Chip die bonder

Abstract

The utility model discloses a chip die bonder, and relates to the technical field of die bonders. The die bonder comprises a part bearing mechanism, an upper visual positioning mechanism, a pickup mechanism and a lower visual positioning mechanism. The part bearing mechanism is used for bearing a first part and a second part to be assembled; the upper visual positioning mechanism is erected above the part bearing mechanism and is aligned to the part bearing mechanism; the picking mechanism is erected above the part bearing mechanism and is aligned to the part bearing mechanism; the lower visual positioning mechanism is fixedly arranged on the side edge of the part bearing mechanism. According to the utility model, the upper visual positioning mechanism, the pickup mechanism and the lower visual positioning mechanism can cooperate with each other, the first part is accurately assembled on the second part, the assembly precision is high, and the assembly precision of the die bonder can be ensured after the die bonder is used for a long time.

Description

Technical Field

[0001] This utility model relates to the field of die bonding machine technology, and in particular to a chip die bonding machine. Background Technology

[0002] With the continuous development of the semiconductor industry and the constant advancement of chip packaging technology, the demand for die bonders continues to grow. Increased demand for chips from consumer electronics, communications, automotive electronics, and industrial control sectors has driven the development of the chip manufacturing and packaging industries, thereby expanding the die bonder market.

[0003] Die bonding machines play a crucial role in semiconductor manufacturing, primarily by firmly bonding chips to substrates to form complete semiconductor devices. Through the use of advanced automation technology and precise mechanical structures, die bonding machines can achieve high-precision, high-speed chip-to-substrate bonding, significantly improving production efficiency and shortening production cycles.

[0004] Currently, existing die bonders use a suction cup mechanism and a vision mechanism to position, pick up, and assemble chips. After long-term use, the relative positions of the suction cup mechanism and the vision mechanism of such die bonders will shift, which will affect the stability of the assembly between parts and reduce the assembly accuracy.

[0005] In the process of realizing this utility model, the inventors discovered that the prior art has at least the following problems:

[0006] Existing die bonders can affect the assembly accuracy of parts after long-term use. Utility Model Content

[0007] The purpose of this invention is to provide a die bonder that solves the technical problem that, after long-term use, die bonders in the prior art can affect the assembly accuracy of parts. The preferred technical solutions among the various technical solutions provided by this invention and their numerous technical effects are detailed below.

[0008] To achieve the above objectives, the present invention provides the following technical solution:

[0009] This utility model provides a chip bonding machine, comprising: a component carrying mechanism, an upper vision positioning mechanism, a picking mechanism, and a lower vision positioning mechanism;

[0010] The part-bearing mechanism is used to carry the first and second parts to be assembled.

[0011] The upper visual positioning mechanism is mounted above the part carrying mechanism and aligned with the part carrying mechanism; the upper visual positioning mechanism is capable of positional movement and is used to photograph and position the first part and the second part on the part carrying mechanism;

[0012] The picking mechanism is mounted above the part carrying mechanism and aligned with the part carrying mechanism; the picking mechanism is capable of positional movement to pick up the first part from the part carrying mechanism and attach the first part to the second part;

[0013] The lower vision positioning mechanism is fixedly disposed on the side of the part carrying mechanism; the lower vision positioning mechanism cooperates with the upper vision positioning mechanism to determine the relative position of the upper vision positioning mechanism and the lower vision positioning mechanism; the lower vision positioning mechanism cooperates with the picking mechanism to position the first part picked up by the picking mechanism.

[0014] Optionally, the lower vision positioning mechanism includes an imaging component, a reflection component, and a calibration component; the imaging component and the reflection component are correspondingly arranged in the Y-axis direction, and the light emitted by the imaging component is refracted by the reflection component and emitted in the Z-axis direction; the calibration component is arranged above the imaging component, and the calibration component can extend in the Y-axis direction.

[0015] Optionally, the calibration component includes a driving component and a calibration component, the calibration component being fixedly connected to the driving component, and the calibration component extending or retracting in the Y-axis direction under the action of the driving component.

[0016] Optionally, the calibration element is made of a transparent material; the calibration element is provided with calibration features.

[0017] Optionally, the die bonder further includes a support mechanism, and both the picking mechanism and the upper vision positioning mechanism are mounted above the part carrying mechanism via the support mechanism.

