Laser heat dissipation device and laser

Abstract

The utility model relates to the technical field of laser heat dissipation, in particular to a laser heat dissipation device and a laser, the laser heat dissipation device comprises a circumferential heat dissipation assembly, the circumferential heat dissipation assembly comprises an annular heat conduction substrate attached to the outer wall of the circumferential side of a laser shell and heat dissipation fin sets distributed in a radial shape, and the multiple heat dissipation fin sets form a first heat conduction channel; the rear-side heat dissipation module is fixedly connected with the rear-side end face of the laser shell and comprises a heat-conducting fin, a fan and air duct plates, the heat-conducting fin is arranged on the rear-side end face of the laser shell, the air duct plates are arranged on the heat-conducting fin, the heat-conducting fin and the air duct plates form a second heat-conducting channel, and the second heat-conducting channel is communicated with the fan. Air inlet holes are formed in the peripheral side of the shell of the laser, the air inlet holes are communicated with the second heat conduction channel, the fan is arranged on the side, away from the shell of the laser, of the air channel plate, and the fan drives air to pass through the second heat conduction channel through the air inlet holes. The method has the effect of reducing the influence on the operation stability of the laser.

Description

Technical Field

[0001] This application relates to the technical field of laser heat dissipation, and in particular to a laser heat dissipation device and a laser. Background Technology

[0002] Currently, with the widespread application of high-power lasers in industrial processing, medical equipment, and other fields, the problem of heat accumulation during their operation is becoming increasingly prominent. Traditional laser heat dissipation designs often employ a unidirectional heat dissipation structure, such as placing an air-cooled or liquid-cooled module only on the rear side of the laser housing, or adding simple heat sinks to the circumferential surface of the housing. Such structures have the following drawbacks:

[0003] Uneven heat flow distribution: Unilateral heat dissipation leads to a significant temperature gradient inside the laser, affecting the refractive index stability of optical components and causing a decrease in beam quality; it cannot meet the rapidly increasing heat load requirements during high-power operation, affecting the operational stability of the laser. Summary of the Invention

[0004] To reduce the impact on the operational stability of the laser, this application provides a laser heat dissipation device and a laser.

[0005] Firstly, this application provides a laser heat dissipation device, which adopts the following technical solution:

[0006] A laser heat dissipation device, comprising:

[0007] A circumferential heat dissipation assembly includes an annular heat-conducting substrate attached to the outer wall of the peripheral side of the laser housing and a radially distributed heat dissipation fin group, wherein a plurality of the heat dissipation fin groups form a first heat conduction channel.

[0008] The rear heat dissipation module is fixedly connected to the rear end face of the laser housing and includes a heat-conducting plate, a fan, and an air duct plate. The heat-conducting plate is disposed on the rear end face of the laser housing, and multiple sets of air duct plates are disposed on the heat-conducting plate. The heat-conducting plate and the multiple air duct plates form a second heat conduction channel, and an air inlet is formed on the periphery of the laser housing. The air inlet is connected to the second heat conduction channel. The fan is disposed on the side of the air duct plate away from the laser housing, and the fan drives the air through the air inlet and through the second heat conduction channel.

[0009] By adopting the above technical solution, the annular heat-conducting substrate is tightly attached to the outer wall of the laser housing, and a first heat-conducting channel is formed by the radial heat dissipation fins, which rapidly diffuses heat from the circumference of the housing outward. The rear heat-conducting sheet and the air duct plate form a second heat-conducting channel. The fan drives the airflow to be drawn in from the air inlet on the circumference of the housing and flows along the gaps in the air duct plate, carrying away the heat from the rear. The circumferential and rear heat dissipation are synchronized, which improves the heat dissipation efficiency compared with the traditional single-sided heat dissipation. The directional guidance of the air inlet and the air duct plate avoids the airflow short-circuit problem in the traditional design, and the effective heat dissipation area is increased. The circumferential heat dissipation and the rear heat dissipation work together to achieve rapid heat dissipation of the laser, so that the performance of the laser can be maintained, the occurrence of overheating can be reduced, and the impact on the operational stability of the laser can be reduced.

[0010] Optionally, it also includes a heat-conducting copper pipe and a liquid cooling supply component that connect the circumferential heat dissipation component and the rear heat dissipation module; the liquid cooling supply component is connected to the heat-conducting copper pipe and is used to circulate and supply coolant.

