Circuit board assembly, optical module and communication equipment

Abstract

The utility model provides a circuit board assembly, an optical module and communication equipment. A first heat conduction part and a second heat conduction part are embedded in the circuit board. The back face of the electric chip faces the circuit board and is connected with the first heat conduction part. The back face of the optical chip faces the circuit board and is connected with the second heat conduction part, and the front face of the electric chip and the front face of the optical chip are electrically connected and arranged adjacently. The electric chip is a heat source device, the working heat of the electric chip can be conducted to the first heat conduction part through the back face of the electric chip, and independent heat dissipation of the electric chip is achieved. The optical chip is a heat-sensitive device, and the working heat of the optical chip can be conducted to the second heat conduction part through the back surface of the optical chip, thereby achieving the independent heat dissipation of the optical chip. A thermal isolation area is arranged between the first heat conduction part and the second heat conduction part, the electric chip and the optical chip keep thermal isolation, the working heat of the electric chip is difficult to conduct to the optical chip, the thermal crosstalk condition of the electric chip and the optical chip is reduced, the working temperature rise of the optical chip is low, the performance of the optical chip is kept or improved, and the reliability of the optical chip is good.

Description

Technical Field

[0001] This application relates to the field of circuit board assembly technology, and in particular to a circuit board assembly, an optical module, and a communication device. Background Technology

[0002] In related optical modules, printed circuit boards (PCBs) house electronic integrated circuits (EICs) and photonic integrated circuits (PICs). To reduce power loss during signal transmission, the EICs and PICs are spaced relatively close together. EICs consume significant power and experience substantial temperature rise, while PICs are temperature-sensitive devices. The heat generated by the EICs can easily be conducted to the PICs, leading to performance degradation and even overheating that can cause reliability issues. Utility Model Content

[0003] This application provides a circuit board assembly, an optical module, and a communication device, which solves the problem that the heat from the electrical chips on existing circuit boards is easily conducted to the optical chips, leading to a decrease in the performance of the optical chips.

[0004] The embodiments of this application adopt the following technical solutions:

[0005] In a first aspect, embodiments of this application provide a circuit board assembly, including: a circuit board, an electrical chip, and an optical chip. The electrical chip is disposed on the circuit board, with its back side facing the circuit board. The optical chip is disposed on the circuit board, with its back side facing the circuit board. The front sides of the electrical chip and the optical chip are electrically connected. The circuit board is embedded with a first heat-conducting part and a second heat-conducting part. The back side of the electrical chip is connected to the first heat-conducting part, and the back side of the optical chip is connected to the second heat-conducting part. A thermal isolation area is formed between the first heat-conducting part and the second heat-conducting part.

[0006] The electrical chip has a front and a back side facing each other. The front side of the electrical chip is the pad side, and the back side is the non-pad side and has a metal skin (such as copper skin).

[0007] The optical chip has a front and a back side facing each other. The front side of the optical chip is the pad side, and the back side is the non-pad side and has a metal skin (such as copper skin).

[0008] The front side of the electrical chip and the front side of the optical chip are electrically connected, allowing the electrical chip and the optical chip to be arranged adjacent to each other or close to each other, and signals of electro-optical conversion can be transmitted between them.

[0009] The circuit board assembly provided in this application embodiment has a first heat-conducting part and a second heat-conducting part embedded in the circuit board, which are isolated from each other. The back side of the electrical chip faces the circuit board and is connected to the first heat-conducting part. The back side of the optical chip faces the circuit board and is connected to the second heat-conducting part. The front side of the electrical chip and the front side of the optical chip are electrically connected and arranged adjacent to each other. The electrical chip is a heat source device, and the operating heat of the electrical chip can be conducted to the first heat-conducting part through the back side of the electrical chip, realizing independent heat dissipation of the electrical chip. The optical chip is a heat-sensitive device, and the operating heat of the optical chip can be conducted to the second heat-conducting part through the back side of the optical chip, realizing independent heat dissipation of the optical chip. There is a thermal isolation area between the first heat-conducting part and the second heat-conducting part, which keeps the electrical chip and the optical chip thermally isolated. The operating heat of the electrical chip is difficult to be conducted to the optical chip, reducing thermal crosstalk between the electrical chip and the optical chip, resulting in a lower operating temperature rise of the optical chip, maintaining or improving the performance of the optical chip, and improving the reliability of the optical chip.

[0010] In one alternative implementation, the front sides of the electrical chip and the optical chip are electrically connected via leads. Connecting the leads between the front pads of the electrical chip and the optical chip easily achieves this electrical connection. Arranging the electrical and optical chips adjacent to or close to each other reduces power loss during signal transmission between them.

[0011] In one alternative implementation, the front side of the electrical chip is electrically connected to the circuit board via a first lead, and the front side of the optical chip is electrically connected to the circuit board via a second lead. The first and second leads are electrically connected via traces on the circuit board. By using different leads to connect the front pads of the electrical chip and the optical chip to the circuit board, and combining this with the circuit board's traces to connect the first and second leads, the electrical connection between the electrical chip and the optical chip can be achieved.

[0012] In one alternative implementation, the first heat-conducting part is a first heat-conducting block. One or both sides of the first heat-conducting block are exposed on the surface of the circuit board. The first heat-conducting block is not connected to the second heat-conducting part or the back side of the optical chip. The back side of the electrical chip is connected to the first heat-conducting block. The operating heat of the electrical chip can be conducted to the first heat-conducting block through the back side of the electrical chip. Heat is then dissipated outward through the first heat-conducting block.

[0013] In one alternative implementation, the first heat-conducting part is a first heat-conducting pillar. A through-hole is provided on the circuit board, and the first heat-conducting pillar is disposed within the through-hole. The two ends of the first heat-conducting pillar are exposed on two opposing surfaces of the circuit board. The back side of the electrical chip is connected to the first heat-conducting pillar. The operating heat of the electrical chip can be conducted to the first heat-conducting pillar through the back side of the electrical chip. Heat is then dissipated outwards through the first heat-conducting pillar.

