Air cavity structure of semiconductor wafer grinding head
By setting countersunk holes and threaded holes on the side of the air chamber body of the grinding head, and combining the rounded corners of the universal joint and the sealing ring design, the cracking and sealing problems of the traditional air chamber structure of the grinding head are solved, achieving tight connection and pressure uniformity, and improving grinding accuracy and equipment stability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-09
- Publication Date
- 2026-04-07
AI Technical Summary
Traditional grinding head air chamber structures are prone to cracking at the joint inlet, resulting in poor sealing and stability, as well as poor pressure uniformity, which affects grinding accuracy.
Countersunk holes and threaded holes are provided on the side of the air chamber body of the grinding head. Combined with the rounded corners of the universal joint and the design of the sealing ring, a tight connection is achieved through threaded connection, and the bevel angle is optimized to improve the smoothness of sliding.
It effectively reduces the risk of cracking at the joint inlet, improves the tightness of the connection and the uniformity of pressure, and enhances the grinding accuracy and equipment stability.
Smart Images
Figure CN224088752U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to chip processing technical field especially relates to a semiconductor wafer grinding head gas cavity structure. BACKGROUND
[0002] The chemical grinding head is a key component in the fields of semiconductor manufacturing, optical processing and precision material surface treatment, and its performance directly affects the grinding precision, process stability and product yield. The gas cavity structure of the grinding head bears important functions such as pressure balance, airflow control and stable support during the operation of the equipment, so its structure optimization is crucial to improving the overall performance of the equipment.
[0003] In the traditional design, a threaded hole is directly provided at the joint inlet of the grinding head gas cavity, especially when thread processing is performed on the contact surface of a relatively thin product, stress concentration is easily generated, which leads to cracking in the joint inlet area, affecting the sealing and stability of the equipment.
[0004] Moreover, the sliding between the grinding head gas cavity body and the universal joint is uneven, which is prone to jamming, resulting in poor pressure uniformity of the pressure film during the grinding process and affecting the grinding precision.
[0005] Therefore, the technical personnel in the art urgently need to provide a semiconductor wafer grinding head gas cavity structure that can reduce the cracking phenomenon at the joint inlet of the grinding head gas cavity body and the pipeline, and make the pipeline and the grinding head gas cavity body more tightly connected. UTILITY MODEL CONTENTS
[0006] The utility model discloses a semiconductor wafer grinding head gas cavity structure can reduce the cracking phenomenon at the joint inlet of the grinding head gas cavity body and the pipeline, and make the pipeline and the grinding head gas cavity body more tightly connected.
[0007] To achieve the above object, the utility model provides a semiconductor wafer grinding head gas cavity structure, including grinding head gas cavity body and universal joint, the lateral surface of grinding head gas cavity body is uniformly provided with counterbore and threaded hole, the counterbore with threaded hole intercommunication, threaded hole with the air passage of grinding head gas cavity body intercommunication, and the pipeline is inserted into threaded hole and is connected together with threaded connection, the middle part of grinding head gas cavity body is provided with cavity, the universal joint is inserted into the cavity, and the grinding head gas cavity body moves up and down along the universal joint.
[0008] Preferably, the lateral surface of the grinding head gas cavity body is provided with four counterbores and four threaded holes.
[0009] Preferably, the bottom of the inner wall of the grinding head gas cavity body is provided with a rounded corner one.
[0010] Preferably, the middle part of the inner wall of the grinding head air cavity body is provided with two inclined surfaces, and the two inclined surfaces are arranged upward and downward in the cavity.
[0011] Preferably, the end of the universal joint is provided with a chamfer, an annular groove is formed in the universal joint, a sealing ring is sleeved on the annular groove, the sealing ring is in sealing sliding connection with the grinding head air cavity body, and the sealing ring slides between the two inclined surfaces.
[0012] Preferably, the inclination angle of the inclined surface is 45°, the radius of the chamfer is 1.3 mm, and the length of the threaded hole is 13 mm.
[0013] The semiconductor wafer grinding head air cavity structure has the advantages and positive effects that:
[0014] 1. A counterbore is additionally arranged at the joint inlet of the grinding head air cavity body, and then a threaded hole is processed, so that the threaded hole is not directly arranged on the thin contact surface of the product, the stress concentration phenomenon around the threaded hole is effectively reduced by virtue of the counterbore design, and the risk of cracking in the joint inlet area is reduced.
