Cooling and heating cup

Abstract

The utility model discloses a cooling and heating cup which comprises a cup body, a base, a heating plate and a semiconductor refrigeration assembly. A temperature guide plate is arranged in the top opening of the base, and a cup is placed on the temperature guide plate; a first through opening is formed in the heating plate, a semiconductor refrigeration sheet in the semiconductor refrigeration assembly is arranged in the first through opening, and the heating plate and the semiconductor refrigeration sheet are both in contact with the heat conduction plate; when refrigeration is needed, the heating plate of the semiconductor chilling plate conducts cold and cools the cup through the temperature conducting plate, when heating is needed, the polarity of direct current is changed through the semiconductor chilling plate, the semiconductor chilling plate conducts heat and heats the cup through the temperature conducting plate, the heating plate starts to work at the same time, and heat and heat are also conducted and heated to the cup through the temperature conducting plate, so that the heating efficiency is improved; the use effect is improved.

Description

Technical Field

[0001] This utility model relates to the field of hot and cold cups, and particularly to hot and cold cups. Background Technology

[0002] Existing thermostat cups typically use semiconductor cooling chips to cool the liquid inside the container. When heating is required, the semiconductor cooling chip can heat the liquid inside the container by changing the polarity of the direct current. However, the heating speed is slow, which affects the performance. Utility Model Content

[0003] This utility model aims to at least solve one of the technical problems existing in the prior art. To this end, an embodiment of this utility model proposes a hot / cold cup, including a cup, a base, a heating plate, and a semiconductor refrigeration component; a temperature-conducting plate is installed in the top opening of the base, and the cup is placed on the temperature-conducting plate; the heating plate is in contact with the temperature-conducting plate, and the heating plate conducts heat to the cup through the temperature-conducting plate, and the heating plate has a first opening; the semiconductor refrigeration component includes a semiconductor refrigeration chip, which is located in the first opening, and the semiconductor refrigeration chip is in contact with the temperature-conducting plate, and the semiconductor refrigeration chip conducts cooling to the cup through the temperature-conducting plate.

[0004] According to some embodiments of the present invention, the semiconductor cooling component further includes a heat sink and a cooling fan. The heat sink includes a base plate and fins. The base plate is in close contact with the bottom of the semiconductor cooling chip. The fins are multiple and arranged on the base plate, with heat dissipation channels formed between adjacent fins. The cooling fan is located on one side of the heat sink and faces the heat dissipation channels. The base has heat dissipation grille holes.

[0005] According to some embodiments of the present invention, the heat dissipation grille holes are provided in two sets, both sets of the heat dissipation grille holes are provided on the side wall of the base, one set of the heat dissipation grille holes faces the cooling fan, and the other set of the heat dissipation grille holes faces the heat dissipation duct.

[0006] According to some embodiments of the present invention, a support plate is installed at the bottom of the temperature-conducting plate, the support plate is fixedly connected to the base, and the heating plate is sandwiched between the support plate and the temperature-conducting plate; a second opening is opened on the support plate, the second opening is matched with the first opening, and the semiconductor cooling chip is accommodated in the second opening and the first opening.

[0007] According to some embodiments of the present invention, the top opening of the base is bent inward to form an inner ring plate, the bottom end of the inner ring plate is pressed against the top surface of the temperature-conducting plate, an inner ring space is formed between the inner ring plate and the side wall of the base, a plurality of fixing columns are arranged in the inner ring space, and fixing screws are installed on the support plate and the fixing screws are inserted into the fixing columns.

[0008] According to some embodiments of the present utility model, a switch is installed below the tray, a pressure rod is installed on the tray, a ring plate is provided on the pressure rod, a spring is sleeved on the pressure rod, and the spring is located between the ring plate and the tray;

[0009] When the cup is placed on the temperature-conducting plate, the pressure rod is pressed and moves downward to working position one. The bottom end of the pressure rod protrudes from the bottom surface of the support plate and activates the switch.

