Power module

Abstract

A power module comprises a box body, the box body comprises a front plate, a rear plate and two side plates, a plate type radiator parallel to the side plates is arranged in the box body, a radiating pipe is laid in the radiator, the power module is further provided with a water inlet pipe and a water outlet pipe which penetrate through the box body, and the water inlet pipe and the water outlet pipe are connected with the two ends of the radiating pipe respectively. Three first IGBT modules are attached to one side of the radiator, three direct-current confluence busbars are arranged at the upper end of the box body, a first alternating-current single-phase copper bar is arranged at the lower end of the box body, and the power module is further provided with a first connecting line which is sequentially connected with the direct-current confluence busbars, the first IGBT modules and the first alternating-current single-phase copper bar. The power module is reasonable in internal structure planning, good in heat dissipation effect, compact in structure, high in space utilization rate, clear in system level, high in power density, light in weight, light in structure, convenient to independently install, transfer and maintain, and low in transfer and installation cost.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of power electronics, in particular to a power module. BACKGROUND

[0002] The power module is an advanced hybrid integrated power component with IGBT as the core, which is used for realizing the functions of electric energy conversion, power amplification, power supply control and protection. With the rapid development of industrial technology, the power level and power density requirements of the power module used by large power electronic equipment are higher and higher, and the power module of the prior art is usually integrated with bus capacitors. Because the volume of the bus capacitor is very large, integrating the bus capacitor into the power module makes the layout in the power module very loose, the space utilization rate is not high, and the structure is not compact. Moreover, because the weight of the bus capacitor is heavy, integrating the bus capacitor into the power module is not conducive to the installation, transportation and maintenance of the power module.

[0003] Therefore, there is an urgent need to develop a compact power module. UTILITY MODEL CONTENT

[0004] The utility model discloses a kind of power modules to avoid the deficiencies in the prior art, and a compact structure is provided, to solve the above technical problems.

[0005] A kind of power module, comprising: box, the box includes front plate, back plate and two side plates, the box is provided with the plate radiator parallel with the side plate, the radiator is laid with heat dissipation pipe, the power module is also provided with water inlet pipe and water outlet pipe that pass through the box, the water inlet pipe and the water outlet pipe are connected with the both ends of the heat dissipation pipe respectively, one side of the radiator is attached with three first IGBT modules, the upper end of the box is provided with three direct current busbars, the lower end of the box is provided with first alternating current single-phase copper bar, the power module is also provided with first connecting line sequentially connecting the direct current busbar, the first IGBT module and the first alternating current single-phase copper bar.

[0006] Preferably, the other side of the above-mentioned radiator is attached with three second IGBT modules, the lower end of the box is provided with second alternating current single-phase copper bar, and the power module is also provided with second connecting line sequentially connecting the direct current busbar, the second IGBT module and the second alternating current single-phase copper bar.

[0007] Preferably, the power module is further provided with a connecting plate connecting the first AC single-phase copper bar and the second AC single-phase copper bar; the three DC bus bars are respectively a first DC bus bar, a second DC bus bar and a third DC bus bar, the first DC bus bar comprises a first bus bar transverse plate, a first terminal block vertically arranged on an upper end surface of the first bus bar transverse plate, and two first terminal pins vertically arranged on a lower end surface of the first bus bar transverse plate; the second DC bus bar comprises a second bus bar transverse plate, a second terminal block vertically arranged on an upper end surface of the second bus bar transverse plate, and two second terminal pins vertically arranged on a lower end surface of the second bus bar transverse plate; and the third DC bus bar comprises a third bus bar transverse plate, a third terminal block vertically arranged on an upper end surface of the third bus bar transverse plate, and two third terminal pins vertically arranged on a lower end surface of the third bus bar transverse plate.

[0008] Preferably, the first terminal block is arranged at the middle of the front end of the first bus bar transverse plate, the second terminal block is arranged at the left of the front end of the second bus bar transverse plate, the third terminal block is arranged at the right of the front end of the third bus bar transverse plate, the third bus bar transverse plate, the first bus bar transverse plate and the second bus bar transverse plate are sequentially stacked from top to bottom, an insulating film is arranged between the third bus bar transverse plate and the first bus bar transverse plate, an insulating film is arranged between the first bus bar transverse plate and the second bus bar transverse plate, the first terminal block is located between the second terminal block and the third terminal block, the first bus bar transverse plate is provided with a first through hole for inserting the two third terminal pins, the second bus bar transverse plate is provided with a second through hole for inserting the two third terminal pins and the two first terminal pins respectively, and the two third terminal pins are sequentially inserted into the first through hole and the second through hole respectively, and the two first terminal pins are inserted into the second through hole respectively.

[0009] Preferably, one of the first terminal pins is arranged at the left of the lower end surface of the first bus bar transverse plate, and the other first terminal pin is arranged at the middle of the lower end surface of the first bus bar transverse plate; the two second terminal pins are respectively arranged at two diagonal positions adjacent to the second terminal block on the lower end surface of the second bus bar transverse plate; and the two third terminal pins are respectively arranged at two diagonal positions adjacent to the third terminal block on the lower end surface of the third bus bar transverse plate.

