Display screen and display device

Abstract

The utility model discloses a display screen and a display device, the display screen comprises a display unit, the display unit comprises a substrate, a conductive adhesive layer, a light-emitting element and a thermosetting protective layer, and the substrate comprises a conductive pad; the conductive adhesive layer is arranged on one side of the substrate and covers the conductive bonding pad; the light-emitting element is arranged on one side of the substrate, the light-emitting element is electrically connected with the conductive bonding pad through the conductive adhesive layer, and at least part of the light-emitting element protrudes out of the side, away from the substrate, of the conductive adhesive layer in the thickness direction of the substrate; at least part of the thermosetting protection layer is arranged on the side, away from the substrate, of the light-emitting element, and part of the surface of the side, facing the substrate, of the thermosetting protection layer abuts against part of the surface of the side, away from the substrate, of the conductive adhesive layer.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of display, and particularly relates to a display screen and a display device. BACKGROUND

[0002] Micro-LED (Micro Light Emitting Diode) or Mini-LED (small light emitting diode) as a new generation of display technology has the advantages of high resolution, high brightness, ultra power saving, fast response speed, high light efficiency and long service life compared with the existing OLED (Organic Light-Emitting Diode) or LCD (Liquid Crystal Display) technology, and is widely used in display fields such as mobile phones, notebook computers and televisions.

[0003] However, the electrical connection between the LED of the display screen and the pad of the substrate is low in reliability, which affects the use performance of the display screen. Utility model content

[0004] The purpose of the present application is to provide a display screen and a display device, which can improve the performance of the display panel.

[0005] The first aspect of the present application provides a display screen, comprising a display unit, the display unit comprising a substrate, a conductive adhesive layer, a light emitting element and a thermosetting protective layer, the substrate comprising a conductive pad; the conductive adhesive layer is arranged on one side of the substrate and covers the conductive pad; the light emitting element is arranged on one side of the substrate, the light emitting element is electrically connected to the conductive pad through the conductive adhesive layer, and at least part of the light emitting element protrudes from the conductive adhesive layer away from the substrate in the thickness direction of the substrate; at least part of the thermosetting protective layer is arranged on the side of the light emitting element away from the substrate, and the part of the surface of the thermosetting protective layer on the side of the substrate abuts against the part of the surface of the conductive adhesive layer on the side away from the substrate.

[0006] In some embodiments, the thermosetting protective layer comprises a first sub-portion and a second sub-portion, the first sub-portion is arranged on the side of the light emitting element away from the substrate, the second sub-portion is arranged around the periphery of the first sub-portion and encloses the first sub-portion to form a containing cavity, and the part of the light emitting element protruding relative to the conductive adhesive layer is located in the containing cavity.

[0007] In some embodiments, the number of light emitting elements and conductive pads is multiple, each light emitting element is electrically connected to each conductive pad through the conductive adhesive layer, part of the second sub-portion is filled between adjacent two light emitting elements, and the side surface of the second sub-portion away from the substrate is flush with the side surface of the first sub-portion away from the substrate.

[0008] In some embodiments, at least one of the thermosetting protective layer and the conductive adhesive layer is arranged in an integral surface.

[0009] In some embodiments, the display unit further comprises a packaging cover plate and a connecting adhesive layer, the packaging cover plate is arranged on the side of the thermosetting protective layer away from the substrate, and the connecting adhesive layer is arranged between the thermosetting protective layer and the packaging cover plate.

[0010] In some embodiments, the conductive adhesive layer is an anisotropic conductive adhesive layer; and / or, the thermosetting protective layer is an OC adhesive layer.

[0011] In some embodiments, the number of display units is multiple, and the multiple display units are arranged in sequence along the direction parallel to the substrate.

[0012] In some embodiments, the display screen further comprises a driving chip, the driving chip is used for driving the light emitting element to emit light, and the driving chip is located on the side of the substrate away from the light emitting element.

