Electro-optical device

Abstract

The utility model relates to an electro-optical device. In various embodiments, an electro-optical device is provided. The electro-optical device includes a transparent layer. The electro-optical device also includes a heat sink mechanically coupled to and embedded in the transparent layer, wherein the heat sink includes a first heat sink portion and a second heat sink portion. The electro-optical device also includes electronic circuitry disposed on the substrate, a first post configured to mechanically couple a first heat sink portion to an electronic circuit system and to transfer heat generated by the electronic circuit system to the first heat sink portion, and a second post configured to mechanically couple a second heat sink portion to an electronic circuit system and to transfer heat generated by the electronic circuit system to the second heat sink portion and a second column.

Description

Technical Field

[0001] The exemplary embodiments of this disclosure generally relate to heat dissipation, and particularly to heat dissipation in electro-optical devices. Background Technology

[0002] Various electro-optical devices may generate heat when performing their respective functions. However, the temperature of the individual components of an electro-optical device may need to be kept within operating limits.

[0003] The applicant has identified numerous technical challenges and difficulties associated with heat dissipation in electro-optical devices. Through effort, ingenuity, and innovation, the applicant has solved the heat dissipation-related problems by developing solutions implemented in this disclosure, which will be described in detail below. Utility Model Content

[0004] The various embodiments described herein relate to systems, apparatuses, devices, and products for thermal improvement of electro-optical devices.

[0005] In various embodiments, the electro-optic device includes a transparent layer. The electro-optic device also includes a heat sink mechanically coupled to and embedded in the transparent layer, wherein the heat sink includes a first heat sink portion and a second heat sink portion. The electro-optic device further includes: an electronic circuit system deployed on a substrate; a first pillar configured to mechanically couple the first heat sink portion to the electronic circuit system and transfer heat generated by the electronic circuit system to the first heat sink portion; and a second pillar configured to mechanically couple the second heat sink portion to the electronic circuit system and transfer heat generated by the electronic circuit system to the second heat sink portion.

[0006] In various embodiments, the first and second pillars comprise thermally conductive adhesive.

[0007] In various embodiments, the first pillar includes a first copper layer mechanically coupled to the electronic circuit system and a first solder layer mechanically coupled to a first heat sink portion, and the second pillar includes a second copper layer mechanically coupled to the electronic circuit system and a second solder layer mechanically coupled to a second heat sink portion.

[0008] In various embodiments, the first heat sink portion includes a first ledge disposed between the first pillar and the transparent layer and mechanically coupled to the transparent layer using adhesive, and the second heat sink portion includes a second ledge disposed between the second pillar and the transparent layer and mechanically coupled to the transparent layer using adhesive.

[0009] In various embodiments, the first radiator portion includes one or more first fins and the second radiator portion includes one or more second fins, wherein the one or more first fins and the one or more second fins are configured to increase the heat exchange surface between the radiator and the environment and to increase the heat dissipation of the radiator.

[0010] In various embodiments, the electro-optical device includes: a transparent layer; a heat sink including bosses, wherein the bosses are mechanically coupled to the transparent layer; an electronic circuit system deployed on a substrate; and a support configured to: mechanically couple the bosses of the heat sink to the electronic circuit system and transfer heat generated by the electronic circuit system to the heat sink.

[0011] In various embodiments, the bosses of the heat sink are configured to be mechanically coupled to the transparent layer using adhesive.

[0012] In various embodiments, the heat sink includes one or more fins configured to increase the heat exchange surface between the heat sink and the environment, and to increase the heat dissipation of the heat sink.

[0013] Electro-optical devices may also include cavities formed between a transparent layer, an electronic circuit system, and a support structure.

[0014] In various embodiments, the support includes a first post and a second post, the heat sink includes a first heat sink portion and a second heat sink portion, the first post is configured to mechanically couple the first heat sink portion to the electronic circuit system, and the second post is configured to mechanically couple the second heat sink portion to the electronic circuit system.

[0015] In various embodiments, the support includes a thermally conductive material.

[0016] In various embodiments, the support and heat sink are configured to reduce thermal resistance from the electronic circuitry system to the environment.

[0017] In various embodiments, the support and heat sink are configured to maintain the maximum junction temperature of the electronic circuit system below the maximum junction temperature threshold.