[0018] Optionally, the die bonder further includes a displacement mechanism, and the picking mechanism and the upper vision positioning mechanism are mounted on the support mechanism via the displacement mechanism.

[0019] Optionally, the displacement mechanism includes an X-axis displacement structure, a Y-axis displacement structure, and a Z-axis displacement structure. The support mechanism, the X-axis displacement structure, the Y-axis displacement structure, and the Z-axis displacement structure are connected in sequence. The picking mechanism and the upper vision positioning mechanism are both connected to the Z-axis displacement structure. Under the action of the X-axis displacement structure, the Y-axis displacement mechanism, and the Z-axis displacement structure, the picking mechanism and the upper vision positioning mechanism move in the X-axis direction, the Y-axis direction, and the Z-axis direction.

[0020] Optionally, the picking mechanism includes a picking drive and a suction cup, the suction cup being fixedly connected to the picking drive, and the suction cup picking up or placing the first part under the action of the picking drive.

[0021] Optionally, the part carrying mechanism includes a support plate, an X-axis moving assembly, a Y-axis moving assembly, and a conveying assembly;

[0022] The X-axis moving component is disposed above the support plate and is capable of positional movement in the X-axis direction; the Y-axis moving component is disposed above the X-axis moving component and is capable of positional movement in the Y-axis direction; the conveying component is conveyingly connected to the Y-axis moving component and is used to convey the first part and the second part; the lower vision positioning mechanism is fixedly disposed on the side of the Y-axis moving component.

[0023] Optionally, the die bonder further includes a support platform for supporting the part carrying mechanism, the upper vision positioning mechanism, the picking mechanism, the lower vision positioning mechanism, the support mechanism, and the displacement mechanism.

[0024] Implementing one of the above-described technical solutions of this utility model has the following advantages or beneficial effects:

[0025] The upper vision positioning mechanism, picking mechanism and lower vision positioning mechanism described in this utility model can cooperate with each other to accurately assemble the first part onto the second part. The assembly accuracy is high and the assembly accuracy of the die bonder can be guaranteed even after long-term use. Attached Figure Description

[0026] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. In the drawings:

[0027] Figure 1 This is a schematic diagram of the overall structure of an embodiment of the present utility model;

[0028] Figure 2 This is a schematic diagram showing the connection between the part-bearing mechanism and the lower vision positioning mechanism in an embodiment of this utility model;

[0029] Figure 3 This is a schematic diagram showing the connection of the support mechanism, displacement mechanism, picking mechanism and upper vision positioning mechanism in an embodiment of this utility model;

[0030] In the diagram: 1. Part carrying mechanism; 11. Carrying plate; 12. X-axis moving assembly; 121. X-axis moving slide rail; 122. X-axis moving slider; 123. X-axis moving plate; 13. Y-axis moving assembly; 131. Y-axis moving slide rail; 132. Y-axis moving slider; 133. Y-axis moving plate; 14. Conveying assembly; 141. Conveying seat; 142. Conveying component; 2. Upper vision positioning mechanism; 3. Picking mechanism; 31. Picking drive component; 32. Suction cup; 4. Lower vision positioning mechanism; 41. Imaging assembly; 411. Lens; 412. Camera; 42. Reflection assembly; 43. Marking 431. Fixed component; 432. Driving component; 433. Calibration component; 434. Calibration feature; 5. First part; 6. Second part; 7. Support mechanism; 71. Support platform; 72. Support beam; 8. Displacement mechanism; 81. X-axis displacement structure; 811. X-axis displacement slide rail; 812. X-axis displacement slider; 813. X-axis displacement plate; 82. Y-axis displacement structure; 821. Y-axis displacement slide rail; 822. Y-axis displacement slider; 823. Y-axis displacement plate; 83. Z-axis displacement structure; 831. Z-axis displacement slide rail; 832. Z-axis displacement slider; 833. Z-axis displacement plate; 9. Bearing platform. Detailed Implementation

[0031] To make the objectives, technical solutions, and advantages of this utility model clearer, various exemplary embodiments described below will be referenced to the accompanying drawings, which form part of the exemplary embodiments, illustrating various exemplary embodiments that may be adopted to implement this utility model. Unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. It should be understood that they are merely examples of processes, methods, and apparatuses consistent with some aspects of this utility model disclosed as detailed in the appended claims, and other embodiments may be used, or structural and functional modifications may be made to the embodiments listed herein without departing from the scope and spirit of this utility model.

