Auxiliary workpiece for testing and positioning semiconductor product

Abstract

The utility model discloses a semiconductor product test positioning auxiliary workpiece comprising a positioning ring, the edge of which is provided with a positioning structure used for bearing a semiconductor product, and the bottom of the semiconductor product is provided with two positioning holes; the base is arranged at the bottom of the positioning ring, two ejector pins are arranged at the top of the base, each ejector pin corresponds to one positioning hole, the ejector pins and the positioning holes are positioned in a matched mode, and the axes where the two ejector pins are located are matched with the positioning structure to form a determined position. The ejector pin and the positioning hole are matched to preliminarily complete positioning of the semiconductor product, and the positioning ring is rotated to enable the positioning structure on the edge of the positioning ring to be located on the axis where the two ejector shafts are located, so that the positioning structure of the positioning ring and the two positioning holes of the product are also located on the same axis. Therefore, the position of the positioning hole can be confirmed through the positioning structure on the positioning ring, the positioning mode is simple to operate, the positioning is rapid and accurate, and the product positioning efficiency before testing is improved.

Description

Technical Field

[0001] This utility model relates to the semiconductor field, and in particular to an auxiliary workpiece for positioning during semiconductor product testing. Background Technology

[0002] Semiconductor products, especially wafers, are tested after wafer manufacturing is complete. The purpose is to evaluate the initial quality and electrical performance of the wafer, ensuring it meets requirements. By precisely measuring the electrical parameters on the wafer, wafer testing can identify manufacturing deviations and defects, such as doping anomalies or linewidth deviations, allowing for timely process adjustments and guaranteeing product quality. Testing these semiconductor products requires accurate and unbiased positioning on the testing equipment; any misalignment or deviation will affect the test results.

[0003] The position of conductor products is typically determined by two positioning holes on the product. Since these holes are usually located on the bottom of the semiconductor product, which is not easily visible, traditional fixing and positioning methods, such as using pads or manual alignment, suffer from numerous problems, including cumbersome procedures and low efficiency. Product testing utilizes a method of directly placing the product onto a measuring platform. During the measurement process, constant attention must be paid to the safety of the product and measuring equipment to prevent any impact. This method demands a high level of technical skill from the operators, and strict standards must be applied to the handling and placement of the product. This measurement method has the following shortcomings:

[0004] The workpiece is placed directly onto the measuring platform. During operation, due to the special materials of the product and the measuring platform, scratches and bumps are very likely to occur, causing damage to the product and measuring equipment or even scrapping it.

[0005] The fixed position is uncertain each time a product is measured. Operators need to spend a long time positioning the product, which is a complicated and time-consuming process, resulting in low testing efficiency and inability to effectively guarantee measurement accuracy. Utility Model Content

[0006] To overcome the shortcomings of existing technologies, such as the susceptibility of products to impacts and low positioning efficiency, this utility model provides an auxiliary workpiece for semiconductor product testing and positioning, comprising:

[0007] The positioning ring has a positioning structure on its edge to support the semiconductor product, and the semiconductor product has two positioning holes at its bottom.

[0008] The base is located at the bottom of the positioning ring, and the top is provided with two pins, each pin corresponding to a positioning hole. The pins cooperate with the positioning holes for positioning, and the axes of the two pins cooperate with the positioning structure to form a definite position.

[0009] Optionally, the base is provided with a groove, and two sliders are provided inside the groove, with each ejector pin set on one slider.

[0010] Optionally, the ejector pin can be made of bakelite.

[0011] Optionally, the positioning ring is equipped with a limiting step.

[0012] Optionally, the top of the positioning ring is provided with a fixing member, which is detachably mounted on the positioning ring.

[0013] Optionally, the fastener includes a pressure plate, which is fixed to the positioning ring by screws.

[0014] Optionally, the slide groove extends through the base, and a detachable baffle is provided at the bottom of the base, with the slider abutting against the baffle.

