Transfer frame for resistivity detection of twelve-inch silicon wafers

By designing a rotating connection structure between the carrier and placement components of the transfer frame, the problem of low silicon wafer sorting efficiency was solved, enabling rapid transfer and efficient detection of silicon wafers.

CN223905576UActive Publication Date: 2026-02-13MCL ELECTRONICS MATERIALS
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Patent Information

Application Number
CN202520546961.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-03-26
Publication Date
2026-02-13
Estimated Expiration
2035-03-26

AI Technical Summary

Technical Problem

The existing notch design of the silicon wafer rack makes it difficult to quickly and easily discharge silicon wafers in one go during the sorting process, which increases the labor intensity of workers and reduces sorting efficiency, affecting the speed and cost of the production process.

Method used

Design a transfer frame for resistivity testing of 12-inch silicon wafers, comprising a carrier with notches and a placement component. The placement component and the carrier are rotatably connected by a connecting shaft, allowing the silicon wafers to be stably stacked vertically and arranged horizontally. The silicon wafers are quickly ejected by using ejection airbags and ejection slots.

Benefits of technology

It achieves stable vertical stacking and horizontal arrangement of silicon wafers, and can easily and quickly transfer multiple silicon wafers to the testing equipment, improving testing efficiency and reducing labor intensity and time costs.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a twelve-inch silicon wafer resistivity detection transfer frame, which is provided with a bearing piece with a notch and a placing piece capable of opening and closing the notch and vertically stacking a plurality of silicon wafers, and the placing piece is rotatably connected with the bearing piece through a connecting shaft, so that the silicon wafers can be stably and transversely arranged and completely separated along with the rotation of the placing piece; the bearing part comprises a bearing cylinder with a semicircular cross section, and an ejection air bag is arranged on the bearing cylinder; the placing piece comprises a placing cylinder with a semicircular cross section, the outer diameter of the placing cylinder is smaller than the inner diameter of the bearing cylinder, the outer wall of the placing cylinder can eject the ejection air bag to limit rotation of the ejection air bag, a plurality of placing plates are vertically and uniformly arranged in the placing cylinder, and gaps among the placing plates are used for placing silicon wafers. The problem that in the prior art, a silicon wafer containing frame cannot be convenient for workers to rapidly discharge all silicon wafers in the silicon wafer containing frame to cooperate with sorting equipment for efficient silicon wafer sorting is solved.
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Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of silicon wafer detection, and particularly to a transfer frame for twelve-inch silicon wafer resistivity detection. BACKGROUND

[0002] In the field of semiconductor manufacturing, silicon wafers as important basic materials, its processing and sorting process plays a key role in ensuring the quality and performance of semiconductor devices. In the production, processing and storage process of silicon wafers, in order to facilitate the staff to take, positioning and identification, usually will be set in the edge of the silicon wafer placing rack gap. The setting of this gap indeed brings convenience for the operation of the staff to a certain extent, for example, when taking the silicon wafer can provide a clear grasping position, at the same time in some automatic equipment can also be used for positioning of silicon wafer.

[0003] However, with the continuous development of semiconductor manufacturing technology and the improvement of production efficiency requirements, the gap setting of the existing silicon wafer placing rack gradually exposes some problems. In the sorting link of silicon wafers, the staff needs to discharge the silicon wafers in the placing rack and place them to the sorting area of the sorting device. When the placing rack is placed horizontally, due to the existence of the gap of the silicon wafer, it is impossible to discharge all the silicon wafers in the placing rack at one time and place them accurately to the sorting area. This is because the gap will affect the arrangement and sliding of the silicon wafers in the placing rack, so that the silicon wafers are prone to jam, tilt or fail to slide out smoothly during the discharging process.

[0004] At present, in order to place the silicon wafers in the placing rack to the sorting area of the sorting device, the staff often needs to spend extra time and effort to adjust, take out and place the silicon wafers one by one, which not only increases the labor intensity of the staff, but also reduces the efficiency of silicon wafer sorting to a certain extent. In large-scale semiconductor production, the reduction of sorting efficiency will directly affect the speed and cost of the whole production process, and thus adversely affect the economic benefit of the enterprise. SUMMARY

[0005] The utility model aims at solving the problem that the silicon wafer placing rack in the prior art cannot facilitate the staff to discharge all the silicon wafers inside quickly, and provides a transfer frame for twelve-inch silicon wafer resistivity detection.