[0010] Remove the cup, release the pressure on the lever and move it upward to the second working position, so that the top of the lever passes through the heating plate and the temperature guiding plate in sequence and protrudes from the top surface of the temperature guiding plate, and release the switch.

[0011] According to some embodiments of the present invention, the support plate is provided with a raised rib ring, which is used to support the heating plate and surrounds the second opening.

[0012] According to some embodiments of the present invention, the switch is connected to the control board, and the control board is controlled to connect to the heating plate and the semiconductor cooling component.

[0013] According to some embodiments of the present invention, the heating plate is provided with a first through hole, and the temperature guiding plate is provided with a second through hole. The first through hole and the second through hole are positioned to fit together, and the first through hole and the second through hole are used to pass through the pressure rod.

[0014] According to some embodiments of the present invention, the base is equipped with a rechargeable battery, which is used to supply power to the heating plate and the semiconductor refrigeration component.

[0015] The present invention has at least the following beneficial effects:

[0016] 1. A temperature-conducting plate is installed in the top opening of the base. The cup is placed on the temperature-conducting plate. The heating plate has a first opening, and the semiconductor cooling chip in the semiconductor cooling assembly is installed in the first opening. Both the heating plate and the semiconductor cooling chip are in contact with the temperature-conducting plate. When cooling is required, the semiconductor cooling chip and the heating plate conduct heat to the cup through the temperature-conducting plate to lower the temperature. When heating is required, the semiconductor cooling chip changes the polarity of the direct current, so that the semiconductor cooling chip conducts heat to the cup through the temperature-conducting plate to heat it. At the same time, the heating plate starts to work and also conducts heat to the cup through the temperature-conducting plate to heat it, thereby improving heating efficiency and improving the use effect.

[0017] 2. When the cup is placed on the temperature-conducting plate, the pressure rod is pressed down and moved to working position one, with the bottom end of the pressure rod protruding from the bottom surface of the support plate. Press down the switch to connect the working circuit. Remove the cup, release the pressure on the pressure rod and move it up to working position two, with the top end of the pressure rod protruding from the top surface of the temperature-conducting plate. Release the switch to disconnect the circuit to ensure safe use.

[0018] 3. There are two sets of heat dissipation grille holes. Since both sets of heat dissipation grille holes are opened on the side wall of the base, sufficient air intake is ensured so that the hot air generated after operation can be quickly dissipated into the external environment, thereby improving heat dissipation efficiency.

[0019] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0020] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0021] Figure 1 This is an overall exploded view of an embodiment of the present utility model;

[0022] Figure 2 This is a top view of an embodiment of the present utility model;

[0023] Figure 3 for Figure 2 Schematic diagram of the AA section;

[0024] Figure 4 for Figure 2 Schematic diagram of the BB cross section;

[0025] Figure 5 for Figure 3 Enlarged diagram of C in the middle;

[0026] Figure 6 for Figure 4 Enlarged diagram of D in the middle;

[0027] Figure 7 This is a schematic diagram of the inner cavity of the base according to an embodiment of the present utility model;

[0028] Figure 8 This is an exploded view of the temperature-conducting plate, heating plate, support plate, and semiconductor refrigeration chip according to an embodiment of the present utility model;

[0029] Figure 9 This is a schematic diagram of the pressure rod in the working position according to an embodiment of the present invention;

[0030] Figure 10 This is a schematic diagram of the pressure rod in the working position according to an embodiment of the present invention. Detailed Implementation

[0031] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements with the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0032] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0033] The working principle of the thermoelectric cooler 510 is as follows: When an N-type semiconductor material and a P-type semiconductor material are connected to form a thermocouple pair, a direct current is applied to this circuit, resulting in energy transfer. The current flows from the N-type element to the P-type element, absorbing heat at the junction, becoming the cold junction, and flows from the P-type element to the N-type element, releasing heat at the junction, becoming the hot junction. The magnitude of heat absorption and release is determined by the magnitude of the current and the number of N and P element pairs in the semiconductor materials. The thermoelectric cooler 510 internally consists of a thermopile composed of hundreds of thermocouple pairs to enhance the cooling (heating) effect.