[0018] In various embodiments, the heat sink comprises copper or a copper alloy.

[0019] In various embodiments, the transparent layer includes at least one of a lens, a lens array, a protective layer, or a refractive filter.

[0020] In various embodiments, the electronic circuit system includes at least one of a light sensor, a photodiode, or a pixel.

[0021] The electro-optical device may also include one or more bonding lines configured to electrically couple at least one of a light sensor, a photodiode, or a pixel to one or more conductive traces on a substrate.

[0022] Electro-optical devices may also include molding materials configured to surround a support, mechanically couple to and hold together the heat sink, support, electronic circuitry, and substrate.

[0023] In various embodiments, the electro-optical device includes a transparent layer, a heat sink mechanically coupled to the transparent layer, an electronic circuit system deployed on a substrate, and a support configured to: mechanically couple the heat sink to the electronic circuit system; and transfer heat generated by the electronic circuit system to the heat sink.

[0024] In various embodiments, the heat sink includes an opening configured to embed a transparent layer. The electro-optical device may also include one or more fins configured to increase the heat exchange surface between the heat sink and the environment, and to increase heat dissipation from the heat sink. The electro-optical device may also include an electronic circuit system comprising one or more photosensitive components. The electro-optical device may also include a support surrounding the one or more photosensitive components.

[0025] The foregoing is provided merely to summarize some exemplary embodiments to provide a basic understanding of some aspects of this disclosure. Therefore, it will be appreciated that the above embodiments are merely illustrative and should not be construed as limiting the scope or spirit of this disclosure in any way. It will also be appreciated that the scope of this disclosure covers many potential embodiments in addition to those summarized herein, some of which will be further described below. Other technical features will readily become apparent to those skilled in the art from the following drawings, description, and claims. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of an electro-optical device.

[0027] Figure 2 These are schematic diagrams of electro-optical devices according to various embodiments.

[0028] Figure 3 These are schematic diagrams of electro-optical devices according to various embodiments.

[0029] Figure 4 These are schematic diagrams of various parts of an electro-optical device according to various embodiments.

[0030] Figure 5 This is a flowchart illustrating a method according to various embodiments. Detailed Implementation

[0031] Embodiments of the present disclosure will now be described more fully with reference to the accompanying drawings, which illustrate some, but not all, embodiments of the present disclosure. In fact, various embodiments of the present disclosure may be implemented in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that the present disclosure may meet applicable legal requirements. Similar reference numerals refer to similar elements throughout the text.

[0032] The phrases “in one embodiment,” “according to one embodiment,” “in some embodiments,” “in various embodiments,” etc., generally mean that the specific feature, structure, or characteristic following the phrase may be included in at least one embodiment of this disclosure and may be included in more than one embodiment of this disclosure (importantly, such phrases do not necessarily refer to the same embodiment).

[0033] The terms “example” or “exemplary” are used herein to mean “served as an example, instance, or illustration.” Any implementation described herein as “exemplary” is not necessarily to be construed as preferred or advantageous over other implementations.

[0034] If the specification states that a component or feature "may," "can," "should," "will," "preferably," "possibly," "usually," "optionally," "for example," "often," or "may" (or other such language) be included or have a certain characteristic, then the particular component or feature is not required to be included or have that characteristic. Such a component or feature may be optionally included in some embodiments, or it may be excluded.

[0035] The terms “electrically coupled,” “electronically coupled,” “electronically coupled to,” “communicating with,” “electronically communicating with,” or “coupled” in this disclosure mean that two or more elements or components are coupled by wired and / or wireless means such that signals, voltages / currents, data, and / or information can be sent to and / or received from these elements or components.

[0036] The use of the term "circuit system" as used herein with respect to components of a system or apparatus should be understood to include specific hardware configured to perform the functions associated with a particular circuit system as described herein. The term "circuit system" should be broadly understood to include hardware and, in some embodiments, software used to construct the hardware. For example, in some embodiments, "circuit system" may include processing circuit systems, communication circuit systems, input / output circuit systems, etc. In some embodiments, other elements may provide for or complement the functionality of a particular circuit system.

