Packaging structure of semiconductor

Abstract

The utility model relates to a semiconductor packaging structure and a semiconductor packaging structure, the semiconductor packaging structure comprises a pedestal, the top end of the outer surface of the pedestal is plugged with a spacing frame, the top of the inner surface of the spacing frame is slidably connected with a scraper, the inner surface of the scraper is provided with a clamping groove A, the inner surface of the spacing frame is elastically connected with an inclined block through a spring A, and the inclined block is provided with a clamping groove B; the top of the outer surface of the inclined block is connected with the inner surface of the clamping groove A in a clamped mode, an L-shaped plate is fixedly connected to the front end of the outer surface of the scraping plate, the outer surface of the L-shaped plate is slidably connected with the inner surface of the limiting frame, and a positioning and fixing assembly is arranged at the top of the base. According to the utility model, through the arrangement of the scraping plate, when the silicone grease is smeared, only the silicone grease needs to be smeared on a semiconductor approximately, and after the limitation of the scraping plate is removed, the scraping plate is moved transversely in a reciprocating manner, so that the scraping plate flattens the accumulated silicone grease and pushes the redundant silicone grease out of the limiting frame, and the effects of easily flattening and removing the redundant silicone grease are achieved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging technology, and in particular to a semiconductor packaging structure. Background Technology

[0002] Semiconductor packaging structure refers to the physical structure that connects a semiconductor chip to an external circuit and protects the chip. It mainly protects the semiconductor from physical damage and environmental factors such as moisture and static electricity, and provides electrical connection and heat dissipation functions.

[0003] In some high-power, high-heat semiconductor chip packages, such as IGBT modules and high-power CPUs, thermal paste is often used because these chips generate a lot of heat when they are working. Thermal paste has good thermal conductivity and can fill the tiny gaps between the chip and heat dissipation components, such as heat sinks and heat dissipation substrates, reducing thermal resistance and allowing the heat generated by the chip to be conducted to the heat dissipation components more effectively. This improves heat dissipation efficiency, ensures that the chip operates within the normal temperature range, and prevents performance from being affected or even damaged due to overheating.

[0004] Considering that uneven application or failure to remove excess silicone grease during application may affect heat dissipation, leading to overheating or even damage to the semiconductor, and that traditional silicone grease application methods are often complex and prone to uneven application and contamination of other components, a semiconductor packaging structure is proposed to address these issues. Utility Model Content

[0005] To overcome the above shortcomings, this utility model provides a semiconductor packaging structure, which aims to improve the existing technology where uneven application of silicone grease or failure to remove excess silicone grease in time can affect heat dissipation, leading to overheating or even damage to the semiconductor. Traditional application methods are complex to operate and are prone to uneven application and contamination of other components.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a semiconductor packaging structure, including a base, a limiting frame inserted into the top of the outer surface of the base, a scraper slidably connected to the top of the inner surface of the limiting frame, a slot A formed on the inner surface of the scraper, an inclined block elastically connected to the inner surface of the limiting frame via a spring A, the top of the outer surface of the inclined block engaging with the inner surface of the slot A, an L-shaped plate fixedly connected to the front end of the outer surface of the scraper, the outer surface of the L-shaped plate slidably connected to the inner surface of the limiting frame, and a positioning and fixing component provided on the top of the base.

[0007] As a further description of the above technical solution:

[0008] The positioning and fixing assembly includes a fixing post and a bolt. The bottom of the outer surface of the fixing post is fixedly connected to the top of the outer surface of the base. The outer surface of the fixing post is slidably connected to the inner surface of the limiting frame. A top cover is inserted into the top of the outer surface of the fixing post. The bottom of the outer surface of the bolt is inserted into the top of the outer surface of the top cover. The bottom of the outer surface of the bolt is threadedly connected to the top of the inner surface of the fixing post.

[0009] As a further description of the above technical solution:

[0010] A heat-conducting sheet is connected through and fixedly to the inner surface of the top cover. A heat dissipation fin is slidably connected to the top of the outer surface of the heat-conducting sheet. A plate is fixedly connected to the left side of the outer surface of the heat dissipation fin. The outer surface of the plate and the outer surface of the heat dissipation fin are both inserted into the top of the inner surface of the top cover.

