Modularized self-adaptive immersion jet liquid cooling system for high-power server

Abstract

The utility model belongs to the technical field of data center cooling, and relates to a modularized self-adaptive immersion jet liquid cooling system for a high-power server, the high-power server comprises a cabinet, the cabinet is provided with a sealed cavity, the sealed cavity is internally provided with a plurality of devices with different heating degrees, the devices are completely immersed in a refrigerant, and the sealed cavity is internally provided with a plurality of nozzles. A modularized jet flow device is arranged on a device with the relatively high heating degree, the modularized jet flow device independently conducts jet flow cooling on the device with the relatively high heating degree, and the sealing cavity is further provided with a machine box refrigerant inlet and a machine box refrigerant outlet. And the case refrigerant inlet and the case refrigerant outlet penetrate from the inside of the sealing cavity to the outside of the case. The utility model aims to solve the problem that high-efficiency and accurate heat dissipation of high-power heating elements such as chips and the like cannot be realized in the prior art.

Description

TECHNICAL FIELD

[0001] The utility model belongs to data center cooling technical field, specifically, relate to a kind of modularization self-adapting immersion jet flow liquid cooling system for high-power server. BACKGROUND

[0002] In the Internet era, the explosive growth of data information leads to the sharp rise of data center energy consumption, especially the energy consumption of cooling equipment, which has become an important part of the total energy consumption of data center. Reducing the energy consumption of cooling equipment is one of the key strategies to improve the energy efficiency ratio (PUE) of data center. With the rapid rise of the heat power of CPU, GPU and other heat generating components, the traditional air cooling technology has been unable to meet the heat dissipation needs of modern data center servers, therefore, liquid cooling technology is gradually becoming the mainstream of data center heat dissipation solution.

[0003] Immersion liquid cooling technology involves completely immersing the server in dielectric fluid, and using the circulation of cooling liquid to remove the heat generated by the device, thereby efficiently managing the heat energy of the server. However, in the traditional immersion liquid cooling technology, the temperature distribution of the liquid coolant inside the server is ladder-shaped, and the heat generation of different components (such as chips and other components) differs greatly. In the prior art, this problem is usually addressed by increasing the flow rate of the liquid coolant and accelerating its circulation, and a specific coolant flow path also needs to be designed. However, this method not only increases the design complexity of the liquid cooling system and the manufacturing cost, but also results in higher energy consumption, which is not conducive to energy saving. Therefore, it is necessary to further explore more efficient heat dissipation methods based on the existing immersion liquid cooling technology to achieve efficient and accurate heat dissipation for high-power heat generating components such as chips. SUMMARY

[0004] In view of the problem that the prior art cannot efficiently and accurately dissipate heat for high-power heat generating components such as chips, the utility model provides a modularization self-adapting immersion jet flow liquid cooling system for high-power server.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions:

[0006] A modularization self-adapting immersion jet flow liquid cooling system for high-power server, the high-power server includes a case, the case has a sealed cavity inside, a plurality of devices with different heat levels are arranged in the sealed cavity, the devices are completely immersed in coolant, a modularization jet flow device is arranged on the device with relatively high heat level, the modularization jet flow device performs jet flow cooling on the device with relatively high heat level alone, the sealed cavity is also provided with a case coolant inlet and a case coolant outlet, the case coolant inlet and the case coolant outlet penetrate from the inside of the sealed cavity to the outside of the case.

[0007] The modular adaptive submerged jet flow liquid cooling system for high-power servers as described above, further, the devices include chips, memories, PCB circuit boards and hard disks, and the devices with relatively high heat levels include at least chips.

[0008] The modular adaptive submerged jet flow liquid cooling system for high-power servers as described above, further, the chassis coolant inlet and the chassis coolant outlet are arranged on the back side of the high-power server, and the chassis coolant outlet is located in the middle of the back of the high-power server.

[0009] The modular adaptive submerged jet flow liquid cooling system for high-power servers as described above, further, the chassis coolant inlet and the chassis coolant outlet are provided with quick couplings.

[0010] The modular adaptive submerged jet flow liquid cooling system for high-power servers as described above, further, the modular jet device includes a device coolant inlet, a liquid pumping micro-pump, a sensing control unit and a plurality of jet nozzles, the sensing control unit includes a sensing module and a control module, wherein the control module determines the required flow for jet cooling according to the temperature data and power data obtained by the sensing module, and then drives the liquid pumping micro-pump to draw coolant from the device coolant inlet and sprays it onto the devices with relatively high heat levels through a plurality of jet nozzles.