[0037] The term "mechanically coupled" in this disclosure refers to the physical coupling of two or more mechanical elements (e.g., but not limited to frames, surfaces, support units, joints, etc.) in various ways, such as direct coupling, coupling through intermediate elements, and / or coupling using one or more fasteners, fasteners, clamps, joints, pin joints, shafts, hinges, adhesives, etc. The term "mechanically coupled" can also refer to any of the following: movable, rotatable, rotating, pivoting, fixed, and / or stationary.

[0038] Now for reference Figure 1A schematic diagram of an electro-optical device 100 is provided. The electro-optical device may include an electronic circuit system 112 deployed or mounted on a substrate 108. The electronic circuit system 112 may be an electronic chip or die made of silicone resin. The substrate 108 may be a laminated substrate and may be made using a dielectric material and conductive traces configured to be electrically coupled to various electronic components. For example, the conductive traces may be electrically coupled to one or more solder balls 104. The electronic circuit system 112 may be electrically coupled to the conductive traces of the substrate using one or more bonding lines 114.

[0039] The electronic circuit system 112 may include one or more photosensitive components 116. These photosensitive components 116 may include, for example, photodiodes, pixels, light sensors such as infrared sensors, transistors, etc. In this example, the one or more photosensitive components 116 are a pixel array.

[0040] During operation of the electro-optical device 100, the temperature of the electronic circuit system 112 may rise due to the operation of its various components. It is desirable to keep the junction temperature of the electronic circuit system 112 below a maximum junction temperature threshold to prevent damage to the electro-optical device 100. For example, the maximum junction temperature may indicate the temperature of the hottest spot on the electronic circuit system 112 and may need to be kept below a maximum junction temperature threshold. For example, the maximum junction temperature threshold may be between 120°C and 170°C, such as approximately 150°C.

[0041] The electro-optic device 100 may include one or more molding materials 110 and 118 to improve the mechanical stability of the electro-optic device 100. For example, the molding material may mechanically couple the transparent layer 106 to the substrate 108 to improve the mechanical stability of the electro-optic device 100. The molding material may, for example, include resin. However, resin may not be thermally conductive and may not dissipate the heat generated in the electronic circuit system 112 at a sufficient rate. Therefore, the junction temperature of the electronic circuit system 112 may increase to the point of failure.

[0042] Various embodiments of this disclosure provide systems, apparatuses, and methods to facilitate the dissipation of heat generated by electronic circuitry in electro-optical devices and to maintain the junction temperature of the electronic circuitry below the highest junction temperature.

[0043] Now for reference Figure 2 Schematic diagrams of an illustrated electro-optical device 200 are provided according to various embodiments of the present disclosure. In various embodiments, a heat sink 204 is provided with an embedded transparent layer 210. The heat sink 204 may be configured to dissipate heat generated by the operation of the electronic circuit system 214 and / or one or more photosensitive components 222 deployed on the electronic circuit system 214.

[0044] In various embodiments, the electro-optical device 200 includes a transparent layer 210, a heat sink 204 mechanically coupled to the transparent layer 210, an electronic circuitry system 214 disposed on a substrate 208, and a support 216 configured to mechanically couple the heat sink 204 to the electronic circuitry system. The support 216 may be configured to transfer heat generated by the electronic circuitry system 214 to the heat sink 204.

[0045] In various embodiments, the transparent layer 210 includes at least one of a lens, a lens array, a protective layer, and / or a refractive filter. For example, a lens or lens array may focus or otherwise manipulate an incident light beam 234 to portions of one or more photosensitive components 222 on the electronic circuit system 214. In some examples, the transparent layer 210 may serve as a protective layer for one or more photosensitive components 222. In various embodiments, the transparent layer 210 is made of at least one of glass, plastic, and / or any other transparent material.

[0046] In various embodiments, the electro-optical device 200 may be a light receiving device as described above, or it may be a light emitting device. The electronic circuitry system 214 may include one or more light emitting components, and the transparent layer 210 may be configured to allow emitted light to pass through or otherwise manipulate the emitted light, for example, by collimating the emitted light. In various embodiments, heat generated by emitting light, receiving light, and / or by various operations of the electronic circuitry system 214 may be dissipated into the environment using the heat sink 204.