[0015] Optionally, the base has a mounting groove at its bottom, and a baffle is disposed in the mounting groove, the size of which is the same as that of the baffle.

[0016] Optionally, the edge of the positioning ring is curved, while the positioning structure is planar.

[0017] Optionally, the base has a T-shaped structure.

[0018] The beneficial effects of this utility model are as follows: A semiconductor product is placed on the positioning ring, and then the two positioning holes at the bottom of the semiconductor product are aligned with the two ejector pins on the base. After alignment, the positioning ring is placed on the base, and the two ejector pins enter different positioning holes. The ejector pins and positioning holes cooperate to initially position the semiconductor product. Since the ejector pins have entered the positioning holes, the semiconductor product's position is fixed. At this time, rotating the positioning ring causes the positioning structure on the edge of the positioning ring to be located on the axis of the two ejector pins. This is equivalent to the positioning structure of the positioning ring and the two positioning holes of the product being on the same axis. Thus, the position of the positioning holes can be confirmed through the positioning structure on the positioning ring, allowing the position of the semiconductor product under test to be confirmed through the positioning ring. This positioning method is simple to operate, fast, and accurate, improving the efficiency of product positioning before testing. Secondly, compared to the existing technology of directly placing the product on the testing platform, the semiconductor product testing positioning auxiliary workpiece provided in this application can use the positioning ring to place the product on the testing platform. The positioning ring can support and protect the product under test, preventing scratches and bumps. Attached Figure Description

[0019] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0020] Figure 1 These are assembly diagrams from some embodiments;

[0021] Figure 2 These are schematic diagrams of explosions in some embodiments;

[0022] Figure 3 These are schematic diagrams of the positioning ring in some embodiments;

[0023] Figure 4 These are schematic diagrams of the base structure in some embodiments.

[0024] Explanation of reference numerals in the attached drawings: 1. Positioning ring; 101. Limiting step; 102. Fixing component; 103. Positioning structure; 2. Base; 201. Ejector pin; 202. Slide groove; 203. Slider; 204. Baffle; 205. Mounting groove. Detailed Implementation

[0025] The following will clearly and completely describe the concept, specific structure, and technical effects of this utility model in conjunction with embodiments and accompanying drawings, so as to fully understand the purpose, features, and effects of this utility model. Obviously, the described embodiments are only a part of the embodiments of this utility model, not all of them. Other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are all within the scope of protection of this utility model. Furthermore, all connections / linkages involved in the patent do not simply refer to direct contact between components, but rather to the ability to form a better connection structure by adding or reducing connecting accessories according to specific implementation conditions. The various technical features in this utility model can be combined interactively without contradicting each other.

[0026] This utility model provides a semiconductor product testing positioning auxiliary workpiece, applied in the field of semiconductor product testing, for assisting in the positioning of the product under test. It includes: a positioning ring 1 with a positioning structure 103 on its edge for supporting the semiconductor product; the semiconductor product has two positioning holes at its bottom; and a base 2, disposed at the bottom of the positioning ring 1, with two pins 201 on its top, each pin 201 corresponding to a positioning hole. The pins 201 cooperate with the positioning holes for positioning, and the axes of the two pins 201 cooperate with the positioning structure 103 to form a defined position. The positioning structure 103 is used to determine the position of the positioning ring 1.

[0027] During implementation, a semiconductor product is placed on the positioning ring 1. Then, the two positioning holes on the bottom of the semiconductor product are aligned with the two ejector pins 201 on the base 2. After alignment, the positioning ring 1 is placed on the base 2, and the two ejector pins 201 enter different positioning holes. The ejector pins 201 and the positioning holes cooperate to initially position the semiconductor product. Since the ejector pins 201 have entered the positioning holes, the semiconductor product's position is fixed. At this time, the positioning ring 1 is rotated so that the positioning structure 103 on the edge of the positioning ring 1 is located on the axis of the two ejector pins. This is equivalent to the positioning structure 103 of the positioning ring 1 and the two positioning holes of the product being positioned. The positioning holes are also on the same axis, so the position of the positioning holes can be confirmed by the positioning structure 103 on the positioning ring 1. The position of the semiconductor product under test can be confirmed by the positioning ring 1. This positioning method is simple to operate, fast and accurate, and improves the efficiency of product positioning before testing. Secondly, compared with the existing technology of directly placing the product on the test platform for testing, the semiconductor product testing positioning auxiliary workpiece provided in this application can use the positioning ring 1 to place the product on the test platform. The positioning ring 1 can support and protect the product under test, and avoid the product under test being scratched or bumped.