[0006] The utility model solves the above technical problem, and the technical scheme adopted is: a transfer frame for twelve-inch silicon wafer resistivity detection, which has a bearing member provided with a gap and a placing member capable of opening and closing the gap and vertically stacking and placing multiple silicon wafers, the placing member is rotatably connected with the bearing member through a connecting shaft, so that the silicon wafers can be stably arranged horizontally and completely discharged with the rotation of the placing member;

[0007] The bearing piece includes a bearing cylinder with a semicircular cross section, and the bearing cylinder is provided with an ejection air bag;

[0008] The placing piece includes a placing cylinder with a semicircular cross section, and the outer diameter of the placing cylinder is smaller than the inner diameter of the bearing cylinder.

[0009] As a further optimization of the utility model discloses a twelve-inch silicon wafer resistivity detection transfer frame, the placing cylinder is provided with an ejection through slot, and the ejection through slot is matched with the ejection air bag to push the silicon wafer placed in the placing piece out.

[0010] As a further optimization of the utility model discloses a twelve-inch silicon wafer resistivity detection transfer frame, a chamfer part is formed at the connecting position between the ejection through slot and the outer wall of the placing cylinder to enable the ejection air bag to get out of or enter the ejection through slot.

[0011] As a further optimization of the utility model discloses a twelve-inch silicon wafer resistivity detection transfer frame, the bearing cylinder is provided with a containing box corresponding to the position of the ejection air bag, and the containing box has a horn-shaped cross section to enable the ejection air bag to shrink into the containing box.

[0012] As a further optimization of the utility model discloses a twelve-inch silicon wafer resistivity detection transfer frame, the connecting shaft is provided with a rotating disc fixed outside the bearing cylinder.

[0013] As a further optimization of the utility model discloses a twelve-inch silicon wafer resistivity detection transfer frame, the connecting shaft is provided with a reset piece connected outside the bearing cylinder.

[0014] As a further optimization of the utility model discloses a twelve-inch silicon wafer resistivity detection transfer frame, the reset piece includes a reset gear and an elastic plate, the elastic plate is arranged in an inclined mode, the two ends of the elastic plate are fixedly connected with the horizontal and vertical segments of the L-shaped holding handle arranged on the bearing cylinder, the reset gear is fixedly connected with the connecting shaft penetrating through the bearing cylinder, the reset gear is engaged with a reset rack, the reset rack is provided with a linkage column, the linkage column is slidingly connected with a limiting seat fixedly arranged on the bearing cylinder, the end of the linkage column, away from the connecting shaft, is fixedly connected with a limiting disc penetrating through a sliding groove arranged on the elastic plate, and the outer diameter of the limiting disc is larger than the distance between the inner walls of the sliding groove.

[0015] As a further optimization of the utility model discloses a twelve-inch silicon wafer resistivity detection transfer frame, the two ends of the holding handle are fixedly connected with the outer circumferential surface of the bearing cylinder and an extension part, respectively, the extension part is arranged on the upper and lower sides of the bearing cylinder and is perpendicular to the annular section of the bearing cylinder.

[0016] Compared with the prior art, the utility model has the following beneficial effects:

[0017] The utility model discloses a cooperation of the setting of bearing and placing piece can make silicon wafer vertically stack and place stably, and the rotary connection mode of placing piece and bearing makes silicon wafer can be placed piece restriction when vertically stack and place change into horizontal arrangement, and with the rotation of placing piece can be all taken out more easily, to the staff with multiple silicon wafer fast transfer to detection equipment, thereby improve the detection efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 It is the front view structure schematic diagram of the utility model embodiment 1;

[0019] Figure 2 It is the cross section structure schematic diagram of the utility model embodiment 1;

[0020] Figure 3 It is the front view structure schematic diagram of the utility model embodiment 2;

[0021] Figure 4 It is the cross section structure schematic diagram of the utility model embodiment 2;

[0022] Mark in drawing: 1, bearing piece;101, bearing cylinder;102, extension part;103, containing box;104, hold handle;2, placing piece;201, placing cylinder;202, placing board;203, ejecting through slot;204, chamfer part;3, connecting shaft;4, dial;5, ejecting air bag;6, reset piece;601, reset gear;602, reset rack;603, linkage column;604, limit seat;605, sliding slot;606, elastic plate;607, limit disc. DETAILED DESCRIPTION

[0023] In order to better understand the utility model, the following combining with the embodiment further illustrates the content of the utility model, but the content of the utility model is not limited to the following embodiment.

