Wafer transmission device

Abstract

The utility model discloses a wafer transmission device, and relates to the technical field of conveying devices. The device comprises a box body, a longitudinal driving mechanism is arranged in the box body, the longitudinal driving mechanism is mounted on the surface of the box body, a mounting box is arranged on the top of the longitudinal driving mechanism, a position adjusting assembly is mounted on the surface of the mounting box, and two mounting rods are arranged on the top of the position adjusting assembly. First electric push rods are fixedly mounted at the ends of the two mounting rods, first connecting rods are fixedly connected to the telescopic ends of the first electric push rods, wafer clamping assemblies used for limiting wafers are arranged at the ends of the first connecting rods, and the longitudinal driving mechanism comprises a first motor; and the first motor is fixedly mounted on the back surface of the box body, so that the effect of quickly conveying two wafers in use is realized, the wafers between shelves are conveyed more conveniently, the conveying process is uninterrupted, and the conveying efficiency is effectively improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to conveying device technical field, concretely relates to a wafer transmission device. BACKGROUND

[0002] Wafer is the basic material of semiconductor manufacturing, usually made of silicon and other materials, used for manufacturing integrated circuits, microelectronic devices and the like. In the semiconductor production process, wafers need to be frequently carried and transported between different processing equipment, storage shelves or workstations. The main function of the wafer transmission device is to ensure that the wafer remains stable and safe during transmission, and can efficiently and accurately complete the carrying task.

[0003] When wafer transmission is carried out between two shelves, the existing device usually needs to take the wafer out of the first shelf first, place it on the transmission device, and then carry the wafer to the second shelf. The whole process takes a long time and cannot realize continuous transmission, so the transmission efficiency is not high.

[0004] Therefore, a wafer transmission device is proposed. UTILITY MODEL CONTENTS

[0005] The utility model aims at: in order to solve the problem mentioned in the above background art, the utility model provides a wafer transmission device.

[0006] The utility model discloses a specific technical scheme in order to realize the above-mentioned purpose:

[0007] A wafer transmission device, comprising a box body, a longitudinal driving mechanism is arranged in the box body, a longitudinal driving mechanism is installed on the surface of the box body, a mounting box is arranged at the top of the longitudinal driving mechanism, a position adjusting assembly is installed on the surface of the mounting box, two mounting rods are arranged at the top of the position adjusting assembly, a first electric push rod is fixedly installed at the end of each of the two mounting rods, a first connecting rod is fixedly connected to the telescopic end of the first electric push rod, and a wafer clamping assembly for limiting the wafer is arranged at the end of the first connecting rod.

[0008] Further, the longitudinal driving mechanism comprises a first motor, and the first motor is fixedly installed on the back of the box body, the output end of the first motor is fixedly connected with a lead screw, the surface of the lead screw is threadedly connected with a U-shaped support, and the top end of the U-shaped support is fixedly connected with the mounting box, the inner wall of the box body is fixedly connected with a sliding column, and the sliding column is slidably connected with the U-shaped support, a first sliding groove is formed through the top surface of the box body, and the inner wall of the first sliding groove is slidably connected with the U-shaped support.

[0009] Further, the position adjusting assembly comprises a second motor, and the second motor is fixedly installed on the bottom surface of the mounting box, the output end of the second motor is fixedly connected with a rotating shaft, the end of the rotating shaft is fixedly connected with a driving gear, the front side and the rear side of the driving gear are engaged with racks, the top surface of the rack is fixedly connected with the mounting rod, and the top surface of the mounting box is provided with a second sliding groove in penetration, and the inner wall of the second sliding groove is slidably connected with the mounting rod.

[0010] Further, the wafer clamping assembly comprises a supporting plate, and the supporting plate is fixedly connected with the first connecting rod, the middle part of the supporting plate is fixedly installed with a second electric push rod, the telescopic end of the second electric push rod is fixedly connected with a second connecting rod, the second connecting rod is movably inserted with the supporting plate, the end of the second connecting rod is fixedly connected with a movable clamping block, and the top surface of the supporting plate is fixedly connected with a fixed clamping block.

[0011] Further, one of the first electric push rods is arranged on the top surface of the mounting rod, the other first electric push rod is arranged on the bottom surface of the mounting rod, and the height of the wafer clamping assembly on the right side is lower than the height of the wafer clamping assembly on the left side.

