Die bonding head assembly and die bonder

Abstract

The utility model relates to the technical field of die bonding equipment, in particular to a die bonding head assembly and a die bonder, which comprise a frame, a first moving platform mounted on the frame, a second moving platform capable of reciprocating along the horizontal direction and perpendicular to the moving direction of the first moving platform, and a third moving platform capable of moving along the vertical direction. The fixed binding head is installed on the third moving platform, the first moving platform is further provided with a buffering platform, the buffering platform can move in a reciprocating mode in the horizontal direction and is parallel to the moving direction of the second moving platform, and the buffering platform and the second moving platform move synchronously and are opposite in moving direction. The design of the buffer platform is helpful for balancing the acting force in the operation process of equipment, so that the whole die bonding head assembly is more stable during working, the stability is helpful for improving the die bonding precision, the service life of each part of the equipment can be prolonged, the mechanical wear and fault occurrence probability caused by frequent vibration are reduced, and the production efficiency is improved. The equipment maintenance cost is reduced.

Description

Technical Field

[0001] This utility model relates to the field of die bonding equipment technology, and in particular to a die bonding head assembly and a die bonding machine. Background Technology

[0002] Die bonding, also known as die bonding, involves using an adhesive to bond a wafer to a designated area on a support, creating a thermal or electrical path to facilitate subsequent wire bonding. It is mainly used in lead frame plates of various gold wire ultrasonic welding equipment, as well as various nozzles, ejector pins, dispensing heads, ceramic nozzles, through-hole needles, motors, carbon brushes, encoders, drive belts, and various spare parts, instruments, etc. of various chip mounting equipment and automated robotic arms.

[0003] In die bonding equipment, chips are typically mounted onto printed circuit boards (PCBs) using a die bonder nozzle. The chip is then picked up and transferred to its mounting position on the PCB. Traditional die bonders, while relatively simple in design and meeting basic die bonding requirements, exhibit significant limitations under high-speed operation. During actual operation, the movement of the die bonder along the Y-axis easily generates substantial inertial forces. These forces are difficult to suppress effectively at high speeds, leading to jitter. This jitter severely restricts the precision control of the die bonder during chip bonding, increasing chip placement deviations and failing to meet the increasingly stringent requirements of high-precision electronic component manufacturing. Furthermore, the frequent need to correct positional deviations caused by jitter forces a reduction in the die bonder's operating speed, hindering capacity expansion and significantly impacting the production efficiency and economic benefits of electronics manufacturing companies. Therefore, developing a new die bonder assembly that effectively overcomes Y-axis motion inertia and reduces jitter is of urgent and significant practical importance for improving the precision and capacity of die bonders. Utility Model Content

[0004] The purpose of this invention is to provide a die bonder assembly and a die bonder, which aims to solve the problem of jitter in the Y-axis movement of the die bonder in the above-mentioned technical problems, and improve the accuracy and productivity of the die bonder.

[0005] The technical solution adopted in this utility model is as follows:

[0006] A die bond assembly, comprising:

[0007] frame;

[0008] A first mobile platform is mounted on the frame and can reciprocate along the horizontal direction;

[0009] The second mobile platform is capable of reciprocating along the horizontal direction and is perpendicular to the movement direction of the first mobile platform.

[0010] A third mobile platform, which can move along a vertical direction;

[0011] A fixed bonding head is mounted on the third mobile platform;

[0012] The first mobile platform is also provided with a buffer platform, which can move back and forth along the horizontal direction and is parallel to the movement direction of the second mobile platform. The movement direction of the buffer platform is synchronous with that of the second mobile platform but opposite to the movement direction.

[0013] This utility model also has the following technical features:

[0014] In one embodiment of the present invention, the buffer platform includes a counterweight and a buffer drive mechanism. The buffer drive mechanism is disposed on the first moving platform and drives the counterweight to reciprocate horizontally.

[0015] In one embodiment of the present invention, the first mobile platform includes a first track, which is horizontal and mounted on the frame. A first platform is slidably disposed on the first track, and a first linear motor is disposed on the frame. The mover of the first linear motor is connected to the first platform.

[0016] In one embodiment of this utility model, the buffer drive mechanism includes a third track disposed on the first platform, and the counterweight is slidably disposed on the third track, which is horizontal and perpendicular to the first track. The buffer drive mechanism also includes a buffer linear motor disposed on the first platform, and the mover of the buffer linear motor is connected to the counterweight.