[0010] Preferably, the first busbar transverse plate is provided with a first busbar side plate perpendicular to the first busbar transverse plate on both sides; the second busbar transverse plate is provided with a second busbar side plate perpendicular to the second busbar transverse plate on the left side; the third busbar transverse plate is provided with a third busbar side plate perpendicular to the third busbar transverse plate on the right side; the third busbar side plate is located on the inner side of the first busbar side plate on the right side, and the first busbar side plate on the left side is located on the inner side of the second busbar side plate; the third busbar side plate and the first busbar side plate are isolated by an insulating film, and the second busbar side plate and the first busbar side plate are isolated by an insulating film; the first busbar transverse plate and the two first busbar side plates are integrally formed, the second busbar transverse plate and the second busbar side plate are integrally formed, and the third busbar transverse plate and the third busbar side plate are integrally formed.

[0011] Preferably, the positions of the three first IGBT modules and the three second IGBT modules attached to both sides of the heat sink correspond one by one, and the heat dissipation pipes are densely arranged at the corresponding positions of the heat sink where the first IGBT modules and the second IGBT modules are attached.

[0012] Preferably, the heat dissipation pipes are arranged in S-shaped shape at the corresponding positions of the heat sink where the first IGBT modules and the second IGBT modules are attached.

[0013] Preferably, the heat dissipation pipes include a main pipe connected to the water inlet pipe and the water outlet pipe, and S-shaped heat dissipation branch pipes, two of which are arranged side by side at the corresponding positions of the heat sink where the first IGBT modules and the second IGBT modules are attached, one end of the two heat dissipation branch pipes is connected to the main pipe on the water inlet pipe side, and the other end of the two heat dissipation branch pipes is connected to the main pipe on the water outlet pipe side.

[0014] Preferably, the front plate inside the cabinet is provided with a driving plate, at least one of the front plate, the rear plate and the two side plates is provided with a heat dissipation hole, the first connecting line is an aluminum bar or a wire or a braided cable, and the second connecting line is an aluminum bar or a wire or a braided cable.

[0015] Preferably, the cabinet further includes a bottom plate, the water inlet pipe and the water outlet pipe are arranged in the front plate or the rear plate or the bottom plate; the connecting plate, the first single-phase AC copper bar and the second single-phase AC copper bar are integrally formed.

[0016] Preferably, the three first IGBT modules attached to one side of the heat sink form a first module group, and more than one first module group is attached to the heat sink laterally on one side; and the three second IGBT modules attached to the other side of the heat sink form a second module group, and more than one second module group is attached to the heat sink laterally on the other side.

[0017] Compared with the prior art, the power module has the following advantages: only power devices are arranged in the power module, and bus capacitors are not integrated as in the prior art, which is conducive to the rational planning of the internal structure, compact structure, high space utilization, clear system hierarchy, high power density, light weight, and convenient independent installation, transportation and maintenance, and low transportation and installation cost. The three first IGBT modules with large heat generation are directly attached to one side of the plate-type heat sink, and the structure is simple and compact, the heat is directly conducted by contact, the heat conduction efficiency is very high, the heat dissipation efficiency is high, and the heat dissipation effect is good.

[0018] The three DC bus bars are arranged at the upper end of the box body, and the first AC single-phase copper bar is arranged at the lower end of the box body, so that the structure is compact and reasonable, and external wiring of the power module is facilitated. BRIEF DESCRIPTION OF DRAWINGS

[0019] The utility model is further described with reference to the drawings, but the embodiment in the drawings does not constitute any limitation to the utility model.

[0020] Figure 1 It is a structure schematic view of a power unit of the utility model;

[0021] Figure 2 It is an internal structure schematic view of a power unit of the utility model;

[0022] Figure 3 It is a structure schematic view of three DC bus bars of a power unit of the utility model and is arranged in layers;

[0023] Figure 4This is a schematic diagram of the structure of three DC busbars of a power unit according to this utility model;

[0024] Figure 5 This is a schematic diagram of the main structure of a heat sink for a power unit according to this utility model;

[0025] Figure 6 This is a side view of the heat sink structure of a power unit according to the present invention;

[0026] Figure 7 This is a schematic diagram of the structure of a power unit of the present invention, in which two sets of first module groups are attached;

[0027] Figure 8 This is a schematic diagram of the main structure of the heat sink when two sets of first module groups are attached to a power unit according to this utility model. Detailed Implementation

[0028] The present invention will be further described in conjunction with the following embodiments and accompanying drawings:

[0029] A power module, such as Figures 1 to 6 As shown, the power module includes: a housing 10, which includes a front panel 11, a rear panel (not shown in the figure), and two side panels 12. A plate-type heat sink 13 parallel to the side panels 12 is installed inside the housing 10. Heat sink pipes 14 are laid inside the heat sink 13. The power module is also provided with an inlet pipe 15 and an outlet pipe 16 that pass through the housing 10. The inlet pipe 15 and the outlet pipe 16 are respectively connected to the two ends of the heat sink pipes 14. Three first IGBT modules 17 are attached to one side of the heat sink 13. Three DC busbars 18 are provided at the upper end of the housing 10. A first AC single-phase copper busbar 19 is provided at the lower end of the housing 10. The power module is also provided with a first connecting line 20 that sequentially connects the DC busbars 18, the first IGBT modules 17, and the first AC single-phase copper busbar 19.