[0011] By adopting the above technical solution, the heat-conducting copper pipe runs through the circumferential heat dissipation component and the rear heat dissipation module, transferring circumferential heat to the rear liquid cooling system; the liquid cooling supply component circulates coolant, forming a gas-liquid composite heat dissipation with the air cooling system inside the copper pipe; the liquid cooling system can cope with instantaneous high heat loads (such as 10kW pulse conditions), and can reduce peak temperature compared with pure air cooling solutions; the copper pipe through-through design avoids the leakage risk of traditional external pipelines and reduces space occupation.

[0012] Optionally, it also includes an intelligent temperature control system that collects circumferential and rear temperature data in real time through temperature sensors and dynamically adjusts the parameters of the fan and the liquid cooling refrigerant assembly.

[0013] By adopting the above technical solution, the temperature sensor monitors the circumferential and rear temperature distribution in real time; the temperature control system dynamically adjusts the fan speed and liquid cooling flow rate according to the temperature difference (for example, liquid cooling is activated first when the circumferential temperature difference is >2℃); dynamic adjustment reduces the overall power consumption of the heat dissipation system, which is significantly more energy-efficient than fixed power control; and temperature feedback avoids the risk of low-temperature condensation in traditional solutions.

[0014] Optionally, a thermally conductive layer is circumferentially coated and formed on the laser housing, and microgrooves are formed on the thermally conductive layer, with the annular thermally conductive substrate in contact with the thermally conductive layer.

[0015] By adopting the above technical solution, a graphene-silver composite thermally conductive layer is formed on the circumferential surface of the laser housing by plasma spraying; the annular thermally conductive substrate is in close contact with the thermally conductive layer through a microgroove array; the thermally conductive layer reduces the contact thermal resistance between the substrate and the housing to 0.05 K·cm² / W, which improves the heat transfer efficiency by 3 times compared with ordinary metal bonding; the microgroove design allows axial thermal expansion displacement, avoiding the thermal stress cracking problem of traditional planar bonding.

[0016] Optionally, the heat conduction passes through the annular heat-conducting substrate via the side corresponding to the circumferential heat dissipation component, and is arranged along the heat-conducting layer.

[0017] By adopting the above technical solution, the heat-conducting copper pipes are arranged around the heat-conducting layer, forming a cross heat conduction network with the heat dissipation fins. Heat is transferred to the liquid cooling system bidirectionally through the copper pipes and the heat-conducting layer. The cross arrangement of the copper pipes and fins ensures that the circumferential temperature difference of the shell is ≤1.5℃, which improves the uniformity of heat dissipation compared to traditional unidirectional heat dissipation. The arrangement along the heat-conducting layer avoids the dust accumulation problem of traditional exposed copper pipes, and extends the maintenance cycle by 3 times.

[0018] Optionally, the spacing between adjacent air duct plates decreases progressively from the air inlet to the air outlet.

[0019] By adopting the above technical solution, the airflow is accelerated through the air duct plate and the airflow is gathered by the gradually narrowing channel; the gradient tilt design increases the Nusselt number (Nu) by 2.1 times and improves the heat dissipation efficiency.

[0020] Optionally, it also includes a flow enhancement component, which includes: an outwardly expanding flow guide shroud, which is fixed to the front end of the circumferential heat dissipation component by a clamp, the inner wall surface of which satisfies Bernoulli's equation and the outlet expansion angle is 25°;

[0021] A flow guide block is disposed on the laser housing and located on the side of the annular heat-conducting substrate away from the fan, and is formed in the flow guide cavity connected to the first heat-conducting channel;

[0022] A fan is mounted on the airflow guide block, and multiple fans are provided, each corresponding to a first heat conduction channel.

[0023] By adopting the above technical solution, the outward-expanding airflow guides the circumferential airflow to uniformly cover the heat dissipation fins through the Bernoulli surface; the guide slope on the airflow block cooperates with multiple fans to drive the airflow to flow along the first heat conduction channel; the airflow guide makes the airflow surface of the heat dissipation fins uniformly covered; the guide slope and multiple fans work together to reduce airflow swirl loss.

[0024] Secondly, the laser provided in this application adopts the following technical solution:

[0025] A laser, including the aforementioned laser heat dissipation device.