[0017] In one embodiment of the present invention, the second mobile platform includes a second track disposed on the first platform, the second track being horizontal and perpendicular to the first track, the third mobile platform being slidably disposed on the second track, and a second linear motor being disposed on the first platform, the mover of the second linear motor being connected to the third mobile platform.

[0018] In one embodiment of this utility model, the third moving platform includes a connecting arm, which is connected to the mover of the second linear motor. A third linear motor is mounted on the connecting arm, and the mover of the third linear motor moves vertically and is connected to the fixed head through a pressure control unit.

[0019] In one embodiment of this utility model, the pressure control unit includes a mounting base plate, a vertical motion slide rail is provided on the mounting base plate, a vertical sliding plate is slidably disposed on the vertical motion slide rail, a vertical magnetic spring is also provided on the mounting base plate, the lower end of the vertical magnetic spring is connected to the vertical sliding plate, and a motion grating ruler is provided on the mounting base plate for collecting the vertical sliding distance of the vertical sliding plate.

[0020] In one embodiment of this utility model, the fixed head includes a connecting mounting base, which is fixed to the vertical sliding plate. A voice coil motor assembly is disposed on the connecting mounting base. A rotating bushing is fixed to the moving part of the voice coil motor assembly. A suction nozzle assembly is rotatably disposed inside the rotating bushing. A transmission pulley is disposed on the suction nozzle assembly. The transmission pulley is connected to a pulley on the rotary motor via a transmission belt. The rotary motor is mounted on the motor mounting base. The motor mounting base is vertically slidably disposed on the connecting mounting base. A vertical force control grating ruler is also disposed on the connecting mounting base. The vertical force control grating ruler is used to measure the vertical movement distance of the suction nozzle assembly.

[0021] This utility model also provides a die bonder, which includes the above-mentioned die bonder assembly.

[0022] Compared with existing technologies, the beneficial effects of this utility model are reflected in the following: The buffer platform set on the first moving platform moves synchronously and in the opposite direction to the second moving platform. During the operation of the equipment, when the second moving platform moves rapidly, the reverse movement of the buffer platform can offset part of the impact force and inertial force generated by the acceleration and deceleration of the second moving platform, effectively reducing the overall vibration of the equipment, protecting the die bonding head and the processed components, reducing the die bonding defect rate caused by vibration, and improving product quality. The design of the buffer platform helps to balance the forces during the operation of the equipment, making the entire die bonding head assembly more stable during operation. This stability not only helps to improve the die bonding accuracy, but also extends the service life of various components of the equipment, reduces the probability of mechanical wear and failure caused by frequent vibration, and reduces equipment maintenance costs. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the structure of a die bonder according to an embodiment of the present invention;

[0024] Figure 2 and Figure 3 These are schematic diagrams of the structure of the die bonder after the die bonder removes part of the present invention in one embodiment;

[0025] Figure 4 This is a schematic diagram of the structure of the first mobile platform in one embodiment of the present invention;

[0026] Figure 5 This is a schematic diagram of the pressure control unit in one embodiment of the present invention;

[0027] Figure 6 This is a schematic diagram of the structure of the fixed head in one embodiment of the present invention;

[0028] Explanation of icon numbers:

[0029] 10. Rack;

[0030] 20. First moving platform; 21. First track; 22. First platform; 23. First linear motor;

[0031] 30. Second moving platform; 31. Second track; 32. Second linear motor;

[0032] 40. Third moving platform; 41. Connecting arm; 42. Third linear motor; 43. Mounting base plate; 44. Vertical motion slide rail; 45. Vertical sliding plate; 46. Vertical magnetic spring; 47. Motion grating ruler;

[0033] 50. Fixed head; 51. Connecting mounting base; 52. Voice coil motor assembly; 53. Rotating bushing; 54. Suction nozzle assembly; 541. Transmission pulley; 55. Rotary motor; 56. Motor mounting base; 57. Vertical force control grating ruler;

[0034] 60. Buffer platform; 61. Counterweight; 63. Third track; 62. Buffered linear motor;

[0035] 70. Bottom visual system. Detailed Implementation

[0036] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model.