[0011] As a further description of the above technical solution:

[0012] The top of the inner surface of the plate is elastically connected to a toggle member via a spring B. A wedge block is fixedly connected to the top of the outer surface of the toggle member. A slot B is provided on the left side of the outer surface of the top of the top cover. The bottom of the outer surface of the wedge block engages with the inner surface of the slot B.

[0013] As a further description of the above technical solution:

[0014] A semiconductor is inserted into the top of the inner surface of the base, and the bottom of the outer surface of the heat-conducting sheet is in contact with the top of the outer surface of the semiconductor.

[0015] As a further description of the above technical solution:

[0016] One end of the spring A is fixedly connected to the top of the inner surface of the limiting frame, and the other end of the spring A is fixedly connected to the bottom of the outer surface of the inclined block.

[0017] As a further description of the above technical solution:

[0018] One end of the spring B is fixedly connected to the top of the inner surface of the top cover, and the other end of the spring B is fixedly connected to the bottom of the outer surface of the actuating element.

[0019] As a further description of the above technical solution:

[0020] The inner surface of the top cover is fixedly connected to a guide post, and the bottom of the inner surface of the actuating element penetrates and is slidably connected to the outer surface of the guide post.

[0021] This utility model has the following beneficial effects:

[0022] 1. In this utility model, by providing a scraper, when applying silicone grease, one only needs to apply the silicone grease roughly to the semiconductor, and then release the limit of the scraper and move the scraper back and forth laterally to smooth out the accumulated silicone grease and push the excess silicone grease out of the limit frame, so as to achieve the effect of easily smoothing and removing excess silicone grease.

[0023] 2. In this utility model, by making the heat dissipation fins a detachable structure, when the heat dissipation fins are bent or damaged by impact or bump, the heat dissipation fins can be quickly, conveniently and effortlessly disassembled and replaced by a toggle mechanism. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the main structure of a semiconductor packaging structure proposed in this utility model;

[0025] Figure 2 This is a schematic diagram showing the disassembly structure of a semiconductor packaging structure proposed in this utility model;

[0026] Figure 3 This is a schematic diagram of the disassembled structure of the heat sink fins of a semiconductor packaging structure proposed in this utility model.

[0027] Figure 4 This is a schematic diagram of the scraper scraping structure of a semiconductor packaging structure proposed in this utility model;

[0028] Figure 5 This is a cross-sectional view of the limiting frame structure of a semiconductor packaging structure proposed in this utility model.

[0029] Figure 6 This is a schematic cross-sectional view of the top cover of a semiconductor packaging structure proposed in this utility model.

[0030] Legend:

[0031] 1. Base; 2. Limiting frame; 3. Top cover; 4. Heat dissipation fins; 5. Actuating component; 6. Plate; 7. Scraper; 8. Fixing post; 9. Semiconductor; 10. Heat-conducting plate; 11. Slot A; 12. Wedge; 13. Spring A; 14. Slot B; 15. Wedge; 16. Spring B; 17. Guide post; 18. Bolt; 19. L-shaped plate. Detailed Implementation

[0032] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0033] Reference Figure 1 , Figure 4 - Figure 5 This utility model provides an embodiment of a semiconductor packaging structure, including a base 1. A limiting frame 2 is inserted into the top of the outer surface of the base 1, allowing the limiting frame 2 to be fixed to the top of the base 1. A scraper 7 is slidably connected to the top of the inner surface of the limiting frame 2, allowing the scraper 7 to move laterally along the top of the inner surface of the limiting frame 2. A slot A11 is formed on the inner surface of the scraper 7, allowing a wedge 12 to engage with the inner surface of the scraper 7. The wedge 12 is elastically connected to the inner surface of the limiting frame 2 by a spring A13, allowing the wedge 12 to maintain an upward movement without external force. The top of the outer surface of the wedge 12... The scraper 7 is engaged with the inner surface of the slot A11, so that the scraper 7 can be fixed in a designated position by engaging with the slot A11. An L-shaped plate 19 is fixedly connected to the front end of the outer surface of the scraper 7, so that the scraper 7 can move the L-shaped plate 19 together when it moves laterally. The outer surface of the L-shaped plate 19 is slidably connected to the inner surface of the limiting frame 2, so that the scraper 7 can always move along the designated position and will not fall off when it moves laterally because the L-shaped plate 19 moves laterally along the inner surface of the limiting frame 2. A positioning and fixing component is provided on the top of the base 1, so that the base 1, the limiting frame 2 and the top cover 3 can be fixed together by the positioning and fixing component.