[0026] By adopting the above technical solution and using a laser heat dissipation device to increase the heat dissipation effect, the laser can operate stably.

[0027] In summary, this application includes at least one of the following beneficial technical effects:

[0028] 1. By guiding the airflow through the air inlet and the duct plate, the airflow short-circuit problem in traditional designs is avoided, and the effective heat dissipation area is increased; the circumferential heat dissipation and the rear heat dissipation work together to achieve rapid heat dissipation of the laser, so that the performance of the laser can be maintained, the occurrence of overheating is reduced, and thus the impact on the stability of laser operation is reduced.

[0029] 2. The heat-conducting copper pipes are arranged around the heat-conducting layer, forming a cross heat conduction network with the heat dissipation fins; heat is transferred to the liquid cooling system bidirectionally through the copper pipes and the heat-conducting layer; the cross arrangement of the copper pipes and fins ensures that the circumferential temperature difference of the shell is ≤1.5℃, which improves the uniformity of heat dissipation compared to traditional unidirectional heat dissipation; the arrangement along the heat-conducting layer avoids the dust accumulation problem of traditional exposed copper pipes, extending the maintenance cycle by 3 times;

[0030] 3. The outward-expanding airflow guides the circumferential airflow to evenly cover the heat dissipation fins through the Bernoulli surface; the guide slope on the airflow block works with multiple fans to drive the airflow along the first heat conduction channel; the airflow guide ensures that the airflow is evenly covered on the surface of the heat dissipation fins; the guide slope and multiple fans work together to reduce airflow swirl loss. Attached Figure Description

[0031] Figure 1 This is a schematic diagram of the overall structure of the heat dissipation device in the embodiments of this application;

[0032] Figure 2 This is a diagram illustrating the fins in an embodiment of this application;

[0033] Figure 3 This is a schematic diagram of the annular thermally conductive substrate in the embodiments of this application;

[0034] Figure 4 yes Figure 1 A magnified view of a portion of region A in the middle.

[0035] Reference numerals: 100, circumferential heat dissipation assembly; 110, annular thermal conductive substrate; 120, heat dissipation fin assembly; 130, annular cover; 140, first thermal conductive channel; 200, rear heat dissipation module; 210, thermal conductive plate; 220, fan; 230, air duct plate; 240, second thermal conductive channel; 250, fin; 300, thermal conductive copper pipe; 400, thermal conductive layer; 410, microgroove; 500, airflow enhancement assembly; 510, outward expansion airflow cover; 520, airflow guide block; 530, cooling fan; 610, airflow channel; 700, housing. Detailed Implementation

[0036] The following combination Figures 1 to 4 This application will be described in further detail.

[0037] This embodiment discloses a laser heat dissipation device.

[0038] Reference Figure 1 and Figure 2 This embodiment provides a laser heat dissipation device, including a circumferential heat dissipation assembly 100, a rear heat dissipation module 200, a heat-conducting copper pipe 300 disposed on both, and a liquid cooling supply assembly connected to the heat-conducting copper pipe 300. The circumferential heat dissipation assembly 100 is arranged around the circumferential outer wall of the laser housing 700, and the rear heat dissipation module 200 is located at the rear end of the housing 700. The two work together to achieve multi-dimensional and efficient heat dissipation, and the heat-conducting copper pipe 300 is used for liquid cooling.

[0039] Reference Figure 1 and Figure 3 The circumferential heat dissipation component 100 includes multiple annular heat-conducting substrates 110, radial heat dissipation fins 120, and a heat-conducting layer 400. The heat-conducting layer 400 is formed on the circumferential outer wall of the housing 700 by plasma spraying process, with a thickness of 0.5 mm. Multiple microgrooves 410 with a depth of 0.2 mm are processed on the surface. The multiple microgrooves 410 are evenly distributed along the length direction of the housing 700. The inner wall of the annular thermally conductive substrate 110 is provided with a corresponding protrusion structure, which corresponds to and engages with the microgroove 410, reducing the contact thermal resistance to 0.05 K·cm² / W. The annular thermally conductive substrate 110 is made of copper-aluminum alloy, and its inner wall is tightly attached to the thermally conductive layer 400 on the circumferential outer wall of the laser housing 700. The contact surface is precision ground, and the bonding gap is ≤0.1mm. The radial heat dissipation fin assembly 120 consists of multiple aluminum alloy fins radially distributed on the outer side of the annular thermally conductive substrate 110. The fin height is 15mm, the thickness is 1.2mm, and the spacing between adjacent fins is 3mm. In order to facilitate gas concentration, an annular cover 130 is provided on the outer side of the fins. The annular cover 130 forms a first heat conduction channel 140 with the heat dissipation fin assembly 120, the thermally conductive layer 400, and the thermally conductive substrate.