[0024] <Embodiment 1>

[0025] As Figure 1 And Figure 2As shown, a transfer frame for 12-inch silicon wafer resistivity detection, the main carrier 1 is a bearing cylinder 101 with a semicircular cross-section. A top-out air bag 5 is installed at a corresponding position of the bearing cylinder 101, and a containing box 103 with a trumpet-shaped cross-section is arranged on the bearing cylinder 101 at a position corresponding to the top-out air bag 5, so that the top-out air bag 5 can retract into the containing box 103 in subsequent work. The main body of the placing part 2 is a placing cylinder 201 with a semicircular cross-section, and the outer diameter of the placing cylinder 201 is smaller than the inner diameter of the bearing cylinder 101. In the placing cylinder 201, a plurality of placing plates 202 are vertically and uniformly installed, and suitable gaps are formed between the placing plates 202 for vertically stacking 12-inch silicon wafers. The placing cylinder 201 is rotationally connected to the bearing cylinder 101 through a connecting shaft 3, so that the placing cylinder 201 can rotate around the connecting shaft 3, thereby opening and closing the gap in the bearing cylinder 101. The upper connecting shaft 3 penetrates the bearing cylinder 101 and is fixedly installed with a dial 4 at the penetrating part. By operating the dial 4, the worker can flexibly control the degree of opening or closing of the gap in the bearing cylinder 101, which is convenient for observing the silicon wafer according to the actual needs, and can also open a larger gap to take out the silicon wafer when needed, and can provide good protection for the silicon wafer when the gap is completely closed.

[0026] When a 12-inch silicon wafer needs to be transferred, the 12-inch silicon wafer is sequentially placed vertically between the gaps between the multiple placing plates 202 in the placing cylinder 201. Since the placing plates 202 are vertically and uniformly arranged, the silicon wafers can be neatly stacked vertically in the placing cylinder 201. At this time, the outer wall of the placing cylinder 201 will press the top-out air bag 5 on the bearing cylinder 101, which effectively limits the rotation of the placing cylinder 201, ensuring that the silicon wafers remain stable in the horizontal arrangement during the transfer process, avoiding damage caused by shaking and collision. When the silicon wafer is transported to the resistivity detection equipment and needs to be transferred to the detection equipment, the operator manually operates the dial 4. Since the dial 4 is fixedly connected to the connecting shaft 3 penetrating the bearing cylinder 101, rotating the dial 4 will drive the connecting shaft 3 to rotate, and then make the placing cylinder 201 rotate under the support of the connecting shaft 3. In the process of rotating the placing cylinder 201, the top-out air bag 5 will retract into the trumpet-shaped containing box 103 on the bearing cylinder 101, so that the placing cylinder 201 can rotate smoothly without being hindered by the top-out air bag 5. When the placing cylinder 201 is rotated to a certain position, the top-out through slot 203 formed in the placing cylinder 201 is aligned with the top-out air bag 5, and the top-out air bag 5 is adapted to the top-out through slot 203 under the elastic force of the top-out air bag 5 and the extrusion of the trumpet-shaped containing box 103, and the silicon wafer in the placing cylinder 201 is pushed out. Since the top-out through slot 203 is provided with a chamfered portion 204 at the connection with the outer wall of the placing cylinder 201, this design can make the top-out air bag 5 more smoothly retract into or exit the top-out through slot 203, ensuring the smooth process of the silicon wafer, and making the silicon wafer accurately transferred to the specified position of the detection equipment.

[0027] The extension 102 is fixedly connected with the outer circumferential surface of the bearing cylinder 101 through the L-shaped holding handle 104, which is convenient for the workers to convert the bearing cylinder 101 from vertical to horizontal, and is convenient for the workers to convert the plurality of silicon wafers vertically stacked in the placing cylinder 201 into horizontal arrangement, so as to realize the convenient and fast discharge of the silicon wafers.

[0028] As shown in Figure 3 and Figure 4 The embodiment is basically the same as the embodiment 1, and the difference is that the reset member 6 is additionally arranged on the holding handle 104. The reset member 6 is composed of a reset gear 601 and an elastic plate 606. The reset gear 601 is fixedly installed on the connecting shaft 3 penetrating through the bearing cylinder 101. The elastic plate 606 is obliquely arranged, and the two ends thereof are fixedly connected with the horizontal section and the vertical section of the L-shaped holding handle 104 of the bearing cylinder 101, respectively. The reset gear 601 is in meshing with a reset rack 602. The reset rack 602 is installed with a linkage column 603, and the linkage column 603 is in sliding fit with a limiting seat 604 fixed on the bearing cylinder 101. The end of the linkage column 603 away from the connecting shaft 3 penetrates through a sliding groove 605 arranged on the elastic plate 606, and is fixedly connected with a limiting disc 607 with an outer diameter larger than the interval of the inner wall of the sliding groove 605.

