Hot pressure welding device with local heating function

Abstract

The utility model discloses a local heating thermocompression welding device which comprises a machine frame, an infrared heating system, a convex lens, a mechanical arm and a suction nozzle, the infrared heating system, the convex lens, the mechanical arm and the suction nozzle are installed on the machine frame, the machine frame is provided with a die bonding platform used for placing a substrate, and the infrared heating system is located below the die bonding platform and used for heating the bottom of a bowl cup of the substrate. The convex lens is located between the infrared heating system and the die bonding platform, the convex lens can refract infrared light emitted by the infrared heating system to the bottom of the substrate bowl cup, the suction nozzle is installed at the end of the mechanical arm, and when the temperature of the heating area is increased to a set value, the mechanical arm swings and sucks a single chip to the center of the substrate bowl cup through the suction nozzle and squeezes the single chip. The infrared heating system is an infrared heat source and can be heated at a high speed within seconds, the production efficiency is improved, infrared light can be focused through the convex lens, the heating area of a heating area is changed, heating of a single chip is achieved, the problem of thermal light attenuation of the chip caused by long-time heating is avoided, and the chip is not prone to being damaged in the hot-pressing die bonding process.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of semiconductor packaging, and particularly relates to a local heating hot press welding device. BACKGROUND

[0002] At present, in the semiconductor packaging industry, flip chip die bonding uses hot press welding eutectic die bonder, melts the gold tin / tin layer at the bottom of the chip through high temperature, and makes the suction nozzle press the chip and the packaging substrate to be bonded. The heating mode of the traditional eutectic device is heat conduction, the die bonding bottom plate is heated by the heating wire, the die bonding bottom plate is in contact with the packaging substrate to achieve heat conduction and thus reach the set die bonding temperature. Since this mode is large-area heating of the bottom plate, there is a difference in local temperature, and secondly, the completed die-bonded chip will continue to withstand high temperature, which will damage the chip structure with poor temperature resistance. Since this mode is large-area heating of the bottom plate, the completed die-bonded chip will continue to be baked at high temperature, which will damage the chip structure with poor temperature resistance and cause thermal light decay, thereby shortening the service life of the chip. Secondly, large-area heating will also cause a difference in local temperature, which will ultimately affect the consistency of the material die bonding effect.

[0003] Therefore, a new technology is needed to solve the problem that the chip is easily damaged in the hot press die bonding process in the prior art. SUMMARY

[0004] To solve the above problems in the prior art, the utility model provides a local heating hot press welding device, which has the effect of not easily causing chip damage.

[0005] The utility model adopts the following technical scheme:

[0006] A local heating hot press welding device, comprising a rack, an infrared heating system, a convex lens, a mechanical arm and a suction nozzle installed on the rack, a die bonding platform for placing a substrate is arranged on the rack, the infrared heating system is located below the die bonding platform and is used for heating the die bonding platform, the convex lens is located between the infrared heating system and the die bonding platform, the convex lens can refract the infrared light emitted by the infrared heating system to the bottom of the substrate bowl cup, the suction nozzle is installed at the end of the mechanical arm, when the temperature of the heating area is heated to a set value, the mechanical arm swings and sucks a single chip to the center of the substrate bowl cup through the suction nozzle and extrudes it.

[0007] As a further improvement of the utility model technical scheme, the infrared heating system comprises an infrared light source, the infrared light source is located below the convex lens and can emit infrared light to the convex lens.

[0008] As a further improvement of the utility model technical scheme, the infrared light source and the convex lens are on the same vertical line.

[0009] As a further improvement of the technical scheme of the utility model, the infrared heating system further includes a focusing knob, a fixed seat is arranged on the rack, one end of the focusing knob is rotatably arranged through the fixed seat and connected with the convex lens, a heating area is formed at the part of the substrate bowl cup bottom irradiated by the infrared light, when the focusing knob rotates, the focal point position of the convex lens changes, and the area of the heating area becomes larger or smaller.

[0010] As a further improvement of the technical scheme of the utility model, the focusing knob includes a knob part and a connecting rod which are fixedly connected in a T shape, a through hole is horizontally arranged on the fixed seat, one end of the connecting rod is fixedly connected with the center of the knob part, and the other end is horizontally arranged through the through hole and connected with the convex lens, and the size of the knob part is larger than the size of the through hole.

[0011] As a further improvement of the technical scheme of the utility model, the temperature measuring system is installed on the rack and located above the die bonding platform, and the temperature measuring system is used for detecting the temperature of the heating area.

[0012] As a further improvement of the technical scheme of the utility model, the temperature measuring system includes a sensor installed on the rack, and the sensor is located on the same vertical line with the infrared light source.

[0013] As a further improvement of the technical scheme of the utility model, the temperature measuring system is installed on the rack and located above the die bonding platform, and the temperature measuring system is used for detecting the temperature of the heating area.

