Cover for high-temperature test of memory bank

Abstract

The utility model provides a cover for high-temperature test of a memory bank, which relates to the technical field of high-temperature test and comprises a fixing plate, and a mainboard is fixedly mounted at the top end of the fixing plate. According to the utility model, by arranging the fixing plate, the mainboard, the memory bank, the protective cover, the display screen, the control button, the PTC heating block, the fan and the heating switch, when the equipment is used, the protective cover structure is arranged, so that effective sealing can be carried out, and the memory bank is effectively prevented from being easily interfered by external environmental factors such as dust and moisture in the testing process; the accuracy of a test result can be prevented from being influenced, and meanwhile, the memory bank can be prevented from being damaged. And secondly, in the aspect of heating, the PTC heating block is arranged, so that the uniform heating effect can be realized. According to the invention, inconsistency of temperatures borne by different parts of the memory bank is effectively avoided, the high-temperature environment of the memory bank in actual use can be accurately simulated, and the performance and stability of the memory bank can be comprehensively and accurately detected.

Description

Technical Field

[0001] This utility model relates to the field of high temperature testing technology, and in particular to a cover for high temperature testing of memory modules. Background Technology

[0002] Package testing is the process of verifying the structure and electrical function of a semiconductor component after it has been packaged, ensuring that the component meets system requirements. High-temperature aging testing is an essential step in semiconductor packaging testing. It plays a crucial role in preventing the tested chip from failing under high-temperature conditions.

[0003] However, traditional testing equipment often suffers from rudimentary testing environments, typically lacking effective protective enclosures. This makes memory modules susceptible to external environmental factors such as dust and moisture during testing, which can affect the accuracy of test results and potentially damage the memory modules. Secondly, in terms of heating, traditional equipment mostly employs simple methods, such as resistance wire heating, which struggles to achieve uniform heating. This results in inconsistent temperatures across different parts of the memory module, failing to accurately simulate the high-temperature environment of real-world use and thus hindering a comprehensive and accurate assessment of memory module performance and stability. Utility Model Content

[0004] The purpose of this utility model is to solve the technical problems mentioned in the background art.

[0005] The present invention adopts the following technical solution: a cover for high-temperature testing of memory modules, comprising a fixing plate, a motherboard fixedly mounted on the top of the fixing plate, a memory module movably connected to the motherboard, a protective cover covering the outer surface of the memory module, a display screen fixedly mounted on the top of the protective cover, a control button fixedly mounted on the top of the protective cover, a PTC heating block fixedly mounted inside the protective cover, a fan fitted inside the protective cover, and a heating switch fixedly mounted on the side of the protective cover.

[0006] Preferably, the top surface of the fan is in contact with the bottom end of the PTC heating block, and the fan is connected and fixed to the inside of the protective cover by bolts. Here, the top surface of the fan is in contact with the bottom end of the PTC heating block, which allows the air blown by the fan to directly act on the PTC heating block, improving the heat dissipation and heat transfer efficiency of the PTC heating block, and can transfer heat to the area around the memory module more quickly and evenly, ensuring the uniformity of the test environment temperature.

[0007] Preferably, the protective cover and the fixing plate are connected and fixed by multiple sets of bolts. Here, multiple sets of bolts firmly connect the protective cover and the fixing plate, ensuring the stability of the entire testing device structure.

[0008] Preferably, both ends of the PTC heating block are connected and fixed to the protective cover by bolts. Here, connecting and fixing both ends of the PTC heating block to the protective cover by bolts ensures the stability of the PTC heating block during operation.

[0009] Preferably, the protective shields are in two sets, with one set connected and fixed to the top of the other set by bolts, and the fan is fitted inside the bottom protective shield. Here, the two sets of bolted protective shields provide a larger testing space, enabling simultaneous testing of more memory modules and improving testing efficiency.

[0010] Preferably, the PTC heating block is placed inside the top protective cover and at the top of the bottom protective cover. Here, the PTC heating block is placed inside the top protective cover and at the top of the bottom protective cover, respectively, enabling heating of the memory module from both top and bottom directions, further improving heating uniformity and efficiency.