[0012] Further, the bottom surface of the box is provided with a plurality of rollers at the four corners, and the rollers have a self-locking structure.

[0013] The beneficial effects of the utility model are as follows:

[0014] The device is moved to the side of the shelf for storing wafers, the mounting box and the mounting rod are moved to the front side through the longitudinal driving mechanism, so that the wafer clamping assembly is close to the shelf, in the process, the first connecting rod is vertically moved through the first electric push rod, so that the wafer clamping assembly finally reaches the lower side of the wafer, the first connecting rod and the wafer clamping assembly are lifted through the first electric push rod, the wafer is lifted through the wafer clamping assembly, the wafer is clamped and fixed through the wafer clamping assembly, then the mounting box and the mounting rod are driven away from the shelf through the longitudinal driving mechanism, the two are controlled to move and exchange positions through the position adjusting assembly, so that the wafer reaches another shelf, the wafer is placed on another shelf through the cooperation of the longitudinal driving mechanism and the first electric push rod, then the wafer clamping assembly releases the clamping of the wafer, and the wafer can be placed on another shelf, while another wafer clamping assembly is located at the first shelf position, the wafer picking can be synchronized, the above steps can be repeated, the wafer conveying between two shelves can be realized, the effect that the two wafers are conveniently and quickly conveyed is realized in use, the wafer conveying between shelves is more convenient, the conveying process is uninterrupted, and the conveying efficiency is effectively improved. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 It is a three-dimensional structure schematic diagram of the utility model;

[0016] Figure 2 is the structure of the utility model oblique section view;

[0017] Figure 3 is the structure of the utility model installation box oblique section view;

[0018] Figure 4 is the structure of the utility model second motor schematic view;

[0019] Figure 5 is the structure of the utility model wafer clamping subassembly side view;

[0020] Reference signs: 1, box;2, longitudinal drive mechanism;201, first motor;202, screw;203, U-shaped support;204, sliding column;205, first sliding groove;3, installation box;4, position adjusting subassembly;401, second motor;402, rotating shaft;403, driving gear;404, rack;405, second sliding groove;5, installation rod;6, first electric push rod;7, first connecting rod;8, wafer clamping subassembly;801, supporting plate;802, second electric push rod;803, movable clamping block;804, fixed clamping block;805, second connecting rod;9, roller. DETAILED DESCRIPTION

[0021] To make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be described clearly and completely below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, rather than all the embodiments. The components of the embodiments of the utility model described and shown in the drawings here can be arranged and designed in various different configurations.

[0022] Therefore, the following detailed description of the embodiments of the utility model provided in the drawings is not intended to limit the scope of the claimed utility model, but only represents selected embodiments of the utility model. Based on the embodiments in the utility model, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of protection of the utility model.

[0023] It should be noted that: similar signs and letters represent similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. In addition, the terms "first", "second" and the like are only used to distinguish description, and cannot be understood as indicating or implying relative importance.

[0024] The electrical components appearing in the text are all connected with the main controller and 220V mains of the outside world, and the main controller can be a conventional known device such as a computer for control.

[0025] In the description of the embodiments of the utility model, it needs to be explained that the directions or position relations indicated by the terms "inner", "outer", "upper" and the like are based on the directions or position relations shown in the drawings, or are the directions or position relations commonly placed when the utility model product is used, which are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the indicated devices or elements must have a particular direction, be constructed and operated in a particular direction, therefore, it cannot be understood as a limitation on the utility model.