[0014] In one alternative implementation, the first heat-conducting part includes a first heat-conducting block and a first heat-conducting pillar. The first heat-conducting block is embedded in the circuit board and is not connected to the second heat-conducting part or the back side of the optical chip. A through-hole is provided on the circuit board, and the first heat-conducting pillar is disposed within the through-hole. The first heat-conducting pillar is connected to the first heat-conducting block. At least a portion of the first heat-conducting pillar and the first heat-conducting block is exposed on the surface of the circuit board. The back side of the electrical chip is connected to the first heat-conducting pillar. The operating heat of the electrical chip can be conducted through the back side of the electrical chip to the first heat-conducting pillar, and then to the first heat-conducting block. Heat is dissipated outward through the first heat-conducting block and / or the first heat-conducting pillar.

[0015] In one optional implementation, the first heat-conducting part includes a first heat-conducting block and two sets of first heat-conducting pillars. The two sets of first heat-conducting pillars are located on opposite sides of the first heat-conducting block and connected to it. The first heat-conducting block can be completely embedded in the circuit board, and the two sets of first heat-conducting pillars can be embedded in the circuit board, with the ends of the first heat-conducting pillars away from the first heat-conducting block exposed on the surface of the circuit board. The back side of the electrical chip is connected to one set of first heat-conducting pillars. The operating heat of the electrical chip can be conducted through the back side of the chip to the upper set of first heat-conducting pillars, and then sequentially to the first heat-conducting block and the lower set of first heat-conducting pillars. Heat is then dissipated outwards through the lower set of first heat-conducting pillars.

[0016] In one alternative implementation, the second heat-conducting part is a second heat-conducting block. One or both sides of the second heat-conducting block are exposed on the surface of the circuit board. The second heat-conducting block is not connected to the first heat-conducting part or the back side of the electrical chip. The back side of the optical chip is connected to the second heat-conducting block. The operating heat of the optical chip can be conducted to the second heat-conducting block through the back side of the optical chip. Heat is then dissipated outward through the second heat-conducting block.

[0017] In one alternative implementation, the second heat-conducting part is a second heat-conducting pillar. A through-hole is provided on the circuit board, and the second heat-conducting pillar is disposed within the through-hole. The two ends of the second heat-conducting pillar are exposed on two opposing surfaces of the circuit board. Multiple discrete second heat-conducting pillars can be arranged on the circuit board to improve heat conduction. The back side of the optical chip is connected to the second heat-conducting pillar. The operating heat of the optical chip can be conducted to the second heat-conducting pillar through the back side of the optical chip. Heat is then dissipated outward through the second heat-conducting pillar.

[0018] In one optional implementation, the second heat-conducting part includes a second heat-conducting block and a second heat-conducting pillar. The second heat-conducting block is embedded in the circuit board and is not connected to the first heat-conducting part or the back side of the electronic chip. A through-hole is provided on the circuit board, and the second heat-conducting pillar is disposed within the through-hole. The second heat-conducting pillar is connected to the second heat-conducting block. At least a portion of the second heat-conducting pillar and the second heat-conducting block is exposed on the surface of the circuit board. The back side of the optical chip is connected to the second heat-conducting pillar. The operating heat of the optical chip can be conducted through the back side of the optical chip to the second heat-conducting pillar, and then to the second heat-conducting block. Heat is dissipated outward through the second heat-conducting block and / or the second heat-conducting pillar.

[0019] In one optional implementation, the second heat-conducting part includes a second heat-conducting block and two sets of second heat-conducting pillars. The two sets of second heat-conducting pillars are located on opposite sides of the second heat-conducting block and connected to it. The second heat-conducting block can be completely embedded in the circuit board, and the two sets of second heat-conducting pillars can be embedded in the circuit board, with the ends of the second heat-conducting pillars away from the second heat-conducting block exposed on the surface of the circuit board. This connects the back side of the optical chip to the upper set of second heat-conducting pillars. The operating heat of the optical chip can be conducted through the back side of the optical chip to the upper set of second heat-conducting pillars, and then sequentially to the second heat-conducting block and the lower set of second heat-conducting pillars. Heat is then dissipated outward through the lower set of second heat-conducting pillars.

[0020] In one alternative implementation, the first heat-conducting part includes a first heat-conducting block and a first heat-conducting pillar. The second heat-conducting part includes a second heat-conducting block and a second heat-conducting pillar.

[0021] In one alternative implementation, the first heat-conducting part is a first heat-conducting pillar. The second heat-conducting part includes a second heat-conducting block and a second heat-conducting pillar.

[0022] In one alternative implementation, the first heat-conducting part is a first heat-conducting block, and the second heat-conducting part is a second heat-conducting block.

[0023] In one alternative implementation, the first heat-conducting part is a first heat-conducting pillar, and the second heat-conducting part is a second heat-conducting pillar.

[0024] In one alternative implementation, the first heat-conducting part includes a first heat-conducting block and a first heat-conducting pillar. The second heat-conducting part is a second heat-conducting pillar.

[0025] In one alternative implementation, the first heat-conducting part is exposed on the surface of the circuit board. The operating heat of the electrical chip can be conducted through the back of the electrical chip to the first heat-conducting part, and then dissipated outward through the exposed first heat-conducting part.

[0026] In one alternative implementation, the second heat-conducting part is exposed on the surface of the circuit board. The operating heat of the optical chip can be conducted through the back of the optical chip to the second heat-conducting part, and then dissipated outward through the exposed second heat-conducting part.

[0027] In one alternative implementation, the thermal isolation area is a portion of the insulating part of the circuit board. The first thermally conductive part and the second thermally conductive part are spaced apart and thermally isolated from each other by a portion of the insulating part of the circuit board, so that the first thermally conductive part and the second thermally conductive part will not have thermal crosstalk.

[0028] In one alternative implementation, the thermal isolation region is a thermal isolation portion disposed within the circuit board. The thermal conductivity of the thermal isolation portion is lower than that of the first thermally conductive portion, and the thermal conductivity of the thermal isolation portion is lower than that of the second thermally conductive portion. Maintaining a distance between the first and second thermally conductive portions and providing a thermally isolation portion with lower thermal conductivity between them reduces thermal crosstalk between the first and second thermally conductive portions.

