Vacuum manipulator movement device for transmitting wafers

Abstract

The utility model discloses a vacuum manipulator moving device for transmitting wafers. The vacuum manipulator moving device comprises a driving piece and a vacuum chamber, a vacuum pipeline mounting preformed hole and a nitrogen pipeline mounting preformed hole are formed in the outer wall of the vacuum cavity, and a first cavity cover used for opening or closing the vacuum cavity is hinged to the top of the vacuum cavity; a transmission assembly and a sliding rail supporting seat are arranged in the vacuum chamber, a sliding block is arranged on the sliding rail supporting seat in a sliding mode, a mechanical arm used for taking and placing wafers is connected to the sliding block, the output end of the driving part is connected with the input end of the transmission assembly, and the output end of the transmission assembly is connected with the sliding block and used for driving the sliding block to move in the length direction of the vacuum chamber. And the front end of the manipulator can be driven to move out of the vacuum chamber. The device provided by the utility model can efficiently complete the function of taking and placing the wafer in a vacuum environment; the manufacturing efficiency of the process is improved; the transmission mode of the wafer in the technological process is optimized, the effect of the whole wafer coating technology is improved, and the production efficiency is greatly improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer processing equipment technical field more particularly, relate to a kind of vacuum manipulator motion device of wafer transmission. BACKGROUND

[0002] Now many vacuum equipment structures of coating film are single, need to heat vacuum cavity in the process of coating film. Therefore, it is particularly important to use manipulator to take and place wafer, which can improve the efficiency of wafer coating.

[0003] In the prior art, the manipulator motion device is mostly directly in the atmospheric environment, that is, to take and place the wafer, which can easily affect the cleanliness of the wafer surface and cause certain chemical pollution to the wafer. Moreover, due to the interference of air flow or air resistance, the motion process of the manipulator can also be affected, thereby affecting the precision of wafer taking and placing. UTILITY MODEL CONTENT

[0004] Therefore, the utility model aims to provide a vacuum manipulator motion device for wafer transmission. The device provided by the utility model can take and place the wafer in a vacuum environment, thereby avoiding air pollution, reducing the risk of wafer oxidation, and improving the precision of wafer taking and placing.

[0005] To achieve the above technical effects, the technical scheme of the utility model is as follows:

[0006] A vacuum manipulator motion device for wafer transmission includes a driving member and a vacuum chamber.

[0007] The outer wall of the vacuum chamber is provided with a vacuum pipeline installation reserved hole and a nitrogen pipeline installation reserved hole, and a first chamber cover for opening or closing the vacuum chamber is hingedly connected to the top of the vacuum chamber.

[0008] The vacuum chamber is provided with a transmission assembly and a slide rail support seat, a sliding block is slidingly arranged on the slide rail support seat, and a manipulator for taking and placing the wafer is connected to the sliding block. The output end of the driving member is connected to the input end of the transmission assembly, the output end of the transmission assembly is connected to the sliding block, and the sliding block is driven to move along the length direction of the vacuum chamber. The front end of the manipulator can be moved to the outside of the vacuum chamber.

[0009] Further, the transmission assembly includes a driving gear, a driven gear, a synchronous belt, a driven shaft, a steel belt pulley and a steel belt.

[0010] The driving gear is installed on the output shaft of the driving member, one end of the driven shaft passes through the slide rail support seat and is connected to the driven gear, and the other end is rotatably installed on the side wall of the vacuum chamber. The synchronous belt is installed between the driving gear and the driven gear.

[0011] The front and rear ends of the slide rail support base are provided with steel belt pulleys, the steel belt is arranged between the two steel belt pulleys, and the sliding block is connected with the steel belt; one of the steel belt pulleys is arranged on the middle part of the driven shaft;

[0012] The driving part is driven to rotate the power gear, the driven gear, the driven shaft and the steel belt pulley in sequence, and further drive the steel belt, the sliding block and the mechanical arm to move forward or backward.

[0013] Further, the vacuum chamber comprises a vacuum main chamber, a vacuum auxiliary chamber connected to the rear side of the vacuum main chamber and a synchronous belt chamber connected to the vacuum auxiliary chamber vertically, the volumes of the vacuum main chamber, the vacuum auxiliary chamber and the synchronous belt chamber decrease in sequence; the first chamber cover is arranged on the top of the vacuum main chamber, the top of the vacuum auxiliary chamber is provided with a second chamber cover, and the outer side of the synchronous belt chamber is provided with a third chamber cover.