[0034] Reference Figures 1 to 3 As shown, the hot / cold cup includes a cup 100, a base 200, a heating plate 400, and a semiconductor cooling component 500. A temperature-conducting plate 300 is installed in the top opening of the base 200, and the cup 100 is placed on the temperature-conducting plate 300. The heating plate 400 is in contact with the temperature-conducting plate 300, and the heating plate 400 conducts heat to the cup 100 through the temperature-conducting plate 300. A first opening 410 is opened on the heating plate 400. The semiconductor cooling component 500 includes a semiconductor cooling chip 510, which is located in the first opening 410. The semiconductor cooling chip 510 is in contact with the temperature-conducting plate 300, and the semiconductor cooling chip 510 conducts cold to the cup 100 through the temperature-conducting plate 300 to lower its temperature.

[0035] When cooling is required, the semiconductor cooling chip 510 and heating plate 400 conduct heat to the cup 100 through the temperature conducting plate 300 to lower the temperature. When heating is required, the semiconductor cooling chip 510 changes the polarity of the direct current, causing the semiconductor cooling chip 510 to conduct heat to the cup 100 through the temperature conducting plate 300 to heat it. At the same time, the heating plate 400 starts working and also conducts heat to the cup 100 through the temperature conducting plate 300, thereby improving heating efficiency and improving the performance.

[0036] Reference Figure 3 As shown, the semiconductor cooling assembly 500 also includes a heat sink 520 and a cooling fan 530. The heat sink 520 is attached to the bottom of the semiconductor cooling chip 510, and the cooling fan 530 is disposed on one side of the heat sink 520.

[0037] When the thermoelectric cooler 510 is cooling, the cold end of the thermoelectric cooler 510 is in contact with the temperature-conducting plate 300, and the hot end of the thermoelectric cooler 510 is in contact with the heat sink 520. At this time, heat is conducted to the heat sink 520, and the cooling fan 530 blows cold air toward the heat sink 520 to complete the heat dissipation. Usually, the temperature difference between the cold end and the hot end of the thermoelectric cooler 510 can reach 40 to 65 degrees. By actively cooling the hot end through the cooling fan 530, the temperature of the cold end will also decrease accordingly, thereby achieving a lower temperature.

[0038] Reference Figure 3 , 4 As shown, the heat sink 520 includes a base plate 521 and fins 522. The base plate 521 is in close contact with the bottom of the semiconductor cooling chip 510. The fins 522 are multiple and arranged on the base plate 521. The heat dissipation area is increased by the multiple fins 522. At the same time, a heat dissipation air channel 501 is formed between adjacent fins 522. The cooling fan 530 faces the heat dissipation air channel 501, so that the cold air enters the heat sink 520 through the heat dissipation air channel 501 for faster heat dissipation.

[0039] Reference Figure 3 , 7 As shown, in order to accelerate the air circulation inside the base 200, a heat dissipation grille hole 201 is opened in the air base 200.

[0040] In this embodiment, there are two sets of heat dissipation grille holes 201, both of which are located on the side wall of the base 200. This changes the existing arrangement of the heat dissipation grille at the bottom of the base 200, so that the airflow is no longer affected by the size of the gap between the bottom of the base 200 and the table.

[0041] The two sets of heat dissipation grilles 201 on the side wall of the base 200 increase the amount of air entering, and the air that has completed heat exchange can quickly dissipate from the base 200, thereby improving the heat dissipation effect.

[0042] Specifically, one set of heat dissipation grille holes 201 faces the cooling fan 530, and the other set of heat dissipation grille holes 201 faces the heat dissipation duct 501.

[0043] Reference Figure 3 , 4 As shown, a support plate 600 is installed at the bottom of the temperature-conducting plate 300. The support plate 600 is fixedly connected to the base 200. A heating plate 400 is sandwiched between the support plate 600 and the temperature-conducting plate 300. The support plate 600 lifts up and fixes the heating plate 400.

