Separating device for large-size silicon wafer and carrier disc

Abstract

A separating device for a large-size silicon wafer and a carrier disc comprises a mounting plate used for being connected with driving equipment, a tray fixedly connected with the mounting plate, a scraper knife detachably arranged on the tray and a fixing assembly used for fixing the scraper knife, and at least two positioning columns are vertically and fixedly arranged on the tray. All the positioning columns are jointly connected with a transparent pressing plate in a sliding mode, an installation space used for containing the scraper knife is formed between the transparent pressing plate and the tray, at least two sliding grooves are formed in the edge of the scraper knife, the positioning columns can enter the sliding grooves in a one-to-one correspondence mode, and the fixing assembly comprises a swing arm rotationally arranged on the tray. And in the rotating process of the swinging arm, the transparent pressing plate can be pushed to press the scraper knife on the tray. The utility model provides a separating device for a large-size silicon wafer and a carrier disc. A scraper knife is easy to replace.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of silicon wafer polishing, in particular to a large-size silicon wafer and carrier disc separation device. BACKGROUND

[0002] In the production process of silicon wafers, the surface needs to be polished to ensure the precision of the subsequent deep processing process. During the polishing process, the silicon wafer is adhered to a carrier disc made of ceramic material by wax, and the carrier disc is driven by the equipment to drive the silicon wafer to rub against the polishing table, thereby achieving polishing. After polishing is completed, the silicon wafer needs to be separated from the carrier disc. In the prior art, a spatula is mainly used to push the edge of the silicon wafer to separate it from the carrier disc. The conventional spatula is fixed on a tray, and the tray is driven to move by a pneumatic cylinder or other equipment, thereby driving the spatula to move. More specifically, at least two screws are fixedly arranged on the tray, and corresponding through holes are formed in the spatula. After the screws pass through the through holes, the spatula is pressed tightly by nuts. The fixing method of this spatula requires multiple rotations of the nuts and accurate alignment of the through holes and the screws to successfully install a new spatula, which is very cumbersome. In order to solve this problem, the applicant improved the structure of the spatula by opening at least two sliding grooves at the tail end of the spatula, so that the spatula can move to the side of the screw, and then the screw enters the sliding groove. Then, a pressing plate is used to press the spatula tightly, and the screw can pass through the pressing plate and cooperate with the butterfly nut. Although this improved scheme can improve the replacement efficiency of the spatula, the part of the screw that needs to enter the through groove is blocked by the pressing plate when replacing the spatula. Maintenance personnel need to adjust the position of the spatula multiple times to make the screw enter the sliding groove smoothly, and the butterfly nut still needs to be rotated. Therefore, the replacement efficiency of the spatula is still low. SUMMARY

[0003] In order to solve the problems in the prior art, the utility model provides a large-size silicon wafer and carrier disc separation device, which is easy to replace the spatula.

[0004] In order to achieve the above-mentioned purpose, the utility model adopts the specific scheme as follows: a large-size silicon wafer and carrier disc separation device, comprising a mounting plate for connecting a driving device, a tray fixedly connected with the mounting plate, a spatula detachably arranged on the tray, and a fixing assembly for fixing the spatula, wherein at least two positioning columns are vertically fixedly arranged on the tray, and all the positioning columns are slidably connected with a transparent pressing plate, and the transparent pressing plate and the tray form an installation space for accommodating the spatula, at least two sliding grooves are formed at the edge of the spatula, and the positioning columns can enter the sliding grooves one by one, and the fixing assembly comprises a swing arm rotatably arranged on the tray, and the swing arm can push the transparent pressing plate to press the spatula on the tray during rotation.

[0005] As a further optimization of the above-mentioned large-size silicon wafer and carrier disc separation device: a plurality of first elastic members are fixedly arranged on the tray, and the first elastic members are located between the transparent pressing plate and the tray, and the transparent pressing plate can compress the first elastic members during movement of the transparent pressing plate pushed by the swing arm, and the first elastic members can push the transparent pressing plate away from the tray when the swing arm is separated from the transparent pressing plate.

[0006] As a further optimization of the above-mentioned large-size silicon wafer and carrier disc separation device: the first elastic member is provided as a spring.

[0007] As a further optimization of the above-mentioned large-size silicon wafer and carrier disc separation device: a limiting ring is fixedly sleeved on the positioning column, and the transparent pressing plate is located between the limiting ring and the tray.