[0047] In various embodiments, the heat sink 204 includes an opening configured to be embedded in the transparent layer 210. For example, the heat sink 204 may include a cutout configured to fit the transparent layer 210. In various embodiments, the heat sink 204 is mechanically coupled to and embedded in the transparent layer 210. The heat sink 204 may, for example, include a boss 240 configured to support the transparent layer 210. The boss 240 may be located between the transparent layer 210 and the support member 216.

[0048] In various embodiments, the heat sink 204 is mechanically coupled to the transparent layer 210 at one edge using a layer of adhesive 236, and directly coupled to the transparent layer 210 at another edge 238. For example, the boss 240 of the heat sink 204 can be mechanically coupled to the support member 216 using a layer of adhesive 236.

[0049] The electro-optic device 200 may include a cavity formed between a support 216, a transparent layer 210, an electronic circuit system 214, and / or a heat sink 204. The cavity may be a hollow region through which the incident light beam 234 travels after passing through the transparent layer 210, or a hollow region through which light emitted by the electro-optic device 200 travels before reaching the transparent layer 210. In various embodiments, a boss 240 of the heat sink 204 may protrude into the cavity. In various embodiments, the boss 240 of the heat sink 204 may be flush with the support 216. In various embodiments, heat generated by emitting light, receiving light, and / or various operations of the electronic circuit system 214 may reach the heat sink 204 through the cavity and / or through the support 216. In various embodiments, the support 216 is made of a thermally conductive material, such as thermally conductive adhesive.

[0050] In various embodiments, the heat sink 204 completely surrounds the transparent layer 210 and / or the cavity. For example, the heat sink 204 may circularly surround the transparent layer 210 and / or the cavity. In some examples, the heat sink 204 may surround the transparent layer 210 in an elliptical, square, or any other geometry. In examples, the support 216 may be a single piece having an annular shape, for example, mechanically coupled to a single portion of the heat sink completely surrounding the transparent layer.

[0051] In various embodiments, the heat sink 204 includes multiple portions, each mechanically coupled to one side of the transparent layer 210. For example, the heat sink 204 may include a first heat sink portion 202 and a second heat sink portion 206. The first heat sink portion 202 may be mechanically coupled to one side of the transparent layer 210, and the second heat sink portion 206 may be mechanically coupled to the other side of the transparent layer 210.

[0052] In various embodiments, the support member 216 mechanically couples the heat sink 204 to the electronic circuit system 214. The support member 216 can have various shapes and / or mechanical forms. For example, the support member 216 may include a first post 220 and a second post 218, each post mechanically coupling the heat sink 204 to the electronic circuit system 214. The first post 220 may be mechanically coupled to a first boss of the heat sink 204, and the second post 218 may be mechanically coupled to a second boss of the heat sink 204.

[0053] In various embodiments, support 216 transfers heat generated by electronic circuitry 214 to heat sink 204, whereby the heat is dissipated into the environment. In various embodiments, first post 220 is configured to mechanically couple a first heat sink portion to electronic circuitry and transfer heat generated by electronic circuitry to the first heat sink portion. In various embodiments, second post 218 is configured to mechanically couple a second heat sink portion to electronic circuitry and transfer heat generated by electronic circuitry to the second heat sink portion.

[0054] In various embodiments, the support 216 is made of a thermally conductive material. For example, the support 216 (such as the first pillar 220 and the second pillar 218) is made of thermally conductive adhesive.

[0055] In the example embodiment, the support 216 and the heat sink 204 are configured to reduce the thermal resistance from the electronic circuitry 214 to the environment surrounding the electro-optical device 200. For example, by using the heat sink 204 embedded in the transparent layer 210, and for example by... Figure 1 Compared to the electro-optical device 100 in which the transparent layer 106 is surrounded by resin, the thermal resistance of the path from the electronic circuit system 214 to the environment is reduced.

[0056] Therefore, in the example embodiment, in the electro-optical device 200, the support 216 and the heat sink 204 are configured to maintain the maximum junction temperature of the electronic circuitry system below the maximum junction temperature threshold. This can reduce the likelihood of malfunctions due to temperature increases in the electro-optical device 200.

