Chip capacitor base plate structure easy to weld

Abstract

The utility model relates to the technical field of chip capacitors, in particular to an easy-to-weld chip capacitor seat plate structure, which is characterized by comprising an insulating block, a placing groove is arranged on the upper side of the insulating block, a plurality of hollow areas are arranged on the inner side of the placing groove, and conductive reeds are arranged in the hollow areas in a limiting manner. Conductive blocks making contact with the wire reeds are fixed to the openings of the two pairs of hollow areas, welding feet are fixed to the two ends of the insulating block and electrically connected with the conductive blocks, and a chip capacitor body is clamped between the multiple conductive reeds. The chip capacitor solves the problems that an existing chip capacitor is extremely small in structure, is difficult to fix and position during manual welding, and is inconvenient for a green hand to weld.

Description

Technical Field

[0001] This utility model relates to the field of surface mount capacitor technology, specifically to a surface mount capacitor base structure that is easy to solder. Background Technology

[0002] The existing surface mount capacitors have a small structure, which results in even smaller electrode structures at both ends of the surface mount capacitor. Generally, a magnifying glass is needed to assist in soldering. However, since tweezers are used for positioning, hand tremors are inevitable, leading to inaccurate positioning and making it difficult to solder the capacitor to the correct position. This is very unfriendly to beginners. Utility Model Content

[0003] The technical problem this invention aims to solve is that some existing surface mount capacitors have extremely small structures, making them difficult to fix in place during hand soldering, which is inconvenient for beginners.

[0004] To solve the above problems, the technical solution adopted by this utility model is an easy-to-weld chip capacitor base plate structure, including an insulating block, a placement groove on the upper side of the insulating block, a plurality of hollow areas on the inner side of the placement groove, a conductive spring being limited in the hollow areas, a conductive block in contact with the conductive spring being fixed at the opening of each pair of hollow areas, a solder foot being fixed at both ends of the insulating block, the solder foot being electrically connected to the conductive block, and a chip capacitor body being sandwiched between the plurality of conductive springs.

[0005] As a further aspect of this utility model: both ends of the conductive spring are in a curled state in the hollow area, which can limit the movement of the conductive spring.

[0006] As a further embodiment of this utility model: two pairs of conductive springs are for conducting electricity, and the other two conductive springs are for limiting position.

[0007] As a further aspect of this invention, the conductive spring contacts the terminals of the chip capacitor body to facilitate normal electrical conduction.

[0008] As a further aspect of this invention, the conductive spring is elastic to facilitate clamping the chip capacitor body.

[0009] Compared with the prior art, the advantages of this utility model are: this patent adds an insulating block and a conductive spring structure. By using the conductive spring, the surface mount capacitor body is fixed in position and conducts electricity, which makes it easier to solder smaller surface mount capacitors and is easier for beginners to solder. Attached Figure Description

[0010] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:

[0011] Figure 1 This is a three-dimensional view of the overall structure of an easy-to-weld surface mount capacitor base plate structure according to this utility model.

[0012] Figure 2 This is a partial structural cross-sectional view of an easy-to-solder surface mount capacitor base plate structure according to this utility model.

[0013] Figure 3 This is an enlarged view of part A of the easy-to-solder surface mount capacitor base plate structure of this utility model.

[0014] In the attached image:

[0015] 1. Insulating block; 2. Conductive spring; 3. Conductive block; 4. Solder foot; 5. Surface mount capacitor body; 1.1. Placement slot; 1.2. Hollow area. Detailed Implementation

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0017] This utility model provides a technical solution to address the existing problems mentioned in the background art.

[0018] Combined with appendix Figure 1-3 It can be seen that the device includes an insulating block 1, an upper side of which has a placement groove 1.1, and a number of hollow areas 1.2 are provided inside the placement groove 1.1. Conductive springs 2 are provided in the hollow areas 1.2 to clamp the chip capacitor body 5 and to accommodate chip capacitor bodies 5 of different sizes. Conductive blocks 3 that are in contact with the conductive springs 2 are fixed at the openings of the two pairs of hollow areas 1.2, and can always be in contact with the conductive springs 2 to conduct the circuit. Solder feet 4 are fixed at both ends of the insulating block 1, which are easier to solder than small capacitors. The solder feet 4 are electrically connected to the conductive blocks 3. The chip capacitor body 5 is sandwiched between the number of conductive springs 2.

[0019] Both ends of the conductive spring 2 are in a curled state in the hollow region 1.2, which can limit the conductive spring 2; two pairs of conductive springs 2 are for conducting electricity, and the other two conductive springs 2 are for limiting electricity; the conductive springs 2 are in contact with the electrodes of the chip capacitor body 5 to facilitate normal conduction; the conductive springs 2 are elastic to clamp the chip capacitor body 5.

[0020] The working principle of this application is as follows: When soldering the small-volume chip capacitor body 5, first use tweezers to pick up the chip capacitor body 5 and place it between the conductive springs 2 so that its bottom contacts the bottom of the placement groove 1.1. Then the solder feet 4 can be soldered. After the soldering is completed, the solder feet 4, conductive block 3, conductive spring 2 and chip capacitor body 5 will form a circuit for normal use.

[0021] The present invention and its embodiments have been described above. This description is not restrictive, and the accompanying drawings are only one embodiment of the present invention; the actual structure is not limited thereto. In conclusion, if those skilled in the art are inspired by this description and design similar structures and embodiments without departing from the inventive spirit of the present invention, such designs should fall within the protection scope of the present invention.

Claims

1. A solderable surface mount capacitor base structure, characterized in that: The device includes an insulating block (1), an upper groove (1.1) on the insulating block (1), several hollow areas (1.2) on the inner side of the groove (1.1), a conductive spring (2) is provided in the hollow area (1.2), a conductive block (3) is fixed at the opening of each pair of hollow areas (1.2) and in contact with the conductive spring (2), a solder foot (4) is fixed at both ends of the insulating block (1), the solder foot (4) is electrically connected to the conductive block (3), and a chip capacitor body (5) is sandwiched between several conductive springs (2).

2. The easily solderable surface mount capacitor base structure according to claim 1, characterized in that: Both ends of the conductive spring (2) are in a curled state within the hollow region (1.2).

3. The easily solderable surface mount capacitor base structure according to claim 1, characterized in that: The two pairs of conductive springs (2) are for conducting electricity, and the other two conductive springs (2) are for limiting position.

4. The easily solderable surface mount capacitor base structure according to claim 1, characterized in that: The conductive spring (2) is in contact with the electrode of the chip capacitor body (5).

5. The easily solderable surface mount capacitor base structure according to claim 1, characterized in that: The conductive spring (2) is elastic.

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