[0013] In some embodiments, the substrate further comprises a substrate, a driving circuit layer and a signal line, the driving circuit layer is arranged on one side of the substrate, the conductive pad is located on the side of the driving circuit layer away from the substrate and is electrically connected with the driving circuit layer, one end of the signal line is electrically connected with the driving circuit layer, the other end of the signal line extends to the side of the substrate away from the driving circuit layer through the side surface of the substrate, and the other end of the signal line is electrically connected with the driving chip.

[0014] The second aspect of the present application provides a display device comprising the display screen of any one of the above.

[0015] The display screen and the display device provided by the embodiments of the present application have the following beneficial effects: the display screen comprises a display unit, the display unit comprises a substrate, a conductive adhesive layer, a light emitting element and a thermosetting protective layer, and the substrate comprises a conductive pad; the conductive adhesive layer is arranged on one side of the substrate and covers the conductive pad; the light emitting element is arranged on one side of the substrate, the light emitting element is electrically connected with the conductive pad through the conductive adhesive layer, at least part of the light emitting element protrudes from the side of the conductive adhesive layer away from the substrate along the thickness direction of the substrate; and the thermosetting protective layer is arranged on one side of the substrate, at least part of the thermosetting protective layer is arranged on the side of the light emitting element away from the substrate. After curing, the thermosetting protective layer will not soften and deform due to heat, therefore, the light emitting element is protected by the thermosetting protective layer, which can effectively buffer or even shield the stress from the upper film layer, reduce the influence of the stress of the upper film layer on the light emitting element, thereby reducing the risk of the light emitting element from deviating, helping to improve the reliability of the connection between the light emitting element and the conductive pad, and improving the use performance of the display screen. At the same time, the part of the surface of the thermosetting protective layer facing the substrate abuts against the part of the surface of the conductive adhesive layer away from the substrate, which is equivalent to further fixing the light emitting element through the thermosetting protective layer, reducing the risk of the thermosetting protective layer and the light emitting element deviating together, and helping to further improve the reliability of the connection between the light emitting element and the conductive pad. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required to be used in the embodiments of the present application will be briefly introduced as follows. Obviously, the drawings described below only constitute some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative effort on the basis of these drawings.

[0017] Figure 1 A cross-sectional schematic view of a display screen provided for some embodiments of the present application is shown in FIG. 1.

[0018] Figure 2 Another cross-sectional schematic view of a display screen provided for some embodiments of the present application is shown in FIG. 2.

[0019] Figure 3 Still another cross-sectional schematic view of a display screen provided for some embodiments of the present application is shown in FIG. 3.

[0020] Figure 4 A cross-sectional schematic view of a display screen provided for some other embodiments of the present application is shown in FIG. 4.

[0021] Figure 5 A cross-sectional schematic view of a display screen provided for some other embodiments of the present application is shown in FIG. 5.

[0022] The reference signs are as follows:

[0023] Display unit 100; substrate 10; conductive pad 11; substrate 12; signal line 13; conductive adhesive layer 20; light emitting element 30; thermosetting protective layer 40; first sub-portion 41; second sub-portion 42; encapsulation cover plate 50; connecting adhesive layer 60; driving chip 70; accommodation cavity K1. DETAILED DESCRIPTION

[0024] The embodiments of the present application will be further described in detail below with reference to the drawings and embodiments. The detailed description of the following embodiments and the drawings are used to exemplarily illustrate the principles of the present application, but cannot be used to limit the scope of the present application, i.e., the present application is not limited to the described embodiments.

[0025] In the description of the present application, it should be noted that, unless otherwise specified, the meaning of "a plurality of" is two or more; the terms "upper", "lower", "left", "right", "inner", "outer" and the like indicate the orientation or positional relationship only for the purpose of facilitating the description of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third" and the like are only for the purpose of description and cannot be understood as indicating or implying relative importance. "Vertical" is not strictly vertical, but within the allowable range of error. "Parallel" is not strictly parallel, but within the allowable range of error.