[0030] IGBT (Insulated Gate Bipolar Transistor) modules typically generate a lot of heat and require effective heat dissipation to operate normally. The power module of this invention can use the DC busbar 18 as the input and the first AC single-phase copper busbar 19 as the output to achieve DC-to-AC conversion; alternatively, it can use the first AC single-phase copper busbar 19 as the input and the DC busbar 18 as the output to achieve AC-to-DC conversion. In other words, the power module of this invention can achieve both DC-to-AC and AC-to-DC conversion according to the functional requirements of the application scenario, offering great flexibility. The number of the first IGBT modules 17 can be set to other quantities depending on the circuit design.

[0031] The power module is only provided with power devices, and bus capacitors are not integrally arranged as in the prior art, so that the internal structure is rationally planned, the structure is compact, the space utilization is high, the system level is clear, the power density is high, the weight is light, the structure is light and convenient for independent installation, transfer and maintenance, and the transfer and installation cost is low.

[0032] The three DC bus bars 18 are arranged at the upper end of the box body 10, and the first AC single-phase copper bar 19 is arranged at the lower end of the box body 10, so that the distribution is compact and reasonable, and external wiring of the power module is facilitated.

[0033] Preferably, as shown in Figure 2 The other side of the radiator 13 is attached with three second IGBT modules (not shown in the figure), the lower end of the box body 10 is provided with a second AC single-phase copper bar 21, and the power module is further provided with a second connecting line (not shown in the figure) connected with the DC bus bar 18, the second IGBT module (not shown in the figure) and the second AC single-phase copper bar 21 in sequence.

[0034] The number of the second IGBT module (not shown in the figure) can be set to other numbers according to the circuit design condition.

[0035] The three second IGBT modules (not shown in the figure) are connected in parallel with the three first IGBT modules 17, three second IGBT modules (not shown in the figure) are attached to the other side of the radiator 13, the space of the other side of the plate radiator 13 is effectively utilized, the structure is more compact, and the power density of the power module of the utility model is increased; similarly, the radiator 13 can quickly dissipate heat for the three second IGBT modules (not shown in the figure) attached to the other side, the heat conduction efficiency is very high, the heat dissipation efficiency of the radiator 13 is further improved, and the heat dissipation effect is good.

[0036] In addition, the three second IGBT modules (not shown in the figure) that generate a lot of heat are directly attached to the other side of the plate heat sink 13. This not only provides good heat dissipation, but also makes it easy to open the side panel 12 of the enclosure 10 to maintain the three second IGBT modules (not shown in the figure). Maintenance is very convenient and cost-effective.

[0037] Better, such as Figures 1 to 4 As shown, the power module is also equipped with a connection plate (not shown in the figure) to connect the first AC single-phase copper busbar 19 and the second AC single-phase copper busbar 21; the three DC busbars 18 are the first DC busbar 40, the second DC busbar 41 and the third DC busbar 18, respectively. The first DC busbar 40 includes a first busbar horizontal plate 22, a first terminal block 23 vertically disposed on the upper end face of the first busbar horizontal plate 22 and two first terminals 24 vertically disposed on the lower end face of the first busbar horizontal plate 22; the second DC busbar 41 includes a second busbar horizontal plate 25, a second terminal block 27 vertically disposed on the upper end face of the second busbar horizontal plate 25 and two second terminals 26 vertically disposed on the lower end face of the second busbar horizontal plate 25; the third DC busbar 18 includes a third busbar horizontal plate 28, a third terminal block 29 vertically disposed on the upper end face of the third busbar horizontal plate 28 and two third terminals 30 vertically disposed on the lower end face of the third busbar horizontal plate 28.

[0038] The power module is also provided with a connection plate (not shown in the figure) to connect the first AC single-phase copper busbar 19 and the second AC single-phase copper busbar 21. That is, the first AC single-phase copper busbar 19 and the second AC single-phase copper busbar 21 of the power module of this utility model can output separately, or they can be connected into equipotential output through the connection plate (not shown in the figure).