[0037] The illustrations provided in this embodiment are only schematic representations of the basic concept of this utility model. Therefore, the drawings only show the components related to this utility model and are not drawn according to the actual number, shape and size of the components. In actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0038] In die bonding equipment, chips are typically mounted onto printed circuit boards (PCBs) using a die bonder nozzle. The chip is then picked up and transferred to its mounting position on the PCB. Traditional die bonders, while relatively simple in design and meeting basic die bonding requirements, exhibit significant limitations under high-speed operation. During actual operation, the movement of the die bonder along the Y-axis easily generates substantial inertial forces. These forces are difficult to suppress at high speeds, leading to jitter. This jitter severely restricts the precision control of the die bonder during chip bonding, increasing chip placement deviations and failing to meet the increasingly stringent requirements of high-precision electronic component manufacturing. Furthermore, the frequent need to correct positional deviations caused by jitter forces a reduction in the die bonder's operating speed, hindering capacity expansion and significantly impacting the production efficiency and economic benefits of electronics manufacturing companies. Therefore, developing a novel die bonder assembly that can effectively overcome Y-axis motion inertia and reduce jitter is of urgent and significant practical importance for improving the accuracy and production capacity of die bonders. A die bonder assembly includes: a frame 10; a first moving platform 20 mounted on the frame 10 and capable of reciprocating along a horizontal direction; a second moving platform 30 capable of reciprocating along a horizontal direction, perpendicular to the moving direction of the first moving platform 20; a third moving platform 40 capable of moving vertically; and a fixed bonder 50 mounted on the third moving platform 40. The first moving platform 20 also includes a buffer platform 60, which is capable of reciprocating along the horizontal direction and parallel to the moving direction of the second moving platform 30. The buffer platform 60 moves synchronously with and in the opposite direction to the second moving platform 30.

[0039] In one embodiment, see Figures 1 to 3 A buffer platform 60 is provided on the first moving platform 20. The buffer platform 60 serves as a counterweight. When the second moving platform 30 drives the third moving platform 40 to move horizontally, the buffer platform 60 moves synchronously and in the opposite direction to the second moving platform 30. During equipment operation, when the second moving platform 30 moves rapidly, the reverse movement of the buffer platform 60 can offset some of the impact force and inertial force generated by the acceleration and deceleration of the second moving platform 30, effectively reducing the overall vibration of the equipment, protecting the fixed bonding head and the processed components, reducing the die bonding failure rate caused by vibration, and improving product quality.

[0040] In one embodiment, the buffer platform 60 includes a counterweight 61 and a buffer drive mechanism. The buffer drive mechanism is disposed on the first moving platform 20, and the buffer drive mechanism drives the counterweight 61 to reciprocate horizontally.

[0041] The buffer drive mechanism drives the counterweight 61 to reciprocate horizontally. When the second moving platform 20 moves rapidly, the movement direction and speed of the counterweight 61 are precisely controlled to generate a force equal in magnitude and opposite in direction to the inertial force caused by the movement of the second moving platform 20. This effectively counteracts the inertial effect of the second moving platform 20's movement, greatly reducing the overall shaking of the equipment caused by inertial forces, ensuring the positional stability of the fixed bonding head 50 during operation, thereby improving the positioning accuracy of chips and other components during die bonding, reducing die bonding deviations caused by shaking, and improving product quality.

[0042] In one embodiment, see Figure 4 To drive the first mobile platform 20, the first mobile platform 20 includes a first track 21, which is horizontal and mounted on the frame 10. A first platform 22 is slidably disposed on the first track 21. A first linear motor 23 is disposed on the frame 10, and the mover of the first linear motor 23 is connected to the first platform 22.

[0043] In one embodiment, the buffer drive mechanism includes a third track 63 disposed on the first platform 22, and a counterweight 61 slidably disposed on the third track 63, the third track 63 being horizontal and perpendicular to the first track 21. The buffer drive mechanism also includes a buffer linear motor 62 disposed on the first platform 22, the mover of the buffer linear motor 62 being connected to the counterweight 61.

[0044] A buffered linear motor 62 is used as the power source and directly connected to the counterweight 61, enabling precise control of the counterweight 61's movement. The mover of the buffered linear motor 62 can quickly respond to control signals and accurately adjust the output force and speed, allowing the counterweight 61 to reciprocate along the preset trajectory and speed on the third track 63. Compared to the traditional drive method of a rotary motor plus a transmission mechanism, the linear motor reduces energy loss and mechanical backlash in the intermediate transmission links, greatly improving drive efficiency and response speed. This ensures that during the rapid movement of the second moving platform, the counterweight can generate a timely and accurate counterforce, effectively counteracting inertial forces and guaranteeing the stability of the equipment operation.