[0040] Reference Figure 1 , Figure 2 and Figure 4The rear heat dissipation module 200 includes a rear heat-conducting plate 210, an air duct plate 230, and a fan 220. The rear heat-conducting plate 210 is a rectangular copper plate, which is fixed to the rear end face of the housing 700 by bolts, and a heat-conducting coating is applied between the two. Three sets of parallel fins 250 are provided on its outer side, with a fin spacing of 5mm. Multiple sets of air duct plates 230 are provided and are evenly distributed along the circumference of the housing 700, and all extend to the axis of the housing 700. The air duct plates 230 are connected to the fins 250. Each set includes two integrally set V-shaped plates with an obtuse angle between them. The two V-shaped plates are opposite to each other, so that the ends of two adjacent sets of air duct plates 230 away from the fins 250 are close to each other. The spacing between adjacent guide vanes decreases from 8mm on the air inlet side to 3mm on the air outlet side, forming a gradually narrowing flow channel. The air duct plate 230, the rear heat-conducting plate 210, and the fins 250 form the second heat-conducting channel 240; the fan 220 is a double ball bearing centrifugal fan 220, which is installed at the air outlet of the air duct plate 230 and drives the airflow to be drawn in from the circumferential air inlet of the housing 700 and flow along the gap of the air duct plate 230.

[0041] Furthermore, the heat-conducting copper pipe 300 is a copper pipe with an inner diameter of 3mm. The heat-conducting copper pipe 300 is divided into a first section and a second section. The first section is spirally arranged around the heat-conducting layer 400 and bent along the arc-shaped contact surface of the heat-conducting layer 400. A through hole is opened on the annular heat-conducting substrate 110. The first section extends through the through hole of the annular heat-conducting substrate 110 to the rear heat dissipation module 200 and communicates with the liquid cooling supply assembly. The liquid cooling supply assembly includes a circulating pump and a plate heat exchanger. The coolant (50% ethylene glycol aqueous solution) circulates in the copper pipe at a flow rate of 0.5m / s, forming a gas-liquid composite heat dissipation with the air cooling system. The second section is located in the rear heat dissipation module 200, in contact with the heat-conducting plate 210, and is hidden between the heat-conducting plate 210 and the shell 700. It is coiled and vortex-shaped.

[0042] The heat dissipation device also features an intelligent temperature control system, including temperature sensors: four PT100 sensors are embedded in the center of the annular thermal conductive substrate 110 and at the four corners of the rear thermal conductive plate 210, respectively; the controller dynamically adjusts the fan speed (500-3000 rpm) and liquid cooling flow rate (0.2-1.0 L / min) based on the sensor data. When the circumferential and rear temperature difference is >2℃, the liquid cooling system is activated first; when the temperature is <25℃, the liquid cooling is shut off to prevent condensation.

[0043] A flow-guiding enhancement component 500 is added to the front end of the circumferential heat dissipation component 100, including an outward-expanding flow guide shroud, a flow guide block 520, and a cooling fan 530. The outward-expanding flow guide shroud is located at the front end of the annular heat-conducting substrate 110 and is fixedly connected to the radial heat dissipation fin group 120. Its inner wall is an involute surface that satisfies Bernoulli's equation, and the outlet expansion angle is 25° to guide the airflow to evenly cover the heat dissipation fins. The flow guide block 520 is located at one end of the housing 700 near the rear heat dissipation module 200, and has a flow guide cavity that flows through the first heat conduction channel 140. It also has a 15° flow guide slope, and three cooling fans 530 are symmetrically installed on it to drive the airflow to flow along the first heat conduction channel 140. A flow guide channel 610 is provided on the housing 700. The flow guide channel 610 is located on the side of the cooling fan 530 away from the flow guide block 520 and is connected to the air inlet formed by the air duct plate 230.