[0032] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," etc., indicate the orientation or positional relationship based on the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the referred element must have a specific orientation, or be constructed and operated in a specific orientation. The terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. The term "multiple" means two or more. The terms "connected" and "linked" should be interpreted broadly, for example, they can be fixed connections, detachable connections, integral connections, mechanical connections, electrical connections, communication connections, direct connections, indirect connections through an intermediate medium, and can be the internal connection of two elements or the interaction relationship between two elements. The term "and / or" includes any and all combinations of one or more of the related listed items. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0033] To illustrate the technical solution described in this utility model, specific embodiments are described below, showing only the parts related to the embodiments of this utility model.

[0034] Example:

[0035] like Figure 1-3 As shown, this utility model provides a chip bonding machine, including: a component carrying mechanism 1, an upper vision positioning mechanism 2, a picking mechanism 3, and a lower vision positioning mechanism 4; the component carrying mechanism 1 is used to carry a first component 5 and a second component 6 to be assembled; the upper vision positioning mechanism 2 is mounted above the component carrying mechanism 1 and aligned with the component carrying mechanism 1; the upper vision positioning mechanism 2 is movable and used to photograph and position the first component 5 and the second component 6 on the component carrying mechanism 1; the picking mechanism 3 is mounted above the component carrying mechanism 1 and aligned with the component carrying mechanism 1; the picking mechanism 3 is movable and used to pick up the first component 5 on the component carrying mechanism 1 and attach the first component 5 to the second component 6; the lower vision positioning mechanism 4 is fixedly mounted on the side of the component carrying mechanism 1; the lower vision positioning mechanism 4 cooperates with the upper vision positioning mechanism 2 to determine the relative position of the upper vision positioning mechanism 2 and the lower vision positioning mechanism 4; the lower vision positioning mechanism 4 cooperates with the picking mechanism 3 to position the first component 5 picked up by the picking mechanism 3.

[0036] Specifically, the part-bearing mechanism 1 serves as a support component, carrying the first part 5 and the second part 6 to be assembled. Since the upper vision positioning mechanism 2, the pickup mechanism 3, and the lower vision positioning mechanism 4 are designed to assemble the first part 5 and the second part 6, they are all arranged around the part-bearing mechanism 1, cooperating to assemble the first part 5 and the second part 6 on the part-bearing mechanism 1. The chip bonding machine described in this embodiment has high assembly accuracy and maintains high assembly accuracy even after long-term use.

[0037] In this embodiment, the first component 5 can be a chip, and the second component 6 can be a circuit board.

[0038] Below, in conjunction with Figure 1-3 The chip bonding machine described in this embodiment will be explained in detail.

[0039] As an optional implementation method, such as Figure 1-2 As shown, the part carrying mechanism 1 is used to carry the first part 5 and the second part 6 to be assembled. The part carrying mechanism 1 includes a support plate 11, an X-axis moving assembly 12, a Y-axis moving assembly 13, and a conveying assembly 14; the X-axis moving assembly 12 is disposed above the support plate 11 and can move in the X-axis direction; the Y-axis moving assembly 13 is disposed above the X-axis moving assembly 12 and can move in the Y-axis direction; the conveying assembly 14 is connected to the Y-axis moving assembly 13 for conveying the first part 5 and the second part 6; the lower vision positioning mechanism 4 is fixedly disposed on the side of the Y-axis moving assembly.

[0040] Specifically, such as Figure 1 As shown, the support plate 11 is located at the bottom and is used to connect with other support mechanisms (such as the support platform 9) to support the X-axis moving assembly 12, the Y-axis moving assembly 13 and the conveying assembly 14.