[0014] Compared with the prior art, the utility model has the beneficial effects that:

[0015] The utility model uses an infrared heat source, realizes high-speed heating in a few seconds, improves the actual production efficiency, the convex lens can focus the infrared light emitted by the infrared light source, changes the heating area of the infrared light source, realizes single chip heating, avoids the problem of thermal light decay caused by long-time heating on the chip, and avoids the damage of the chip in the heat pressing die bonding process. BRIEF DESCRIPTION OF DRAWINGS

[0016] The utility model will be further described in detail in combination with the drawings and specific embodiments:

[0017] Fig. 1 It is the overall structure schematic view of the utility model;

[0018] Fig. 2is a structural schematic view of an infrared heating system.

[0019] Reference signs:

[0020] 1-infrared heating system; 11-infrared light source; 12-focusing knob; 121-knob part; 122-connecting rod;

[0021] 2-convex lens;

[0022] 3-substrate bowl cup; 31-heating area;

[0023] 4-chip;

[0024] 5-temperature control system;

[0025] 6-temperature measurement system; 61-sensor;

[0026] 7-suction nozzle;

[0027] 8-mechanical arm;

[0028] 9-fixing seat. DETAILED DESCRIPTION

[0029] The concept, specific structure and technical effects of the present application will be described clearly and completely in combination with the embodiments and the drawings, so as to fully understand the purpose, scheme and effect of the present application. It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict. The same reference signs used in the drawings indicate the same or similar parts.

[0030] It should be noted that, unless otherwise specified, when a certain feature is referred to as being "fixed" or "connected" to another feature, it can be directly fixed or connected to the other feature, or indirectly fixed or connected to the other feature. In addition, the up, down, left, right and other descriptions used in the present application are only relative to the mutual position relationship of the components of the present application in the drawings.

[0031] Reference Figs. 1-2The application discloses a local heating hot-pressing welding device which comprises a rack, an infrared heating system 1, a convex lens 2, a mechanical arm 8 and a suction nozzle 7 which are installed on the rack, the rack is provided with a die platform for placing a substrate, the infrared heating system 1 is located below the die platform and is used for heating the die platform, the convex lens 2 is located between the infrared heating system 1 and the die platform, the convex lens 2 can refract infrared light emitted by the infrared heating system 1 to the bottom of a substrate bowl 3, the suction nozzle 7 is installed at the end of the mechanical arm 8, when the temperature of the heating area 31 is heated to a set value, the mechanical arm 8 swings and sucks a single chip 4 to the center of the substrate bowl 3 through the suction nozzle 7 and presses the single chip 4 and the substrate bowl 3, so that the hot-pressing die bonding process is completed.

[0032] The infrared heat source is used to realize high-speed heating in a few seconds, the actual production efficiency is improved, the lens is arranged to focus the infrared light emitted by the infrared light source 11, the heating area of the infrared light source 11 is changed, the single chip 4 is heated, the problem of thermal light decay caused by long-time heating to the chip 4 is avoided, and the chip 4 is not easily damaged in the hot-pressing die bonding process. The infrared heat source is preferably an infrared heat source with adjustable power.

[0033] The application heats the packaging substrate by high-speed heat radiation, the convex lens 2 is used for focusing the infrared light emitted by the infrared heat source, the area of the heating area 31 can be adjusted by changing the focal point position of the convex lens 2, and the temperature of the heating area 31 can be adjusted by changing the heating power of the infrared heat source or / and the heating time.

[0034] Specifically, the infrared heating system 1 comprises an infrared light source 11, the infrared light source 11 is located below the convex lens 2 and can emit infrared light to the convex lens 2, and the infrared light source 11 and the convex lens 2 are on the same vertical line.

[0035] Specifically, the infrared heating system 1 further comprises a focusing knob 12, a fixed seat 9 is arranged on the rack, one end of the focusing knob 12 is rotatably connected with the convex lens 2 through the fixed seat 9, a heating area 31 is formed at the position of the substrate bowl cup 3 bottom irradiated by the infrared light, when the focusing knob 12 is rotated, the focal point position of the convex lens 2 changes, and the area of the heating area 31 changes. By adjusting the focusing knob 12, the area of the heating area 31 can be adjusted, and finally the single chip 4 heating function is realized, and the problem of thermal light decay caused by long-time high-temperature baking of the completed die bonding chip 4 is effectively solved. The connection between the convex lens 2 and the focusing knob 12 is similar to the connection principle of a microscope, and the connection structure of the convex lens 2 and the focusing knob 12 can also refer to the related connection structure of a similar microscope. When adjusting the size of the heating area 31, the size of the heating area is observed by an image recognition device, the focusing knob is manually rotated, the lens focal point is adjusted, and finally the heating area is adjusted to be appropriate.

[0036] By changing the focal point position of the lens, the size of the heating area is adjusted, the single chip 4 heating can be realized, the problem of thermal light decay caused by long-time heating of the completed die bonding chip 4 is avoided, and the difference in local temperature caused by large-area heating is also avoided, which finally affects the consistency of the material die bonding effect.