[0045] Similarly, see Figures 1 to 3 To drive the second mobile platform 30, the second mobile platform 30 includes a second track 31 disposed on the first platform 22. The second track 31 is horizontal and perpendicular to the first track 21. The third mobile platform 40 is slidably disposed on the second track 31. A second linear motor 32 is disposed on the first platform 22. The mover of the second linear motor 32 is connected to the third mobile platform 40.

[0046] In one embodiment, to achieve vertical drive of the third moving platform 40, the third moving platform 40 includes a connecting arm 41, the connecting arm 41 is connected to the mover of the second linear motor 32, the connecting arm 41 is provided with a third linear motor 42, the mover of the third linear motor 42 moves vertically and is connected to the fixed head 50 through a pressure control unit.

[0047] In one embodiment, see Figure 5 The pressure control unit includes a mounting base plate 43, on which a vertical motion slide rail 44 is provided, and a vertical sliding plate 45 is slidably disposed on the vertical motion slide rail 44. A vertical magnetic spring 46 is also provided on the mounting base plate 43, with the lower end of the vertical magnetic spring 46 connected to the vertical sliding plate 45. A motion grating ruler 47 is provided on the mounting base plate 43, which is used to collect the vertical sliding distance of the vertical sliding plate 45.

[0048] The vertical magnetic spring 46 in the pressure control unit plays a crucial role. When the fixing head 50 contacts the die-bonded component, the vertical magnetic spring 46 adaptively adjusts the pressure applied to the component according to its characteristics and die-bonding process requirements. For example, for some fragile chips, the vertical magnetic spring 46 provides gentle and stable pressure to prevent excessive pressure from damaging the component; while for situations requiring greater pressure to ensure a firm connection, it provides sufficient and stable pressure output to guarantee the reliability of the die-bonding connection. Moreover, the placement of the vertical magnetic spring 46 effectively counteracts the weight of the fixing head 50 itself, reducing the load on the third linear motor 42 and ensuring accurate working precision. The motion grating ruler 47 collects the vertical sliding distance of the vertical sliding plate 45 in real time, thereby accurately obtaining the position information of the fixing head 50. This feedback mechanism enables the equipment to monitor the pressure and displacement during the die-bonding process in real time. Once a deviation occurs, the control system can quickly make adjustments to ensure that the die-bonding operation is always performed in the optimal state. For example, if the fixed bonding head 50 is detected to be moving too fast or under abnormal pressure during descent, the system can adjust the operating parameters of the third linear motor 42 in a timely manner to ensure the stability and reliability of the die bonding operation.

[0049] In one embodiment, see Figure 6The fixed head 50 includes a connecting mounting base 51, which is fixed on the vertical sliding plate 45. A voice coil motor assembly 52 is provided on the connecting mounting base 51. A rotating bushing 53 is fixed to the moving part of the voice coil motor assembly 52. ​​A suction nozzle assembly 54 is rotatably mounted inside the rotating bushing 53. A transmission pulley 541 is provided on the suction nozzle assembly 54. The transmission pulley 541 is connected to the pulley on the rotary motor 55 through a transmission belt. The rotary motor 55 is mounted on the motor mounting base 56. The motor mounting base 56 is vertically slidably mounted on the connecting mounting base 51. A vertical force control grating ruler 57 is also provided on the connecting mounting base 51. The vertical force control grating ruler 57 is used to measure the vertical movement distance of the suction nozzle assembly 54.

[0050] The mover of the voice coil motor assembly 52 drives the rotating bushing 53 and the nozzle assembly 54 to move vertically. Combined with the measurement feedback from the vertical force control grating ruler 57, the vertical position and applied pressure of the nozzle assembly 54 can be precisely controlled. During the die bonding process, the height of the nozzle assembly 54 can be quickly and accurately adjusted for chips of different thicknesses and characteristics, ensuring appropriate pressure for chip pickup and placement. This effectively avoids chip damage due to excessive pressure or unstable chip pickup due to insufficient pressure, improving the success rate of die bonding and product quality. The vertical force control grating ruler 57 measures the vertical movement distance of the nozzle assembly 54 in real time, providing precise position information to the control system. The control system can adjust the operating state of the voice coil motor assembly 52 in a timely manner based on this feedback data, ensuring that the height and pressure of the nozzle assembly 54 are always at the optimal working state. This real-time monitoring and feedback mechanism greatly improves the stability and reliability of the die bonding process and reduces die bonding defects caused by equipment errors or external interference.

[0051] In one embodiment, to improve system accuracy, a bottom vision system 70 is provided below the nozzle assembly 54.