[0041] like Figure 2As shown, the X-axis moving assembly 12 is disposed above the support plate 11. The X-axis moving assembly 12 includes an X-axis moving slide rail 121, an X-axis moving slider 122, and an X-axis moving plate 123. The X-axis moving slide rail 121 is fixedly disposed above the support plate 11. The X-axis moving slider 122 is slidably connected to the X-axis moving slide rail 121. The X-axis moving plate 123 is fixedly disposed on the X-axis moving slider 122 and can move in the X-axis direction under the action of the X-axis moving slider 122. The Y-axis moving assembly 13 includes a Y-axis moving slide rail 131, a Y-axis moving slider 132, and a Y-axis moving plate 133. The Y-axis moving slide rail 131 is fixedly disposed above the X-axis moving plate 123. The Y-axis moving slider 132 is slidably connected to the Y-axis moving slide rail 131. The Y-axis moving plate 133 is fixedly disposed on the Y-axis moving slider 132 and can move in the Y-axis direction under the action of the Y-axis moving slider 132. It should be noted that there are two X-axis sliding rails 121 and two Y-axis sliding rails 131, and multiple X-axis sliding blocks 122 and multiple Y-axis sliding blocks 132 are provided, and are correspondingly set on the two X-axis sliding rails 121 and two Y-axis sliding rails 131.

[0042] like Figure 2 As shown, the conveying assembly 14 includes two conveying seats 141 and a conveying component 142 disposed between the two conveying seats 141. The two conveying seats 141 are parallel and fixedly arranged on the Y-axis moving plate 133. The conveying component 142 is drivenly connected to the two conveying seats 141. The first part 5 and the second part 6 to be assembled are placed on the conveying component 142 and conveyed by the conveying component 142. Specifically, during the assembly of the first part 5 and the second part 6, the conveying component 142 is in a stationary state.

[0043] It should be noted that the conveying component 14 can be displaced in the X-axis and Y-axis directions under the action of the X-axis moving component 12 and the Y-axis moving component 13, which can adjust the position of the first part 5 and the second part 6 to be assembled on the conveying component 14, so as to ensure that the picking mechanism 3 and the upper vision positioning mechanism 2 mounted on the part carrying mechanism 1 can better photograph and pick up the first part 5 and the second part 6, thereby improving the efficiency of the photographing and picking process.

[0044] As an optional implementation method, such as Figure 2 As shown, the lower vision positioning mechanism 4 includes a shooting component 41, a reflection component 42, and a calibration component 43; the shooting component 41 and the reflection component 42 are arranged correspondingly in the Y-axis direction, and the light emitted by the shooting component 41 is refracted by the reflection component 42 and then emitted in the Z-axis direction; the calibration component 43 is arranged above the shooting component 41, and the calibration component 43 can extend in the Y-axis direction.

[0045] Specifically, the lower vision positioning mechanism 4 is fixedly mounted on the side of the conveyor seat 141, and can move synchronously with the part carrying mechanism 1. The imaging component 41 and the reflecting component 42 are correspondingly arranged in the Y-axis direction. The imaging component 41 includes a lens 411 and a camera 412. When the imaging component 41 is working, the lens 411 emits a light source, which is reflected by the reflecting component 42, ultimately emitting light from the Z-axis direction. The camera 412 then captures images of objects in the Z-axis direction (e.g., a calibration plate extending in the Y-axis direction, and the first part 5 moved above the lower vision positioning mechanism 4). The calibration component 43 is positioned above the imaging component 41 and parallel to it. The calibration component 43 includes a driving component 431 and a calibration component 432, which are fixedly connected. The calibration component 432 can extend or retract in the Y-axis direction under the action of the driving component 431. It should be noted that the reflecting component 42 is a 45° reflecting mirror. The drive component 431 is a cylinder or a motor. The calibration component 432 is made of transparent material; and the calibration component 432 is provided with calibration features 433.

[0046] In this embodiment, the lower vision positioning mechanism 4 has two functions. First, it works in conjunction with the upper vision positioning mechanism 2 to determine their relative positions. Specifically, when determining the relative positions of the lower vision positioning mechanism 4 and the upper vision positioning mechanism 2, the calibration member 432 extends outward under the action of the driving member 431. At this time, both the lower vision positioning mechanism 4 and the upper vision positioning mechanism 2 will capture images of the calibration features 433 on the calibration plate. Then, the lower vision positioning mechanism 4 and the upper vision positioning mechanism 2 will determine their relative positions based on the captured images of the calibration features 433 on the calibration plate.