[0057] In various embodiments, the heat sink 204 includes a first heat sink portion 202 and a second heat sink portion 206. A first post 220 may be configured to mechanically couple the first heat sink portion 202 to the electronic circuit system 214, and a second post 218 may be configured to mechanically couple the second heat sink portion 206 to the electronic circuit system 214.

[0058] In various embodiments, the heat sink 204 includes one or more fins. The heat sink 204 may include, for example, one or more first fins 230 on a first heat sink portion 202 and one or more second fins 228 on a second heat sink portion 206. The one or more fins are configured to increase the heat exchange surface between the heat sink and the environment and to increase heat dissipation from the heat sink to the environment.

[0059] In various embodiments, the heat sink is made of copper or a copper alloy. Copper has high thermal conductivity and can increase the heat dissipation of the heat sink.

[0060] The electronic circuit system 214 may include one or more photosensitive components 222. The one or more photosensitive components 222 may include, for example, photodiodes, pixels, light sensors such as infrared sensors, transistors, etc. In this example, the one or more photosensitive components 222 are a pixel array.

[0061] In various embodiments, the electronic circuit system 214 is deployed on the substrate 208. The electro-optic device 200 may be a wire-bonded electro-optic device. For example, the electro-optic device 200 may include one or more bonding lines 212. The one or more bonding lines 212 may be configured to electrically couple the electronic circuit system 214 or components of the electronic circuit system 214 to one or more conductive traces on the substrate 208.

[0062] In various embodiments, the electro-optic device 200 may include a molding material 224. The molding material 224 may be configured to surround and mechanically couple to and hold together the heat sink, the support, the electronic circuitry, and the substrate. In an example embodiment, the molding material 224 increases the mechanical robustness of the electro-optic device 200. The molding material 224 may include a resin. In an example embodiment, although the molding material 224 may have high thermal resistance, the use of a heat sink and a low thermal resistance path from the electronic circuitry 214 to the heat sink 204 allows for heat dissipation and keeps the maximum junction temperature below the maximum junction temperature threshold. Therefore, in the example embodiment, the electro-optic device described herein provides high mechanical strength and high heat dissipation.

[0063] Now for reference Figure 3 Schematic diagrams of an electro-optical device 300 are provided according to various embodiments of the present disclosure. In various embodiments, the electro-optical device 300 includes a support member 216. The support member 216 may include a first layer made of copper and / or a copper alloy and a second solder layer made of, for example, tin and / or silver. The support member 216 may have various forms and / or shapes as described above.

[0064] In various embodiments, the support 216 includes a first post 220 and a second post 218. The first post 220 may include a first copper layer 308 mechanically coupled to the electronic circuit system 214 and a first solder layer 310 mechanically coupled to the first heat sink portion 202. Similarly, the second post 218 may include a second copper layer 316 mechanically coupled to the electronic circuit system 214 and a second solder layer 318 mechanically coupled to the second heat sink portion 206.

[0065] In various embodiments, the first heat sink portion 202 may include a first boss 314, and the second heat sink portion 206 may include a second boss 312. In various embodiments, one end of either boss may extend within a cavity or be flush with the interior of the support member 216. In various embodiments, the first boss 314 is disposed between the first pillar and the transparent layer and mechanically coupled to the transparent layer using adhesive. In various embodiments, the second boss 312 is disposed between the second pillar and the transparent layer and mechanically coupled to the transparent layer using adhesive. In various embodiments, another surface of the heat sink is in direct contact with the transparent layer. For example, surface 320 or surface 322 of the heat sink 204 may be mechanically coupled to and in direct contact with the transparent layer 210.

[0066] In various embodiments, the first radiator portion 202 includes one or more first fins 230, and the second radiator portion 206 includes one or more second fins 228. In various embodiments, the one or more first fins 230 and the one or more second fins 228 are configured to increase the heat exchange surface between the radiator and the environment and to increase the heat dissipation of the radiator.

[0067] In various embodiments, the heat sink may include a portion surrounding the transparent layer, for example having a circular, elliptical, and / or any other shape. In various embodiments, the heat sink may include one or more fins, each fin also surrounding the transparent layer.