[0011] The modular adaptive submerged jet flow liquid cooling system for high-power servers as described above, further, the sensing module includes a power monitor and a temperature sensor, wherein the power monitor is used to obtain power data, and the temperature sensor is used to obtain temperature data.

[0012] The modular adaptive submerged jet flow liquid cooling system for high-power servers as described above, further, the control module includes a flow controller, a data storage and a feedback controller, wherein the flow controller determines the required flow for jet cooling according to the power data obtained by the power monitor and the temperature data obtained by the temperature sensor, at the same time, the data storage stores the historically obtained power data and temperature data, and the feedback controller generates a negative feedback signal to control the flow controller according to the historically obtained power data and temperature data.

[0013] The modular adaptive submerged jet flow liquid cooling system for high-power servers as described above, further, the liquid pumping micro-pump is a cylinder, the sensing control unit is arranged on the top of the liquid pumping micro-pump, the device coolant inlet is arranged on the side column surface of the liquid pumping micro-pump, and a plurality of jet nozzles are arranged on the bottom of the liquid pumping micro-pump.

[0014] The modular adaptive submerged jet flow liquid cooling system for high-power servers as described above, further, the area of the liquid pumping micro-pump is equivalent to the area of the device with relatively high heat level.

[0015] The modular adaptive submerged jet flow liquid cooling system for high-power servers as described above, further, the diameter of the cylinder is 40-60mm, the inner diameter of the end nozzle of the jet flow nozzle is 3mm, and the distance between the end nozzle and the device with relatively high heat level is 1-3 times of the inner diameter.

[0016] Compared with the prior art, the utility model has the beneficial effects that:

[0017] 1、 The modular jet flow device and the single high heat flux density element in the blade server, such as central processing unit (CPU) or / and graphic processing unit (GPU), form a heat dissipation unit for jet flow cooling. The modular jet flow device extracts the liquid coolant inside the blade server and sprays it at high speed onto the hot surface of the high heat flux density element, forming a thin thermal boundary layer and a velocity boundary layer, thereby generating a very high heat transfer coefficient and forming a local strong heat exchange area, achieving the purpose of rapid cooling, and further solving the problem of high efficiency and accurate heat dissipation for high-power heat generating elements such as chips in the prior art.

[0018] 2、 The coolant of the utility model enters the system through the case coolant inlet, which is different from the traditional submerged jet flow liquid cooling system. Since the utility model adopts a unique modular design, the complex and difficult-to-adjust coolant transmission channel is avoided.

[0019] 3、 The coolant spraying device of the utility model adopts a modular design, which does not need to design a complex coolant transmission channel inside the server and set a high-pressure pump outside the case to transport the coolant, can effectively reduce the pressure drop loss of the coolant in and out of the case, reduce the pump power loss while reducing the risk of coolant leakage, can effectively improve the operation performance and equipment stability of the data center server, and prolong the effective service life of the server.

[0020] 4, The utility model discloses a sensing module includes power monitor and temperature sensor, can real -time record and calculate the temperature data and power data of current heat -generating chip, control module includes flow controller, data memory and feedback controller, and data memory first saves the heat -generating chip temperature data and power data recorded by sensing module, then adjusts the jet flow of modular jet flow device through feedback controller based on these data, specifically, with the increase of chip temperature, the jet flow for cooling increases accordingly, on the contrary, when the chip temperature reduces, the jet flow reduces, through this negative feedback control mechanism, the system can adaptively adjust the cooling process of heat -generating chip, ensures that its temperature keeps in the safe and reasonable range, and the dual demands of cooling efficiency and energy -conserving are also taken into account. BRIEF DESCRIPTION OF DRAWINGS

[0021] In order to more clearly illustrate the technical scheme in the embodiment of the utility model, the drawings needed in the embodiment will be simply introduced below, and obviously, the drawings in the following description are only some embodiments of the application, and those skilled in the art can also obtain other drawings according to these drawings without creating labor.

[0022] Figure 1 It is the structural schematic diagram of modular adaptive immersion jet flow liquid cooling system for high-power server in the embodiment of the utility model.

[0023] Figure 2 It is the top view of modular adaptive immersion jet flow liquid cooling system for high-power server in the embodiment of the utility model.