[0008] As a further optimization of the above-mentioned large-size silicon wafer and carrier disc separation device: the fixing assembly comprises two support plates which are vertically fixedly arranged on the tray, and a central shaft is rotatably connected between the two support plates, and the swing arm is fixedly connected with the central shaft.

[0009] As a further optimization of the above-mentioned large-size silicon wafer and carrier disc separation device: the swing arm comprises a trunk portion in a U shape, and a second elastic member is connected between the middle portion of the trunk portion and the tray.

[0010] As a further optimization of the above-mentioned large-size silicon wafer and carrier disc separation device: the second elastic member is provided as a spring.

[0011] As a further optimization of the above-mentioned large-size silicon wafer and carrier disc separation device: the swing arm is fixedly connected with a gasket, and the gasket is in contact with the transparent pressing plate when the swing arm pushes the transparent pressing plate.

[0012] As a further optimization of the above-mentioned large-size silicon wafer and carrier disc separation device: the mounting plate is fixedly connected with an extension plate, and the extension plate and the mounting plate form an obtuse angle, and the tray is fixedly connected with the extension plate.

[0013] As a further optimization of the above-mentioned large-size silicon wafer and carrier disc separation device: the edge of the shovel is provided with a blade, and the blade is obliquely arranged.

[0014] Beneficial effects: in the utility model, the shovel is pushed by the swing arm to press and fix the transparent pressing plate, when the shovel needs to be replaced, whether the sliding groove is aligned with the positioning column can be clearly observed through the transparent pressing plate, the efficiency of maintenance and replacement can be improved, and in addition to removing the old shovel and installing the new shovel, only the swing arm needs to be rotated, which is simple and convenient. BRIEF DESCRIPTION OF DRAWINGS

[0015] Fig. 1is the schematic diagram of relative position between mounting plate, tray and spade;

[0016] Fig. 2 is the schematic diagram of overall structure of the utility model;

[0017] Fig. 3 is the schematic diagram of cooperation mode of spade, tray and transparent pressing plate;

[0018] Fig. 4 is the schematic diagram of setting mode of sliding slot.

[0019] BRIEF DESCRIPTION OF DRAWINGS:1-mounting plate, 2-extended plate, 3-tray, 4-spade, 5-edge, 6-positioning column, 7-transparent pressing plate, 8-limiting ring, 9-first elastic member, 10-oscillating arm, 11-gasket, 12-second elastic member, 13-supporting plate, 14-center shaft, 15-sliding slot. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the utility model will be apparently and completely described in conjunction with the drawings in the embodiments of the utility model, and obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by the person skilled in the art without creative labor fall within the protection scope of the utility model.

[0021] As Figs. 1 to 4 shown, a kind of large-size silicon wafer and carrier plate separation device, including the mounting plate 1 for connecting driving equipment, the tray 3 of fixed connection with mounting plate 1, spade 4 can be detachably arranged on tray 3, and the fixing assembly for fixing spade 4, wherein at least two positioning columns 6 are vertically fixed and arranged on tray 3, all positioning columns 6 are slidably connected with transparent pressing plate 7, and installation space for accommodating spade 4 is formed between transparent pressing plate 7 and tray 3, at least two sliding slots 15 are set in the edge of spade 4, positioning column 6 can be one-to-one into sliding slot 1515, and fixing assembly includes oscillating arm 10 rotationally arranged on tray 3, and oscillating arm 10 can push transparent pressing plate 7 and press spade 4 on tray 3 during rotation.

[0022] The utility model is suitable for silicon wafer polishing production line, in the polishing process, the silicon wafer is pasted on the carrier disc through wax, when the polishing of the silicon wafer is finished, the utility model is used to separate the silicon wafer from the carrier disc. Specifically, the silicon wafer and the carrier disc after polishing are transported to the side of the separating device of the utility model, then the carrier disc is inclined, after that, the driving equipment is used to drive the mounting plate 1 to move, the mounting plate 1 drives the tray 3 and the shovel 4 to move synchronously in the moving process, until the shovel 4 abuts against the edge of the silicon wafer, the mounting plate 1 continues to move to shovel up the silicon wafer by the shovel 4, thereby realizing the separation of the silicon wafer and the carrier disc. When the shovel 4 is damaged or deformed, the maintenance personnel first rotate the swing arm 10 to separate it from the transparent pressing plate 7, thereby releasing the transparent pressing plate 7, then the maintenance personnel take down the shovel 4 and replace it with a new one, when installing the new shovel 4, the sliding slot 15 is aligned with the positioning column 6, and the shovel 4 is moved until the positioning column 6 is inserted into the sliding slot 15, thereby completing the installation of the new shovel 4, by setting the transparent pressing plate 7, it is convenient for the maintenance personnel to observe whether the sliding slot 15 and the positioning column 6 are aligned, thereby improving the efficiency of maintenance and replacement. After the installation of the new shovel 4 is completed, the swing arm 10 is used to push the transparent pressing plate 7 again, and the transparent pressing plate 7 is used to press and fix the shovel 4 on the tray 3, thereby ending the maintenance. It should be noted that how to incline the carrier disc, and the specific structure and principle of the driving equipment are all prior art, and will not be repeated here.