[0026] Reference to an "embodiment" in this application means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are they necessarily mutually exclusive of one another. As will be apparent to one of ordinary skill in the art, embodiments described in this application can be combined with one another.

[0027] The positional words appearing in the following description are the directions shown in the drawings, and are not intended to limit the specific structure of the application. It should be noted in the description of the application that, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", and "connecting" should be understood broadly, for example, they can be fixedly connected, or detachably connected, or integrally connected; they can be directly connected, or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0028] In some display screens, the light emitting elements can be electrically connected with the conductive pads of the substrate through the conductive adhesive layer, so that the driving circuit in the substrate can be used to drive the light emitting elements to emit light. At present, in order to improve the display effect of the display screen, at least part of the light emitting elements will usually be exposed relative to the conductive adhesive layer, and will not be completely inserted into the inside of the conductive adhesive layer. The exposed light emitting elements will usually be in direct contact with the film layer above them, which is easy to be offset due to the stress of the film layer above, and even lead to the disconnection with the conductive pads, affecting the use performance of the display screen.

[0029] In order to solve at least part of the above technical problems, the embodiments of the present application provide a display screen and a display device. The specific structure of the display screen and the display device provided by the embodiments of the present application will be introduced below in combination with the drawings.

[0030] Please refer to Figure 1 The first aspect of the present application provides a display screen, comprising a display unit 100, the display unit 100 comprising a substrate 10, a conductive adhesive layer 20, a light emitting element 30 and a thermosetting protective layer 40, the substrate 10 comprising a conductive pad 11; the conductive adhesive layer 20 is arranged on one side of the substrate 10 and covers the conductive pad 11; the light emitting element 30 is arranged on one side of the substrate 10, and the light emitting element 30 is electrically connected with the conductive pad 11 through the conductive adhesive layer 20. In the thickness direction of the substrate 10, at least part of the light emitting element 30 protrudes from the conductive adhesive layer 20 away from one side of the substrate 10; at least part of the thermosetting protective layer 40 is arranged on the side of the light emitting element 30 away from the substrate 10, and the part of the surface of the thermosetting protective layer 40 on the side of the substrate 10 abuts against the part of the surface of the conductive adhesive layer 20 on the side away from the substrate 10.

[0031] The substrate 10 comprises a substrate 12 and a driving circuit layer arranged on the substrate 12. The substrate 12 can be a rigid substrate 12 made of glass or plastic or the like. The driving circuit layer is provided with a driving circuit for controlling the light-emitting element 30 to emit light. The driving circuit layer is generally composed of a metal layer, a semiconductor layer (active layer), an insulating layer and the like inorganic film layers. By patterning these inorganic film layers, the driving circuit for controlling the light-emitting element 30 to emit light can be formed. The specific circuit structure has various implementation manners, and thus will not be described here.

[0032] The substrate 10 further comprises a conductive pad 11, which can be arranged on the side of the driving circuit layer away from the substrate 12, for realizing the electrical connection between the light-emitting element 30 and the driving circuit, so as to ensure that the driving circuit can drive the light-emitting element 30. The light-emitting element 30 can be electrically connected to the conductive pad 11 through the conductive adhesive layer 20. Specifically, the conductive adhesive layer 20 can be formed on the side of the substrate 10 where the conductive pad 11 is arranged, and then the light-emitting element 30 is formed on the side of the conductive adhesive layer 20 away from the substrate 10, so that the light-emitting element 30 is electrically connected to the conductive pad 11 through the conductive particles in the conductive adhesive layer 20. Alternatively, part of the light-emitting element 30 can be embedded in the conductive adhesive layer 20, and the other part protrudes from the side of the conductive adhesive layer 20 away from the substrate 10 in the thickness direction. Alternatively, the light-emitting element 30 can also completely protrude from the side of the conductive adhesive layer 20 away from the substrate 10. The conductive adhesive layer 20 can be various, for example, the conductive adhesive layer 20 can be an anisotropic conductive adhesive layer, or an anisotropic conductive adhesive, conductive silicone adhesive or other conductive adhesive layer 20.