[0034] Reference Figure 2 - Figure 4 The positioning and fixing components include a fixing post 8 and a bolt 18. The bottom of the outer surface of the fixing post 8 is fixedly connected to the top of the outer surface of the base 1, and the top of the outer surface of the base 1 provides a fixed support for the fixing post 8. The outer surface of the fixing post 8 penetrates and slides through the inner surface of the limiting frame 2, allowing the limiting frame 2 to move vertically along the outer surface of the fixing post 8. A top cover 3 is inserted into the top of the outer surface of the fixing post 8, allowing the top cover 3 to be precisely inserted into the top of the outer surface of the limiting frame 2. The bottom of the outer surface of the bolt 18 is inserted into the top of the outer surface of the top cover 3, allowing the bolt 18 to pass through the top of the outer surface of the top cover 3 and be threadedly connected to the inner surface of the fixing post 8. The bottom of the outer surface of the bolt 18 is threadedly connected to the top of the inner surface of the fixing post 8, allowing the top cover 3 to be fixed together with the limiting frame 2 and the base 1 through the threaded connection between the bolt 18 and the top of the inner surface of the fixing post 8.

[0035] Reference Figure 3 , Figure 6A heat-conducting plate 10 is connected and fixedly attached to the inner surface of the top cover 3, providing a fixed support for the heat-conducting plate 10. A heat dissipation fin 4 is slidably connected to the top of the outer surface of the heat-conducting plate 10, allowing the heat dissipation fin 4 to move laterally along the outer surface of the heat-conducting plate 10 and dissipate heat. A plate 6 is fixedly connected to the left side of the outer surface of the heat dissipation fin 4, allowing the plate 6 to move laterally, thus moving the heat dissipation fin 4 along with it. Both the outer surfaces of the plate 6 and the heat dissipation fin 4 are inserted into the top of the inner surface of the top cover 3, ensuring that when the plate 6 and the heat dissipation fin 4 are inserted into the inner surface of the top cover 3, they can only move laterally and not interfering with each other. To achieve the effect of vertical sliding, the top of the inner surface of the plate 6 is elastically connected to the actuating element 5 via spring B16, so that the actuating element 5 can always move downward without the influence of external force. The top of the outer surface of the actuating element 5 is fixedly connected to the wedge block 15, so that when the actuating element 5 moves vertically, it can drive the wedge block 15 to move together. The left side of the outer surface of the top of the top cover 3 is provided with a slot B14, so that the wedge block 15 can engage with the left side of the outer surface of the top of the top cover 3. The bottom of the outer surface of the wedge block 15 engages with the inner surface of the slot B14, so that the actuating element 5 can drive the plate 6 and the heat dissipation fins 4 to be fixed in a designated position due to the engagement of the wedge block 15 with the inner surface of the slot B14.

[0036] Reference Figure 2 , Figure 5 - Figure 6 A semiconductor 9 is inserted into the top of the inner surface of the base 1, allowing the semiconductor 9 to be placed on the inner surface of the base 1 through insertion. The bottom end of the outer surface of the heat-conducting plate 10 is in contact with the top end of the outer surface of the semiconductor 9, allowing the heat-conducting plate 10 to conduct the heat emitted by the semiconductor 9 to the heat dissipation fins 4, thus dissipating the heat. One end of the spring A13 is fixedly connected to the top of the inner surface of the limiting frame 2, and the other end of the spring A13 is fixedly connected to the bottom end of the outer surface of the inclined block 12. This allows the inclined block 12 to be pushed downwards by the inclined surface of the inclined plate 12 when the scraper 7 is pushed to the left or right side of the limiting frame 2. Then, when the scraper 7 moves to the designated position, the inclined block 12 will be pushed downwards by the elastic force of the spring A13. The scraper 7 moves downwards and upwards, engaging with the slot A11 on the scraper 7 to fix the scraper 7 in a designated position. One end of the spring B16 is fixedly connected to the top of the inner surface of the top cover 3, and the other end of the spring B16 is fixedly connected to the bottom of the outer surface of the actuating member 5. This allows the actuating member 5 to move downwards under the force of the spring B16 when the operation of the actuating member 5 is stopped. A guide post 17 is fixedly connected to the inner surface of the top cover 3, providing fixed support for the guide post 17. The bottom of the inner surface of the actuating member 5 is slidably connected to the outer surface of the guide post 17, allowing the actuating member 5 to always move along the designated position when moving vertically.