[0047] The second mechanism involves the lower vision positioning mechanism 4 cooperating with the picking mechanism 3 to position the first part 5 picked up by the picking mechanism 3. After picking up the first part 5 under the action of the upper vision positioning mechanism 2, the picking mechanism 3 moves to the position of the lower vision positioning mechanism 4 to take a picture. This allows for positional compensation when the first part 5 is subsequently attached to the second part 6, improving assembly accuracy. In fact, before picking up the first part 5, the upper vision positioning mechanism 2 takes a picture of the first part 5 to obtain its location, ensuring that the picking mechanism 3 can accurately pick it up. However, during the picking process, the position of the first part 5 may shift. Therefore, the picking mechanism 3 needs to move the first part 5 above the lower vision positioning mechanism 4 for positioning, facilitating its assembly onto the second part 6 and improving assembly accuracy.

[0048] In this embodiment, the upper visual positioning mechanism 2 and the lower visual positioning mechanism 4 determine their relative positions, and the first part 5 picked up by the picking mechanism 3 is also moved to the lower visual positioning mechanism 4 for imaging. It can be seen that both the upper visual positioning mechanism 2 and the picking mechanism 3 are positionally related to the lower visual positioning mechanism 4; therefore, a positional connection is established between the upper visual positioning mechanism 2 and the picking mechanism 3 through the lower visual positioning mechanism 4. Finally, when the picking mechanism 3 assembles the picked-up first part 5 onto the second part 6, due to the positional connection between the picking mechanism 3 and the upper visual positioning mechanism 2, its assembly position is adjusted according to the relative position between the upper visual positioning mechanism 2 and the lower visual positioning mechanism 4. Position compensation is performed on the first part 5 before assembly, ultimately improving its assembly accuracy.

[0049] As an optional implementation method, such as Figure 3 As shown, the die bonder also includes a support mechanism 7. The pickup mechanism 3 and the upper vision positioning mechanism 2 are both mounted above the part carrying mechanism 1 via the support mechanism 7. Specifically, the support mechanism 7 supports the pickup mechanism 3 and the upper vision positioning mechanism 2, allowing them to be mounted above the part carrying mechanism 1. The support mechanism 7 includes a support platform 71 and a support beam 72. Two support platforms 71 are provided, each mounted on another carrying mechanism (e.g., carrying platform 9). The support beam 72 is positioned between the two support platforms 71, supporting the pickup mechanism 3 and the upper vision positioning mechanism 2.

[0050] As an optional implementation method, such as Figure 3 As shown, the die bonder also includes a displacement mechanism 8, and the pickup mechanism 3 and the upper vision positioning mechanism 2 are mounted on the support mechanism 7 via the displacement mechanism 8. Specifically, the pickup mechanism 3 and the upper vision positioning mechanism 2 can move on the support mechanism 7, and the movement of the pickup mechanism 3 and the upper vision positioning mechanism 2 is achieved by the displacement mechanism 8.

[0051] like Figure 3 As shown, the displacement mechanism 8 includes an X-axis displacement structure 81, a Y-axis displacement structure 82, and a Z-axis displacement structure 83. The support mechanism 7, the X-axis displacement structure 81, the Y-axis displacement structure 82, and the Z-axis displacement structure 83 are connected in sequence. The pickup mechanism 3 and the upper vision positioning mechanism 2 are both connected to the Z-axis displacement structure 83. Under the action of the X-axis displacement structure 81, the Y-axis displacement mechanism 82, and the Z-axis displacement structure 83, the pickup mechanism 3 and the upper vision positioning mechanism 2 move in the X-axis direction, the Y-axis direction, and the Z-axis direction.