[0033] The thermosetting protective layer 40 is a non-reversible curing structure, which can be made of OC, transparent polyimide or other transparent thermosetting materials. It has the properties of non-reversible curing, high mechanical strength and high temperature resistance. After curing, it will not soften and deform under the influence of temperature and other conditions, and it is not reversible.

[0034] In the embodiment of the present application, by arranging at least part of the thermosetting protective layer 40 on the side of the light emitting element 30 away from the substrate 10, the thermosetting protective layer 40 can cover the light emitting element 30 to a certain extent to protect the light emitting element 30. In subsequent processes of the display screen or in the process of using the display screen, the thermosetting protective layer 40 will not soften and deform again due to changes in temperature and other conditions, so as to effectively buffer or even shield the stress from the other film layers above, reduce the influence of the stress of the film layers above on the light emitting element 30, thereby reducing the risk of the light emitting element 30 from being offset, helping to improve the reliability of the connection between the light emitting element 30 and the conductive pad 11, and improve the use performance of the display screen. At the same time, the part of the surface of the thermosetting protective layer 40 on the side toward the substrate 10 abuts against the part of the surface of the conductive adhesive layer 20 on the side away from the substrate 10, which is equivalent to further fixing the light emitting element 30 by the thermosetting protective layer 40, reducing the risk of the thermosetting protective layer 40 and the light emitting element 30 being offset together, and helping to further improve the reliability of the connection between the light emitting element 30 and the conductive pad 11.

[0035] In addition, in the related art, the light emitting element 30 and the conductive pad 11 are electrically connected through the conductive particles in the conductive adhesive layer 20. When part of the conductive particles is in a critical state of being about to break due to the extrusion of the conductive pad 11 and the light emitting element 30, the part of the conductive particles is easy to break in subsequent processes or in the process of use due to the stress on the light emitting element 30, thereby causing the resistance between the light emitting element 30 and the corresponding conductive pad 11 to increase, causing the light emitting brightness of the light emitting element 30 to decrease, and forming a weak dark spot.

[0036] Therefore, in the embodiment of the present application, at least part of the thermosetting protective layer 40 is arranged on the side of the light emitting element 30 away from the substrate 10, and the part of the surface of the thermosetting protective layer 40 on the side toward the substrate 10 abuts against the part of the surface of the conductive adhesive layer 20 on the side away from the substrate 10. Through the fixing effect of the thermosetting protective layer 40 on the light emitting element 30 and by means of the thermosetting protective layer 40 effectively buffering or even shielding the stress between the light emitting element 30 and the other film layers above, the risk of the conductive particles between the light emitting element 30 and the conductive pad 11 breaking in subsequent processes or in the process of use can also be reduced, thereby reducing the risk of the resistance between the light emitting element 30 and the conductive pad 11 increasing to form a weak dark spot, and helping to improve the reliability of the display screen.

[0037] In addition, the part of the surface of the thermosetting protective layer 40 on the side toward the substrate 10 abuts against the part of the surface of the conductive adhesive layer 20 on the side away from the substrate 10, and the thermosetting protective layer 40 can also encapsulate the conductive adhesive layer 20 to a certain extent, reducing the risk of the conductive adhesive layer 20 collapsing due to moisture absorption and expansion, and also reducing the risk of the bubbles in the conductive adhesive layer 20 expanding in subsequent processes to affect the reliability of the connection between the light emitting element 30 and the conductive pad 11.