[0044] Reference Figure 5 , 6 As shown, the top opening of the base 200 is bent inward to form an inner ring plate 210. The bottom end of the inner ring plate 210 is pressed against the top surface of the temperature-conducting plate 300. An inner ring space 202 is formed between the inner ring plate 210 and the side wall of the base 200. Multiple fixing posts 220 are arranged in the inner ring space 202. Fixing screws are installed on the support plate 600. After passing through the support plate 600, the fixing screws are screwed into the fixing posts 220 to complete the fixing of the support plate 600.

[0045] Reference Figure 8 As shown, in order to enable the thermoelectric cooler 510 to contact the temperature-conducting plate 300, a second opening 610 is provided on the support plate 600. The second opening 610 is positioned to match the first opening 410, and the second opening 610 and the first opening 410 accommodate the thermoelectric cooler 510.

[0046] Reference Figure 6 As shown, a switch 700 is installed below the tray 600, a pressure rod 800 is installed on the tray 600, and a switch 700 is installed below the pressure rod 800. The switch 700 is installed on the working circuit and controls the opening and closing of the working circuit.

[0047] Reference Figure 9 When the cup 100 is placed on the temperature-conducting plate 300, the pressure rod 800 is pressed and moves downward to the working position one. The bottom end of the pressure rod 800 protrudes from the bottom surface of the support plate 600 and presses the switch 700, thereby connecting the working circuit.

[0048] Reference Figure 10After the cup 100 is removed, the pressure rod 800 is released from pressure and moves upward to the second working position. The top of the pressure rod 800 passes through the heating plate 400 and the temperature guiding plate 300 in sequence and protrudes from the top surface of the temperature guiding plate 300. The switch 700 is then released, disconnecting the working circuit. This ensures that the device cannot work without the cup 100, guaranteeing the safety of consumers during use.

[0049] Meanwhile, a ring plate 810 is provided on the rod part of the pressure rod 800, and a spring 820 is sleeved on the pressure rod 800. The spring 820 is located below the ring plate 810 and between the ring plate 810 and the support plate 600. When the pressure rod 800 is pressed and moves downward, the spring 820 deforms under pressure. When the cup 100 is removed, the pressure rod 800 is released from pressure. At this time, the elastic force of the spring 820 is used to make the pressure rod 800 move upward and return to its original position.

[0050] Reference Figure 8 As shown, the support plate 600 is provided with a raised rib ring 620, which is used to support the heating plate 400 and surrounds the second opening 610.

[0051] The rib ring 620 prevents the heating plate 400 from directly contacting the support plate 600, creating a gap between the heating plate 400 and the support plate 600, thus preventing the heating plate 400 from overheating and being damaged.

[0052] Switch 700 is mounted on the working circuit of the control board. When switch 700 is open, the working circuit of the control board is disconnected; conversely, when switch 700 is closed, the working circuit of the control board is connected, and the control board can control the heating plate 400 and the semiconductor cooling component 500.

[0053] Reference Figure 8 As shown, to facilitate the passage of the pressure rod 800, the heating plate 400 is provided with a first through hole 420 and the temperature guiding plate 300 is provided with a second through hole 310. The positions of the first through hole 420 and the second through hole 310 are matched, and the first through hole 420 and the second through hole 310 pass through the pressure rod 800.

[0054] To facilitate use when out and about, a rechargeable battery 900 is installed in the base 200. The rechargeable battery 900 is used to power the heating plate 400 and the semiconductor cooling component 500, thus expanding the usage scenarios.

[0055] In the description of this specification, references to terms such as "some embodiments" or "as one might imagine" indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one embodiment or example.

[0056] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.