[0029] When adjusting the degree of the opening of the bearing cylinder 101 by the placing cylinder 201, the operator can pull the elastic plate 606 with the vertical section of the holding handle 104 as the support, and make the limiting disc 607 displace through the sliding groove 605 on the elastic plate 606. The displacement of the limiting disc 607 drives the linkage column 603 to move under the constraint of the limiting seat 604, and then drives the connecting shaft 3 to rotate through the reset gear 601, so that the placing cylinder 201 rotates under the support of the bearing cylinder 101, and the adjustment of the opening degree of the bearing cylinder 101 is realized. When the operator releases the elastic plate 606, the elastic plate 606 will restore to the original state under the elastic force and the support of the holding handle 104, and the restoring force will drive the reset rack 602 to move reversely. When the reset rack 602 moves reversely, the reset gear 601 and the connecting shaft 3 are reversely rotated through the meshing effect, so as to reversely rotate the placing cylinder 201, and make it restore to the initial position, so as to prepare for the next placing of the silicon wafers.

[0030] The specific embodiments of the utility model are described above. It should be understood that the utility model is not limited to the specific implementation manners described above, and various modifications or changes can be made by those skilled in the art within the scope of claims, which does not affect the essential content of the utility model.

Claims

1. A transfer rack for twelve inch silicon wafer resistivity testing, characterized by: It has a carrier (1) provided with a gap and a placing part (2) capable of opening and closing the gap and vertically stacking multiple silicon wafers, the placing part (2) is rotatably connected with the carrier (1) through a connecting shaft (3), so that the silicon wafers can be stably arranged transversely and all be taken out with the rotation of the placing part (2); The carrier (1) comprises a carrier cylinder (101) with a semicircular cross section, and the carrier cylinder (101) is provided with an ejection air bag (5); The placing part (2) comprises a placing cylinder (201) with a semicircular cross section, the outer diameter of the placing cylinder (201) is smaller than the inner diameter of the carrier cylinder (101), the outer wall of the placing cylinder (201) can press the ejection air bag (5) to limit its rotation, and multiple placing plates (202) are vertically and uniformly arranged in the placing cylinder (201), and the gaps between the multiple placing plates (202) are used for placing silicon wafers.

2. The transfer rack for 12-inch silicon wafer resistivity testing as recited in claim 1, wherein: The placing cylinder (201) is provided with an ejection through slot (203), and the ejection through slot (203) is matched with the ejection air bag (5) to push the silicon wafers placed in the placing part (2) out.

3. A transfer rack for twelve inch silicon wafer resistivity testing as defined in claim 2 wherein: The ejection through slot (203) is provided with a chamfer portion (204) at the connection with the outer wall of the placing cylinder (201), so that the ejection air bag (5) can be taken out or enter the ejection through slot (203).

4. The transfer rack for twelve inch silicon wafer resistivity testing of claim 1 wherein: The carrier cylinder (101) is provided with a containing box (103) corresponding to the ejection air bag (5), and the containing box (103) has a horn-shaped cross section, so that the ejection air bag (5) can be retracted into the containing box (103).

5. The transfer rack for twelve inch silicon wafer resistivity testing as recited in claim 1, wherein: The connecting shaft (3) penetrates the carrier cylinder (101) and is fixedly provided with a dial plate (4).

6. The transfer rack for twelve inch silicon wafer resistivity testing as recited in claim 1, wherein: The connecting shaft (3) penetrates the carrier cylinder (101) and is connected with a reset part (6).

7. A twelve inch silicon wafer resistivity test transport rack as in claim 6, wherein: The reset part (6) comprises a reset gear (601) and an elastic plate (606), the elastic plate (606) is inclinedly arranged, and the two ends of the elastic plate (606) are fixedly connected with the horizontal and vertical segments of an L-shaped holding handle (104) arranged on the carrier cylinder (101), the reset gear (601) is fixedly connected with the connecting shaft (3) penetrating the carrier cylinder (101), the reset gear (601) is engaged with a reset rack (602), the reset rack (602) is provided with a linkage column (603), the linkage column (603) is slidingly matched with a limiting seat (604) fixedly arranged on the carrier cylinder (101), one end of the linkage column (603) away from the connecting shaft (3) penetrates a sliding groove (605) arranged on the elastic plate (606) and is fixedly connected with a limiting disc (607), and the outer diameter of the limiting disc (607) is greater than the inner wall spacing of the sliding groove (605).

8. The transfer rack for twelve inch silicon wafer resistivity testing of claim 7, wherein: The two ends of the holding handle (104) are fixedly connected with the outer circumferential surface of the carrier cylinder (101) and an extension part (102), respectively, the extension part (102) is arranged on the upper and lower sides of the carrier cylinder (101) and is perpendicular to the annular cross section of the carrier cylinder (101).