[0029] In one alternative implementation, the thermal insulation part can be made of a material with low thermal conductivity, such as resin or glass fiber.

[0030] In one alternative implementation, the thermal isolation area is a slot provided on the circuit board. This maintains a distance between the first and second heat-conducting parts, and the slot is provided in the circuit board area between the first and second heat-conducting parts to reduce thermal crosstalk between them.

[0031] In one alternative implementation, the electrical chip includes at least one of a driver chip, a transimpedance amplifier, and an optical digital signal processor.

[0032] In one alternative implementation, the optical chip includes at least one of a semiconductor laser, a semiconductor detector, a silicon photonic chip, and a light-emitting diode.

[0033] In one alternative implementation, the semiconductor laser can be a direct-modulated laser, a vertical-cavity surface-emitting laser, or an electro-absorption modulated laser.

[0034] In one alternative implementation, the circuit board assembly is used in the optical module. The circuit board includes a driver chip and a vertical-cavity surface-emitting laser (VCSEL). The driver chip is an electrical chip, and the VCSEL is an optical chip. Multiple first heat-conducting pillars are embedded in the circuit board corresponding to the driver chip, serving as first heat-conducting sections. Two sets of second heat-conducting pillars and a second heat-conducting block are embedded in the circuit board corresponding to the VCSEL. The two sets of second heat-conducting pillars are connected to opposite sides of the second heat-conducting block, serving as second heat-conducting sections. A thermal isolation zone exists between the first and second heat-conducting sections. The electrical chip dissipates heat independently through the first heat-conducting section, and the optical chip dissipates heat independently through the second heat-conducting section. The operating heat from the electrical chip is difficult to conduct to the optical chip, reducing thermal crosstalk between the electrical and optical chips during operation.

[0035] In one alternative implementation, the first heat-conducting part is made of copper, aluminum, or gold. These first heat-conducting parts have high thermal conductivity. The operating heat of the electrical chip can be conducted to the first heat-conducting part through the back of the electrical chip, and then efficiently dissipated to the outside through the first heat-conducting part.

[0036] In one alternative implementation, the second heat-conducting part is made of copper, aluminum, or gold. These second heat-conducting parts have high thermal conductivity. The operating heat of the optical chip can be conducted to the second heat-conducting part through the back of the optical chip, and then efficiently dissipated to the outside through the second heat-conducting part.

[0037] In one alternative implementation, the front side of the electrical chip and the circuit board can be electrically connected via leads. Connecting the leads between the pads on the front side of the electrical chip and the pads on the circuit board achieves the electrical connection between the electrical chip and the circuit board.

[0038] In one alternative implementation, the electrical chip and the optical chip can be respectively bonded to the circuit board using different thermally conductive patches, facilitating their assembly on the circuit board. The operating heat of the electrical chip can be conducted from its back side through the thermally conductive patches to a first thermally conductive part, from which it is dissipated to the outside. The operating heat of the optical chip can be conducted from its back side through the thermally conductive patches to a second thermally conductive part, from which it is dissipated to the outside.

[0039] In one alternative implementation, the electrical chip and the optical chip are located on the same surface of the circuit board. This approach facilitates the arrangement of the electrical and optical chips, has a simple structure, enables electrical connection between the electrical and optical chips, and meets the requirements for high-speed interconnection between them.

[0040] In one alternative implementation, the electrical chip and the optical chip are located on opposite surfaces of the circuit board. Electrical connection between the electrical chip and the optical chip is achieved. The front side of the electrical chip is electrically connected to the circuit board via a first lead, and the front side of the optical chip is electrically connected to the circuit board via a second lead. The first and second leads are electrically connected via traces on the circuit board.

[0041] In one alternative implementation, the circuit board can be a rigid printed circuit board. The electrical chip and the optical chip can be located on the same surface of the circuit board, or they can be located on opposite surfaces of the circuit board.

[0042] In one alternative implementation, the circuit board can be a stacked structure of a flexible circuit board and a reinforcing sheet. The electrical chip and optical chip are located on the side of the flexible circuit board facing away from the reinforcing sheet. The reinforcing sheet enhances the structural strength of the flexible circuit board. The reinforcing sheet can be a steel sheet, etc.

[0043] Secondly, embodiments of this application provide an optical module, including the aforementioned circuit board assembly. An optical module is an optoelectronic device that realizes photoelectric conversion and electro-optical conversion functions during optical signal transmission.

[0044] In one alternative implementation, the optoelectronic conversion module is an optical module, also known as a fiber optic transceiver, which is an Ethernet transmission media conversion unit that converts short-distance twisted-pair electrical signals to long-distance optical signals.

[0045] In one alternative implementation, the optical module can be packaged in the form of dual-density four-channel small pluggable, eight-channel small pluggable, ultra-density eight-channel small pluggable, or second-generation packaged pluggable, etc.

[0046] Thirdly, embodiments of this application provide a communication device, including the circuit board assembly or the optical module described above.

[0047] In one alternative implementation, the communication equipment can be a cabinet top switch, leaf switch, spine switch, core switch, router, wavelength division multiplexing (WDM) equipment, etc.

[0048] The optical module and communication device provided in this application embodiment have an electrical connection between the front side of the electrical chip and the front side of the optical chip in the circuit board assembly, and the two are arranged adjacent to each other. The electrical chip is a heat source device, and the operating heat of the electrical chip can be conducted to the first heat-conducting part through the back side of the electrical chip, realizing independent heat dissipation of the electrical chip. The optical chip is a heat-sensitive device, and the operating heat of the optical chip can be conducted to the second heat-conducting part through the back side of the optical chip, realizing independent heat dissipation of the optical chip. There is a thermal isolation area between the first heat-conducting part and the second heat-conducting part, keeping the electrical chip and the optical chip thermally isolated. The operating heat of the electrical chip is difficult to be conducted to the optical chip, reducing thermal crosstalk between the electrical chip and the optical chip, resulting in a lower operating temperature rise of the optical chip, maintaining or improving the performance of the optical chip, and improving the reliability of the optical chip. Attached Figure Description

[0049] Figure 1 This is a schematic diagram of the circuit board assembly provided in an embodiment of this application;

[0050] Figure 2 A front view of the circuit board assembly provided in an embodiment of this application;

[0051] Figure 3 for Figure 2 A cross-sectional view of the circuit board assembly along line AA;

[0052] Figure 4 This is a schematic diagram of the structure of a circuit board assembly provided in another embodiment of this application;

[0053] Figure 5 A front view of a circuit board assembly provided in another embodiment of this application;

[0054] Figure 6 for Figure 5 A cross-sectional view of the circuit board assembly along line BB;

[0055] Figures 7 to 13 These are schematic diagrams of the circuit board assemblies provided in different embodiments of this application.