[0024] Figure 3 It is the three-dimensional structural schematic diagram of modular heat dissipation unit in the embodiment of the utility model.

[0025] Figure 4 It is the structural schematic diagram of modular jet flow device in the embodiment of the utility model.

[0026] Figure 5 It is the working schematic diagram of modular jet flow device in the embodiment of the utility model (the arrow shows the flow direction of refrigerant).

[0027] 1, modular jet flow device, 2, chip, 3, memory, 4, PCB circuit board, 5, hard disk, 6, case refrigerant inlet, 7, case refrigerant outlet, 8, case, 11, device refrigerant inlet, 12, liquid pumping micropump, 13, sensing control unit, 14, jet flow nozzle. DETAILED DESCRIPTION

[0028] With reference to the drawings of the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described, obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by the person skilled in the art without creative labor are within the protection scope of the present application.

[0029] Embodiment:

[0030] It should be noted that the terms "first", "second" and the like in the description and claims of the present application and the above drawings are used to distinguish similar objects, and do not have to be used to describe a specific order or sequence. It should be understood that the data thus used can be interchanged under appropriate circumstances, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "include" and "have" and any variations thereof in the embodiments of the present application are intended to cover non-exclusive inclusion, for example, a process, method, system, product or device including a series of steps or units does not have to be limited to those steps or units clearly listed, but can include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0031] In the description of the present application, the meaning of "a plurality of" is at least two, for example, two, three, etc., unless otherwise explicitly specified. In addition, unless otherwise explicitly specified and limited, the terms "mount", "connect", "connection" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integrally connected; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or the communication inside two elements. For the person skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0032] Figure 1 The structural schematic diagram of the modular adaptive immersion jet flow liquid cooling system for high-power servers in the embodiments of the present application. Figure 2 The top view of the modular adaptive immersion jet flow liquid cooling system for high-power servers in the embodiments of the present application. Figure 1 And Figure 2As shown, the modular self-adaptive immersion jet flow liquid cooling system in the embodiment of the utility model is used in high-power server, the high-power server includes case 8, the case 8 has sealed cavity, the sealed cavity is equipped with a variety of different heat generating degree devices, the device is completely immersed in refrigerant, and the modular jet flow device 1 is arranged on the device with relatively high heat generating degree, the modular jet flow device 1 carries out jet flow cooling to the device with relatively high heat generating degree alone, the sealed cavity is also equipped with case refrigerant inlet 6 and case refrigerant outlet 7, and the case refrigerant inlet 6 and the case refrigerant outlet 7 are penetrated from the inside of the sealed cavity to the outside of the case 8.

[0033] In specific implementation, the high-power server can be a certain type of blade server, the a variety of different heat generating degree devices can include chip 2, memory 3, PCB circuit board 4 and hard disk 5, and the device with relatively high heat generating degree at least includes chip 2; the above heat generating devices are completely immersed in refrigerant, and the refrigerant can use dielectric fluid; the case refrigerant inlet 6 and the case refrigerant outlet 7 are arranged on the back side of the high-power server, and the case refrigerant outlet 7 is located in the middle of the back of the high-power server, which is beneficial to realize uniform distribution of refrigerant in the case 8; the case refrigerant inlet 6 and the case refrigerant outlet 7 preferably use quick connectors; the modular jet flow device 1 and a single high heat flux density element in the blade server, such as central processing unit (CPU) or / and graphics processing unit (GPU), form a heat dissipation unit to carry out jet flow cooling. The modular jet flow device 1 extracts liquid refrigerant inside the blade server and sprays it at high speed on the hot surface of the high heat flux density element, forms a thin thermal boundary layer and a velocity boundary layer, thereby generating very high heat transfer coefficient (HTC) and forming a local strong heat exchange area to achieve the purpose of rapid cooling, thereby solving the problem of high efficiency and accurate heat dissipation of the chip 2 and other high-power heat generating elements in the prior art.