[0038] It should be noted that the at least part of the thermosetting protective layer 40 located on the side of the light emitting element 30 away from the substrate 10 can mean that all of the thermosetting protective layer 40 is located on the side of the light emitting element 30 away from the substrate 10 in the thickness direction of the substrate 10, and the thermosetting protective layer 40 can protrude relative to the light emitting element 30 in the direction parallel to the substrate 10, at this time, the side surface of the thermosetting protective layer 40 located on the side of the light emitting element 30 away from the substrate 10 can be in abutment with the side surface of the conductive adhesive layer 20 located on the side of the light emitting element 30 away from the substrate 10. Alternatively, the at least part of the thermosetting protective layer 40 located on the side of the light emitting element 30 away from the substrate 10 can also mean that part of the thermosetting protective layer 40 is located on the side of the light emitting element 30 away from the substrate 10, and part of the thermosetting protective layer 40 is located on the side of the light emitting element 30, at this time, the side surface of the thermosetting protective layer 40 located on the side of the light emitting element 30 can be in abutment with the side surface of the conductive adhesive layer 20 located on the side of the light emitting element 30.

[0039] Optionally, the thermosetting protective layer 40 can be a light-transmitting layer to reduce the influence of the thermosetting protective layer 40 on the light emitting element 30 and improve the display effect of the display screen.

[0040] Please continue to refer to Figure 1 In some embodiments, the thermosetting protective layer 40 includes a first sub-portion 41 and a second sub-portion 42, the first sub-portion 41 is arranged on the side of the light emitting element 30 away from the substrate 10, and the second sub-portion 42 is arranged around the periphery of the first sub-portion 41 and encloses the first sub-portion 41 to form a receiving cavity K1, the part of the light emitting element 30 protruding relative to the conductive adhesive layer 20 is located in the receiving cavity K1, which can increase the coverage area of the thermosetting protective layer 40 on the light emitting element 30 and improve the protection effect and fixing effect of the thermosetting protective layer 40 on the light emitting element 30, so as to further improve the connection reliability between the conductive pads 11 of the light emitting element 30.

[0041] The first sub-portion 41 and the second sub-portion 42 are connected as an integrated structure, the first sub-portion 41 is located on the side of the light emitting element 30 away from the substrate 10 and is attached to and connected with the side surface of the light emitting element 30 away from the substrate 10. The second sub-portion 42 is arranged around the periphery of the first sub-portion 41 and can enclose the first sub-portion 41 to form a receiving cavity K1, the receiving cavity K1 is located on the side of the first sub-portion 41 away from the substrate 10, and the part of the light emitting element 30 protruding relative to the conductive adhesive layer 20 is located in the receiving cavity K1, at this time, the second sub-portion 42 is equivalent to being arranged around the periphery of the light emitting element 30 protruding relative to the conductive adhesive layer 20.

[0042] Preferably, the thickness H1 of the first sub-part 41 satisfies: 2 microns ≤ H1 ≤ 100 microns, for example, the thickness of the first sub-part 41 can be 2 microns, 10 microns, 40 microns, 700 microns, 100 microns, etc., so as to improve the protection effect of the thermosetting protective layer 40 on the light emitting element 30.

[0043] Referring to Figure 2 In some embodiments, the number of the light emitting elements 30 and the conductive pads 11 is multiple, each light emitting element 30 is electrically connected with each conductive pad 11 through the conductive adhesive layer 20, and part of the second sub-part 42 is filled between adjacent two light emitting elements 30, and the side surface of the second sub-part 42 away from the substrate 10 is flush with the side surface of the first sub-part 41 away from the substrate 10.

[0044] The light emitting elements 30 can be arranged in an array on one side of the substrate 10. The number of the conductive pads 11 can be adapted to the number of the light emitting elements 30, and one light emitting element 30 can be electrically connected with one conductive pad 11, or can be electrically connected with multiple conductive pads 11. Optionally, the light emitting element 30 can include two connecting pins, and the two connecting pins can be respectively electrically connected with at least one conductive pad 11.