[0056] Explanation of reference numerals in the attached figures:

[0057] 1-Circuit board assembly; 2-Circuit board; 3-Electrical chip; 3a-Front side of electrical chip; 3b-Back side of electrical chip; 4-Optical chip; 4a-Front side of optical chip; 4b-Back side of optical chip; 5-Lead wire; 6-Heat-conducting part;

[0058] 100 - Circuit board assembly;

[0059] 10-Circuit board; 11-Trace; 12-Through hole; 13-Through hole; 10a-Printed circuit board; 10b-Flexible circuit board; 10c-Reinforcing sheet;

[0060] 20 - Electrical chip; 20a - Front side of electrical chip; 20b - Back side of electrical chip;

[0061] 30 - Optical chip; 30a - Front side of optical chip; 30b - Back side of optical chip;

[0062] 40 - First heat-conducting part; 41 - First heat-conducting block; 42 - First heat-conducting column;

[0063] 50 - Second heat-conducting part; 51 - Second heat-conducting block; 52 - Second heat-conducting column;

[0064] 60 - Thermal isolation zone; 61 - Insulation section; 62 - Thermal isolation section; 63 - Groove;

[0065] 70 - Lead wire; 71 - First lead wire; 72 - Second lead wire. Detailed Implementation

[0066] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application. Although the description of this application is presented in conjunction with some embodiments, this does not mean that the features of this application are limited to this implementation. On the contrary, the purpose of describing the application in conjunction with embodiments is to cover other options or modifications that may arise based on the claims of this application. To provide a thorough understanding of this application, many specific details will be included in the following description. This application may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of this application, some specific details will be omitted in the description. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other.

[0067] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0068] It should be understood that, in the description of the embodiments of this application, unless otherwise expressly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. The terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0069] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0070] In the embodiments of this application, "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0071] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0072] See Figure 1A circuit board assembly 1 according to an embodiment of this application includes: a circuit board 2, an electrical chip 3, and an optical chip 4. The electrical chip 3 is disposed on the circuit board 2, with its back surface 3b facing the circuit board 2. The optical chip 4 is disposed on the circuit board 2, with its back surface 4b facing the circuit board 2. The front surface 3a of the electrical chip 3 and the front surface 4a of the optical chip 4 are electrically connected by a lead 5. A heat-conducting part 6 is embedded in the circuit board 2. The heat-conducting part 6 can be made of a highly thermally conductive material, such as copper. The back surface 3b of the electrical chip 3 and the heat-conducting part 6 are connected, and the back surface 4b of the optical chip 4 is also connected to the heat-conducting part 6.

[0073] Electrical chip 3 and optical chip 4 share a heat-conducting part 6. The operating heat from both chips can be conducted to the heat-conducting part 6 for dissipation. However, the power consumption of electrical chip 3 is greater than that of optical chip 4, and its temperature is higher. Electrical chip 3 is a heat source device, while optical chip 4 is a heat-sensitive device. The operating heat from electrical chip 3 is conducted to optical chip 4 through the heat-conducting part 6, meaning optical chip 4 is heated by electrical chip 3. This thermal crosstalk between electrical chip 3 and the heat source chip degrades the performance of optical chip 4. Figure 1 In the middle, the arrow on the heat-conducting part 6 indicates the direction of heat conduction.

[0074] See Figure 2 , Figure 3 This application provides a circuit board assembly 100, including a circuit board 10, an electrical chip 20, and an optical chip 30. The electrical chip 20 is disposed on the circuit board 10, with its back surface 20b facing the circuit board 10. The optical chip 30 is disposed on the circuit board 10, with its back surface 30b facing the circuit board 10. The front surface 20a of the electrical chip 20 and the front surface 30a of the optical chip 30 are electrically connected. The circuit board 10 is embedded with a first heat-conducting part 40 and a second heat-conducting part 50. The back surface 20b of the electrical chip 20 is connected to the first heat-conducting part 40, and the back surface 30b of the optical chip 30 is connected to the second heat-conducting part 50. A thermal isolation region 60 is formed between the first heat-conducting part 40 and the second heat-conducting part 50.

[0075] exist Figure 3 In the following figures and other accompanying drawings, the arrows on the first heat-conducting part 40 and the second heat-conducting part 50 indicate the direction of heat conduction.

[0076] The electrical chip 20 has a front side 20a and a back side 20b that are opposite to each other. The front side 20a of the electrical chip 20 is the pad side, and the back side 20b is the non-pad side and has a metal skin (such as copper skin).

[0077] The optical chip 30 has a front side 30a and a back side 30b facing each other. The front side 30a of the optical chip 30 is the pad side, and the back side 30b is the non-pad side and has a metal skin (such as copper skin).

[0078] The front surface 20a of the electrical chip 20 and the front surface 30a of the optical chip 30 are electrically connected, so that the electrical chip 20 and the optical chip 30 are arranged adjacent to each other or close to each other, and can transmit electro-optical conversion signals between them.