[0039] The first DC busbar 40 includes a first busbar horizontal plate 22, which has a plate design to ensure that the first DC busbar 40 has a large heat dissipation area, which is beneficial to the heat dissipation of the first DC busbar 40. A first terminal block 23 is vertically arranged on the upper end face of the first busbar horizontal plate 22, and two first terminals 24 are vertically arranged on the lower end face of the first busbar horizontal plate 22. The structure is simple and reliable. The first terminal block 23 is vertically arranged on the upper end face of the first busbar horizontal plate 22 to facilitate the wiring operation of the first terminal block 23 with external cables. The two first terminals 24 are vertically arranged on the lower end face of the first busbar horizontal plate 22 to facilitate the electrical connection of the two first terminals 24 with the three first IGBT modules 17 and the three second IGBT modules (not shown in the figure) arranged in the box.

[0040] The second DC bus bar 41 comprises a second bus bar transverse plate 25, i.e. a plate design, which can ensure that the second DC bus bar 41 has a large heat dissipation area, and is beneficial to heat dissipation of the second DC bus bar 41; the second wiring board 27 is vertically arranged on the upper end surface of the second bus bar transverse plate 25, and two second wiring terminals 26 are vertically arranged on the lower end surface of the second bus bar transverse plate 25, which has a simple and reliable structure; the second wiring board 27 is vertically arranged on the upper end surface of the second bus bar transverse plate 25, which is convenient for the second wiring board 27 to perform wiring operation with external cables; and the two second wiring terminals 26 are vertically arranged on the lower end surface of the second bus bar transverse plate 25, which is convenient for the two second wiring terminals 26 to be electrically connected with the three first IGBT modules 17 and the three second IGBT modules (not marked in the figure) arranged in the box.

[0041] The third DC bus bar 18 comprises a third bus bar transverse plate 28, i.e. a plate design, which can ensure that the third DC bus bar 18 has a large heat dissipation area, and is beneficial to heat dissipation of the third DC bus bar 18; the third wiring board 29 is vertically arranged on the upper end surface of the third bus bar transverse plate 28, and two third wiring terminals 30 are vertically arranged on the lower end surface of the third bus bar transverse plate 28, which has a simple and reliable structure; the third wiring board 29 is vertically arranged on the upper end surface of the third bus bar transverse plate 28, which is convenient for the third wiring board 29 to perform wiring operation with external cables; and the two third wiring terminals 30 are vertically arranged on the lower end surface of the third bus bar transverse plate 28, which is convenient for the two third wiring terminals 30 to be electrically connected with the three first IGBT modules 17 and the three second IGBT modules (not marked in the figure) arranged in the box.

[0042] Preferably, as shown in Figure 3 and Figure 4 , the first wiring board 23 is arranged at the middle of the front end of the first bus bar transverse plate 22, the second wiring board 27 is arranged at the left of the front end of the second bus bar transverse plate 25, the third wiring board 29 is arranged at the right of the front end of the third bus bar transverse plate 28, the third bus bar transverse plate 28, the first bus bar transverse plate 22 and the second bus bar transverse plate 25 are sequentially stacked from top to bottom, the third bus bar transverse plate 28 and the first bus bar transverse plate 22 are isolated by the insulating film 32, the first bus bar transverse plate 22 and the second bus bar transverse plate 25 are isolated by the insulating film 32, the first wiring board 23 is located between the second wiring board 27 and the third wiring board 29, the first bus bar transverse plate 22 is provided with the first through hole (not marked in the figure) for inserting the two third wiring terminals 30, the second bus bar transverse plate 25 is provided with the second through hole 31 for respectively inserting the two third wiring terminals 30 and the two first wiring terminals 24, the two third wiring terminals 30 are sequentially inserted into the first through hole (not marked in the figure) and the second through hole 31 respectively, and the two first wiring terminals 24 are inserted into the second through hole 31 respectively.

[0043] The first terminal block 23 is arranged at the middle of the front end of the first busbar transverse plate 22, the second terminal block 27 is arranged at the left side of the front end of the second busbar transverse plate 25, and the third terminal block 29 is arranged at the right side of the front end of the third busbar transverse plate 28, so that when the third busbar transverse plate 28, the first busbar transverse plate 22 and the second busbar transverse plate 25 are arranged in sequence from top to bottom, the second terminal block 27, the first terminal block 23 and the third terminal block 29 are arranged in sequence from left to right, the structure is compact and beautiful; and the parallel and concentrated arrangement of the second terminal block 27, the first terminal block 23 and the third terminal block 29 facilitates the external cable wiring.

[0044] The two third terminal blocks 30 are arranged in sequence through the first through hole (not shown in the figure) and the second through hole 31 respectively, and the two first terminal blocks 24 are arranged through the second through hole 31 respectively, so that when the third busbar transverse plate 28, the first busbar transverse plate 22 and the second busbar transverse plate 25 are arranged in sequence from top to bottom, the first terminal block 24 and the third terminal block 30 are arranged below the second busbar transverse plate 25, facilitating the wiring of the first terminal block 24 and the third terminal block 30.