[0014] The power gear, the driven gear and the synchronous belt are arranged in the synchronous belt chamber.

[0015] The slide rail support base is arranged in the middle of the vacuum main chamber and the vacuum auxiliary chamber; the driven shaft is arranged to rotate in the vacuum auxiliary chamber and is connected to the driven gear through the side wall of the vacuum auxiliary chamber and the synchronous belt chamber at one end.

[0016] Further, the mechanical arm comprises a connecting part and a pick-and-place part, one end of the connecting part is connected with the sliding block, and the other end extends into the vacuum main chamber and is detachably connected with the pick-and-place part.

[0017] Further, two groups of laser sensors are symmetrically arranged on the bottom of the vacuum main chamber, and two laser reflectors corresponding to the laser sensors are arranged on the first chamber cover.

[0018] Further, a window is arranged in the center of the first chamber cover.

[0019] Further, a main chamber laser sensor is arranged on the bottom of the vacuum main chamber, and a main chamber laser reflector corresponding to the main chamber laser sensor is arranged on the first chamber cover at the window.

[0020] Further, a handle is arranged on the first chamber cover.

[0021] Further, an uncovering sensor is arranged on the first chamber cover.

[0022] The beneficial effects of the utility model lie in:

[0023] The vacuum mechanical hand movement device for transmitting wafers provided by the utility model can be installed on a wafer coating vacuum equipment through a gate valve, is used for realizing wafer taking and placing functions, can efficiently complete wafer taking and placing functions in a vacuum environment, can quickly take out high-temperature wafers from the vacuum environment, improves the manufacturing efficiency of a process, optimizes the transmission mode of wafers in a process, improves the effect of the whole wafer coating process, and greatly improves the production efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced below, and obviously, the drawings in the following description are only some embodiments of the present application, and other embodiments can also be obtained by those skilled in the art according to these drawings.

[0025] Figure 1 is a schematic diagram of the bottom structure of the utility model.

[0026] Figure 2 is a schematic diagram of the bottom structure of the utility model.

[0027] Figure 3 is a schematic diagram of the internal cross-sectional structure of the utility model.

[0028] Figure 4 is a schematic diagram of the internal top view structure of the utility model.

[0029] Figure 5 is a schematic diagram of the internal cross-sectional structure of the utility model.

[0030] BRIEF DESCRIPTION OF DRAWINGS

[0031] 1, vacuum main chamber;2, vacuum sub-chamber;3, first cavity cover;4, second cavity cover;5, slide rail support seat;6, steel belt wheel;7, steel belt;8, sliding block;9, connecting part;10, taking and placing part;11, synchronous belt chamber;12, third cavity cover;13, driven gear;14, power gear;15, driving piece;16, synchronous belt;17, laser reflection plate;18, laser sensor;19, window;20, main cavity laser reflection plate;21, main cavity laser sensor;22, cover opening sensor;23, vacuum pipeline installation reserved hole;24, nitrogen pipeline installation reserved hole;25, function standby hole;26, handle;27, driven shaft;28, ball;29, round hole. DETAILED DESCRIPTION

[0032] The structure provided by the utility model will be explained and described in detail below in combination with the drawings in the specification.

[0033] REFERENCE Figures 1 to 4As shown, this embodiment specifically discloses a vacuum manipulator motion device for transporting wafers, including a drive component 15 and a vacuum chamber; the drive component 15 can specifically be a servo motor, which has high precision and high performance;

[0034] The outer wall (bottom or side wall) of the vacuum chamber is provided with a vacuum pipeline installation reserved hole 23 and a nitrogen pipeline installation reserved hole 24, and the top is hinged with a first chamber cover 2 for opening or closing the vacuum chamber; specifically, the vacuum pipeline installation reserved hole 23 and the nitrogen pipeline installation reserved hole 24 are both opened at the bottom of the vacuum chamber; in order to facilitate the expansion or upgrading of the function of the vacuum chamber in the future, at least one functional spare hole 25 is opened at the bottom;

[0035] The vacuum chamber is equipped with a transmission component and a slide rail support 5. A slider 8 is slidably mounted on the slide rail support 5. A robotic arm for picking up and placing wafers is connected to the slider 8. The output end of the drive component 15 is connected to the input end of the transmission component, and the output end of the transmission component is connected to the slider 8. The drive component 15 is used to drive the slider 8 to move along the length of the vacuum chamber and can move the front end of the robotic arm to the outside of the vacuum chamber.