[0068] In various embodiments, the heat sink may also be mechanically coupled to the support, electronic circuitry, and / or substrate using a molding material such as resin. For example, the area surrounding the support or on either side of the first and second pillars may be used with reference to... Figure 2 The molding material 224 shown and described is filled with a similar molding material. In the example embodiment, the use of molding material increases the mechanical robustness of the electro-optical device 300.

[0069] Now for reference Figure 4 Schematic diagram 400 illustrates a disc-shaped transparent layer 408, an annular heat sink 410, and an annular support 406, according to various exemplary embodiments of this disclosure. In various embodiments, the heat sink 410 is shaped to be embedded in the transparent layer 408, and the support 406 is shaped to mechanically couple the heat sink 410 to an electronic circuit system. Figure 4 The shapes of the supports, heat sinks, and transparent layers shown are for illustrative purposes only, and they can have various other shapes, such as ellipses, squares, rectangles, etc., as previously described.

[0070] In various embodiments, the heat sink can have fins of various shapes and / or arrangements. For example, the fins can extend radially from the center of the heat sink or can be arranged as concentric rings on the heat sink.

[0071] Figure 5 This is a flowchart illustrating a method 500 for manufacturing an electro-optical device according to various embodiments of the present disclosure. For example, method 500 can be used to manufacture a reference device. Figure 2 The described electro-optical device 200 or reference Figure 3 The electro-optical device 300 is described.

[0072] In various embodiments, method 500 fabricates an electronic circuit system 214 on a silicone layer at block 502. In various embodiments, method 500 fabricates one or more optical components, such as photosensitive components or light-emitting components, on the electronic circuit system 214 at block 504. In various embodiments, method 500 mounts the silicone layer or electronic circuit system 214 on a substrate 208 at block 506.

[0073] In various embodiments, method 500 uses one or more bonding lines 212 at block 508 to electrically couple the electronic circuit system 214 to the substrate 108. In various embodiments, method 500 fabricates a support 216 on the silicone layer or electronic circuit system 214 at block 510. In various embodiments, method 500 includes mounting a heat sink 204 on the support 216 at block 512. In various embodiments, method 500 embeds a transparent layer 210 in the heat sink 204 at block 514. In various embodiments, fabrication is performed according to... Figure 5 The manufacturing process is performed in the order shown. In various embodiments, manufacturing may be performed in any other order (one or more).

[0074] Those skilled in the art, upon benefiting from the teachings presented in the foregoing description and associated drawings, will conceive of numerous modifications and other embodiments of the disclosure set forth herein. While the drawings illustrate certain components of the apparatuses and systems according to the various embodiments described herein, it should be understood that various other components may be used in conjunction with the systems according to the various embodiments. Therefore, it should be understood that the disclosure is not limited to the specific embodiments disclosed, and modifications and other embodiments are intended to be included within the scope of the appended claims. Furthermore, the steps in the methods according to the various embodiments described above do not necessarily occur in the order depicted in the drawings, and in some cases, one or more of the depicted steps may occur substantially simultaneously, or additional steps may be involved. Although specific terminology is used herein, it is used only in a general and descriptive sense and not for limiting purposes.

[0075] Furthermore, the section headings used herein are intended to provide organizational clues in accordance with the recommendations of 37C.FR1.77 or otherwise. These headings should not limit or characterize the disclosure (one or more) listed in any of the claims that may be made from this disclosure.

[0076] The use of broader terms such as “comprising,” “including,” and “having” should be understood to provide support for narrower terms such as “consisting of,” “substantially consisting of,” and “essentially consisting of.” The use of terms such as “optionally,” “may,” “perhaps,” or “possibly” with respect to any element of an embodiment means that the element is not essential, or alternatively, that the element is essential, both of which are within the scope of the embodiment(s). Furthermore, references to examples are provided for illustrative purposes only and are not intended to be exclusive.

[0077] While this detailed description has set forth some embodiments of the present disclosure, the appended claims cover other embodiments of the present disclosure that differ from the described embodiments with various modifications and improvements.

Claims

1. An electro-optical device, characterized by, comprising: a transparent layer; a heat sink mechanically coupled to the transparent layer and embedded in the transparent layer, wherein the heat sink comprises: a first heat sink portion; and a second heat sink portion; electronic circuitry disposed on a substrate; a first pillar configured to: mechanically couple the first heat sink portion to the electronic circuitry; and transfer heat generated by the electronic circuitry to the first heat sink portion; and a second pillar configured to: mechanically couple the second heat sink portion to the electronic circuitry; and transfer heat generated by the electronic circuitry to the second heat sink portion.