[0023] In the utility model, the shovel 4 is pressed and fixed by the swing arm 10 pushing the transparent pressing plate 7, when the shovel 4 needs to be replaced, whether the sliding slot 15 is aligned with the positioning column 6 can be clearly observed through the transparent pressing plate 7, thereby improving the efficiency of maintenance and replacement, and in addition to taking down the old shovel 4 and installing the new shovel 4, only the swing arm 10 needs to be rotated, which is simple and convenient.

[0024] In order to facilitate the taking down of the old shovel 4 after the transparent pressing plate 7 is separated from the swing arm 10, a plurality of first elastic members 9 are fixedly arranged on the tray 3, and the first elastic members 9 are located between the transparent pressing plate 7 and the tray 3, the transparent pressing plate 7 can compress the first elastic members 9 in the moving process of the swing arm 10 pushing the transparent pressing plate 7, and the first elastic members 9 can push the transparent pressing plate 7 away from the tray 3 when the swing arm 10 is separated from the transparent pressing plate 7. By setting the first elastic members 9, when the swing arm 10 presses the transparent pressing plate 7 to fix the shovel 4, the first elastic members 9 are in the compressed state, after the transparent pressing plate 7 is separated from the swing arm 10, the first elastic members 9 recover and push the transparent pressing plate 7 away from the tray 3, at this time, the transparent pressing plate 7 no longer presses the shovel 4 tightly, thereby facilitating the taking down of the shovel 4. In an embodiment, the first elastic members 9 are set as springs.

[0025] In order to avoid that the transparent pressing plate 7 is separated from the positioning column 6 due to the excessive distance of the transparent pressing plate 7 pushed by the first elastic member 9 during the recovery process, the positioning column 6 is fixedly sleeved with a limiting ring 8, and the transparent pressing plate 7 is located between the limiting ring 8 and the tray 3. The limiting ring 8 is used for limiting the position of the transparent pressing plate 7, so as to avoid that the transparent pressing plate 7 is completely separated from the positioning column 6.

[0026] The swing arm 10 is specifically provided as follows: the fixing assembly includes two support plates 13 which are vertically fixed on the tray 3, a center shaft 14 is rotationally connected between the two support plates 13, and the swing arm 10 is fixedly connected with the center shaft 14. More specifically, the support plate 13 is provided with an insertion hole, and the center shaft 14 is fixedly connected with an insertion rod at each end, and the diameter of the insertion rod is smaller than the diameter of the center shaft 14. The insertion rod is inserted into the insertion hole to realize the rotational connection between the center shaft 15 and the support plate 13.

[0027] The swing arm 10 can be driven by a driving device, for example, a cylinder, so as to stably press the transparent pressing plate 7 and the shovel 4. However, the structure of this mode is complex and the cost is high. In order to simplify the structure of the fixing assembly and reduce the cost, the swing arm 10 includes a main stem portion in the shape of U, and the middle portion of the main stem portion is connected with the tray 3 through a second elastic member 12. The second elastic member 12 is always in a deformed state and always has a tendency to rebound, so as to always generate a movement tendency to pull the swing arm 10 to rotate, thereby ensuring that the swing arm 10 can be pulled to rotate around the center shaft 14, and the swing arm 10 pushes the transparent pressing plate 7 to press the shovel 4. During the replacement of the shovel 4, the second elastic member 12 is further deformed during the manual rotation of the swing arm 10 by the maintenance personnel, and more energy is accumulated. After the swing arm 10 is released by the maintenance personnel, the swing arm 10 can be quickly pulled to rotate until the transparent pressing plate 7 and the shovel 4 are pressed tightly. In an embodiment, the second elastic member 12 is provided as a spring. It should be noted that, in actual application, in order to avoid that the shovel 4 damages the silicon wafer, the shovel 4 is made of plastic material and has a small size, so the weight of the shovel 4 is very light. The swing arm 10 driven by the second elastic member 12 can sufficiently press and fix the shovel 4.