[0045] The third busbar transverse plate 28, the first busbar transverse plate 22 and the second busbar transverse plate 25 are arranged in sequence from top to bottom, the third busbar transverse plate 28 and the first busbar transverse plate 22 are isolated by the insulating film 32, and the first busbar transverse plate 22 and the second busbar transverse plate 25 are isolated by the insulating film 32, the arrangement of the insulating film 32 is convenient and simple, the insulation effect is good, and the cost is low. Under the condition of ensuring that the third busbar transverse plate 28, the first busbar transverse plate 22 and the second busbar transverse plate 25 satisfy mutual insulation and safety regulation isolation, the space of the first direct current busbar 40, the second direct current busbar 41 and the third direct current busbar 18 is greatly saved, and the structure is simple, beautiful and compact.

[0046] Preferably, as shown in Figure 3 and Figure 4 , one of the first terminal blocks 24 is arranged at the left side of the lower end surface of the first busbar transverse plate 22, and the other first terminal block 24 is arranged at the middle of the lower end surface of the first busbar transverse plate 22; the two second terminal blocks 26 are arranged at two diagonal positions adjacent to the second terminal block 27 of the lower end surface of the second busbar transverse plate 25; and the two third terminal blocks 30 are arranged at two diagonal positions adjacent to the third terminal block 29 of the lower end surface of the third busbar transverse plate 28.

[0047] One of the first terminals 24 of the first DC busbar 40 is located on the left side of the lower end face of the first busbar horizontal plate 22, and the other first terminal 24 is located in the middle of the lower end face of the first busbar horizontal plate 22. The two first terminals 24 are arranged separately, which is beneficial for current sharing in the line. The two second terminals 26 of the second DC busbar 41 are respectively located at two adjacent diagonal positions of the second terminal block 27 on the lower end face of the second busbar horizontal plate 25. The two second terminals 26 are symmetrically arranged with respect to the second terminal block 27. The current path length between the two second terminals 26 and the second terminal block 27 is basically the same, which is beneficial for current sharing in the power module of this invention. Similarly, the two third terminals 30 of the third DC busbar 18 are respectively located at two adjacent diagonal positions of the third terminal block 29 on the lower end face of the third busbar horizontal plate 28. The two third terminals 30 are symmetrically arranged with respect to the third terminal block 29. The current path length between the two third terminals 30 and the third terminal block 29 is basically the same, which is beneficial for current sharing in the power module of this invention.

[0048] Better, such as Figures 1 to 4 As shown, the first busbar horizontal plate 22 has a first busbar side plate 33 perpendicular to the first busbar horizontal plate 22 on both sides; the second busbar horizontal plate 25 has a second busbar side plate 34 perpendicular to the second busbar horizontal plate 25 on the left side; the third busbar horizontal plate 28 has a third busbar side plate 35 perpendicular to the third busbar horizontal plate 28 on the right side; the third busbar side plate 35 is located inside the first busbar side plate 33 on the right, and the first busbar side plate 33 on the left is located inside the second busbar side plate 34; an insulating film 32 is provided between the third busbar side plate 35 and the first busbar side plate 33, and an insulating film 32 is provided between the second busbar side plate 34 and the first busbar side plate 33; the first busbar horizontal plate 22 and the two first busbar side plates 33 are integrally formed, the second busbar horizontal plate 25 and the second busbar side plate 34 are integrally formed, and the third busbar horizontal plate 28 and the third busbar side plate 35 are integrally formed.

[0049] The first busbar horizontal plate 22 has two sides with first busbar side plates 33 that are perpendicular to the first busbar horizontal plate 22. The upward placement of the first busbar side plates 33 greatly increases the heat dissipation area of ​​the first DC busbar 40, which is beneficial to the external heat dissipation of the first DC busbar 40 and further improves the heat dissipation efficiency of the power module of this utility model.

[0050] A second busbar side plate 34, perpendicular to the second busbar horizontal plate 25, is provided on the left side of the second busbar horizontal plate 25. The upward placement of the second busbar side plate 34 greatly increases the heat dissipation area of ​​the second DC busbar 41, which is beneficial to the external heat dissipation of the second DC busbar 41 and further improves the heat dissipation efficiency of the power module of this utility model.

[0051] The third busbar transverse plate 28 is provided with a third busbar side plate 35 which is perpendicular to the third busbar transverse plate 28 and is arranged upwards on the right side of the third busbar transverse plate 28, the third busbar side plate 35 is arranged upwards, which greatly increases the heat dissipation area of the third DC busbar 18, is beneficial to the heat dissipation of the third DC busbar 18, and further improves the heat dissipation efficiency of the power module.

[0052] When the third busbar transverse plate 28, the first busbar transverse plate 22 and the second busbar transverse plate 25 are sequentially stacked from top to bottom, the third busbar side plate 35 is located inside the first busbar side plate 33 on the right side, and the first busbar side plate 33 on the left side is located inside the second busbar side plate 34, so that the space occupied by the first busbar side plate 33, the second busbar side plate 34 and the third busbar side plate 35 can be saved, and the structure is compact and beautiful.