[0028] Furthermore, the positioning structure 103 can be a protrusion, a raised strip, or other pattern that can serve as an identifier on the edge of the positioning ring 1, or it can be a shape that is clearly distinct from the edge of the positioning ring 1.

[0029] In some embodiments, the base 2 is provided with a groove 202, and two sliders 203 are provided inside the groove 202, with each pin 201 disposed on one slider 203.

[0030] In implementation, a slide groove 202 is opened on the base 2, and two sliders 203 are set in the slide groove 202. The sliders 203 can move in the slide groove 202. The ejector pins 201 are set on the sliders 203 so that the ejector pins 201 can move on the base 2. The positions of the positioning holes are different for different product models. For different product models, the position of the ejector pins 201 can be adjusted in advance on the base 2 so that the position of the ejector pins 201 corresponds to the position of the positioning holes on the product. That is, the length between the positions of the two ejector pins 201 is the same as the length of the two positioning holes on the product.

[0031] In some cases, multiple mounting holes can be set side by side on the base 2, and the ejector pins 201 can be installed into different holes for different products, thereby changing the length between the two ejector pins 201.

[0032] In some embodiments, the ejector pin 201 is made of bakelite.

[0033] During implementation, the ejector pin 201 works with the positioning hole to position the semiconductor product. To prevent the ejector pin 201 from scratching the semiconductor product, the ejector pin 201 is made of bakelite. Bakelite has a lower hardness than semiconductor products such as wafers and will not scratch them.

[0034] In some embodiments, the positioning ring 1 is provided with a limiting step 101.

[0035] During implementation, the product is placed on the positioning ring 1. The product will be resisted by the limiting step 101. The limiting step 101 is used to support the product and prevent the product from contacting the table surface during testing, thus avoiding scratches on the product.

[0036] Specifically, the limiting step 101 is set on the inner side of the positioning ring 1.

[0037] In some embodiments, a fixing member 102 is provided at the top of the positioning ring 1, and the fixing member 102 is detachably mounted on the positioning ring 1.

[0038] During implementation, the product is placed on the positioning ring 1, and then the positioning ring 1 is placed on the base 2 for positioning. The fixing part 102 is then installed on the positioning ring 1. The fixing part 102 serves to fix the product and prevent the product from shifting position during the test.

[0039] Furthermore, the positioning ring 1 is provided with four screw holes, which are equidistantly spaced around the top of the positioning ring 1. There are four fixing members 102, each with the same structure and a through hole. The fixing members 102 can be fixed to the positioning ring 1 with screws. One end of the fixing member 102 is fixed to the positioning ring 1, and the other end abuts against the product, thereby fixing the product and preventing it from moving.

[0040] In some embodiments, the fastener 102 includes a pressure plate, which is fixed to the positioning ring 1 by screws.

[0041] During implementation, after positioning the product on the positioning ring 1, the product can be fixed on the positioning ring 1 by using a pressure plate.

[0042] Furthermore, one end of the pressure plate is provided with a through hole, and the top of the positioning ring 1 is provided with a screw hole. The pressure plate is fixed to the positioning ring 1 by screws. There are four screw holes on the positioning ring 1, and there are also four pressure plates, with each pressure plate corresponding to one screw hole.

[0043] In some embodiments, the slide 202 extends through the base 2, and the bottom of the base 2 is provided with a removable baffle 204, and the slider 203 abuts against the baffle 204.