[0026] As Figures 1 to 5 shown, a wafer conveying device, including box 1, the inside of box 1 is provided with longitudinal drive mechanism 2, the surface of box 1 is mounted with longitudinal drive mechanism 2, the top of longitudinal drive mechanism 2 is provided with mounting box 3, the surface of mounting box 3 is mounted with position adjusting assembly 4, the top of position adjusting assembly 4 is provided with two mounting rods 5, the end of two mounting rods 5 is fixedly installed with first electric push rod 6, the telescopic end of first electric push rod 6 is fixedly connected with first connecting rod 7, the end of first connecting rod 7 is provided with wafer clamping assembly 8 for limiting wafer. More specifically, the device is carried to the side of the shelf where the wafer is stored, runs through longitudinal drive mechanism 2, drives mounting box 3 and mounting rod 5 to move to the front side, so that wafer clamping assembly 8 is close to the shelf, in the process, first electric push rod 6 drives first connecting rod 7 to move vertically, so that wafer clamping assembly 8 finally reaches the lower side of wafer, then first electric push rod 6 controls first connecting rod 7 and wafer clamping assembly 8 to rise, wafer clamping assembly 8 is used to lift wafer, and wafer clamping assembly 8 is used to clamp and fix wafer, then mounting box 3 and mounting rod 5 are driven away from the shelf through longitudinal drive mechanism 2, then position adjusting assembly 4 is operated, controls two to move and exchange positions, so that wafer reaches another shelf, wafer is placed on another shelf through the cooperation of longitudinal drive mechanism 2 and first electric push rod 6, then wafer clamping assembly 8 releases the clamping of wafer, wafer can be placed at another shelf, and another wafer clamping assembly 8 is located at the first shelf position, wafer can be picked up synchronously, the above steps can be repeated, and the conveying of wafer between two shelves can be realized.

[0027] The longitudinal driving mechanism 2 comprises a first motor 201 fixedly installed on the back of the box body 1, and the output end of the first motor 201 is fixedly connected with a lead screw 202, the surface of the lead screw 202 is threadedly connected with a U-shaped support 203, and the top end of the U-shaped support 203 is fixedly connected with the mounting box 3. The inner wall of the box body 1 is fixedly connected with a sliding column 204, and the sliding column 204 is slidingly connected with the U-shaped support 203. The top surface of the box body 1 is provided with a first sliding groove 205, and the inner wall of the first sliding groove 205 is slidingly connected with the U-shaped support 203. It should be noted that the first motor 201 drives the lead screw 202 to rotate, and under the action of the thread, the U-shaped support 203 will slide along the surface of the sliding column 204, thereby pushing the mounting box 3 to move longitudinally.

[0028] The position adjusting assembly 4 comprises a second motor 401 fixedly installed on the bottom surface of the mounting box 3, and the output end of the second motor 401 is fixedly connected with a rotating shaft 402. The end of the rotating shaft 402 is fixedly connected with a driving gear 403, and the front side and the rear side of the driving gear 403 are engaged with a rack 404. The top surface of the rack 404 is fixedly connected with the mounting rod 5, and the top surface of the mounting box 3 is provided with a second sliding groove 405, and the inner wall of the second sliding groove 405 is slidingly connected with the mounting rod 5. More specifically, the second motor 401 is operated to drive the rotating shaft 402 to rotate, thereby driving the driving gear 403 to rotate. The driving gear 403 will drive the rack 404 engaged therewith to move, so that the two racks 404 move in different directions, thereby driving the two mounting rods 5 to slide along the inner wall of the second sliding groove 405.

[0029] The wafer clamping assembly 8 comprises a supporting plate 801 fixedly connected with the end of the first connecting rod 7, and a second electric push rod 802 fixedly installed in the middle of the supporting plate 801. The telescopic end of the second electric push rod 802 is fixedly connected with a second connecting rod 805 which is movably inserted into the supporting plate 801. The end of the second connecting rod 805 is fixedly connected with a movable clamping block 803, and the top surface of the supporting plate 801 is fixedly connected with a fixed clamping block 804. It should be noted that the bottom of the wafer is supported by the supporting plate 801, and the second electric push rod 802 is operated to drive the second connecting rod 805 to move, thereby pushing the movable clamping block 803 to move. The wafer is clamped and fixed by the movable clamping block 803 and the fixed clamping block 804.

[0030] One of the first electric push rods 6 is arranged on the top surface of the mounting rod 5, and the other first electric push rod 6 is arranged on the bottom surface of the mounting rod 5. The height of the right wafer clamping assembly 8 is lower than that of the left wafer clamping assembly 8. More specifically, by arranging the two groups of first electric push rods 6 and wafer clamping assemblies 8 at different heights, mutual interference of the two groups during movement is avoided.

[0031] The bottom surface of the box body 1 is provided with a roller 9 at each corner, and the roller 9 has a self-locking structure.