[0015] 2. The length of the threaded hole is arranged, the pipeline is connected with the threaded hole through threads, and the pipeline and the grinding head air cavity body are more closely connected.
[0016] 3. The end of the universal joint is provided with a chamfer, and the bottom of the inner wall of the grinding head air cavity body is provided with a chamfer, so that the universal joint can be conveniently inserted into the cavity of the grinding head air cavity body, and the grinding head air cavity body and the universal joint are more smoothly connected.
[0017] 4. The universal joint is provided with a sealing ring, in order to reduce the jamming of the grinding head air cavity body on the universal joint, the inclination angle of the inclined surface of the cavity of the grinding head air cavity body is 45°, the sealing ring can move more smoothly in the area of the upward and downward inclined surfaces, the grinding head air cavity body operates more smoothly along the universal joint, the pressure uniformity of the grinding process is improved, and the grinding precision is improved.
[0018] The technical scheme of the utility model will be further described in detail below with reference to the drawings and embodiments. DESCRIPTION OF DRAWINGS
[0019] Figure 1 It is a semiconductor wafer grinding head air cavity structure schematic view of the utility model;
[0020] Figure 2 It is another view of the utility model semiconductor wafer grinding head air cavity structure schematic view;
[0021] Figure 3 It is a structure schematic view of the utility model grinding head air cavity body.
[0022] Figure 4 is a plan view of the air cavity body of the grinding head of the utility model;
[0023] Figure 5 is Figure 4 is a sectional view along A-A direction of the utility model;
[0024] Figure 6 is an enlarged view of the bevel of the utility model.
[0025] Reference signs
[0026] 1, air cavity body of grinding head; 2, counterbore; 3, threaded hole; 4, air passage; 5, cavity; 6, universal joint; 601, annular groove; 7, rounded corner one; 8, bevel. DETAILED DESCRIPTION
[0027] In the description of the utility model, it needs to be explained that the orientation or position relationship indicated by the terms "upper", "lower", "inner", "outer" and the like is based on the orientation or position relationship shown in the drawings, or is the orientation or position relationship that the utility model product is usually placed in when in use, and is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the device or element indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the utility model. In the description of the utility model, it also needs to be explained that, unless otherwise explicitly specified and limited, the terms "arrangement", "installation", "connection" should be understood broadly, for example, can be fixedly connected, or can be detachably connected, or integrally connected; can be mechanically connected, or can be electrically connected; can be directly connected, or can be indirectly connected through an intermediate medium, or can be the communication inside two elements. For ordinary skilled persons in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.
[0028] In the present application, unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present application belongs. If there is any inconsistency, the meaning explained in the specification or the meaning derived from the content described in the specification shall prevail. In addition, the terms used herein are only for the purpose of describing the embodiments of the present application, and are not intended to limit the present application.
[0029] The embodiments of the utility model will be described in detail below with reference to the drawings.
[0030] As Figures 1-6As shown in the figure, a semiconductor wafer grinding head air cavity structure comprises a grinding head air cavity body 1 and a universal joint 6, the side surface of the grinding head air cavity body 1 is uniformly provided with a counterbore 2 and a threaded hole 3, the counterbore 2 is communicated with the threaded hole 3, the threaded hole 3 is communicated with an air duct 4 of the grinding head air cavity body 1, a pipeline is inserted into the threaded hole 3 and is screwed together, a cavity 5 is formed in the middle of the grinding head air cavity body 1, the universal joint 6 is inserted into the cavity 5, and the grinding head air cavity body 1 moves up and down along the universal joint 6.
[0031] Specifically, one end of the pipeline is communicated with the air duct 4, the other end is communicated with a carrier, a film is arranged below the carrier, and the film is communicated with the carrier.
[0032] Specifically, the top of the grinding head air cavity body 1 is provided with a vent hole, the vent hole is communicated with the air duct, the air duct 4 is inflated through the vent hole, and the gas in the air duct 4 enters the carrier along the pipeline. A plurality of air holes are formed in the disc at the bottom of the universal joint 6. The gas between the carrier and the film passes through the air holes, so that the gas fills between the grinding head air cavity body 1 and the universal joint 6, and the sealing ring on the universal joint plays a sealing role. Finally, the gas lifts the grinding head air cavity body 1, so that the grinding head air cavity body 1 moves upward along the universal joint 6. Stop inflating, the gas flows out of the air duct along the pipeline, and finally flows out of the vent hole.
