Heat-resistant single-sided PCB (printed circuit board)
By combining modular design with airflow mechanism, the problem of low heat dissipation efficiency of existing PCB circuit boards is solved, achieving efficient heat dissipation and convenient maintenance.
Patent Information
- Application Number
- CN202520455378.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-17
- Publication Date
- 2026-02-24
- Estimated Expiration
- 2035-03-17
AI Technical Summary
Existing PCB circuit boards have low heat dissipation efficiency, and the entire circuit board needs to be replaced if the heat sink is damaged, which does not allow for flexible maintenance.
It adopts a modular design, with a heat dissipation structure composed of heat-conducting plates and heat dissipation fins. It is independently connected to the equipment's heat dissipation structure through an air guide mechanism to achieve efficient heat dissipation. The thermal conductivity is improved by aluminum sheets and thermal grease, and dustproof mesh strips prevent dust accumulation.
It achieves efficient heat dissipation of the circuit board, facilitates independent disassembly and maintenance of the heat dissipation module, improves heat dissipation efficiency and reduces maintenance costs.
Smart Images

Figure CN223943047U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of circuit board technology, and more specifically, to a heat-resistant single-sided PCB circuit board. Background Technology
[0002] A single-sided PCB is a type of printed circuit board. Only one side of the PCB has wiring (which may or may not have holes), while the other side is a substrate or directly covered with insulating ink, without any wiring, and is entirely translucent under strong light (except for certain board materials and special manufacturing processes). In cross-section, only the side with wiring contains copper foil.
[0003] Some existing PCB circuit boards are made of good heat-resistant materials, but their heat dissipation is limited. In order to improve heat dissipation efficiency, heat sinks are attached to the PCB circuit board in the current technology. However, the current heat dissipation is more like an integrated design of PCB circuit board. Once the heat sink is damaged, the entire circuit board needs to be replaced. Moreover, the heat sink relies on the overall heat dissipation mechanism of the equipment for heat dissipation, and it still relies on the heat sink to dissipate heat, so the efficiency is still not high. Utility Model Content
[0004] In view of the problems existing in the prior art, the purpose of this utility model is to provide a heat-resistant single-sided PCB circuit board to solve the problems in the background art.
[0005] To achieve the above objectives, the present invention adopts the following technical solution;
[0006] A heat-resistant single-sided PCB circuit board includes a circuit board substrate, on which multiple countersunk bolt holes are provided. A heat-conducting plate is fixedly connected to the bottom of the circuit board substrate by bolts. Heat dissipation fins arranged at equal intervals are fixedly installed on the bottom of the heat-conducting plate. A wind guide mechanism is fixedly installed at one end of the heat dissipation fins.
[0007] The air guiding mechanism includes a square tube and a connector. One side of the square tube is fixedly installed to the end of the heat dissipation fins, and the interior of the square tube is connected to the gap between the heat dissipation fins. One end of the connector is inserted and fixed to the interior of the square tube, and the other end of the connector is connected and cooperates with the external heat dissipation and air guiding structure.
[0008] As a further description of the above technical solution: the top of the heat-conducting plate is fixedly connected with horizontally protruding strips arranged at equal intervals, and the bottom of the circuit board is provided with a mating groove that engages with the horizontally protruding strips.
[0009] As a further description of the above technical solution: the countersunk bolt hole corresponds to and fits with the bottom mating groove, and the bolt is inserted into the inside of the countersunk bolt hole and passes through to the inside of the mating groove to be threadedly connected with the transverse convex strip.
[0010] As a further description of the above technical solution: the heat dissipation fins are arranged longitudinally, and the transverse convex strips are arranged laterally.
[0011] As a further description of the above technical solution: the heat dissipation fins are aluminum sheets, and thermally conductive silicone grease is coated between the contact surfaces of the heat-conducting plate and the heat dissipation fins.
[0012] As a further description of the above technical solution: a dustproof mesh strip is fixedly connected to the end of the heat dissipation fins away from the square tube.