[0032] In summary: the device is transported to the storage wafer shelf, the longitudinal driving mechanism 2 is operated, the mounting box 3 and the mounting rod 5 are driven to move to the front side, so that the wafer clamping assembly 8 is close to the shelf, in the process, the first connecting rod 7 is driven to move vertically by the first electric push rod 6, so that the wafer clamping assembly 8 finally reaches below the wafer, then the first connecting rod 7 and the wafer clamping assembly 8 are lifted by the first electric push rod 6, the wafer is lifted by the wafer clamping assembly 8, and the wafer is clamped and fixed by the wafer clamping assembly 8, then the mounting box 3 and the mounting rod 5 are driven away from the shelf by the longitudinal driving mechanism 2, then the position adjusting assembly 4 is operated, the two are controlled to move and exchange positions, so that the wafer reaches another shelf, the wafer is placed on another shelf by the cooperation of the longitudinal driving mechanism 2 and the first electric push rod 6, then the wafer clamping assembly 8 releases the clamping of the wafer, that is, the wafer can be placed on another shelf, and another wafer clamping assembly 8 is located at the first shelf position, the wafer can be picked up synchronously, the above steps can be repeated, and the wafer conveying between two shelves can be realized, the effect of quickly conveying two wafers is realized in use, the wafer conveying between shelves is more convenient, the conveying process is uninterrupted, and the conveying efficiency is effectively improved.

[0033] The basic principle, main features and advantages of the present application are shown and described above. Those skilled in the art should understand that the present application is not limited by the above embodiments, and the above embodiments and descriptions in the specification are only the principles of the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application, and these changes and improvements all fall within the scope of the claimed present application. The scope of protection required by the present application is defined by the appended claims and their equivalents.

Claims

1. A wafer transfer device, comprising: The utility model provides a wafer positioner, including box (1), the inside of box (1) is provided with longitudinal drive mechanism (2), the surface of box (1) is installed longitudinal drive mechanism (2), the top of longitudinal drive mechanism (2) is provided with installation box (3), the surface of installation box (3) is installed position adjusting assembly (4), the top of position adjusting assembly (4) is provided with two mounting rods (5), and the end of two mounting rods (5) is fixedly installed first electric push rod (6), and the telescopic end of first electric push rod (6) is fixedly connected with first connecting rod (7), and the end of first connecting rod (7) is provided with wafer clamping assembly (8) for limiting wafer.

2. The wafer transfer device of claim 1, wherein The longitudinal drive mechanism (2) includes a first motor (201), and the first motor (201) is fixedly installed on the back of the box (1), the output end of the first motor (201) is fixedly connected with a screw rod (202), the surface of the screw rod (202) is threadedly connected with a U-shaped support (203), and the top end of the U-shaped support (203) is fixedly connected with the installation box (3), the inner wall of the box (1) is fixedly connected with a sliding column (204), and the sliding column (204) is slidably connected with the U-shaped support (203), and the top surface of the box (1) is provided with a first sliding groove (205), and the inner wall of the first sliding groove (205) is slidably connected with the U-shaped support (203).

3. The wafer transfer device of claim 1, wherein The position adjusting assembly (4) includes a second motor (401), and the second motor (401) is fixedly installed on the bottom surface of the installation box (3), the output end of the second motor (401) is fixedly connected with a rotating shaft (402), the end of the rotating shaft (402) is fixedly connected with a driving gear (403), the front side and the rear side of the driving gear (403) are engaged with a rack (404), the top surface of the rack (404) is fixedly connected with the mounting rod (5), and the top surface of the installation box (3) is provided with a second sliding groove (405), and the inner wall of the second sliding groove (405) is slidably connected with the mounting rod (5).

4. The wafer transfer device of claim 1, wherein The wafer clamping assembly (8) includes a supporting plate (801), and the supporting plate (801) is fixedly connected with the end of the first connecting rod (7), the middle part of the supporting plate (801) is fixedly installed with a second electric push rod (802), the telescopic end of the second electric push rod (802) is fixedly connected with a second connecting rod (805), and the second connecting rod (805) is movably inserted with the supporting plate (801), the end of the second connecting rod (805) is fixedly connected with a movable clamping block (803), and the top surface of the supporting plate (801) is fixedly connected with a fixed clamping block (804).

5. The wafer transfer device of claim 4, wherein, One of the first electric push rods (6) is arranged on the top surface of the mounting rod (5), and the other first electric push rod (6) is arranged on the bottom surface of the mounting rod (5), and the height of the wafer clamping assembly (8) on the right side is lower than that on the left side.

6. The wafer transfer device of claim 1, wherein The bottom surface of the box (1) is provided with a roller (9) at each corner, and the roller (9) has a self-locking structure.

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