[0034] Figure 3 It is a three-dimensional structure schematic view of the modular heat dissipation unit in the embodiment of the utility model. Figure 4 It is a structure schematic view of the modular jet flow device in the embodiment of the utility model. Figure 5 It is a working schematic view of the modular jet flow device in the embodiment of the utility model (the arrow indicates the flow direction of refrigerant). Figures 3 to 5As shown, in some embodiments, the modular jet device 1 includes a refrigerant inlet 11, a liquid-drawing micro-pump 12, a sensing control unit 13, and multiple jet nozzles 14. The sensing control unit 13 includes a sensing module and a control module. The control module determines the flow rate required for jet cooling based on temperature and power data acquired by the sensing module, and then drives the liquid-drawing micro-pump 12 to draw refrigerant from the refrigerant inlet 11 and spray it onto the device with a relatively high heat level through the multiple jet nozzles 14. Further, the sensing module includes a power monitor and a temperature sensor. The power monitor is used to acquire power data, and the temperature sensor is used to acquire temperature data. The control module includes a flow controller, a data storage unit, and a feedback controller. The flow controller determines the flow rate required for jet cooling based on the power data acquired by the power monitor and the temperature data acquired by the temperature sensor. The data storage unit stores historically acquired power and temperature data. The feedback controller generates a negative feedback signal to control the flow controller based on the historically acquired power and temperature data.

[0035] In practical implementation, the sensing module includes a power monitor and a temperature sensor, capable of recording and calculating the current temperature and power data of the heating chip 2 in real time. The control module includes a flow controller, a data storage device, and a feedback controller. The data storage device first stores the temperature and power data of the heating chip 2 recorded by the sensing module, and then adjusts the jet flow rate of the modular jet device 1 based on this data through the feedback controller. Specifically, as the temperature of the chip 2 increases, the jet flow rate used for cooling increases accordingly; conversely, when the temperature of the chip 2 decreases, the jet flow rate decreases. Through this negative feedback control mechanism, the system can adaptively adjust the cooling process of the heating chip 2, ensuring that its temperature remains within a safe and reasonable range, while simultaneously meeting the dual requirements of cooling efficiency and energy saving.

[0036] In some embodiments, the liquid-drawing micropump 12 is cylindrical, with the sensing and control unit 13 located at its top, the refrigerant inlet 11 on its side cylindrical surface, and multiple jet nozzles 14 at its bottom. The area of ​​the liquid-drawing micropump 12 is comparable to the area of ​​the device with a relatively high heat generation. The diameter of the cylinder is 40-60 mm, the inner diameter of the end port of the jet nozzle 14 is 3 mm, and the distance between the end port and the device with a relatively high heat generation is 1-3 times this inner diameter.

[0037] In practical implementation, for the modular jet device 1, the size of the refrigerant inlet 6 of the chassis is calculated based on the maximum heating power of the chip 2 and the required flow rate, and can be designed with reference to the jet pipe diameter of a conventional immersion jet liquid-cooled server chassis 8. A sensor control unit 13 is integrated above the liquid-drawing micro-pump 12 to accurately monitor key information such as the temperature and power of the chip 2 and make real-time adjustments, thereby achieving a highly efficient and energy-saving heat dissipation effect. The bottom surface size of the liquid-drawing micro-pump 12 matches the heating chip 2, typically a circular area with a diameter of 40-60mm. Multiple jet nozzles 14 are regularly distributed on the bottom surface of the micro-pump body to ensure that their effective spray area can uniformly cover the surface of the heating chip 2. The inner diameter of the nozzle tip is generally about 3mm, and the distance between the nozzle tip and the heating chip 2 is generally 1 to 3 times the inner diameter. The refrigerant is sprayed through the jet nozzles 14 onto the heating surface of the chip 2 for forced convection heat transfer.

[0038] The working principle and process of this modular adaptive immersion jet liquid cooling system for high-power servers are as follows: The refrigerant enters uniformly through the chassis refrigerant inlet 6. Unlike traditional immersion jet liquid cooling systems, this invention employs a unique modular design, thus avoiding complex and difficult-to-adjust refrigerant transmission channels. Therefore, the chassis refrigerant inlet 6 does not require a high-pressure pump to deliver high-flow-rate and high-pressure refrigerant. All heat-generating units in the server are immersed in the refrigerant, achieving heat dissipation for low-heat-flux-density components and some chips 2 through normal circulation. For locally high-heat-flux-density components (such as GPUs, CPUs, etc.), jet cooling is performed separately through the modular jet device 1 to enhance local heat exchange: First, the sensor control unit 13 adjusts the required heat dissipation flow rate based on real-time recorded data such as chip 2 temperature and power. Then, the liquid-drawing micro-pump 12 draws the refrigerant from the device's refrigerant inlet 11 into the pump body of the liquid-drawing micro-pump 12, and evenly sprays it onto the surface of the chip 2 through multiple jet nozzles 14 for efficient heat dissipation. The sensor control unit 13 adjusts the refrigerant flow rate pumped by the micro pump 12 based on real-time data feedback such as temperature changes in the chip 2, achieving adaptive control of the jet flow rate to meet the heat dissipation requirements of the chip 2 in an efficient and energy-saving manner. Finally, all refrigerant in the chassis 8 is discharged from the system through the chassis refrigerant outlet 7.