2. The electro-optical device of claim 1, wherein, The first pillar and the second pillar comprise a thermally conductive glue.

3. The electro-optical device of claim 1, wherein: the first pillar comprises a first copper layer mechanically coupled to the electronic circuitry and a first solder layer mechanically coupled to the first heat sink portion; and the second pillar comprises a second copper layer mechanically coupled to the electronic circuitry and a second solder layer mechanically coupled to the second heat sink portion.

4. The electro-optical device of claim 1, wherein: the first heat sink portion comprises a first boss disposed between the first pillar and the transparent layer and mechanically coupled to the transparent layer using glue; and the second heat sink portion comprises a second boss disposed between the second pillar and the transparent layer and mechanically coupled to the transparent layer using glue.

5. The electro-optical device of claim 1, wherein, The first heat sink portion comprises one or more first fins and the second heat sink portion comprises one or more second fins, wherein the one or more first fins and the one or more second fins are configured to: increase a heat exchange surface between the heat sink and an environment; and increase heat dissipation of the heat sink. comprising:

6. An electro-optical device, characterized by a transparent layer; a heat sink comprising a boss, wherein the boss is mechanically coupled to the transparent layer; electronic circuitry disposed on a substrate; and a support configured to: mechanically couple the boss of the heat sink to the electronic circuitry; and transfer heat generated by the electronic circuitry to the heat sink. The boss of the heat sink is configured to be mechanically coupled to the transparent layer using glue.

7. The electro-optical device of claim 6, wherein, The heat sink comprises one or more fins configured to:

8. The electro-optical device of claim 7, wherein, increase a heat exchange surface between the heat sink and an environment; and increase heat dissipation of the heat sink. comprising a cavity, wherein the cavity is generated between the transparent layer, the electronic circuitry, and the support.

9. The electro-optical device of claim 6, wherein, 10. The electro-optical device of claim 6, wherein: the support comprises a first pillar and a second pillar; the heat sink comprises a first heat sink portion and a second heat sink portion; the first pillar is configured to mechanically couple the first heat sink portion to the electronic circuitry; and the second pillar is configured to mechanically couple the second heat sink portion to the electronic circuitry. The support comprises a thermally conductive material. The support and the heat sink are configured to reduce thermal resistance from the electronic circuitry to an environment.

11. The electro-optical device of claim 6, wherein, ​ 12. The electro-optical device of claim 11, wherein, ​ 13. The electro-optical device of claim 11, wherein, The support and the heat sink are configured to maintain a maximum junction temperature of the electronic circuitry below a maximum junction temperature threshold.

14. The electro-optical device of claim 11, wherein, The heat sink comprises copper or a copper alloy.

15. The electro-optical device of claim 6, wherein, The transparent layer comprises at least one of a lens, a lens array, a protective layer, or a refractive filter.

16. The electro-optical device of claim 6, wherein, The electronic circuitry comprises at least one of a photosensor, a photodiode, or a pixel.

17. The electro-optical device of claim 16, wherein, Further comprising one or more bond wires configured to electronically couple at least one of the photosensor, the photodiode, or the pixel to one or more conductive traces of the substrate.

18. The electro-optical device of claim 6, wherein, Further comprising a molding material configured to: surround the support; mechanically couple to and hold together the heat sink, the support, the electronic circuitry, and the substrate.

19. An electro-optical device, characterized by comprise: a transparent layer; a heat sink mechanically coupled to the transparent layer; electronic circuitry disposed on a substrate; and a support configured to: mechanically couple the heat sink to the electronic circuitry; and transfer heat generated by the electronic circuitry to the heat sink.

20. The electro-optical device of claim 19, wherein: the heat sink comprises: an opening configured to be embedded in the transparent layer; and one or more fins configured to: increase a heat exchange surface between the heat sink and an environment; and increase heat dissipation of the heat sink; the electronic circuitry comprises one or more light sensitive components; and the support surrounds the one or more light sensitive components. ​

Images