[0013] Compared with existing technologies, the advantages of this utility model are:
[0014] This solution uses a modular design to enable flexible and convenient assembly and disassembly of the circuit board and the heat dissipation structure, facilitating independent disassembly and maintenance of damaged modules in the future. Furthermore, by utilizing an air guide mechanism to connect to the equipment's heat dissipation air guide structure, it achieves independent air supply, which has the advantage of improving heat dissipation efficiency. Attached Figure Description
[0015] Figure 1 This is a three-dimensional structural diagram of the present invention;
[0016] Figure 2 This is a three-dimensional cross-sectional structural diagram of the present invention;
[0017] Figure 3 for Figure 2 Enlarged schematic diagram of section A in the middle;
[0018] Figure 4 This is a partial top view of the structure of this utility model.
[0019] Explanation of the labels in the diagram:
[0020] 1. Circuit board; 2. Countersunk bolt holes; 3. Heat-conducting plate; 31. Horizontal convex strip; 4. Heat dissipation fins; 41. Dustproof mesh strip; 5. Air guide mechanism; 51. Square tube; 52. Connector; 6. Connecting groove. Detailed Implementation
[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model;
[0022] Please see Figures 1-4 In this utility model, a heat-resistant single-sided PCB circuit board includes a circuit board 1. The circuit board 1 has multiple countersunk bolt holes 2. The bottom of the circuit board 1 is fixedly connected to a heat-conducting plate 3 by bolts. The bottom of the heat-conducting plate 3 is fixedly installed with heat dissipation fins 4 arranged at equal intervals. One end of the heat dissipation fins 4 is fixedly installed with an air guide mechanism 5.
[0023] The air guiding mechanism 5 includes a square tube 51 and a connector 52. One side of the square tube 51 is fixedly installed to the end of the heat dissipation fins 4, and the interior of the square tube 51 is connected to the gap between the heat dissipation fins 4. One end of the connector 52 is inserted and fixed to the interior of the square tube 51, and the other end of the connector 52 is connected and cooperated with the external heat dissipation air guiding structure.
[0024] In this invention, a circuit board 1 serves as the main body. A heat-conducting plate 3 is connected and fixed to the heat-conducting plate 3 using bolts through countersunk bolt holes 2. Then, heat dissipation fins 4 are attached and fixed to the heat-conducting plate 3, forming a modular heat-conducting and heat-dissipating structure. The connector 52 on the square tube 51 is independently connected to the heat dissipation structure of the equipment, allowing for independent ventilation. High-speed airflow passes through the connector 52 and enters the interior of the square tube 51. The airflow then flows at high speed into the gaps between the heat dissipation fins 4, dissipating heat and achieving efficient heat dissipation and conduction of the circuit board 1. Furthermore, the heat-conducting plate 3 and heat dissipation fins 4 are easily installed and removed from the circuit board 1. This invention achieves the advantages of adding a heat dissipation structure to the circuit board to improve heat dissipation efficiency, while utilizing a modular design for easy installation, removal, and maintenance. It solves the problem in existing technologies where heat dissipation fins are attached to the PCB circuit board to improve heat dissipation efficiency. However, current heat dissipation relies on an integrated PCB circuit board design, requiring replacement of the entire circuit board if the heat dissipation plate is damaged. Additionally, the heat dissipation plate still relies on the overall heat dissipation mechanism of the equipment for heat dissipation, resulting in low efficiency.
[0025] Please see Figure 3 The heat-conducting plate 3 has equidistant horizontal protrusions 31 fixedly connected to its top, and the circuit board 1 has a mating groove 6 at its bottom that engages with the horizontal protrusions 31.
[0026] In this invention, the contact area between the heat-conducting plate 3 and the circuit board 1 is increased by using the horizontal protrusion 31 in conjunction with the docking groove 6, thereby improving the heat conduction efficiency.
