyor belt 22, then enters the second negative pressure area, and finally falls into the material box 5 from the second negative pressure area.

[0051] Optionally, the second negative pressure generating device 32 can also be a variable frequency fan, which draws negative pressure and adjusts the negative pressure of the suction cup 31 by changing the fan's airflow output. In one implementation scenario, after the silicon wafer is held by the suction cup 31, the negative pressure can be reduced to allow the wafer to be conveyed along the conveyor belt 22; or, after the silicon wafer is held by the suction cup 31, the fan can be turned off to allow the wafer to be conveyed along the conveyor belt 22. Of course, in other implementation scenarios, the negative pressure at the adsorption area can also be set to be able to pick up the silicon wafer from the feeding mechanism 4 without affecting its movement along the conveyor belt 22.

[0052] In one embodiment, the suction cup 31 is installed on both sides of the negative pressure box 21 via the suction plate 33. The suction plate 33 has an adsorption hole 331 that communicates with the internal cavity of the suction cup 31. The lower surface of the suction plate 33 is flush with the lower surface of the base plate 212, that is, the lower surface of the suction plate 33 and the lower surface of the base plate 212 are basically on the same horizontal plane.

[0053] Optionally, the suction plate 33 and the base plate 212 are an integral structure, that is, the suction plate 33 is provided on the end of the base plate 212 near the feeding mechanism 4, and the suction cup 31 is provided above the suction plate 33.

[0054] Optionally, suction cup 31 is a Bernoulli suction cup.

[0055] Optionally, the bottom plate 212 of the negative pressure box 21 is a one-piece structure or is made up of multiple bottom plates spliced ​​together.

[0056] Optionally, two sets of negative pressure holes 2121 are provided along the length of the base plate 212. Each set of negative pressure holes consists of multiple elongated holes spaced apart. The elongated holes are arranged along the width of the base plate 212, and the conveyor belt 22 covers several of the elongated holes. By arranging several negative pressure holes on the base plate 212, the adsorption area for the silicon wafer is increased, resulting in a better adsorption effect and reducing the risk of the silicon wafer falling off.

[0057] Optionally, the conveyor belt 22 can be a perforated belt, that is, the conveyor belt 22 corresponding to the positions of several negative pressure holes 2121 can be provided with through holes.

[0058] Optionally, a vertical plate is provided on the lower surface of the base plate 212. The vertical plate coincides with a portion of the first negative pressure zone near the end of the second negative pressure zone. Several vertical holes are provided on the vertical plate. The vertical holes are perpendicular to the elongated holes, and the vertical holes coincide with a portion of the elongated holes in the first negative pressure zone.

[0059] In one embodiment, the feeding mechanism 4 includes a connecting block 41, a transmission frame 42, a transmission roller 43, a belt 44, and a second drive motor 45.

[0060] The transfer frame 42 is mounted on the frame 1 via a connecting block 41. Two sets of parallel and spaced belts 44 are provided on the transfer frame 42 via multiple conveyor rollers 43. The belts 44 are wound around the multiple conveyor rollers 43. The belts 44 are driven by a second drive motor 45 located on one side of the transfer frame 42. The second drive motor 45 drives the belts 44 to transport the silicon wafers. When the belts 44 transport the silicon wafers to the loading range corresponding to the adsorption area / suction cup 31, the two suction cups 31 adsorb the silicon wafers that have entered the loading range.

[0061] In practical applications, the conveyor mechanism 2, the negative pressure feeding mechanism 3, and the feeding mechanism 4 can be intelligently controlled by the control system to achieve precise control. The control system can control the operation of the conveyor belt 22 and the belt 44, as well as the start / stop or the level of negative pressure of the first and second negative pressure generating devices. The control system is existing technology and may include electronic components such as sensors and PLCs to achieve automated control and monitoring. For example, when the belt 44 carries the silicon wafer into the feeding range of the negative pressure feeding mechanism 3, the first and second negative pressure generating devices can be automatically activated by sensors or preset programs. The negative pressure generated in the adsorption zone will absorb the silicon wafer that has entered the feeding range. The silicon wafer that has entered the adsorption zone will move along the conveyor belt 22 through the first negative pressure zone into the second negative pressure zone. When it enters the designated position in the second negative pressure zone, the control system will adjust the negative pressure generated in the second negative pressure zone to make the silicon wafer automatically fall into the designated dropping position in the material box 5.

[0062] In use, the quantity transported at one time can be intelligently controlled according to the capacity of the material box through a preset program in the control system. For example, refer to the attached document. Figure 1As shown, the material box 5 can hold nine silicon wafers 6 along its length. The nine silicon wafers form a group of transport units. The negative pressure feeding mechanism 3 continuously picks up nine silicon wafers 6 and then stops feeding. The picked-up silicon wafers 6 are transported from one end to the other by the conveyor belt 22. When the first picked-up silicon wafer is located at the right end of the material box 5 and the last picked-up silicon wafer is located at the left end of the material box 5, the first negative pressure generating device 23 is lowered or turned off to place all the silicon wafers in the material box 5. After the transport of this group of silicon wafers is completed, the transport of the next group of silicon wafers continues. That is, the feeding mechanism 4 continues to feed, the negative pressure feeding mechanism 3 continues to pick up a group of silicon wafers, and the conveying mechanism 2 moves the group of silicon wafers into the material box 5. During the transport process, multiple silicon wafers are continuously moved, which greatly improves the transport efficiency of silicon wafers.