[0052] Specifically, the X-axis displacement structure 81 includes an X-axis displacement slide rail 811, an X-axis displacement slider 812, and an X-axis displacement plate 813. The X-axis displacement slide rail 811 is fixedly mounted on the support beam 72, the X-axis displacement slider 812 is slidably connected to the X-axis displacement slide rail 811, and the X-axis displacement plate 813 is fixedly connected to the X-axis displacement slider 812. The Y-axis displacement structure 82 includes a Y-axis displacement slide rail 821, a Y-axis displacement slider 822, and a Y-axis displacement plate 823. The Y-axis displacement slide rail 821 is fixedly mounted on the X-axis displacement plate 813, the Y-axis displacement slider 822 is slidably connected to the Y-axis displacement slide rail 821, and the Y-axis displacement plate 823 is fixedly connected to the Y-axis displacement slider 822. The Z-axis displacement structure 83 includes a Z-axis displacement slide rail 831, a Z-axis displacement slider 832, and a Z-axis displacement plate 833. The Z-axis displacement slide rail 831 is fixedly mounted on the Y-axis displacement plate 823, the Z-axis displacement slider 832 is slidably connected to the Z-axis displacement slide rail 831, and the Z-axis displacement plate 833 is fixedly connected to the Z-axis displacement slider 832.

[0053] It should be noted that there are two X-axis displacement slide rails 811, two Y-axis displacement slide rails 821 and two Z-axis displacement slide rails 831, and multiple X-axis displacement sliders 812, multiple Y-axis displacement sliders 822 and multiple Z-axis displacement sliders 832, which are respectively set on the two X-axis displacement slide rails 811, two Y-axis displacement slide rails 821 and two Z-axis displacement slide rails 831.

[0054] Both the pickup mechanism 3 and the upper vision positioning mechanism 2 are fixedly connected to the Z-axis displacement plate 833 and can move in the X-axis, Y-axis, and Z-axis directions under the action of the X-axis displacement structure 81, Y-axis displacement structure 82, and Z-axis displacement structure 83. The pickup mechanism 3 can move in the X-axis, Y-axis, and Z-axis directions under the action of the displacement mechanism 8, picking up the first part 5, moving it above the lower vision positioning mechanism 4 for photographing, and then moving the first part 5 above the second part 6 for assembly. The upper vision positioning mechanism 2 can move in the X-axis, Y-axis, and Z-axis directions under the action of the displacement mechanism 8. The upper vision positioning mechanism 2 can photograph the first part 5 and the second part 6 and cooperate with the lower vision positioning mechanism 4 to photograph the calibration feature 433 on the calibration plate. The displacement mechanism 8 facilitates the pickup by the pickup mechanism 3 and the photographing by the upper vision positioning mechanism 2, ensuring efficiency in the assembly process of the first part 5 and the second part 6.

[0055] As an optional implementation method, such as Figure 1 , Figure 3As shown, the picking mechanism 3 includes a picking drive 31 and a suction cup 32. The suction cup 32 is fixedly connected to the picking drive 31, and the suction cup 32 picks up or places the first part 5 under the action of the picking drive 31. Specifically, the picking mechanism 3 can move in the Z-axis direction under the action of the displacement mechanism 8, moving closer to or away from the first part 5 and the second part 6 placed on the conveying assembly 14. However, in the actual process of picking up and placing the first part 5, it is accomplished by the picking drive 31 and the suction cup 32. When the first part 5 needs to be picked up, the picking drive 31 will cause the suction cup 32 to generate suction, so that the suction cup 32 picks up the first part 5. When the first part 5 needs to be placed on the second part 6 to assemble the first part 5 and the second part 6, the picking drive 31 will return to its original position, causing the suction of the suction cup 32 to disappear, and finally the first part 5 is accurately placed on the second part 6. The arrangement of the pickup drive unit 31 and the suction cup 32 facilitates the suction cup 32 in picking up and placing the first part 5, ensuring its pickup efficiency and accuracy. More specifically, the suction cup 32 can move along the R-axis under the action of the pickup drive unit 31, realizing position compensation of the first part 5 on the R-axis.

[0056] In summary, the upper vision positioning mechanism 2 photographs the first part 5 and the second part 6; the picking mechanism 3 picks up the first part 5 and moves it to the lower vision positioning mechanism 4 for photographing; the lower vision positioning mechanism 4 and the upper vision positioning mechanism 2 simultaneously photograph the calibration feature 433 on the calibration part 432. The purpose of this series of steps is to position the first part 5 and the second part 6. After positioning, before assembling the first part 5 onto the second part 6, the first part 5 undergoes position compensation. During position compensation, compensation in the X-axis and Y-axis directions can be achieved through the displacement mechanism 8, which is mounted above the part-bearing mechanism 1 and used to move the picking mechanism 3 and the upper vision positioning mechanism 2, or through the part-bearing mechanism 1 itself moving the second part 6. R-axis compensation is achieved through the picking mechanism 3. The first part 5 is then mounted onto the second part 6 after position compensation. Positioning and compensating the first part 5 and the second part 6 ensures correct assembly and improves assembly quality.