[0036] In this embodiment, the vacuum pipeline installation reserved hole 23 is used to install and connect the vacuum pipeline, and the nitrogen pipeline installation reserved hole 24 is used to install and connect the nitrogen pipeline.

[0037] In use, the motion device is installed on the coating vacuum equipment via a gate valve (not shown) to enable the wafer pick-and-place function.

[0038] Specifically, the vacuum chamber has an opening on the front for the robotic arm to extend from. When connected to the coating vacuum equipment, a valve seal can be installed at the opening. This device can maintain a vacuum state.

[0039] When using it, the process of retrieving the wafer is as follows:

[0040] The wafer is placed in a coating vacuum chamber and kept under vacuum. 1. Evacuate the vacuum chamber to the same vacuum level as the coating vacuum chamber; 2. Open the valve between the coating vacuum chamber and the vacuum chamber; 3. Using a drive and transmission mechanism, extend a robotic arm into the coating vacuum chamber and place the wafer on it (this can be achieved through a lifting mechanism within the coating vacuum chamber); 4. Drive the robotic arm back into the vacuum chamber; 5. Close the valve; 6. Fill the vacuum chamber with nitrogen until it reaches atmospheric pressure; 7. Open the first chamber cover and remove the wafer.

[0041] The wafer placement process is as follows:

[0042] 1. Place the wafer on the robotic arm and close the first chamber cover; 2. Evacuate the vacuum chamber to the same vacuum level as the coating vacuum equipment; 3. Open the valve; 4. Extend the robotic arm carrying the wafer into the coating vacuum equipment and place it in the designated position inside the cavity; 5. Drive the robotic arm back into the coating vacuum equipment; 6. Close the valve.

[0043] In short, the system can efficiently handle the placement and removal of wafers in a vacuum environment; it can quickly remove high-temperature wafers from a vacuum environment; it improves the efficiency of the manufacturing process; it optimizes the wafer transfer method during the process, improves the overall wafer coating process, and greatly enhances production efficiency.

[0044] Continue to refer to Figure 3 and Figure 4 As shown, in this embodiment, the transmission assembly includes a drive gear 14, a driven gear 13, a synchronous belt 16, a driven shaft 27, a steel pulley 6, and a steel belt 7;

[0045] The drive gear 14 is mounted on the output shaft of the drive component 15. The driven shaft 27 passes through one end of the slide rail support 5 and is connected to the driven gear 13. The other end is rotatably mounted on the side wall of the vacuum chamber. The synchronous belt 16 is installed between the drive gear 14 and the driven gear 13.

[0046] Steel pulleys 6 are installed at both the front and rear ends of the slide rail support 5. A steel belt 7 is installed between the two steel pulleys 6, and the slider 8 is connected to the steel belt. One of the steel pulleys 6 is installed in the middle of the driven shaft 27. It can be understood that a space for installing the steel pulleys 6 is formed in the middle of both sides of the slide rail support 5. One steel pulley 6 is rotatably installed on the slide rail support 5, and the steel pulley 6 on the side closer to the driving component 15 is fixedly installed on the driven shaft 27.

[0047] The drive component 15 drives the power gear 14, driven gear 13, driven shaft 27, and steel pulley 6 to rotate in sequence, thereby driving the steel belt 7, slider 8, and robot arm to move forward or backward; thus realizing the extension or retraction of the robot arm, that is, realizing the wafer picking and placing function.

[0048] Optionally, in some other embodiments, other transmission components such as chain drive, ball screw, etc. can be used to move the slider 8.

[0049] Combination Figure 5 As shown, in order to improve the power transmission between the steel belt 7 and the steel pulleys, in some preferred embodiments, the two steel pulleys 6 are circumferentially arranged with a plurality of balls 28, and the steel belt 7 is provided with a plurality of round holes 29 adapted to the size of the balls.

[0050] Continue to combine Figure 1As shown, in this embodiment, the vacuum chamber includes a main vacuum chamber 1, a secondary vacuum chamber 2 connected to the rear side of the main vacuum chamber 1, and a synchronous belt chamber 11 perpendicularly connected to the secondary vacuum chamber 2. The volumes of the main vacuum chamber 1, the secondary vacuum chamber 2, and the synchronous belt chamber 11 decrease sequentially. A first chamber cover 3 is installed on the top of the main vacuum chamber 1, a second chamber cover 4 is provided on the top of the secondary vacuum chamber 2, and a third chamber cover 12 is provided on the outer side of the synchronous belt chamber 11.