[0011] Preferably, the memory modules are arranged in multiple groups in an array on the surface of the motherboard, and the control buttons include an up button, a down button, a shift button, and a setting button. Here, multiple arrayed memory modules can undergo high-temperature testing simultaneously, greatly improving testing efficiency and making it suitable for quality inspection of memory modules in mass production.

[0012] Preferably, the top of the protective cover has a groove, and the air outlet of the fan is located at the bottom of the PTC heating block. Here, the groove at the top of the protective cover may be used to place some auxiliary equipment or as a ventilation opening, etc., and the specific purpose can be determined according to the actual situation.

[0013] Compared with the prior art, the advantages and positive effects of this utility model are as follows:

[0014] This invention incorporates a structure consisting of a fixing plate, motherboard, memory module, protective cover, display screen, control buttons, PTC heating block, fan, and heating switch. During operation, the protective cover effectively seals the memory module, preventing interference from external environmental factors such as dust and moisture, thus ensuring accurate test results and preventing damage. Furthermore, the PTC heating block provides uniform heating, preventing uneven temperature distribution across different parts of the memory module. This accurately simulates the high-temperature environment of real-world use, enabling comprehensive and accurate testing of the memory module's performance and stability. Attached Figure Description

[0015] Figure 1 A three-dimensional structural diagram of a cover for high-temperature testing of memory modules is provided for this utility model;

[0016] Figure 2 This utility model provides a schematic diagram of the side end structure of a cover for high-temperature testing of memory modules;

[0017] Figure 3 This utility model provides a schematic diagram of the internal structure of a cover for high-temperature testing of memory modules;

[0018] Figure 4 An exploded view of a cover for high-temperature testing of memory modules is provided for this utility model.

[0019] Figure 5 This invention proposes a cover for high-temperature testing of memory modules. Figure 2 Enlarged view of point A in the middle.

[0020] Legend:

[0021] 1. Mounting plate; 2. Motherboard; 3. Memory module; 4. Protective cover; 5. Display screen; 6. Control buttons; 7. PTC heating block; 8. Fan; 9. Heating switch. Detailed Implementation

[0022] To better understand the above-mentioned objectives, features, and advantages of this utility model, the present utility model will be further described below with reference to the accompanying drawings and embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0023] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the present invention is not limited to the specific embodiments disclosed in the following specification.

[0024] Example 1

[0025] Please see Figures 1-5This utility model provides a technical solution: a cover for high-temperature testing of memory modules, including a fixing plate 1, a motherboard 2 fixedly mounted on the top of the fixing plate 1, a memory module 3 movably connected to the motherboard 2, a protective cover 4 covering the outer surface of the memory module 3, a display screen 5 fixedly mounted on the top of the protective cover 4, a control button 6 fixedly mounted on the top of the protective cover 4, a PTC heating block 7 fixedly mounted inside the protective cover 4, a fan 8 fitted inside the protective cover 4, and a heating switch 9 fixedly mounted on the side of the protective cover 4. When using this cover for high-temperature testing of memory modules 3, first place the fixing plate 1, fix the motherboard 2 on the top of the fixing plate 1, and then movably connect the memory module 3 to the motherboard 2. Next, put the protective cover 4 on the outer surface of the memory module 3 and connect and fix the protective cover 4 to the fixing plate 1 with bolts. Then press the heating switch 9 and set the desired temperature through the control button 6. After setting the temperature, the fan 8 starts working, blowing air onto the PTC heating block 7. The heat generated by the PTC heating block 7 is evenly distributed under the action of the fan 8, and the high-temperature cover fan 8 heats the memory module 3. During the heating process, display screen 5 shows the temperature and other relevant data in real time. When the temperature reaches the set temperature, the PTC heating block 7 will automatically turn off; when the temperature falls below the set temperature, the PTC heating block 7 will restart to heat up. By repeatedly executing this procedure, a high-temperature aging test is achieved on the memory module 3. If it is necessary to fix the memory module 3 during the test, the lowering button can be pressed manually to achieve automatic pressing and tightening.