[0033] Four counterbores 2 and four threaded holes 3 are formed in the side surface of the grinding head air cavity body 1. Specifically, four pipelines are respectively screwed with one threaded hole 3.
[0034] The bottom of the inner wall of the grinding head air cavity body 1 is provided with a rounded corner one 7, so that the universal joint 6 is inserted into the cavity, and the grinding head air cavity body 1 and the universal joint 6 are more smoothly connected.
[0035] The middle of the inner wall of the grinding head air cavity body 1 is provided with two inclined surfaces 8, and the two inclined surfaces 8 are arranged up and down in the cavity 5. The sealing ring is in sealing sliding connection with the grinding head air cavity body 1, and the sealing ring slides between the two inclined surfaces 8.
[0036] Specifically, when the gas fills between the grinding head air cavity body 1 and the universal joint 6, the sealing ring on the universal joint 6 plays a sealing role.
[0037] The end of the universal joint 6 is provided with a rounded corner two, the universal joint 6 is provided with an annular groove 601, and the sealing ring is sleeved on the annular groove 601.
[0038] The inclination angle of the inclined surface 8 is 45°. Specifically, the upper inclined surface 8 is inclined downward by 45°, and the lower inclined surface 8 is inclined upward by 45°.
[0039] The radius of the rounded corner one 7 is 1.3 mm, and the length of the threaded hole 3 is 13 mm.
[0040] The use process of the utility model is:
[0041] First, four air passages are screwed into the threaded holes 3 and are screwed with the threaded holes 3, realizing the stable connection of the pipeline and the grinding head air cavity body 1.
[0042] When the grinding head air cavity body 1 needs to move upward, the air passages 4 are inflated by the air holes on the top of the grinding head air cavity body 1, and the gas in the air passages 4 enters the carrier along the pipeline. The disc at the bottom of the universal joint 6 is provided with an air hole. The gas between the carrier and the film permeates through the air hole, fills the gas between the grinding head air cavity body 1 and the universal joint 6, and the sealing ring on the universal joint plays a sealing role. Finally, the gas lifts the grinding head air cavity body 1, and the grinding head air cavity body 1 moves upward along the universal joint 6. When the grinding head air cavity body 1 needs to move downward, stop inflating, and the gas flows out of the air passages 4 along the pipeline and finally out of the air hole.
[0043] Finally, it should be noted that: the above examples are only used to illustrate the technical solutions of the present application and not to limit them. Although the present application has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present application can still be modified or replaced by equivalents, and these modifications or equivalent replacements cannot make the modified technical solutions deviate from the spirit and scope of the technical solutions of the present application.
Claims
1. A gas cavity structure for a semiconductor wafer grinding head, characterized in that: The device includes a grinding head air chamber body and a universal joint. The grinding head air chamber body has countersunk holes and threaded holes evenly distributed on its side. The countersunk holes are connected to the threaded holes, and the threaded holes are connected to the air passage of the grinding head air chamber body. The passage extends into the threaded hole and is connected to the thread. A cavity is formed in the middle of the grinding head air chamber body, and the universal joint extends into the cavity. The grinding head air chamber body moves up and down along the universal joint.
2. The air cavity structure of a semiconductor wafer grinding head according to claim 1, characterized in that: The grinding head air chamber body has four countersunk holes and four threaded holes on its side.
3. The air cavity structure of a semiconductor wafer grinding head according to claim 1, characterized in that: The bottom of the inner wall of the grinding head air chamber body is provided with a rounded corner.
4. The air cavity structure of a semiconductor wafer grinding head according to claim 3, characterized in that: The inner wall of the grinding head air chamber body has two inclined surfaces in the middle, and the two inclined surfaces are arranged one above the other in the cavity.
5. The air cavity structure of a semiconductor wafer grinding head according to claim 4, characterized in that: The universal joint has a rounded corner at one end and an annular groove on it. A sealing ring is fitted onto the annular groove and is slidably connected to the air chamber body of the grinding head. The sealing ring slides between two inclined surfaces.
6. The air cavity structure of a semiconductor wafer grinding head according to claim 4, characterized in that: The inclination angle of the inclined surface is 45°; the radius of the first rounded corner is 1.3 mm; and the length of the threaded hole is 13 mm.