[0079] The circuit board assembly 100 provided in this application embodiment has a circuit board 10 embedded with a first heat-conducting part 40 and a second heat-conducting part 50 that are isolated from each other. The back side 20b of the electrical chip 20 faces the circuit board 10 and is connected to the first heat-conducting part 40. The back side 30b of the optical chip 30 faces the circuit board 10 and is connected to the second heat-conducting part 50. The front side 20a of the electrical chip 20 and the front side 30a of the optical chip 30 are electrically connected and arranged adjacent to each other. The electrical chip 20 is a heat source device, and the operating heat of the electrical chip 20 can be conducted to the first heat-conducting part 40 through the back side 20b of the electrical chip 20, realizing individual heat dissipation of the electrical chip 20. The optical chip 30 is a heat-sensitive device, and the operating heat of the optical chip 30 can be conducted to the second heat-conducting part 50 through the back side 30b of the optical chip 30, realizing individual heat dissipation of the optical chip 30. The first heat-conducting part 40 and the second heat-conducting part 50 are separated by a thermal isolation zone 60. The electrical chip 20 and the optical chip 30 are kept thermally isolated, and the working heat of the electrical chip 20 is difficult to be conducted to the optical chip 30. This reduces the thermal crosstalk between the electrical chip 20 and the optical chip 30, resulting in a lower operating temperature rise of the optical chip 30. The performance of the optical chip 30 is maintained or improved, and the reliability of the optical chip 30 is good.

[0080] There are several possible implementation methods for achieving the electrical connection between the electrical chip 20 and the optical chip 30. Two exemplary implementation methods are given below.

[0081] The first method for implementing electrical connection between electrical chip 20 and optical chip 30: See [link / reference] Figures 2 to 4 The front side 20a of the electrical chip 20 and the front side 30a of the optical chip 30 are electrically connected by a lead 70.

[0082] By using wire bonding, connecting the lead 70 between the front-side pad 20a of the electrical chip 20 and the front-side pad 30a of the optical chip 30, an electrical connection between the electrical chip 20 and the optical chip 30 can be achieved, which is easy to implement. Arranging the electrical chip 20 and the optical chip 30 adjacent to or close to each other can reduce power loss during signal transmission between the two chips.

[0083] Wire bonding (WB), also known as wire bonding, uses metal wires to tightly weld leads 70 to pads under the combined effects of heat, pressure, and ultrasonic energy, achieving electrical interconnection and information exchange between different locations.

[0084] The second method for implementing the electrical connection between electrical chip 20 and optical chip 30: See [link / reference] Figure 5 , Figure 6The front side 20a of the electrical chip 20 is electrically connected to the circuit board 10 via a first lead 71, and the front side 30a of the optical chip 30 is electrically connected to the circuit board 10 via a second lead 72. The first lead 71 and the second lead 72 are electrically connected via traces 11 on the circuit board 10.

[0085] By using wire bonding, different wires are used to connect the front 20a pad of the electrical chip 20 and the front 30a pad of the optical chip 30 to the circuit board 10 respectively. Combined with the wiring 11 of the circuit board 10 to connect the first wire 71 and the second wire 72, the electrical connection between the electrical chip 20 and the optical chip 30 can be achieved, which is easy to implement.

[0086] There are several possible implementation methods when setting the first conductive part. Three implementation methods are given as examples below.

[0087] The first implementation method of the first heat-conducting part 40: see [link / reference] Figure 7 The first heat-conducting part 40 is a first heat-conducting block 41. The first heat-conducting block 41 is embedded in the circuit board 10, with one or both sides of the first heat-conducting block 41 exposed on the surface of the circuit board 10. The first heat-conducting block 41 is not connected to the second heat-conducting part 50 or the back surface 30b of the optical chip 30. The back surface 20b of the electrical chip 20 is connected to the first heat-conducting block 41. The operating heat of the electrical chip 20 can be conducted to the first heat-conducting block 41 through the back surface 20b of the electrical chip 20. Heat is then dissipated outward through the first heat-conducting block 41.

[0088] The second implementation method of the first heat-conducting part 40: see [link / reference] Figure 4 , Figure 8 The first heat-conducting part 40 is a first heat-conducting pillar 42. A through-hole 12 is provided on the circuit board 10, and the first heat-conducting pillar 42 is disposed within the through-hole 12. The two ends of the first heat-conducting pillar 42 are exposed on two opposing surfaces of the circuit board 10. Multiple discrete first heat-conducting pillars 42 can be arranged on the circuit board 10 to improve heat conduction. The back surface 20b of the electrical chip 20 is connected to the first heat-conducting pillar 42. The operating heat of the electrical chip 20 can be conducted to the first heat-conducting pillar 42 through the back surface 20b of the electrical chip 20. Heat is then dissipated outwards through the first heat-conducting pillar 42.

[0089] The third implementation method of the first heat-conducting part 40: see [link / reference] Figure 3 , Figure 6 , Figure 9The first heat-conducting part 40 includes a first heat-conducting block 41 and a first heat-conducting pillar 42. The first heat-conducting block 41 is embedded in the circuit board 10 and is not connected to the second heat-conducting part 50 or the back surface 30b of the optical chip 30. A through hole 12 is provided on the circuit board 10, and the first heat-conducting pillar 42 is disposed within the through hole 12. The first heat-conducting pillar 42 is connected to the first heat-conducting block 41. At least a portion of the first heat-conducting pillar 42 and the first heat-conducting block 41 is exposed on the surface of the circuit board 10. The back surface 20b of the electrical chip 20 is connected to the first heat-conducting pillar 42. The operating heat of the electrical chip 20 can be conducted through the back surface 20b of the electrical chip 20 to the first heat-conducting pillar 42, and then to the first heat-conducting block 41. Heat is dissipated outward through the first heat-conducting block 41 and / or the first heat-conducting pillar 42.

[0090] For example, see Figure 3 The first heat-conducting part 40 includes a first heat-conducting block 41 and two sets of first heat-conducting pillars 42. The two sets of first heat-conducting pillars 42 are located on opposite sides of the first heat-conducting block 41 and connected to the first heat-conducting block 41. The first heat-conducting block 41 can be completely embedded in the circuit board 10, and the two sets of first heat-conducting pillars 42 can be embedded in the circuit board 10. The end of the first heat-conducting pillar 42 away from the first heat-conducting block 41 is exposed on the surface of the circuit board 10. This connects the back surface 20b of the electrical chip 20 to one of the sets of first heat-conducting pillars 42.

[0091] The heat generated by the electrical chip 20 can be conducted through the back surface 20b of the electrical chip 20 to the upper set of first heat-conducting pillars 42, and then sequentially to the first heat-conducting block 41 and the lower set of first heat-conducting pillars 42. Heat is then dissipated outwards through the lower set of first heat-conducting pillars 42.