[0026] Please see Figures 1-5 The top surface of fan 8 is attached to the bottom of PTC heating block 7. Fan 8 is connected and fixed to the inside of protective cover 4 by bolts. Protective cover 4 is connected and fixed to fixing plate 1 by multiple sets of bolts. Both ends of PTC heating block 7 are connected and fixed to protective cover 4 by bolts. There are two sets of protective covers 4, and one set is connected and fixed to the top of the other set by bolts. Fan 8 is fitted inside the bottom protective cover 4. PTC heating block 7 is placed inside the top protective cover 4 and on the top of the bottom protective cover 4. There are multiple sets of memory modules 3, which are arranged in an array on the surface of motherboard 2. Control buttons 6 include up button, down button, displacement button, and setting button. The top of protective cover 4 has a groove. The air outlet of fan 8 is at the bottom of PTC heating block 7. The air outlet of fan 8 is at the bottom of PTC heating block, which allows the air blown by fan 8 to directly act on PTC heating block, quickly and effectively transferring the heat generated by PTC heating block to the area around memory module 3, improving heating efficiency and heat transfer uniformity, and ensuring the stability of memory module 3 in high-temperature testing environment.

[0027] Working Principle: When using this cover for high-temperature testing of memory module 3, first place the mounting plate 1, fix the motherboard 2 on top of the mounting plate 1, and then movably connect the memory module 3 to the motherboard 2. Next, put the protective cover 4 on the outer surface of the memory module 3 and connect and fix the protective cover 4 to the mounting plate 1 with bolts. Then press the heating switch 9 and set the desired temperature through the control button 6. After setting the temperature, the fan 8 starts working, blowing air onto the PTC heating block 7. The heat generated by the PTC heating block 7 is evenly distributed under the action of the fan 8, and the high-temperature cover fan 8 is activated to heat the memory module 3. During the heating process, the display screen 5 displays the temperature and other relevant data in real time. When the temperature reaches the set temperature, the PTC heating block 7 will automatically turn off; when the temperature is lower than the set temperature, the PTC heating block 7 will restart to heat up. By repeatedly executing this procedure, the high-temperature aging test of the memory module 3 is achieved. If it is necessary to fix the memory module 3 during the test, the lowering button can be pressed manually to achieve automatic pressing and tightening.

[0028] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments for application in other fields. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present utility model without departing from the technical solution of the present utility model shall still fall within the protection scope of the technical solution of the present utility model.

Claims

1. A cover for high temperature test of memory bank, comprising a fixing plate (1), characterized in that: The top of the fixed plate (1) is fixedly mounted with a motherboard (2), the motherboard (2) is movably connected with a memory module (3), the outer surface of the memory module (3) is covered with a protective cover (4), the top of the protective cover (4) is fixedly mounted with a display screen (5), the top of the protective cover (4) is fixedly mounted with a control button (6), the inside of the protective cover (4) is fixedly mounted with a PTC heating block (7), the inside of the protective cover (4) is covered with a fan (8), and the side of the protective cover (4) is fixedly mounted with a heating switch (9).

2. The cover for high temperature testing of memory modules according to claim 1, wherein: The top surface of the fan (8) is attached to the bottom end of the PTC heating block (7), and the fan (8) is connected and fixed to the inside of the protective cover (4) by bolts.

3. The cover for high temperature testing of memory modules as recited in claim 1, wherein: The protective cover (4) and the fixing plate (1) are connected and fixed by multiple sets of bolts.

4. The cover for high temperature testing of memory modules as recited in claim 1, wherein: The two ends of the PTC heating block (7) are connected and fixed to the protective cover (4) by bolts.

5. The cover for high temperature testing of memory modules as recited in claim 1, wherein: The number of the protective covers (4) is two sets, and one set is connected and fixed at the top of the other set by bolts. The fan (8) is fitted inside the bottom protective cover (4).

6. A cover for high-temperature testing of memory modules according to claim 1, characterized in that: The PTC heating block (7) is placed inside the top protective cover (4) and at the top of the bottom protective cover (4).

7. A cover for high-temperature testing of memory modules according to claim 1, characterized in that: The number of memory modules (3) is multiple and they are arranged in an array on the surface of the motherboard (2). The control buttons (6) include an up button, a down button, a displacement button, and a setting button.

8. A cover for high-temperature testing of memory modules according to claim 1, characterized in that: The top of the protective cover (4) is provided with a groove, and the air outlet of the fan (8) is at the bottom of the PTC heating block (7).

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