Claims

1. A hot and cold cup, characterized in that, The utility model relates to a cup heating device, including a cup (100); a base (200), a temperature guide plate (300) is arranged in the top opening of the base (200), and the cup (100) is placed on the temperature guide plate (300); a heating plate (400) is in contact with the temperature guide plate (300), the heating plate (400) is heated to the cup (100) through the temperature guide plate (300), and a first through hole (410) is formed in the heating plate (400); a semiconductor refrigeration assembly (500) includes a semiconductor refrigeration sheet (510), the semiconductor refrigeration sheet (510) is located in the first through hole (410), the semiconductor refrigeration sheet (510) is in contact with the temperature guide plate (300), and the semiconductor refrigeration sheet (510) is cooled to the cup (100) through the temperature guide plate (300).

2. The temperature control cup of claim 1, wherein, The semiconductor refrigeration assembly (500) further includes a radiator (520) and a cooling fan (530), the radiator (520) includes a bottom plate (521) and fins (522), the bottom plate (521) is tightly attached to the bottom of the semiconductor refrigeration sheet (510), the fins (522) are arranged on the bottom plate (521), and a cooling air duct (501) is formed between adjacent fins (522); The cooling fan (530) is arranged on one side of the radiator (520) and faces the cooling air duct (501), and the base (200) is provided with a cooling grille hole (201).

3. The temperature control cup of claim 2, wherein, The cooling grille hole (201) is provided with two groups, and the two groups of cooling grille holes (201) are arranged on the side wall of the base (200), one group of the cooling grille holes (201) faces the cooling fan (530), and the other group of the cooling grille holes (201) faces the cooling air duct (501).

4. The temperature control cup of claim 1, wherein, The bottom of the temperature guide plate (300) is provided with a supporting plate (600), the supporting plate (600) is fixedly connected with the base (200), the heating plate (400) is clamped between the supporting plate (600) and the temperature guide plate (300), a second through hole (610) is formed in the supporting plate (600), the second through hole (610) is matched with the first through hole (410), and the second through hole (610) and the first through hole (410) accommodate the semiconductor refrigeration sheet (510).

5. The temperature control cup of claim 4, wherein, The top opening of the base (200) is inwardly bent to form an inner ring plate (210), the bottom end of the inner ring plate (210) is pressed on the top surface of the temperature guide plate (300), an inner ring space (202) is formed between the inner ring plate (210) and the side wall of the base (200), a plurality of fixing columns (220) are arranged in the inner ring space (202), the supporting plate (600) is provided with a fixing screw, and the fixing screw is arranged in the fixing column (220).

6. The temperature control cup of claim 4, wherein, The lower part of the supporting plate (600) is equipped with a switch (700), and the supporting plate (600) is equipped with a pressing rod (800); When the cup (100) is placed on the temperature guide plate (300), the pressing rod (800) is pressed and moves downward to working position I, the bottom end of the pressing rod (800) protrudes from the bottom surface of the supporting plate (600) and presses the switch (700); When the cup (100) is removed, the pressing rod (800) is no longer pressed and moves upward to working position II, the top end of the pressing rod (800) protrudes from the top surface of the temperature guide plate (300) after passing through the heating plate (400) and the temperature guide plate (300) in sequence, and the pressing on the switch (700) is released.

7. The temperature control cup of claim 4, wherein, A rib ring (620) is arranged on the supporting plate (600), the rib ring (620) is used to support the heating plate (400), and the rib ring (620) surrounds the second through hole (610).

8. The temperature control cup of claim 6, wherein, The rod part of the pressing rod (800) is equipped with a ring plate (810), a spring (820) is sleeved on the pressing rod (800), the spring (820) is located below the ring plate (810), and the spring (820) is located between the ring plate (810) and the supporting plate (600).

9. The temperature control cup of claim 6, wherein, The heating plate (400) is equipped with a first through hole (420), the temperature guide plate (300) is equipped with a second through hole (310), the positions of the first through hole (420) and the second through hole (310) are matched, and the first through hole (420) and the second through hole (310) are used to pass through the pressing rod (800).

10. The temperature control cup of claim 6, wherein, The base (200) is equipped with a charging battery (900), and the charging battery (900) is used to supply power to the heating plate (400) and the semiconductor refrigeration assembly (500).

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