[0053] The third busbar side plate 35 and the first busbar side plate 33 are isolated by the insulating film 32, and the second busbar side plate 34 and the first busbar side plate 33 are isolated by the insulating film 32, the insulating film 32 is convenient and simple to arrange, has good insulation effect, and has low cost, so that the safe isolation between the third busbar side plate 35 and the first busbar side plate 33 and between the second busbar side plate 34 and the first busbar side plate 33 can be ensured.

[0054] The first busbar transverse plate 22 and the two first busbar side plates 33 can be integrally formed, that is, the two first busbar side plates 33 can be formed by bending the first busbar transverse plate 22 on both sides upwards, the integral forming can save the fixed connection between the first busbar transverse plate 22 and the two first busbar side plates 33, the installation is simpler, and the structure is more reliable.

[0055] Similarly, the second busbar transverse plate 25 and the second busbar side plate 34 can be integrally formed, that is, the second busbar side plate 34 is formed by bending the left side of the second busbar transverse plate 25 upwards, the integral forming can save the fixed connection between the second busbar transverse plate 25 and the second busbar side plate 34, the installation is simpler, and the structure is more reliable.

[0056] Similarly, the third busbar transverse plate 28 and the third busbar side plate 35 can be integrally formed, that is, the third busbar side plate 35 is formed by bending the right side of the third busbar transverse plate 28 upwards, the integral forming can save the fixed connection between the third busbar transverse plate 28 and the third busbar side plate 35, the installation is simpler, and the structure is more reliable.

[0057] Preferably, as shown in Figure 2 and Figure 5 three first IGBT modules 17 and three second IGBT modules (not marked in the figure) are correspondingly arranged on both sides of the heat sink 13, and the heat dissipation pipes 14 are densely arranged at the corresponding positions of the heat sink 13 where the first IGBT modules 17 and the second IGBT modules (not marked in the figure) are arranged.

[0058] The three first IGBT modules 17 and the three second IGBT modules (not shown in the figure) are correspondingly arranged on both sides of the heat sink 13, and the heat pipes 14 are arranged at the corresponding positions of the heat sink 13 where the first IGBT modules 17 and the second IGBT modules (not shown in the figure) are arranged. The heat pipes 14 arranged at the corresponding positions of the heat sink 13 where the first IGBT modules 17 and the second IGBT modules (not shown in the figure) are arranged can increase the flow path of the cooling water or other cooling liquid at the corresponding positions of the first IGBT modules 17 and the second IGBT modules (not shown in the figure), thereby increasing the heat exchange time, better absorbing the heat generated by the first IGBT modules 17 and the second IGBT modules (not shown in the figure), greatly improving the heat dissipation efficiency, and achieving good heat dissipation effect.

[0059] Preferably, as shown in Figure 5 The heat pipes 14 arranged at the corresponding positions of the heat sink 13 where the first IGBT modules 17 and the second IGBT modules (not shown in the figure) are arranged are arranged in S-shaped shape.

[0060] The heat pipes 14 arranged at the corresponding positions of the heat sink 13 where the first IGBT modules 17 and the second IGBT modules (not shown in the figure) are arranged are arranged in S-shaped shape to achieve the arrangement of the heat pipes 14, and the arrangement in S-shaped shape is simple in structure and easy to implement, and has good heat dissipation effect and high heat dissipation efficiency.

[0061] Preferably, as shown in Figure 5 The heat pipes 14 include a main pipe 36 connected with the water inlet pipe 15 and the water outlet pipe 16, and S-shaped heat dissipation branch pipes 37. Two S-shaped heat dissipation branch pipes 37 are arranged side by side at the corresponding positions of the heat sink 13 where the first IGBT modules 17 and the second IGBT modules (not shown in the figure) are arranged. One end of the two S-shaped heat dissipation branch pipes 37 is connected to the main pipe 36 on the side of the water inlet pipe 15, and the other end of the two S-shaped heat dissipation branch pipes 37 is connected to the main pipe 36 on the side of the water outlet pipe 16.

[0062] That is, the two S-shaped return arranged heat dissipation branch pipes 37 can be communicated simultaneously at the corresponding position of the first IGBT module 17 and the second IGBT module (not marked in the figure) attached main pipe 36, that is, the cooling water or other cooling liquid flows through the main pipe 36 on the side of the inlet pipe 15, and then enters the two heat dissipation branch pipes 37 respectively, and then flows through the two heat dissipation branch pipes 37 and converges back to the main pipe 36 on the side of the outlet pipe 16, that is, each heat dissipation branch pipe 37 is communicated by the main pipe 36. Two heat dissipation branch pipes 37 are arranged side by side at the corresponding position of the first IGBT module 17 and the second IGBT module (not marked in the figure) attached, further increasing the flow path of the cooling water or other cooling liquid at the corresponding position of the first IGBT module 17 and the second IGBT module (not marked in the figure), further increasing the heat exchange time, better absorbing the heat generated by the first IGBT module 17 and the second IGBT module (not marked in the figure), greatly improving the heat dissipation efficiency, simple and effective, good heat dissipation effect.