[0037] Working principle: When applying silicone grease to the surface of semiconductor 9, semiconductor 9 is first placed into the inner surface of base 1. Then, the limiting frame 2 is inserted along the outer surface of the fixing post 8, so that the bottom end of the limiting frame 2 is in contact with the top end of the outer surface of base 1. Then, silicone grease is squeezed onto the surface of semiconductor 9. Then, the inclined block 12 is pressed down with a tool to stop the effect of the inclined block 12 on fixing scraper 7. Then, scraper 7 is moved laterally to spread the silicone grease on semiconductor 9 evenly and remove excess silicone grease from the limiting frame 2. Then, top cover 3 is inserted into the top end of fixing post 8, so that the plates 6 on both sides of top cover 3 scrape the silicone grease pushed out of the limiting frame downward and make heat conduction plate 10 adhere to the silicone grease on semiconductor 9, so that the heat dissipated by semiconductor 9 can be conducted to heat dissipation fins 4 by heat conduction plate 10. Then, bolts 18 are threadedly connected to the top end of fixing post 8 to form a whole.

[0038] When the heat sink fin 4 is bent or damaged, first move the actuating part 5 upward so that it drives the wedge block 15 upward so that it is disengaged from the slot B14, thereby releasing the fixing effect between the plate 6 and the heat sink fin 4. Then pull out the plate 6 and the heat sink fin 4 to replace them.

[0039] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A packaging structure of a semiconductor, comprising a base (1), characterized in that: The outer surface top of the base (1) is inserted into the limiting box (2), the inner surface top of the limiting box (2) is slidably connected with the scraper (7), the inner surface of the scraper (7) is provided with the clamping groove A (11), the inner surface of the limiting box (2) is elastically connected with the inclined block (12) through the spring A (13), the outer surface top of the inclined block (12) is clamped with the inner surface of the clamping groove A (11), the outer surface front end of the scraper (7) is fixedly connected with the L-shaped plate (19), the outer surface of the L-shaped plate (19) is slidably connected with the inner surface of the limiting box (2), and the top of the base (1) is provided with the positioning and fixing assembly.

2. The semiconductor package structure of claim 1, wherein: The outer surface bottom of the fixed column (8) is fixedly connected with the outer surface top of the base (1), the outer surface of the fixed column (8) penetrates through and is slidably connected with the inner surface of the limiting box (2), the outer surface top of the fixed column (8) is inserted into the top cover (3), the outer surface bottom of the bolt (18) is inserted into the outer surface top of the top cover (3), and the outer surface bottom of the bolt (18) is screwed with the inner surface top of the fixed column (8).

3. The package structure of claim 2, wherein: The inner surface of the top cover (3) penetrates and is fixedly connected with the heat-conducting sheet (10), the outer surface top of the heat-conducting sheet (10) is slidably connected with the heat dissipation fin (4), the outer surface left side of the heat dissipation fin (4) is fixedly connected with the plate body (6), and the outer surfaces of the plate body (6) and the heat dissipation fin (4) are inserted into the inner surface top of the top cover (3).

4. The semiconductor package structure of claim 3, wherein: The inner surface top of the plate body (6) is elastically connected with the knob (5) through the spring B (16), the outer surface top of the knob (5) is fixedly connected with the wedge block (15), the outer surface left side of the top of the top cover (3) is provided with the clamping groove B (14), and the outer surface bottom of the wedge block (15) is clamped with the inner surface of the clamping groove B (14).

5. The semiconductor package structure of claim 3, wherein: The inner surface top of the base (1) is inserted into the semiconductor (9), and the outer surface bottom of the heat-conducting sheet (10) is in contact with the outer surface top of the semiconductor (9).

6. The semiconductor package structure of claim 1, wherein: One end of the spring A (13) is fixedly connected with the inner surface top of the limiting box (2), and the other end of the spring A (13) is fixedly connected with the outer surface bottom of the inclined block (12).

7. The semiconductor package structure of claim 4, wherein: One end of the spring B (16) is fixedly connected with the inner surface top of the top cover (3), and the other end of the spring B (16) is fixedly connected with the outer surface bottom of the knob (5).

8. The semiconductor package structure of claim 4, wherein: The inner surface of the top cover (3) is fixedly connected with the guide column (17), and the inner surface bottom of the knob (5) penetrates through and is slidably connected with the outer surface of the guide column (17).

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