[0052] This utility model also proposes a die bonder, which includes a die bonder assembly. The design of the buffer platform 60 in the die bonder helps to balance the forces during equipment operation, making the entire die bonder assembly more stable during operation. This stability not only improves the die bonding accuracy but also extends the service life of various equipment components, reduces mechanical wear and the probability of failure caused by frequent vibration, and lowers equipment maintenance costs. The specific structure of the die bonder assembly is as described in the above embodiments. Since this die bonder adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be elaborated here.

[0053] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0054] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A die bond assembly, characterized in that, The utility model relates to a kind of movable platform, including: Rack (10); First mobile platform (20), the first mobile platform (20) is installed on the rack (10) and can reciprocate along horizontal direction; Second mobile platform (30), the second mobile platform (30) can reciprocate along horizontal direction, and the second mobile platform (30) is perpendicular to the moving direction of the first mobile platform (20); Third mobile platform (40), the third mobile platform (40) can move along vertical direction; Fixed bonding head (50), the fixed bonding head (50) is installed on the third mobile platform (40); Wherein, the first mobile platform (20) is further provided with buffer platform (60), the buffer platform (60) can reciprocate along the horizontal direction and is parallel with the moving direction of the second mobile platform (30), and the buffer platform (60) moving direction synchronously moves with the second mobile platform (30) and moving direction is opposite.

2. The die bond bump assembly of claim 1, wherein: The buffer platform (60) includes counterweight (61) and buffer drive mechanism, the buffer drive mechanism is arranged on the first mobile platform (20), and the buffer drive mechanism drives the counterweight (61) reciprocating movement along horizontal direction.

3. The die bond assembly of claim 2, wherein: The first mobile platform (20) includes first track (21), the first track (21) is horizontally installed on the rack (10), the first track (21) is slidably provided with first platform (22), and the rack (10) is provided with first linear motor (23), and the mover of the first linear motor (23) is connected with the first platform (22).

4. The die bond assembly of claim 3, wherein: The buffer drive mechanism includes third track (63) arranged on the first platform (22), the counterweight (61) is slidably arranged on the third track (63), and the third track (63) is horizontal and perpendicular to the first track (21), and the buffer drive mechanism further includes buffer linear motor (62) arranged on the first platform (22), and the mover of the buffer linear motor (62) is connected with the counterweight (61).

5. The die bond assembly of claim 3, wherein: The second mobile platform (30) includes second track (31) arranged on the first platform (22), and the second track (31) is horizontal and perpendicular to the first track (21), and the third mobile platform (40) is slidably arranged on the second track (31), and the first platform (22) is provided with second linear motor (32), and the mover of the second linear motor (32) is connected with the third mobile platform (40).

6. The die bond assembly of claim 5, wherein: The third mobile platform (40) includes connecting arm (41), the connecting arm (41) is connected with the mover of the second linear motor (32), the third linear motor (42) is arranged on the connecting arm (41), the mover of the third linear motor (42) moves vertically and is connected with the fixed bonding head (50) by pressure control unit.

7. The die bond assembly of claim 6, wherein: The pressure control unit comprises a mounting base plate (43) provided with a vertical movement slide rail (44), a vertical slide plate (45) is slidably arranged on the vertical movement slide rail (44), a vertical magnetic spring (46) is further arranged on the mounting base plate (43), the lower end of the vertical magnetic spring (46) is connected with the vertical slide plate (45), and a movement grating ruler (47) is arranged on the mounting base plate (43) and used for collecting the vertical sliding distance of the vertical slide plate (45).

8. The die bond assembly of claim 7, wherein: The fixed bump head (50) comprises a connecting mounting seat (51) fixed on the vertical slide plate (45), a voice coil motor assembly (52) is arranged on the connecting mounting seat (51), a rotating shaft sleeve (53) is fixed to the rotor of the voice coil motor assembly (52), a suction nozzle assembly (54) is rotatably arranged in the rotating shaft sleeve (53), a transmission belt wheel (541) is arranged on the suction nozzle assembly (54), the transmission belt wheel (541) is connected with a belt wheel on a rotary motor (55) through a transmission belt, the rotary motor (55) is mounted on a motor mounting seat (56), the motor mounting seat (56) is vertically slidably arranged on the connecting mounting seat (51), and a vertical force control grating ruler (57) is further arranged on the connecting mounting seat (51) and used for measuring the vertical moving distance of the suction nozzle assembly (54).

9. A die bonder characterized by: The die bonder comprises the die bonder bump head assembly according to any one of claims 1 to 8.

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