[0063] Preferably, as shown in Figure 1 , Figure 2 , Figure 6 The inside of the front plate 11 in the box body 10 is provided with a driving plate 38, at least one of the front plate 11, the rear plate (not marked in the figure) and the two side plates 12 is provided with a heat dissipation hole 39, the first connecting wire 20 is an aluminum bar or a wire or a braided cable, and the second connecting wire (not marked in the figure) is an aluminum bar or a wire or a braided cable; the box body 10 further comprises a bottom plate (not marked in the figure), the inlet pipe 15 and the outlet pipe 16 are arranged in the front plate 11 or the rear plate (not marked in the figure) or the bottom plate (not marked in the figure); the connecting plate (not marked in the figure), the first alternating single-phase copper bar 19 and the second alternating single-phase copper bar 21 are integrally formed; the three first IGBT modules 17 attached to one side of the heat sink 13 form a first module group 45, and more than one first module group 45 is transversely attached to one side of the heat sink 13; the three second IGBT modules (not marked in the figure) attached to the other side of the heat sink 13 form a second module group (not marked in the figure), and more than one second module group (not marked in the figure) is transversely attached to the other side of the heat sink 13.

[0064] The inside of the front plate 11 in the box body 10 is provided with a driving plate 38, the driving plate 38 is arranged inside the front plate 11 in the box body 10, further improving the space utilization of the box body 10, reasonable layout, compact structure.

[0065] At least one of the front plate 11, the rear plate (not marked in the figure) and the two side plates 12 is provided with a heat dissipation hole 39, that is, the heat dissipation hole 39 can be arranged on the front plate 11 or the rear plate (not marked in the figure) or the two side plates 12 according to individual needs, the heat dissipation hole 39 can increase the external circulation of air in the box body 10, which is beneficial to the heat dissipation of the components in the box 1.

[0066] The first connecting line 20 can be an aluminum bar or a wire or a braided cable of the prior art, and the second connecting line (not shown in the figure) can also be an aluminum bar or a wire or a braided cable of the prior art.

[0067] The water inlet pipe 15 and the water outlet pipe 16 are arranged in the front plate 11 or the rear plate (not shown in the figure) or the bottom plate (not shown in the figure) as needed, so as to facilitate the connection of the water inlet pipe 15 and the water outlet pipe 16.

[0068] The connecting plate (not shown in the figure), the first single-phase AC copper bar 19 and the second single-phase AC copper bar 21 are integrally formed, and the shape of the integrally formed connecting plate (not shown in the figure), the first single-phase AC copper bar 19 and the second single-phase AC copper bar 21 can be set as needed, that is, the first IGBT module 17 and the second module group (not shown in the figure) can be directly connected to the integrally formed first single-phase AC copper bar 19 and the second single-phase AC copper bar 21.

[0069] As shown in Figure 7 and Figure 8 , the three first IGBT modules 17 attached to one side of the heat sink 13 form a first module group 45, and more than one first module group 45 is attached to the heat sink 13 transversely on one side; the three second IGBT modules (not shown in the figure) attached to the other side of the heat sink 13 form a second module group (not shown in the figure), and more than one second module group (not shown in the figure) is attached to the heat sink 13 transversely on the other side. More than one first module group 45 is attached to the heat sink 13 transversely on one side, and more than one second module group (not shown in the figure) is attached to the heat sink 13 transversely on the other side, that is, the power module can be expanded as needed to increase the power density of the power module. When more than one first module group 45 is attached to the heat sink 13 transversely on one side, as shown in Figure 8 , the heat pipes 14 are densely arranged at the corresponding positions of the heat sink 13 where the first IGBT modules 17 and the second IGBT modules (not shown in the figure) are attached.

[0070] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, and are not intended to limit the scope of protection of the present application. Although the present application has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present application can be modified or replaced by equivalents without departing from the essence and scope of the technical solutions of the present application.

Claims

1. A power module, characterized in that, include: The enclosure includes a front panel, a rear panel, and two side panels. A plate-type heat sink parallel to the side panels is installed inside the enclosure. Heat dissipation pipes are laid inside the heat sink. The power module is also provided with an inlet pipe and an outlet pipe that pass through the enclosure. The inlet pipe and the outlet pipe are respectively connected to the two ends of the heat dissipation pipes. Three first IGBT modules are attached to one side of the heat sink. Three DC busbars are provided at the upper end of the enclosure. A first AC single-phase copper busbar is provided at the lower end of the enclosure. The power module is also provided with a first connecting line that sequentially connects the DC busbars, the first IGBT modules, and the first AC single-phase copper busbar.

2. A power module according to claim 1, characterized in that: Three second IGBT modules are attached to the other side of the heat sink. A second AC single-phase copper busbar is provided at the lower end of the housing. The power module is also provided with a second connecting line that connects the DC busbar, the second IGBT modules and the second AC single-phase copper busbar in sequence.