[0027] Please see Figure 3 The countersunk bolt hole 2 corresponds to the bottom mating groove 6. The bolt is inserted into the countersunk bolt hole 2 and passes through the mating groove 6 to be threadedly connected to the transverse protrusion 31.
[0028] In this invention, bolts are inserted into the countersunk bolt holes 2 to facilitate the installation and removal of the transverse protrusion 31 and the circuit board 1, so as to ensure that the surface of the circuit board 1 remains flat and will not affect the installation of other components.
[0029] Please see Figure 2 Among them, the heat dissipation fins 4 are arranged longitudinally, and the horizontal convex strips 31 are arranged laterally.
[0030] In this invention, the heat dissipation fins 4 and the transverse convex strips 31 are arranged in a cross shape and perpendicularly to each other to improve the heat conduction efficiency between the heat conduction plate 3 and the heat dissipation fins 4.
[0031] Please see Figure 1 Among them, the heat dissipation fins 4 are thin aluminum sheets, and thermal grease is coated between the contact surfaces of the heat-conducting plate 3 and the heat dissipation fins 4.
[0032] In this invention, the overall heat conduction and heat dissipation performance is improved by using aluminum heat sink fins 4, and the heat conduction efficiency between the thermal grease heat sink plate 3 and the heat sink fins 4 is utilized.
[0033] Please see Figure 3 Among them, the end of the heat dissipation fin 4 away from the square tube 51 is fixedly connected to a dustproof mesh strip 41.
[0034] In this invention, the air outlet side of the heat dissipation fins 4 is protected against dust by a dustproof mesh strip 41 to prevent dust accumulation inside.
[0035] The above description is merely a preferred embodiment of this utility model; however, the protection scope of this utility model is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the technical scope disclosed in this utility model, based on the technical solution and its improved concept, should be included within the protection scope of this utility model.
Claims
1. A heat-resistant single-sided PCB circuit board, comprising a circuit board substrate (1), characterized in that: The circuit board (1) has multiple countersunk bolt holes (2) on its upper surface. A heat-conducting plate (3) is fixedly connected to the bottom of the circuit board (1) by bolts. Heat dissipation fins (4) are fixedly installed at equal intervals on the bottom of the heat-conducting plate (3). A wind guide mechanism (5) is fixedly installed at one end of the heat dissipation fins (4). The air guiding mechanism (5) includes a square tube (51) and a connector (52). One side of the square tube (51) is fixedly installed to the end of the heat dissipation fins (4), and the interior of the square tube (51) is connected to the heat dissipation fins (4) through a gap. One end of the connector (52) is inserted and fixed to the interior of the square tube (51), and the other end of the connector (52) is connected and cooperated with the external heat dissipation air guiding structure.
2. The heat-resistant single-sided PCB circuit board according to claim 1, characterized in that: The top of the heat-conducting plate (3) is fixedly connected with horizontal protrusions (31) arranged at equal intervals, and the bottom of the circuit board (1) is provided with a mating groove (6) that engages with the horizontal protrusions (31).
3. A heat-resistant single-sided PCB circuit board according to claim 2, characterized in that: The countersunk bolt hole (2) corresponds to the bottom mating groove (6), and the bolt is inserted into the countersunk bolt hole (2) and passes through the mating groove (6) to be threadedly connected to the transverse protrusion (31).
4. A heat-resistant single-sided PCB circuit board according to claim 2, characterized in that: The heat dissipation fins (4) are arranged longitudinally, and the transverse convex strips (31) are arranged transversely.
5. A heat-resistant single-sided PCB circuit board according to claim 1, characterized in that: The heat dissipation fins (4) are aluminum sheets, and thermal grease is coated between the contact surfaces of the heat-conducting plate (3) and the heat dissipation fins (4).
6. A heat-resistant single-sided PCB circuit board according to claim 1, characterized in that: A dustproof mesh strip (41) is fixedly connected to the end of the heat dissipation fin (4) away from the square tube (51).