[0044] In practice, a baffle 204 is detachably installed at the bottom of the base 2. First, the baffle 204 can support the slider 203 inside the slide. Second, the baffle 204 is detachably installed at the bottom of the base plate. When the slider 203 or the ejector pin 201 needs to be replaced, the baffle 204 can be removed first, and then the slider 203 and the ejector pin 201 can be taken out from the slide groove 202.

[0045] Furthermore, the baffle 204 is fixed to the base 2 with screws. In some cases, the baffle 204 can also be fixed to the base 2 by means of clips.

[0046] In some embodiments, the base 2 has a mounting groove 205 at its bottom, and a baffle 204 is disposed in the mounting groove 205, wherein the size of the mounting groove 205 is the same as that of the baffle 204.

[0047] In practice, the baffle 204 is installed into the mounting groove 205. Since the size of the mounting groove 205 is the same as the size of the baffle 204, after the baffle 204 is installed into the mounting groove 205, the baffle 204 and the bottom of the base 2 form a flat surface, which can improve the stability of the base 2.

[0048] In some embodiments, the edge of the positioning ring 1 is curved, and the positioning structure 103 is planar.

[0049] In practice, the edge of the positioning ring 1 is set as a curved surface, and the positioning structure 103 is set as a plane. The plane and the curved surface are clearly different. The plane can be used to determine the position of the positioning ring 1.

[0050] In some cases, the positioning structure 103 can also be a structure that is significantly different from other parts of the positioning ring 1, such as positioning protrusions or the addition of patterns.

[0051] In some embodiments, the base has a T-shaped structure.

[0052] During implementation, base 2 is set on side base 2, and the T-shaped structure makes it easier to pick up.

[0053] The above is a detailed description of the preferred embodiments of the present utility model. However, the present utility model is not limited to the described embodiments. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present utility model. All such equivalent modifications or substitutions are included within the scope defined by the claims of this application.

Claims

1. A semiconductor product testing and positioning auxiliary workpiece, characterized in that, include: The positioning ring has a positioning structure on its edge to support the semiconductor product, and the semiconductor product has two positioning holes at its bottom. The base is located at the bottom of the positioning ring, and the top is provided with two pins, each pin corresponding to a positioning hole. The pins cooperate with the positioning holes for positioning, and the axes of the two pins cooperate with the positioning structure to form a definite position.

2. The semiconductor product testing and positioning auxiliary workpiece according to claim 1, characterized in that, The base has a sliding groove, and inside the sliding groove are two sliders, with each ejector pin set on one slider.

3. The semiconductor product testing and positioning auxiliary workpiece according to claim 1, characterized in that, The thimble is made of bakelite.

4. The semiconductor product testing and positioning auxiliary workpiece according to claim 1, characterized in that, The positioning ring is equipped with a limit step.

5. The semiconductor product testing and positioning auxiliary workpiece according to claim 1, characterized in that, The top of the positioning ring is provided with a fixing member, which is detachably mounted on the positioning ring.

6. The semiconductor product testing and positioning auxiliary workpiece according to claim 5, characterized in that, The fastener includes a pressure plate, which is fixed to the positioning ring by screws.

7. The semiconductor product testing and positioning auxiliary workpiece according to claim 2, characterized in that, The slide groove runs through the base, and a detachable baffle is provided at the bottom of the base, with the slider abutting against the baffle.

8. The semiconductor product testing and positioning auxiliary workpiece according to claim 7, characterized in that, The base has a mounting groove at its bottom, and a baffle is placed inside the mounting groove. The size of the mounting groove is the same as that of the baffle.

9. The semiconductor product testing and positioning auxiliary workpiece according to claim 1, characterized in that, The edge of the positioning ring is curved, while the positioning structure is planar.

10. The semiconductor product testing and positioning auxiliary workpiece according to claim 1, characterized in that, The base has a T-shaped structure.

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