3. A power module according to claim 2, characterized in that: The power module is further provided with a connection plate to connect the first AC single-phase copper busbar and the second AC single-phase copper busbar; the three DC busbars are respectively the first DC busbar, the second DC busbar and the third DC busbar. The first DC busbar includes a first busbar horizontal plate, a first terminal block vertically disposed on the upper surface of the first busbar horizontal plate and two first terminals vertically disposed on the lower surface of the first busbar horizontal plate; the second DC busbar includes a second busbar horizontal plate, a second terminal block vertically disposed on the upper surface of the second busbar horizontal plate and two second terminals vertically disposed on the lower surface of the second busbar horizontal plate; the third DC busbar includes a third busbar horizontal plate, a third terminal block vertically disposed on the upper surface of the third busbar horizontal plate and two third terminals vertically disposed on the lower surface of the third busbar horizontal plate.

4. A power module according to claim 3, characterized in that: The first terminal block is located in the middle of the front end of the first busbar horizontal plate, the second terminal block is located on the left side of the front end of the second busbar horizontal plate, and the third terminal block is located on the right side of the front end of the third busbar horizontal plate. The third busbar horizontal plate, the first busbar horizontal plate, and the second busbar horizontal plate are stacked together from top to bottom. An insulating film is provided between the third busbar horizontal plate and the first busbar horizontal plate. An insulating film is provided between the first busbar horizontal plate and the second busbar horizontal plate. The first terminal block is located in the middle of the second terminal block and the third terminal block. The first busbar horizontal plate is provided with a first through hole for inserting two third terminals. The second busbar horizontal plate is provided with a second through hole for inserting two third terminals and two first terminals respectively. The two third terminals pass through the first through hole and the second through hole respectively, and the two first terminals pass through the second through hole respectively.

5. A power module according to claim 4, characterized in that: One of the first terminals is located on the left side of the lower end face of the first busbar horizontal plate, and the other first terminal is located in the middle of the lower end face of the first busbar horizontal plate; the two second terminals are respectively located at two adjacent diagonal positions of the second terminal block on the lower end face of the second busbar horizontal plate; the two third terminals are respectively located at two adjacent diagonal positions of the third terminal block on the lower end face of the third busbar horizontal plate.

6. A power module according to claim 5, characterized in that: The first busbar horizontal plate has a first busbar side plate perpendicular to it on both sides; the second busbar horizontal plate has a second busbar side plate perpendicular to it on its left side; the third busbar horizontal plate has a third busbar side plate perpendicular to it on its right side; the third busbar side plate is located inside the first busbar side plate on the right, and the first busbar side plate on the left is located inside the second busbar side plate; an insulating film is provided between the third busbar side plate and the first busbar side plate, and an insulating film is provided between the second busbar side plate and the first busbar side plate; the first busbar horizontal plate and the two first busbar side plates are integrally formed, the second busbar horizontal plate and the second busbar side plate are integrally formed, and the third busbar horizontal plate and the third busbar side plate are integrally formed.

7. A power module according to claim 2, characterized in that: The positions of the three first IGBT modules and the three second IGBT modules attached to both sides of the heat sink correspond one-to-one, and the heat pipes are densely arranged at the corresponding positions on the heat sink where the first IGBT modules and the second IGBT modules are attached.

8. A power module according to claim 7, characterized in that: The heat pipe is configured in an S-shaped fold at the corresponding positions on the heat sink where the first IGBT module and the second IGBT module are attached.

9. A power module according to claim 7, characterized in that: The heat dissipation pipe includes a main pipeline connecting the inlet pipe and the outlet pipe, and heat dissipation branch pipes arranged in an S-shape. Two heat dissipation branch pipes are arranged side by side at the corresponding positions where the first IGBT module and the second IGBT module are attached. One end of the two heat dissipation branch pipes converges and connects to the main pipeline on the side of the inlet pipe, and the other end of the two heat dissipation branch pipes converges and connects to the main pipeline on the side of the outlet pipe.

10. A power module according to claim 2, characterized in that: A drive plate is provided on the inner side of the front panel inside the housing. At least one of the front panel, the rear panel, and the two side panels is provided with heat dissipation holes. The first connecting line is an aluminum busbar, a wire, or a braided cable, and the second connecting line is an aluminum busbar, a wire, or a braided cable.

11. A power module according to claim 3, characterized in that: The enclosure also includes a bottom plate, and the water inlet pipe and the water outlet pipe pass through the front plate, the rear plate, or the bottom plate; the connecting plate, the first AC single-phase copper busbar, and the second AC single-phase copper busbar are integrally formed.

12. A power module according to claim 2, characterized in that: The three first IGBT modules attached to one side of the heat sink constitute a first module group, and one or more first module groups are attached horizontally on one side of the heat sink; the three second IGBT modules attached to the other side of the heat sink constitute a second module group, and one or more second module groups are attached horizontally on the other side of the heat sink.

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