[0045] The thermosetting protective layer 40 can cover the part of each light emitting element 30 protruding relative to the conductive adhesive layer 20, so as to protect each light emitting element 30. Specifically, the thermosetting protective layer 40 can include multiple first sub-parts 41, each first sub-part 41 is arranged one by one on the side of each light emitting element 30 away from the substrate 10, and the second sub-part 42 can be arranged around the periphery of each first sub-part 41, so as to form multiple accommodation cavities K1 enclosed by the multiple first sub-parts 41, and the part of each light emitting element 30 protruding relative to the conductive adhesive layer 20 is accommodated one by one in each accommodation cavity K1.

[0046] It can be known that when the second sub-part 42 is arranged around the periphery of each first sub-part 41, part of the second sub-part 42 is arranged between adjacent two light emitting elements 30, the part of the second sub-part 42 can fill the gap between the adjacent two light emitting elements 30, and the side surface of the second sub-part 42 away from the substrate 10 is flush with the side surface of the first sub-part 41 away from the substrate 10, so as to reduce the risk of separation of the second sub-part 42 from the side surface of the light emitting element 30, and help to further improve the protection effect of the thermosetting protective layer 40 on each light emitting element 30.

[0047] In some embodiments, at least one of the thermosetting protective layer 40 and the conductive adhesive layer 20 is arranged in an integral surface, so as to form a continuous film layer structure, which helps to improve the stability of the thermosetting protective layer 40 and / or the conductive adhesive layer 20, and reduce the risk of peeling of the thermosetting protective layer 40 and / or the conductive adhesive layer 20.

[0048] Referring to Figure 3In some embodiments, the display unit 100 further comprises a packaging cover plate 50 and a connecting adhesive layer 60, the packaging cover plate 50 is arranged on the side of the thermosetting protective layer 40 away from the substrate 10, and the connecting adhesive layer 60 is arranged between the thermosetting protective layer 40 and the packaging cover plate 50.

[0049] The packaging cover plate 50 is arranged on the side of the thermosetting protective layer 40 away from the substrate 10, which can effectively package the structures such as the substrate 10, the conductive adhesive layer 20 and the light emitting element 30, thereby reducing the risk of invasion of impurities such as water and oxygen and improving the reliability and service life of the display unit 100. Optionally, the material of the packaging cover plate 50 can include polyethylene terephthalate (PET), so that the packaging cover plate 50 has good packaging capability.

[0050] The connecting adhesive layer 60 is arranged between the thermosetting protective layer 40 and the packaging cover plate 50, which can play a good connecting role between the two, reduce the risk of separation of the packaging cover plate 50, and at the same time, the connecting adhesive layer 60 can further package the structures such as the thermosetting protective layer 40 and the light emitting element 30, to further reduce the risk of invasion of impurities such as water and oxygen.

[0051] Preferably, at least one of the packaging cover plate 50 and the connecting adhesive layer 60 is arranged in an integral surface, to improve the reliability of the packaging cover plate 50 and / or the connecting adhesive layer 60.

[0052] In some embodiments, the conductive adhesive layer 20 is an anisotropic conductive adhesive layer; and / or, the thermosetting protective layer 40 is an OC adhesive layer.

[0053] In some embodiments, the conductive adhesive layer 20 is arranged as an anisotropic conductive adhesive layer, which can on the one hand ensure the connection reliability between the light emitting element 30 and the conductive pad 11, and on the other hand can simplify the process steps of the conductive adhesive layer 20 and reduce the preparation difficulty of the conductive adhesive layer 20.

[0054] In some embodiments, the thermosetting protective layer 40 is arranged as an OC adhesive layer, which has good thermosetting property and will not soften and deform again after curing due to heat, can play a good protective role on the light emitting element 30, and effectively buffer or even shield the stress from the upper film layer.