[0092] There are several possible implementation methods when setting the second conductive part. Three implementation methods are given as examples below.

[0093] The first implementation method of the second heat-conducting part 50: see [link / reference] Figure 7 The second heat-conducting part 50 is a second heat-conducting block 51. The second heat-conducting block 51 is embedded in the circuit board 10, with one or both sides of the second heat-conducting block 51 exposed on the surface of the circuit board 10. The second heat-conducting block 51 is not connected to the first heat-conducting part 40 or the back surface 20b of the electrical chip 20. The back surface 30b of the optical chip 30 is connected to the second heat-conducting block 51. The operating heat of the optical chip 30 can be conducted to the second heat-conducting block 51 through the back surface 30b of the optical chip 30. Heat is then dissipated outwards through the second heat-conducting block 51.

[0094] The second implementation method of the second heat-conducting part 50: see [link / reference] Figure 8 , Figure 9The second heat-conducting part 50 is a second heat-conducting pillar 52. A through-hole 13 is provided on the circuit board 10, and the second heat-conducting pillar 52 is disposed within the through-hole 13. The two ends of the second heat-conducting pillar 52 are exposed on two opposing surfaces of the circuit board 10. Multiple discrete second heat-conducting pillars 52 can be arranged on the circuit board 10 to improve heat conduction. The back surface 30b of the optical chip 30 is connected to the second heat-conducting pillar 52. The operating heat of the optical chip 30 can be conducted to the second heat-conducting pillar 52 through the back surface 30b of the optical chip 30. Heat is then dissipated outwards through the second heat-conducting pillar 52.

[0095] The third implementation method of the second heat-conducting part 50: see [link / reference] Figure 3 , Figure 4 , Figure 6 The second heat-conducting part 50 includes a second heat-conducting block 51 and a second heat-conducting pillar 52. The second heat-conducting block 51 is embedded in the circuit board 10 and is not connected to the first heat-conducting part 40 or the back surface 20b of the electronic chip 20. A through hole 13 is provided on the circuit board 10, and the second heat-conducting pillar 52 is disposed within the through hole 13. The second heat-conducting pillar 52 is connected to the second heat-conducting block 51. At least a portion of the second heat-conducting pillar 52 and the second heat-conducting block 51 is exposed on the surface of the circuit board 10. The back surface 30b of the optical chip 30 is connected to the second heat-conducting pillar 52. The operating heat of the optical chip 30 can be conducted through the back surface 30b of the optical chip 30 to the second heat-conducting pillar 52, and then to the second heat-conducting block 51. Heat is dissipated outward through the second heat-conducting block 51 and / or the second heat-conducting pillar 52.

[0096] For example, see Figure 3 The second heat-conducting part 50 includes a second heat-conducting block 51 and two sets of second heat-conducting pillars 52. The two sets of second heat-conducting pillars 52 are located on opposite sides of the second heat-conducting block 51 and connected to it. The second heat-conducting block 51 can be completely embedded in the circuit board 10, and the two sets of second heat-conducting pillars 52 can be embedded in the circuit board 10. The end of the second heat-conducting pillar 52 away from the second heat-conducting block 51 is exposed on the surface of the circuit board 10. This connects the back surface 30b of the optical chip 30 to the upper set of second heat-conducting pillars 52.

[0097] The heat generated by the optical chip 30 can be conducted through the back surface 30b of the optical chip 30 to the upper set of second heat-conducting pillars 52, and then sequentially to the second heat-conducting block 51 and the lower set of second heat-conducting pillars 52. Heat is then dissipated outwards through the lower set of second heat-conducting pillars 52.

[0098] It is understandable that the above three implementation methods of the first heat-conducting part 40 and the three implementation methods of the second heat-conducting part 50 can be arbitrarily selected and combined.

[0099] For example, see Figure 3 , Figure 6The first heat-conducting part 40 includes a first heat-conducting block 41 and a first heat-conducting pillar 42. The second heat-conducting part 50 includes a second heat-conducting block 51 and a second heat-conducting pillar 52.

[0100] For example, see Figure 4 The first heat-conducting part 40 is a first heat-conducting pillar 42. The second heat-conducting part 50 includes a second heat-conducting block 51 and a second heat-conducting pillar 52.

[0101] For example, see Figure 7 The first heat-conducting part 40 is the first heat-conducting block 41, and the second heat-conducting part 50 is the second heat-conducting block 51.

[0102] For example, see Figure 8 The first heat-conducting part 40 is the first heat-conducting pillar 42, and the second heat-conducting part 50 is the second heat-conducting pillar 52.

[0103] For example, see Figure 9 The first heat-conducting part 40 includes a first heat-conducting block 41 and a first heat-conducting pillar 42. The second heat-conducting part 50 is a second heat-conducting pillar 52.

[0104] In some embodiments, see Figure 3 , Figure 4 The first heat-conducting part 40 is exposed on the surface of the circuit board 10. The operating heat of the electrical chip 20 can be conducted to the first heat-conducting part 40 through the back side 20b of the electrical chip 20, and then dissipated to the outside through the exposed first heat-conducting part 40.

[0105] In some embodiments, see Figure 3 , Figure 4 The second heat-conducting part 50 is exposed on the surface of the circuit board 10. The operating heat of the optical chip 30 can be conducted to the second heat-conducting part 50 through the back surface 30b of the optical chip 30, and then dissipated to the outside through the exposed second heat-conducting part 50.

[0106] There are several possible implementation methods when setting the thermal isolation zone 60. Three implementation methods are given as examples below.

[0107] The first method for implementing thermal isolation zone 60: See [link / reference] Figure 3 , Figure 4 , Figures 6 to 9 The thermal isolation zone 60 is part of the insulating part 61 of the circuit board 10.

[0108] When manufacturing the circuit board 10 in which the first heat-conducting part 40 and the second heat-conducting part 50 are embedded, the first heat-conducting part 40 and the second heat-conducting part 50 are spaced apart and thermally isolated from each other by a portion of the insulating part 61 of the circuit board 10, so that the first heat-conducting part 40 and the second heat-conducting part 50 will not have thermal crosstalk. The portion of the insulating part 61 of the circuit board 10 is part of the insulating layer of the circuit board 10 itself.