[0037] Specifically, the focusing knob 12 comprises a knob part 121 and a connecting rod 122 fixedly connected in a T shape, a through hole is horizontally arranged on the fixed seat 9, one end of the connecting rod 122 is fixedly connected with the center of the knob part 121, the other end is horizontally connected with the convex lens 2 through the through hole, and the size of the knob part 121 is larger than that of the through hole. Among them, the convex lens 2 can be installed on a suitable mounting bracket, the end of the connecting rod 122 away from the knob part 121 is detachably fixed with the mounting bracket through the through hole or threaded hole on the fixed seat 9, and the focal point of the convex lens 2 can be changed by rotating the focusing knob 12. The connecting rod 122 and the mounting bracket can be fixed in a conventional manner, such as threaded connection.

[0038] Specifically, the local heating hot-pressing welding device of the present scheme further comprises a temperature measuring system 6, which is installed on the rack and located above the die bonding platform. The temperature measuring system 6 is used to detect the temperature of the heating area 31, and the infrared light source 11 stops heating when the inductor 61 detects that the heating area 31 reaches the set value. By adding the infrared temperature measuring device, the consistency of the heating area 31 temperature during each hot pressing is ensured, and the difference in local temperature is avoided, which finally affects the consistency of the material die bonding effect.

[0039] Specifically, the temperature measuring system 6 comprises a sensor 61 mounted on the rack, the sensor 61 is located above the die bonding platform, and the sensor 61 is on the same vertical line perpendicular to the horizontal plane as the infrared light source 11.

[0040] Specifically, the local heating hot press welding device further comprises a temperature control system 5 mounted on the rack, the sensor 61 is electrically connected with the temperature control system 5, the temperature control system 5 is electrically connected with the infrared light source 11, the sensor 61 monitors the temperature of the heating area 31 and can feedback signals to the temperature control system 5, when the sensor 61 detects that the heating area 31 reaches the set value, the temperature control system 5 controls the infrared light source 11 to stop heating. The infrared temperature measuring device is used to detect the temperature of the heating area 31 in real time, and the temperature control system 5 is used to feedback signals to the infrared heating device in real time, so that the infrared heat source can be adjusted or cut off, automatic temperature adjustment is realized, and the consistency of the heating temperature is ensured.

[0041] In use, the infrared temperature measuring system 6 monitors the temperature of the heating area 31 and feedbacks signals to the temperature control system 5, the temperature control system 5 can adjust the power or switch of the infrared heating system 1, the light emitted by the infrared heating system 1 is irradiated to the heating area 31 at the bottom of the substrate bowl 3 through the convex lens 2, when the sensor 61 in the infrared temperature measuring system 6 detects that the temperature of the heating area 31 reaches the set value, the infrared light source 11 of the infrared heating system 1 stops heating, the suction nozzle 7 adsorbs the chip 4 on the silicon wafer, the mechanical arm 8 swings to move the chip to the center of the substrate bowl 3 and performs extrusion, and the bonding is completed. The sensor 61 can be preferably an infrared sensor 61, and the temperature control system 5 can adopt a common controller and control circuit to realize electrical connection with the sensor 61 and control of the power or switch of the infrared heating system 1.

[0042] Other contents of the local heating hot press welding device are known from the prior art, and will not be repeated here.

[0043] The above is only a preferred embodiment of the present application, and does not limit the present application in any form, so any modification, equivalent change and modification of the above embodiment according to the technical essence of the present application, all still belong to the scope of the technical scheme of the present application.

Claims

1. A locally heated hot press bonding apparatus, characterized by: The infrared heating system includes an infrared light source, which is located below the convex lens and can emit infrared light to the convex lens.

2. The locally heated hot press bonding apparatus of claim 1, wherein: The infrared light source and the convex lens are on the same vertical line.

3. The locally heated hot press bonding apparatus of claim 2, wherein: The infrared heating system further includes a focusing knob, and the machine frame is provided with a fixing seat.

4. The locally heated hot press bonding apparatus of claim 1, wherein: The focusing knob includes a T-shaped knob part and a connecting rod fixedly connected with each other.

5. A localised heated hot press bonding apparatus as claimed in claim 4, wherein: The machine frame is further provided with a temperature measuring system, which is installed on the machine frame and located above the die bonding platform.

6. The locally heated hot press bonding apparatus of claim 2, wherein: The temperature measuring system includes a sensor installed on the machine frame, and the sensor and the infrared light source are on the same vertical line.

7. A localised heated hot press bonding apparatus as claimed in claim 6, wherein: The machine frame is further provided with a temperature control system installed thereon.

8. The locally heated hot press bonding apparatus of claim 7, wherein: The sensor is electrically connected with the temperature control system, and the temperature control system is electrically connected with the infrared light source. The sensor can monitor the heating area and feed back signals to the temperature control system. When the sensor detects that the heating area reaches a set value, the temperature control system controls the infrared light source to stop heating.

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