[0055] In addition, in some embodiments, due to the influence of the material properties, the conductive adhesive layer 20 is arranged as an anisotropic conductive adhesive layer, and the thermosetting protective layer 40 is arranged as an OC adhesive layer, which can effectively improve the adhesion between the conductive adhesive layer 20 and the thermosetting protective layer 40, improve the connection reliability of the two, and make the conductive adhesive layer 20 and the thermosetting protective layer 40 approximately constitute an integral structure.

[0056] Please refer to Figure 4In some embodiments, the display unit 100 is provided in plurality, and the plurality of display units 100 are arranged in sequence along a direction parallel to the substrate 10, so as to form a spliced display screen, thereby achieving high resolution, high definition, multi-signal source access, flexibility, stability and other characteristics.

[0057] Referring to Figure 5 In some embodiments, the display screen further comprises a driving chip 70, the driving chip 70 is used for driving the light emitting element 30 to emit light, and the driving chip 70 is located on the side of the substrate 10 away from the light emitting element 30, which helps to reduce the space occupation of the display screen on the non-display area of the peripheral side, increase the display area of the display screen, and improve the display effect.

[0058] In some embodiments, the substrate 10 further comprises a substrate 12, a driving circuit layer and a signal line 13, the driving circuit layer is arranged on one side of the substrate 12, the conductive pad 11 is located on the side of the driving circuit layer away from the substrate 12 and is electrically connected with the driving circuit layer, one end of the signal line 13 is electrically connected with the driving circuit layer, and the other end extends from the side of the substrate 12 facing the driving circuit layer, passes through the side of the substrate 12, and extends to the side of the substrate 12 away from the driving circuit layer and is electrically connected with the driving chip 70.

[0059] Specifically, the driving circuit layer, the conductive pad 11, the conductive adhesive layer 20 and the light emitting element 30 are arranged in sequence away from the substrate 12, the conductive pad 11 is electrically connected with the driving circuit layer, and the conductive pad 11 is further electrically connected with the light emitting element 30 through the conductive adhesive layer 20, so that the driving circuit layer can drive the light emitting element 30 to emit light. The driving circuit layer is further electrically connected with the driving chip 70, so as to realize the control of the driving chip 70 on the light emitting element 30.

[0060] The driving circuit layer is electrically connected with the driving chip 70 through the signal line 13. The signal line 13 can extend from the side of the substrate 12 facing the driving circuit layer, pass through the side of the substrate 12, and extend to the side of the substrate 12 away from the driving circuit layer, so as to be electrically connected with the driving chip 70. Compared with the through hole connection between the driving circuit layer and the driving chip 70, the present embodiment does not need to form a through hole on the substrate 12, so as to simplify the preparation process of the substrate 10 and reduce the preparation difficulty of the substrate 10.

[0061] Optionally, when the plurality of display units 100 are arranged in sequence along a direction parallel to the substrate 10, part of the signal lines 13 can be located between the substrates 12 of adjacent two display units 100, that is, the area between the substrates 12 of adjacent two display units 100 is used for wiring. At this time, in the direction parallel to the substrate 12, the minimum distance between the light emitting elements 30 of adjacent two display units 100 can be greater than or equal to 200 microns, so as to reduce the influence of the signal lines 13 located between the substrates 12 of adjacent two display units 100 on the display effect of the display screen.

[0062] Optionally, the pixel density PPI of each display unit 100 is less than or equal to 100, which helps to realize uniform display of each display unit 100 and improve the display effect of the display screen.

[0063] The second aspect of the present application provides a display device comprising the display screen of any one of the above. Since the display device adopts all the technical solutions of the above-mentioned embodiments, it has at least all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which will not be repeated here.

[0064] The display device can be any device with display function, for example, a mobile phone, a tablet computer, a notebook computer, a palm computer, a vehicle-mounted electronic device, a wearable device, an ultra-mobile personal computer (UMPC), a netbook, a personal digital assistant (PDA), a personal computer (PC), a television (TV), a teller machine or a self-service machine, etc.