[0057] As an optional implementation method, such as Figure 1As shown, the die bonder also includes a support platform 9, which supports the part carrying mechanism 1, the upper vision positioning mechanism 2, the pickup mechanism 3, the lower vision positioning mechanism 4, the support mechanism 7, and the displacement mechanism 8. Specifically, the die bonder also includes a support platform 9, where the support plate 11 in the part carrying mechanism 1 and the support platform 71 in the support mechanism 7 are both connected to the support platform 9 and supported by it. This allows the part carrying mechanism 1, the upper vision positioning mechanism 2, the pickup mechanism 3, the lower vision positioning mechanism 4, the support mechanism 7, and the displacement mechanism 8 to form a whole on the support platform 71, providing support conditions for the assembly of the first part 5 and the second part 6.

[0058] The working principle of the chip bonding machine described in this embodiment is as follows:

[0059] The upper vision positioning mechanism 2 captures images of the second part 6 and the first part 5 to obtain their positions. The picking mechanism 3 picks up the first part 5 based on the image captured by the upper vision positioning mechanism 2. After picking up the first part 5, the picking mechanism 3 moves its position under the action of the displacement mechanism 8, moving the first part 5 above the lower vision positioning mechanism 4, where the lower vision positioning mechanism 4 captures an image of the first part 5. After the image capture is completed, the picking mechanism 3 moves its position under the action of the displacement mechanism 8. Simultaneously, the displacement mechanism 8 moves the upper vision positioning mechanism 2 above the lower vision positioning mechanism 4, causing the calibration plate in the lower vision positioning mechanism 4 to pop out. The upper vision positioning mechanism 2 and the lower vision positioning mechanism 4 simultaneously capture images of the calibration features 433 on the calibration plate to determine the relative positions of the upper vision positioning mechanism 2 and the lower vision positioning mechanism 4, thus positioning the first part 5 and the second part 6. Finally, the picking mechanism 3 performs positional compensation on the first part 5 based on the relative positions of the upper visual positioning mechanism 2 and the lower visual positioning mechanism 4, the positional relationship between the picking mechanism 3 and the lower visual positioning mechanism 4, and the positional relationship between the picking mechanism 3 and the upper visual positioning mechanism 2. This accurately places the first part 5 onto the second part 6, thus completing the assembly. Each time the first part 5 and the second part 6 are assembled, the above steps are performed to achieve the assembly.

[0060] It should be noted that the upper visual positioning mechanism 2 includes a lens and a camera, which are not specifically described in this embodiment.

[0061] The upper vision positioning mechanism 2, the picking mechanism 3, and the lower vision positioning mechanism 4 described in this embodiment can cooperate with each other to accurately assemble the first part 5 onto the second part 6. The assembly accuracy is high, and the die bonder repeats the corresponding steps every time it is assembled, so the assembly accuracy of the die bonder can be guaranteed even after long-term use.

[0062] The embodiment is merely a special case and does not indicate that this utility model is implemented in such a way.

[0063] The above description is merely a preferred embodiment of the present utility model. Those skilled in the art will understand that various changes or equivalent substitutions can be made to these features and embodiments without departing from the spirit and scope of the present utility model. Furthermore, under the teachings of the present utility model, these features and embodiments can be modified to adapt to specific situations and materials without departing from the spirit and scope of the present utility model. Therefore, the present utility model is not limited to the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this application are within the protection scope of the present utility model.