[0063] Any aspects not described in detail in this embodiment are techniques known in the art.

[0064] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any person skilled in the art can easily conceive of various variations or substitutions within the technical scope disclosed in this utility model, and these should all be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the protection scope of the claims.

Claims

1. A conveying device, characterized in that, include: Rack (1); A conveying mechanism (2) is mounted on the frame (1); A negative pressure feeding mechanism (3) is disposed at one end of the conveying mechanism (2); The feeding mechanism (4) is located below the negative pressure feeding mechanism (3); The negative pressure feeding mechanism (3) sucks up the material entering the feeding range, and the conveying mechanism (2) generates negative pressure adsorption on the material sucked by the negative pressure feeding mechanism (3) and moves it to a preset position.

2. The conveying device according to claim 1, characterized in that, The transmission mechanism (2) includes: A negative pressure box (21) is installed on the frame (1); The bottom of the negative pressure box (21) is provided with a plurality of negative pressure holes (2121) that are connected to the negative pressure chamber (211) inside the negative pressure box (21). The conveyor belt (22) is wound around the negative pressure box (21) and driven by the first drive motor (25); The first negative pressure generating device (23) is connected to the negative pressure chamber (211); The bottom of the negative pressure box (21) forms a negative pressure zone that adsorbs the material under the action of the first negative pressure generating device (23), and the conveyor belt (22) drives the material sucked by the negative pressure feeding mechanism (3) to move.

3. The conveying device according to claim 2, characterized in that, The negative pressure box (21) has driven rollers (27) at both ends respectively through the first mounting block (26), and the negative pressure box (21) has an active roller (29) through the second mounting block (28). Guide rollers are provided on both sides below the active roller (29). The conveyor belt (22) is wound around the driven roller (27) and the active roller (29). The first drive motor (25) is installed on the outside of the second mounting block (28), and the power output end of the first drive motor (25) is driven and connected to the active roller (29).

4. The conveying device according to claim 2, characterized in that, The conveying device also includes: The material box (5) is located at the bottom of the negative pressure box (21) and is located away from the negative pressure feeding mechanism (3); The negative pressure in the negative pressure zone can be adjusted by the first negative pressure generating device (23) to allow the adsorbed material to fall into the material box (5).

5. The conveying device according to claim 4, characterized in that, The negative pressure zone includes an adsorption zone, a first negative pressure zone, and a second negative pressure zone arranged sequentially along the material travel direction. The negative pressure feeding mechanism (3) is located in the adsorption zone, and the material box (5) is located below the second negative pressure zone. The material entering the second negative pressure zone falls into the material box under the action of the first negative pressure generating device (23).

6. The conveying device according to claim 5, characterized in that, The negative pressure chamber (21) is provided with a first partition (213) and a second partition (214) inside. The first partition (213) and the second partition (214) divide the negative pressure chamber (211) into a first negative pressure chamber (211a), a second negative pressure chamber (211b) and a third negative pressure chamber (211c). The bottom of the negative pressure chamber (21) corresponding to the first negative pressure chamber (211a), the second negative pressure chamber (211b) and the third negative pressure chamber (211c) is an adsorption area, a first negative pressure area and a second negative pressure area.

7. The conveying device according to claim 6, characterized in that, One or more sub-partitions (215) may also be provided in the negative pressure chamber corresponding to the second negative pressure chamber (211b) and / or the third negative pressure chamber (211c).

8. The conveying device according to claim 2, characterized in that, The negative pressure feeding mechanism (3) includes: Suction cups (31) are arranged on both sides of the negative pressure box (21), and A second negative pressure generating device (32) is connected to the internal cavity of the suction cup (31); The suction cup (31) sucks up the material entering the feeding range under the action of the second negative pressure generating device (32).

9. The conveying device according to claim 8, characterized in that, The suction cup (31) is installed on both sides of the negative pressure box (21) via the suction plate (33). The suction plate (33) has an adsorption hole (331) that communicates with the internal cavity of the suction cup (31). The lower surface of the suction plate (33) is flush with the lower surface of the bottom plate (212) of the negative pressure box (21).

10. The conveying device according to claim 1, characterized in that, The feeding mechanism (4) includes: The transmission rack (42) is mounted on the rack (1) via a connecting block (41); The transmission frame (42) is provided with two sets of parallel and spaced belts (44) via transmission rollers (43). The belt (44) is driven by a second drive motor (45).

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