[0065] Although the embodiments disclosed in the present application are as above, the content described is only the embodiments adopted for the convenience of understanding the present application, and is not intended to limit the present application. Any person skilled in the art can make any modification and change in the form and details without departing from the spirit and scope of the present application, but the protection scope of the present application shall be subject to the scope defined by the appended claims.

[0066] The above is only a specific embodiment of the present application, and those skilled in the art can clearly understand that, for the convenience and brevity of description, the above-described replacement of other connection modes and the like can refer to the corresponding process in the foregoing method embodiments, which will not be repeated here. It should be understood that the protection scope of the present application is not limited thereto, and any person skilled in the art can easily think of various equivalent modifications or replacements within the technical range disclosed in the present application, and these modifications or replacements shall be covered within the protection scope of the present application.

Claims

1. A display screen, characterized by The display unit comprises: a substrate comprising a conductive pad; a conductive adhesive layer disposed on one side of the substrate and covering the conductive pad; a light-emitting element disposed on one side of the substrate, the light-emitting element being electrically connected to the conductive pad through the conductive adhesive layer, at least part of the light-emitting element protruding from the conductive adhesive layer away from the substrate along the thickness direction of the substrate; a thermosetting protective layer, at least part of the thermosetting protective layer being disposed on the side of the light-emitting element away from the substrate, the part of the surface of the thermosetting protective layer on the side of the substrate abutting against the part of the surface of the conductive adhesive layer on the side away from the substrate.

2. The display screen of claim 1, wherein, The thermosetting protective layer comprises a first sub-portion and a second sub-portion, the first sub-portion being disposed on the side of the light-emitting element away from the substrate, the second sub-portion being disposed around the periphery of the first sub-portion and enclosing the first sub-portion to form a receiving cavity, the part of the light-emitting element protruding from the conductive adhesive layer being located in the receiving cavity.

3. The display screen of claim 2, wherein, The number of the light-emitting elements and the conductive pads is plural, each of the light-emitting elements being electrically connected to each of the conductive pads through the conductive adhesive layer, part of the second sub-portion is filled between two adjacent light-emitting elements, the surface of the second sub-portion on the side away from the substrate being flush with the surface of the first sub-portion on the side away from the substrate.

4. The display screen of claim 1, wherein, At least one of the thermosetting protective layer and the conductive adhesive layer is disposed in an entirety.

5. A display screen according to any one of claims 1 to 4, characterised in that, The display unit further comprises an encapsulation cover plate and a connecting adhesive layer, the encapsulation cover plate being disposed on the side of the thermosetting protective layer away from the substrate, the connecting adhesive layer being disposed between the thermosetting protective layer and the encapsulation cover plate.

6. A display screen according to any one of claims 1 to 4, characterised in that The conductive adhesive layer is an anisotropic conductive adhesive layer; and / or, the thermosetting protective layer is an OC adhesive layer.

7. A display screen according to any one of claims 1 to 4, characterised in that The number of the display units is plural, the plural display units being sequentially disposed along the direction parallel to the substrate.

8. A display screen according to any one of claims 1 to 4, characterised in that The display screen further comprises a driving chip, the driving chip being used to drive the light-emitting element to emit light, the driving chip being located on the side of the substrate away from the light-emitting element.

9. The display screen of claim 8, wherein, The substrate further comprises a substrate, a driving circuit layer and a signal line, the driving circuit layer being disposed on one side of the substrate, the conductive pad being located on the side of the driving circuit layer away from the substrate and being electrically connected to the driving circuit layer, one end of the signal line being electrically connected to the driving circuit layer, the other end of the signal line extending from the side of the substrate toward the driving circuit layer, via the side surface of the substrate, to the side of the substrate away from the driving circuit layer and being electrically connected to the driving chip.

10. A display device, characterized by comprising: The display screen comprises the display unit according to any one of claims 1-9.

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