[0051] The drive gear 14, driven gear 13, and synchronous belt 16 are all housed in the synchronous belt chamber 11;

[0052] The slide rail support 5 is centrally located in the vacuum main chamber 1 and the vacuum secondary chamber 2; the driven shaft 27 is rotatably located in the vacuum secondary chamber, and one end passes through the side wall of the vacuum secondary chamber and the synchronous belt chamber and is connected to the driven gear.

[0053] In this embodiment, by dividing the vacuum chamber into three chambers of progressively smaller size, and placing the corresponding components in the corresponding chambers, the installation and placement of the components within the chambers can be ensured, while the overall size of the device can be reduced. This means that while ensuring functionality, the footprint of the device can be reduced to a large extent.

[0054] Optionally, in some cases where there is ample installation space, the vacuum chamber can be set up as a single large chamber without any partitioning.

[0055] Of course, whether it is a separate unit or a whole, the vacuum chamber is sealed to ensure that it can maintain the internal vacuum level when a vacuum is required.

[0056] In this embodiment, the robotic arm includes a connecting part 9 and a picking and placing part 10. The picking and placing part 10 is arc-shaped and located in the vacuum main chamber 1. A stepped surface for placing wafers can be formed on it. One end of the connecting part 9 is detachably connected to the slider 8, and the other end extends into the vacuum main chamber 1 and is detachably connected to the picking and placing part 10.

[0057] Different wafer sizes are typically used to meet different process requirements. This device can also adapt to different wafer sizes. Different sized pick-and-place sections 10 can be quickly replaced to meet the pick-and-place requirements of different wafers. Currently, the commonly used wafer sizes are 12-inch, 8-inch, and 6-inch. To adapt to the pick-and-place requirements of different wafer sizes, different sized pick-and-place sections 10 can be designed to cooperate with the connecting section 9.

[0058] Furthermore, two sets of laser sensors 18 are symmetrically arranged on the bottom of the main vacuum chamber 1, and two laser reflectors 17 corresponding to the laser sensors 18 are arranged on the first chamber cover 3.

[0059] The two sets of laser sensors 18 and laser reflector 17 are mainly used for correction detection during the wafer handling process. When the wafer passes through the two laser beams simultaneously, it indicates that the wafer is in the correct position. If there is an error in the time it takes for the wafer to pass through the two laser beams, it indicates that the wafer's position has shifted and correction is required (which can be done manually).

[0060] Continue to refer to Figure 1 As shown, a viewing window 19 is also provided in the center of the first cavity cover 3 to facilitate observation of the internal situation.

[0061] Furthermore, a main cavity laser sensor 21 is also provided at the bottom of the vacuum main cavity chamber 1, and a main cavity laser reflector 20 corresponding to the main cavity laser sensor 21 is installed on the first cavity cover 3 at the viewing window 19; the position of the wafer in the cavity can be determined by judging whether the laser of the main cavity laser sensor 21 is blocked.

[0062] To facilitate opening the main vacuum chamber 1, a handle 26 is also installed on the first chamber cover 3; at the same time, an opening sensor 22 is also installed on the first chamber cover 3 to detect the opening status of the first chamber cover 3.

[0063] Specifically, in this embodiment, the detailed process of transferring the wafer is as follows:

[0064] 1. Select a pick-and-place section 10 of matching size according to the wafer and install it on the connecting section 9;

[0065] 2. Place the wafer on the pick-and-place section 10 and tighten the first chamber cover 3; evacuate the vacuum chamber;

[0066] 3. Open the valve between the vacuum chamber and the coating vacuum chamber;

[0067] 4. Drive the drive component 15 (driving the power gear 14 → synchronous belt 16 → driven gear 13 → steel pulley 6 → steel belt 7 → slider 8 → connecting part 9 → pick-and-place part 10), driving the robot arm to move forward;

[0068] 5. If the correction laser beams from the two laser sensors 18 are blocked simultaneously, the wafer position is confirmed to be correct.

[0069] 6. The wafer is delivered to the designated position in the coating vacuum chamber, the lifting mechanism inside the chamber lifts the wafer, and the robot returns to its original position in the main vacuum chamber 1;

[0070] 7. Close the valve between the main vacuum chamber 1 and the coating vacuum chamber.