[0109] The second method for implementing thermal isolation zone 60: See [link / reference] Figure 10 The thermal isolation zone 60 is a thermal isolation part 62 disposed within the circuit board 10. The thermal conductivity of the thermal isolation part 62 is less than that of the first thermally conductive part 40, and the thermal conductivity of the thermal isolation part 62 is less than that of the second thermally conductive part 50. Thermal conductivity, also known as thermal conductivity coefficient or thermal conductivity, is a physical quantity that represents the magnitude of a material's ability to conduct heat.

[0110] During the fabrication of the circuit board 10, the first heat-conducting part 40 and the second heat-conducting part 50 are kept apart, and a thermal isolation part 62 with low thermal conductivity is provided between the first heat-conducting part 40 and the second heat-conducting part 50 to reduce thermal crosstalk between the first heat-conducting part 40 and the second heat-conducting part 50.

[0111] The thermal insulation part 62 can be made of a material with low thermal conductivity, such as resin or glass fiber.

[0112] The third method for implementing thermal isolation zone 60: See [link / reference] Figure 11 The thermal isolation area 60 is a slot 63 provided on the circuit board 10. During the fabrication of the circuit board 10, the first heat-conducting part 40 and the second heat-conducting part 50 are kept apart, and the slot 63 is provided in the area of ​​the circuit board 10 between the first heat-conducting part 40 and the second heat-conducting part 50 to reduce thermal crosstalk between the first heat-conducting part 40 and the second heat-conducting part 50.

[0113] In some embodiments, see Figure 3 , Figure 4 The electrical chip 20 includes at least one of a driver (DRV) chip, a transimpedance amplifier (TIA), and an optical digital signal processor (oDSP).

[0114] In some embodiments, see Figure 3 , Figure 4 The optical chip 30 includes at least one of a semiconductor laser, a semiconductor detector, a silicon photonic chip, and a light-emitting diode (LED).

[0115] Semiconductor lasers can be directly modulated lasers (DML), vertical cavity surface emitting lasers (VCSEL), or electroabsorption modulated lasers (EML).

[0116] For example, see Figure 2 , Figure 3 The circuit board assembly 100 is used in an optical module. The circuit board 10 includes a DRV chip (electrical chip 20) and a VCSEL (optical chip 30). Multiple first heat-conducting pillars 42 are embedded in the circuit board 10 corresponding to the DRV chip positions, serving as first heat-conducting sections 40. Two sets of second heat-conducting pillars 52 and a second heat-conducting block 51 are embedded in the circuit board 10 corresponding to the VCSEL positions. The two sets of second heat-conducting pillars 52 are respectively connected to opposite sides of the second heat-conducting block 51, serving as second heat-conducting sections 50. A thermal isolation zone 60 is formed between the first heat-conducting sections 40 and 50. The electrical chip 20 dissipates heat independently through the first heat-conducting section 40, and the optical chip 30 dissipates heat independently through the second heat-conducting section 50. The operating heat of the electrical chip 20 is difficult to conduct to the optical chip 30, reducing thermal crosstalk between the electrical chip 20 and the optical chip 30 during operation.

[0117] In some embodiments, see Figure 3 , Figure 4 The first heat-conducting part 40 is made of copper, aluminum, or gold. These first heat-conducting parts 40 have high thermal conductivity. The operating heat of the electrical chip 20 can be conducted to the first heat-conducting part 40 through the back surface 20b of the electrical chip 20, and then efficiently dissipated to the outside through the first heat-conducting part 40.

[0118] In some embodiments, see Figure 3 , Figure 4 The second heat-conducting part 50 is made of copper, aluminum, or gold. These second heat-conducting parts 50 have high thermal conductivity. The operating heat of the optical chip 30 can be conducted to the second heat-conducting part 50 through the back surface 30b of the optical chip 30, and then efficiently dissipated to the outside through the second heat-conducting part 50.

[0119] In some embodiments, see Figure 3 , Figure 4 The front side 20a of the electrical chip 20 and the circuit board 10 can be electrically connected via leads (not shown). By using wire bonding, the leads are connected between the pads on the front side 20a of the electrical chip 20 and the pads on the circuit board 10, which can easily achieve the electrical connection between the electrical chip 20 and the circuit board 10.

[0120] In some embodiments, see Figure 3 , Figure 4The electrical chip 20 and the optical chip 30 can be respectively bonded to the circuit board 10 using different thermally conductive patches (not shown), facilitating their assembly on the circuit board 10. The heat generated by the electrical chip 20 can be conducted from its back surface 20b to the first thermally conductive part 40 via the thermally conductive patch, and then dissipated to the outside by the first thermally conductive part 40. Similarly, the heat generated by the optical chip 30 can be conducted from its back surface 30b to the second thermally conductive part 50 via the thermally conductive patch, and then dissipated to the outside by the second thermally conductive part 50.

[0121] In some embodiments, see Figures 2 to 4 The electrical chip 20 and the optical chip 30 are located on the same surface of the circuit board 10. This method facilitates the arrangement of the electrical chip 20 and the optical chip 30, has a simple structure, realizes the electrical connection between the electrical chip 20 and the optical chip 30, and meets the high-speed interconnection between the electrical chip 20 and the optical chip 30.

[0122] In other embodiments, see Figure 12 The electrical chip 20 and the optical chip 30 are located on opposite surfaces of the circuit board 10. This method enables electrical connection between the electrical chip 20 and the optical chip 30. The front side 20a of the electrical chip 20 is electrically connected to the circuit board 10 via a first lead 71, and the front side 30a of the optical chip 30 is electrically connected to the circuit board 10 via a second lead 72. The first lead 71 and the second lead 72 are electrically connected via traces 11 on the circuit board 10.

[0123] In some embodiments, see Figures 2 to 4 The circuit board 10 can be a rigid printed circuit board 10a. The electrical chip 20 and the optical chip 30 are located on the same surface of the circuit board 10, or they can be located on opposite surfaces of the circuit board 10.