[0039] In this invention, the information collected by the modular jet device 1 can be visualized using data acquisition instruments or software. Simultaneously, it enables real-time monitoring and recording of server power consumption, effectively preventing and avoiding dangerous situations such as server overload and insufficient heat dissipation that excessively shorten the server's lifespan. This significantly improves the stability and reliability of the liquid-cooled server, ensuring its computing performance.

[0040] It should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0041] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0042] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0043] The above embodiments are merely illustrative of the technical concept and features of this utility model, and are intended to enable those skilled in the art to understand the content of this utility model and implement it accordingly. They should not be construed as limiting the scope of protection of this utility model. All equivalent changes or modifications made based on the substance of the content of this utility model should be covered within the scope of protection of this utility model.

Claims

1. A modular adaptive immersion jet liquid cooling system for high-power servers, characterized in that, The high-power server includes a chassis with a sealed cavity inside. Various devices with different heat outputs are housed within the sealed cavity and are completely immersed in refrigerant. Modular jet cooling devices are installed on the devices with relatively high heat outputs, allowing for individual jet cooling of these devices. The sealed cavity also has a chassis refrigerant inlet and a chassis refrigerant outlet, extending from the interior of the sealed cavity to the exterior of the chassis.

2. The modular adaptive immersion jet liquid cooling system for high-power servers according to claim 1, characterized in that, The device includes a chip, memory, PCB circuit board and hard disk, and the device with relatively high heat generation includes at least a chip.

3. The modular adaptive immersion jet liquid cooling system for high-power servers according to claim 1, characterized in that, The refrigerant inlet and the refrigerant outlet of the chassis are located on one side of the back of the high-power server, and the refrigerant outlet is located in the middle of the back of the high-power server.

4. The modular adaptive immersion jet liquid cooling system for high-power servers according to claim 1, characterized in that, The refrigerant inlet and refrigerant outlet of the chassis are equipped with quick connectors.

5. The modular adaptive immersion jet liquid cooling system for high-power servers according to claim 1, characterized in that, The modular jet device includes a refrigerant inlet, a liquid pump, a sensing and control unit, and multiple jet nozzles. The sensing and control unit includes a sensing module and a control module. The control module determines the flow rate required for jet cooling based on the temperature and power data obtained by the sensing module, and then drives the liquid pump to draw refrigerant from the refrigerant inlet and spray it onto the device with a relatively high heat level through the multiple jet nozzles.

6. The modular adaptive immersion jet liquid cooling system for high-power servers according to claim 5, characterized in that, The sensing module includes a power monitor and a temperature sensor, wherein the power monitor is used to acquire power data and the temperature sensor is used to acquire temperature data.

7. The modular adaptive immersion jet liquid cooling system for high-power servers according to claim 6, characterized in that, The control module includes a flow controller, a data storage unit, and a feedback controller. The flow controller determines the flow rate required for jet cooling based on the power data acquired by the power monitor and the temperature data acquired by the temperature sensor. Meanwhile, the data storage unit stores historically acquired power and temperature data. The feedback controller generates a negative feedback signal to control the flow controller based on the historically acquired power and temperature data.

8. The modular adaptive immersion jet liquid cooling system for high-power servers according to claim 5, characterized in that, The liquid pump is cylindrical, with the sensing and control unit located at the top, the refrigerant inlet on the side cylindrical surface, and multiple jet nozzles at the bottom.

9. The modular adaptive immersion jet liquid cooling system for high-power servers according to claim 5, characterized in that, The area of ​​the liquid-drawing micropump is comparable to the area of ​​the device with a relatively high degree of heat generation.

10. The modular adaptive immersion jet liquid cooling system for high-power servers according to claim 8, characterized in that, The cylinder has a diameter of 40-60 mm, the nozzle tip has an inner diameter of 3 mm, and the distance between the nozzle tip and the device with a relatively high heat generation is 1-3 times the inner diameter.

Images