Claims

1. A chip die bonder, characterized by, The device comprises: a part bearing mechanism (1), an upper visual positioning mechanism (2), a pickup mechanism (3) and a lower visual positioning mechanism (4); the part bearing mechanism (1) is used for bearing a first part (5) and a second part (6) to be assembled; the upper visual positioning mechanism (2) is arranged above the part bearing mechanism (1) and is arranged in alignment with the part bearing mechanism (1); the upper visual positioning mechanism (2) can move in position and is used for photographing and positioning the first part (5) and the second part (6) on the part bearing mechanism (1); the pickup mechanism (3) is arranged above the part bearing mechanism (1) and is arranged in alignment with the part bearing mechanism (1); the pickup mechanism (3) can move in position, pick up the first part (5) on the part bearing mechanism (1) and mount the first part (5) on the second part (6); the lower visual positioning mechanism (4) is fixedly arranged at the side of the part bearing mechanism (1); the lower visual positioning mechanism (4) cooperates with the upper visual positioning mechanism (2) and is used for determining the relative position of the upper visual positioning mechanism (2) and the lower visual positioning mechanism (4); the lower visual positioning mechanism (4) cooperates with the pickup mechanism (3) and is used for positioning the first part (5) picked up by the pickup mechanism (3).

2. The die bonder of claim 1, wherein The lower visual positioning mechanism (4) comprises a photographing assembly (41), a reflecting assembly (42) and a calibration assembly (43); the photographing assembly (41) is arranged in correspondence with the reflecting assembly (42) in the Y-axis direction, the light emitted by the photographing assembly (41) is refracted by the reflecting assembly (42) and then emitted in the Z-axis direction; the calibration assembly (43) is arranged above the photographing assembly (41) and can extend in the Y-axis direction.

3. The die bonder of claim 2, wherein the die bonder further comprises: The calibration assembly (43) comprises a driving member (431) and a calibration member (432); the calibration member (432) is fixedly connected with the driving member (431) and extends or retracts in the Y-axis direction under the action of the driving member (431).

4. The die bonder of claim 3, wherein the first and second stages are configured to move the first and second dies in a direction that is substantially perpendicular to the plane of the first and second dies. The calibration member (432) is made of transparent material; the calibration member (432) is provided with a calibration feature (433).

5. The die bonder of claim 1, wherein The die bonder further comprises a support mechanism (7); the pickup mechanism (3) and the upper visual positioning mechanism (2) are arranged above the part bearing mechanism (1) through the support mechanism (7).

6. The die bonder of claim 5, wherein the die bonder further comprises: The die bonder further comprises a displacement mechanism (8); the pickup mechanism (3) and the upper visual positioning mechanism (2) are arranged on the support mechanism (7) through the displacement mechanism (8).

7. The die bonder of claim 6, wherein the die bonder further comprises: The displacement mechanism (8) comprises an X-axis displacement structure (81), a Y-axis displacement structure (82) and a Z-axis displacement structure (83), the support mechanism (7), the X-axis displacement structure (81), the Y-axis displacement structure (82) and the Z-axis displacement structure (83) are sequentially connected, and the pickup mechanism (3) and the upper visual positioning mechanism (2) are connected with the Z-axis displacement structure (83); the pickup mechanism (3) and the upper visual positioning mechanism (2) are moved in position in the X-axis direction, the Y-axis direction and the Z-axis direction under the action of the X-axis displacement structure (81), the Y-axis displacement mechanism (8) and the Z-axis displacement structure (83).

8. The die bonder of claim 1, wherein The pickup mechanism (3) comprises a pickup driving element (31) and a suction cup (32), the suction cup (32) is fixedly connected with the pickup driving element (31), and the suction cup (32) picks up or places the first part (5) under the action of the pickup driving element (31).

9. The die bonder of claim 1, wherein, The part carrying mechanism (1) comprises a carrying plate (11), an X-axis moving assembly (12), a Y-axis moving assembly (13) and a conveying assembly (14); The X-axis moving assembly (12) is arranged above the carrying plate (11) and can move in position in the X-axis direction; the Y-axis moving assembly (13) is arranged above the X-axis moving assembly (12) and can move in position in the Y-axis direction; the conveying assembly (14) is in conveying connection with the Y-axis moving assembly (13) and is used for conveying the first part (5) and the second part (6); and the lower visual positioning mechanism (4) is fixedly arranged at the side of the Y-axis moving assembly.

10. The die bonder according to any one of claims 1 to 9, wherein The die bonder further comprises a carrying table (9) for supporting the part carrying mechanism (1), the upper visual positioning mechanism (2), the pickup mechanism (3), the lower visual positioning mechanism (4), the support mechanism (7) and the displacement mechanism (8).

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