[0071] The wafer removal process is as follows:

[0072] 1. Evacuate the vacuum chamber to the same level as the coating vacuum chamber, then open the valve;

[0073] 2. Drive the drive component 15 (driving the power gear 14 → synchronous belt 16 → driven gear 13 → steel pulley 6 → steel belt 7 → slider 8 → connecting part 9 → pick-and-place part 10), driving the robot arm to move forward;

[0074] 3. The pick-and-place section 10 extends to a predetermined position inside the coating vacuum chamber, and the internal lifting mechanism places the wafer on the pick-and-place section 10;

[0075] 4. The wafer pick-and-place section 10 carries the wafer back to its original position in the main vacuum chamber 1;

[0076] 5. Close the valve between the main vacuum chamber 1 and the coating vacuum chamber;

[0077] 6. Introduce nitrogen into the vacuum chamber to restore the pressure inside the chamber to atmospheric pressure; open the first chamber cover 3 and remove the wafer.

[0078] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0079] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0080] In the description of this specification, the references to terms such as "this embodiment," "an embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in a suitable manner in any at least one embodiment or example. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0081] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0082] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and simple improvements made on the substantive content of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A vacuum robotic arm motion device for transporting wafers, characterized in that, Includes drive components and vacuum chamber; The outer wall of the vacuum chamber is provided with a vacuum pipeline installation hole and a nitrogen pipeline installation hole, and the top is hinged with a first chamber cover for opening or closing the vacuum chamber. The vacuum chamber is equipped with a transmission component and a slide rail support. A slider is slidably mounted on the slide rail support. A robotic arm for picking up and placing wafers is connected to the slider. The output end of the drive component is connected to the input end of the transmission component, and the output end of the transmission component is connected to the slider. The drive component is used to drive the slider to move along the length of the vacuum chamber and to move the front end of the robotic arm to the outside of the vacuum chamber.

2. The vacuum robotic arm motion device for transferring wafers according to claim 1, characterized in that, The transmission assembly includes a drive gear, a driven gear, a synchronous belt, a driven shaft, a steel pulley, and a steel belt; The drive gear is mounted on the output shaft of the drive unit. One end of the driven shaft passes through the slide rail support and is connected to the driven gear. The other end is rotatably mounted on the side wall of the vacuum chamber. The synchronous belt is installed between the drive gear and the driven gear. Steel pulleys are installed at both the front and rear ends of the slide rail support, and the steel belt is installed between the two steel pulleys. The slider is connected to the steel belt; one of the steel pulleys is installed in the middle of the driven shaft. The driving component drives the power gear, the driven gear, the driven shaft, and the steel pulley to rotate in sequence, thereby driving the steel belt, the slider, and the robot to move forward or backward.

3. The vacuum robotic arm motion device for transferring wafers according to claim 2, characterized in that, The vacuum chamber includes a main vacuum chamber, a secondary vacuum chamber connected to the rear side of the main vacuum chamber, and a synchronous belt chamber perpendicularly connected to the secondary vacuum chamber. The volumes of the main vacuum chamber, the secondary vacuum chamber, and the synchronous belt chamber decrease sequentially. A first chamber cover is installed on the top of the main vacuum chamber, a second chamber cover is provided on the top of the secondary vacuum chamber, and a third chamber cover is provided on the outer side of the synchronous belt chamber. The drive gear, the driven gear, and the synchronous belt are all disposed in the synchronous belt chamber; The slide rail support is centrally located in the main vacuum chamber and the secondary vacuum chamber; the driven shaft is rotatably located in the secondary vacuum chamber, and one end passes through the side wall of the secondary vacuum chamber and the synchronous belt chamber and is connected to the driven gear.

4. The vacuum robotic arm motion device for transferring wafers according to claim 3, characterized in that, The robotic arm includes a connecting part and a picking and placing part. One end of the connecting part is connected to the slider, and the other end extends into the vacuum main chamber and is detachably connected to the picking and placing part.

5. The vacuum robotic arm motion device for transferring wafers according to claim 3, characterized in that, Two sets of laser sensors are symmetrically arranged at the bottom of the main vacuum chamber, and two laser reflectors corresponding to the laser sensors are arranged on the first cavity cover.

6. The vacuum manipulator motion device for transferring wafers according to claim 3, wherein a viewing window is further provided at the center of the first cavity cover.

7. The vacuum robotic arm motion device for transferring wafers according to claim 6, characterized in that, A main cavity laser sensor is also provided at the bottom of the main vacuum chamber, and a main cavity laser reflector corresponding to the main cavity laser sensor is installed on the first cavity cover at the viewing window.

8. The vacuum robotic arm motion device for transferring wafers according to claim 1, characterized in that, A handle is also installed on the first cavity cover.

9. The vacuum robotic arm motion device for transferring wafers according to claim 1, characterized in that, An opening sensor is also installed on the first cavity cover.

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