[0044] When the laser is running, heat is conducted through the heat-conducting layer 400 to the annular heat-conducting substrate 110, and then diffused through the radial fin array (first heat-conducting channel 140). Simultaneously, heat from the rear is transferred by the heat-conducting plate 210 to the air duct plate 230, and the fan 220 drives airflow to be drawn in through the air inlet, accelerating heat dissipation through the tapered flow channel (second heat-conducting channel 240). When the temperature rise exceeds a threshold, the liquid cooling system activates, and the coolant absorbs circumferential and rearward heat within the copper tubes, then is discharged through the heat exchanger. The intelligent temperature control system adjusts the heat dissipation intensity in real time to ensure that the surface temperature difference of the housing 700 is ≤1.5℃.

[0045] This embodiment also provides a laser, which can be a fiber laser, a carbon dioxide laser, or a helium-neon (HeNe) laser, etc., with a cylindrical housing. The housing 700 integrates the aforementioned heat dissipation device. Testing showed that under a 10kW pulse condition, the peak temperature of the housing 700 decreased from 85℃ in the traditional solution to 62℃, improving heat dissipation efficiency by 40% and effectively ensuring the stability of laser output.

[0046] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A laser heat dissipation device, characterized in that: include: The circumferential heat dissipation assembly (100) includes an annular heat-conducting substrate (110) attached to the outer wall of the peripheral side of the laser housing (700) and a radially distributed heat dissipation fin group (120), wherein a plurality of the heat dissipation fin groups (120) form a first heat conduction channel (140). The rear heat dissipation module (200) is fixedly connected to the rear end face of the laser housing (700) and includes a heat-conducting plate (210), a fan (220) and an air duct plate (230). The heat-conducting plate (210) is disposed on the rear end face of the laser housing (700). Multiple sets of air duct plates (230) are disposed on the heat-conducting plate (210). The heat-conducting plate (210) and the multiple air duct plates (230) form a second heat conduction channel (240). An air inlet is formed on the periphery of the laser housing (700). The air inlet is connected to the second heat conduction channel (240). The fan (220) is disposed on the side of the air duct plate (230) away from the laser housing (700). The fan (220) drives the air through the air inlet and through the second heat conduction channel (240).

2. The laser heat dissipation device according to claim 1, characterized in that: It also includes a heat-conducting copper pipe (300) that connects the circumferential heat dissipation component (100) and the rear heat dissipation module (200) and a liquid cooling supply component; the liquid cooling supply component is connected to the heat-conducting copper pipe (300) and is used to circulate and supply coolant.

3. The laser heat dissipation device according to claim 2, characterized in that: It also includes an intelligent temperature control system that collects circumferential and rear temperature data in real time through temperature sensors and dynamically adjusts the parameters of the fan (220) and the liquid cooling supply assembly.

4. The laser heat dissipation device according to claim 3, characterized in that: The laser housing (700) is circumferentially coated with and formed with a thermally conductive layer (400), and microgrooves (410) are formed on the thermally conductive layer (400), and the annular thermally conductive substrate (110) is in contact with the thermally conductive layer (400).

5. The laser heat dissipation device according to claim 4, characterized in that: The heat-conducting copper pipe (300) passes through the annular heat-conducting substrate (110) on the side corresponding to the circumferential heat dissipation assembly (100) and is arranged along the heat-conducting layer (400).

6. The laser heat dissipation device according to any one of claims 1-5, characterized in that: The spacing between adjacent air duct plates (230) decreases gradually from the air inlet to the air outlet.

7. The laser heat dissipation device according to any one of claims 1-5, characterized in that: It also includes a flow enhancement component (500), which includes: an outwardly expanding flow guide shroud, which is fixed to the front end of the circumferential heat dissipation component (100) by a clamp, the inner wall surface of which satisfies Bernoulli's equation and the outlet expansion angle is 25°; A flow guide block (520) is disposed on the laser housing (700) and located on the side of the annular heat-conducting substrate (110) away from the fan (220), and forms a flow guide cavity communicating with the first heat-conducting channel (140); A fan (220) is disposed on the air guide block (520), and multiple fans are disposed therecorresponding to the first heat conduction channel (140).

8. A laser, characterized in that, Includes the laser heat dissipation device as described in any one of claims 1-7.

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