[0124] In other embodiments, see Figure 13 The circuit board 10 can be a stacked structure of a flexible circuit board 10b and a reinforcing sheet 10c. The electrical chip 20 and the optical chip 30 are located on the side of the flexible circuit board 10b facing away from the reinforcing sheet 10c. The reinforcing sheet 10c enhances the structural strength of the flexible circuit board 10b. The reinforcing sheet 10c can be a steel sheet, etc.

[0125] See Figures 2 to 4 This application provides an optical module, including the circuit board assembly 100 described above.

[0126] An optical module is an optoelectronic device that enables photoelectric conversion and electro-optical conversion during optical signal transmission.

[0127] An optoelectronic conversion module is an optical module, also known as a fiber optic transceiver. It is an Ethernet transmission media conversion unit that converts short-distance twisted-pair electrical signals to long-distance optical signals.

[0128] The packaging forms of optical modules can be quad small form factor pluggable-doubledensity (QSFP-DD), octal small form factor pluggable (OSFP), octal small form factor pluggable-extra dense (OSFP-XD), centum form factor pluggable (CFP), etc.

[0129] See Figures 2 to 4 This application provides a communication device, including the circuit board assembly 100 or the optical module described above.

[0130] The communication equipment can include top-of-rack (TOR) switches, leaf switches, spine switches, core switches, routers, wavelength division multiplexing (WDM) equipment, etc.

[0131] In the optical module and communication equipment provided in this application embodiment, the front side 20a of the electrical chip 20 and the front side 30a of the optical chip 30 are electrically connected and arranged adjacent to each other in the circuit board assembly 100. The electrical chip 20 is a heat source device, and the operating heat of the electrical chip 20 can be conducted to the first heat-conducting part 40 through the back side 20b of the electrical chip 20, realizing independent heat dissipation of the electrical chip 20. The optical chip 30 is a heat-sensitive device, and the operating heat of the optical chip 30 can be conducted to the second heat-conducting part 50 through the back side 30b of the optical chip 30, realizing independent heat dissipation of the optical chip 30. A thermal isolation zone 60 is formed between the first heat-conducting part 40 and the second heat-conducting part 50, keeping the electrical chip 20 and the optical chip 30 thermally isolated. The operating heat of the electrical chip 20 is difficult to be conducted to the optical chip 30, reducing thermal crosstalk between the electrical chip 20 and the optical chip 30, resulting in a lower operating temperature rise of the optical chip 30, maintaining or improving the performance of the optical chip 30, and improving the reliability of the optical chip 30.

[0132] When determining the circuit board assembly 100, optical module, and communication device of this application embodiment, the circuit board assembly 100 can be disassembled to determine that the electrical chip 20 is disposed on the circuit board 10, with its back surface 20b facing the circuit board 10. The optical chip 30 is disposed on the circuit board 10, with its back surface 30b facing the circuit board 10. The front surface 20a of the electrical chip 20 and the front surface 30a of the optical chip 30 are electrically connected. The circuit board 10 is embedded with a first heat-conducting part 40 and a second heat-conducting part 50. The back surface 20b of the electrical chip 20 is connected to the first heat-conducting part 40, and the back surface 30b of the optical chip 30 is connected to the second heat-conducting part 50. A thermal isolation zone 60 is formed between the first heat-conducting part 40 and the second heat-conducting part 50.

[0133] Finally, it should be noted that the above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A circuit board assembly, characterized in that, include: Circuit boards, electrical chips, and optical chips; The electrical chip is disposed on the circuit board, with the back of the electrical chip facing the circuit board; The optical chip is disposed on the circuit board, with the back of the optical chip facing the circuit board; The front side of the electrical chip and the front side of the optical chip are electrically connected; The circuit board is embedded with a first heat-conducting part and a second heat-conducting part. The back side of the electrical chip is connected to the first heat-conducting part, and the back side of the optical chip is connected to the second heat-conducting part. There is a thermal isolation area between the first heat-conducting part and the second heat-conducting part.

2. The circuit board assembly according to claim 1, characterized in that, The front side of the electrical chip and the front side of the optical chip are electrically connected by leads. Alternatively, the front side of the electrical chip and the circuit board are electrically connected via a first lead, the front side of the optical chip and the circuit board are electrically connected via a second lead, and the first lead and the second lead are electrically connected via traces on the circuit board.

3. The circuit board assembly according to claim 1 or 2, characterized in that, The first heat-conducting part includes a first heat-conducting block and / or a first heat-conducting column; And / or, the second heat-conducting part includes a second heat-conducting block and / or a second heat-conducting column.

4. The circuit board assembly according to any one of claims 1 to 3, characterized in that, The first thermally conductive portion is exposed on the surface of the circuit board; Alternatively, the second heat-conducting part is exposed on the surface of the circuit board.

5. The circuit board assembly according to any one of claims 1 to 4, characterized in that, The thermal isolation zone is a portion of the insulating part of the circuit board; Alternatively, the thermal isolation area is a thermal isolation part disposed within the circuit board, wherein the thermal conductivity of the thermal isolation part is less than that of the first thermally conductive part, and the thermal conductivity of the thermal isolation part is less than that of the second thermally conductive part; Alternatively, the thermal isolation area may be a slot provided on the circuit board.

6. The circuit board assembly according to any one of claims 1 to 5, characterized in that, The electrical chip includes at least one of a driver chip, a transimpedance amplifier, and an optical digital signal processor. And / or, the optical chip includes at least one of a semiconductor laser, a semiconductor detector, a silicon photonic chip, and a light-emitting diode.

7. The circuit board assembly according to any one of claims 1 to 6, characterized in that, The first heat-conducting part is made of copper, aluminum, or gold. And / or, the second heat-conducting part is a copper, aluminum, or gold component.

8. The circuit board assembly according to any one of claims 1 to 7, characterized in that, The electrical chip and the optical chip are located on the same surface of the circuit board; Alternatively, the electrical chip and the optical chip may be located on opposite surfaces of the circuit board.

9. An optical module, characterized in that, Includes the circuit board assembly as described in any one of claims 1 to 8.

10. A communication device, characterized in that, Includes the circuit board assembly as described in any one of claims 1 to 8 or the optical module as described in claim 9.

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