[0028] In order to avoid that the swing arm 10 damages the transparent pressing plate 7, the swing arm 10 is fixedly connected with a gasket 11, and the gasket 11 is in contact with the transparent pressing plate 7 when the swing arm 10 pushes the transparent pressing plate 7. The gasket 11 can be made of corrosion-resistant rubber material.

[0029] In order to ensure that the shovel 4 can smoothly separate the silicon wafer from the carrier disc, the mounting plate 1 is fixedly connected with an extension plate 2, and the extension plate 2 is at an obtuse angle with the mounting plate 1. The tray 3 is fixedly connected with the extension plate 2. The edge of the shovel 4 is provided with a blade 5, and the blade 5 is obliquely arranged.

[0030] The above description of disclosed embodiments enables one of ordinary skill in the art to make or use the application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein can be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A device for separating a large-size silicon wafer from a carrier disk, characterized in that, The utility model provides a kind of cutting device, including the mounting plate (1) for connecting driving device, the tray (3) fixedly connected with mounting plate (1), detachably set on tray (3) spade (4) and the fixing assembly for fixing spade (4), wherein at least two positioning posts (6) are vertically fixedly provided on tray (3), all positioning posts (6) are slidably connected with transparent pressing plate (7), and installation space for accommodating spade (4) is formed between transparent pressing plate (7) and tray (3), at least two sliding grooves (15) are provided at the edge of spade (4), and positioning post (6) can enter sliding groove (15) one by one, and the fixing assembly includes swing arm (10) rotatably arranged on tray (3), and swing arm (10) can push transparent pressing plate (7) and press spade (4) on tray (3) during rotation.

2. An apparatus for separating a large size silicon wafer from a carrier disk as claimed in claim 1, wherein, A plurality of first elastic members (9) are fixedly provided on the tray (3), and the first elastic members (9) are located between the transparent pressing plate (7) and the tray (3), the transparent pressing plate (7) can compress the first elastic members (9) during movement of the transparent pressing plate (7) pushed by the swing arm (10), and the first elastic members (9) can push the transparent pressing plate (7) away from the tray (3) when the swing arm (10) is separated from the transparent pressing plate (7).

3. An apparatus for separating a large size silicon wafer from a carrier disk as recited in claim 2, wherein, The first elastic members (9) are springs.

4. An apparatus for separating a large size silicon wafer from a carrier disk as recited in claim 1, wherein, A limiting ring (8) is fixedly sleeved on the positioning post (6), and the transparent pressing plate (7) is located between the limiting ring (8) and the tray (3).

5. An apparatus for separating a large size silicon wafer from a carrier disk as recited in claim 1, wherein, The fixing assembly includes two support plates (13) vertically fixed on the tray (3), and a central shaft (14) is rotatably connected between the two support plates (13), and the swing arm (10) is fixedly connected with the central shaft (14).

6. An apparatus for separating a large size silicon wafer from a carrier disk as recited in claim 5, wherein, The swing arm (10) includes a U-shaped main stem portion, and a second elastic member (12) is connected between the middle of the main stem portion and the tray (3).

7. An apparatus for separating a large size silicon wafer from a carrier disk as claimed in claim 6, wherein, The second elastic member (12) is a spring.

8. An apparatus for separating a large size silicon wafer from a carrier disk as recited in claim 6, wherein, The swing arm (10) is fixedly connected with a gasket (11), and the gasket (11) is in contact with the transparent pressing plate (7) when the swing arm (10) pushes the transparent pressing plate (7).

9. An apparatus for separating a large size silicon wafer from a carrier disk as recited in claim 1, wherein, The mounting plate (1) is fixedly connected with an extension plate (2), and the extension plate (2) forms an obtuse angle with the mounting plate (1), and the tray (3) is fixedly connected with the extension plate (2).

10. An apparatus for separating a large size silicon wafer from a carrier disk as recited in claim 1, wherein, The edge of the spade (4) is provided with a blade edge (5), and the blade edge (5) is inclined.

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