Motor driving module, motor driving thermal protection system and photovoltaic cleaning device
By placing temperature sensors among the high-heat-generating switching transistors in the motor drive module, the heating status of these transistors can be detected to infer the heating status of other transistors. This solves the problem of high cost caused by a large number of temperature sensors, and achieves cost reduction and improved reliability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-15
- Publication Date
- 2026-04-07
AI Technical Summary
Existing motor drive modules have a large number of switching transistors, which leads to a large number of temperature sensors and higher costs.
By placing temperature sensors among the high-heat-generating switching transistors in the motor drive module, the heating status of these switching transistors can be detected to infer the heating status of other switching transistors, thus reducing the number of temperature sensors required.
The number of temperature sensors was reduced, lowering costs while improving the reliability and safety of the motor drive module.
Smart Images
Figure CN224097618U_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of motor drive technology, and in particular relates to a motor drive module, a motor drive thermal protection system, and a photovoltaic cleaning device. Background Technology
[0002] In a motor drive module, the motor current and speed are controlled by turning the switching transistors on and off. During operation, these transistors experience power losses, primarily dissipated as heat, causing them to heat up. To ensure proper operation and extend the lifespan of the motor drive module, traditional modules typically include a temperature sensor around each transistor for real-time temperature monitoring. However, the large number of transistors in a motor drive module necessitates a large number of temperature sensors, resulting in higher costs. Utility Model Content
[0003] This application aims to at least solve one of the technical problems existing in the prior art. To this end, this application proposes a motor drive module, a motor drive thermal protection system, and a photovoltaic cleaning device, which infers the heating status of other switching transistors in the motor drive module by detecting the heating status of the high-heat-generating switching transistor, thereby reducing the number of temperature sensors and lowering costs.
[0004] In a first aspect, this application provides a motor drive module, comprising:
[0005] Circuit board;
[0006] The drive unit, mounted on a circuit board, includes a first upper bridge switch and a first lower bridge switch connected to each other, and a second upper bridge switch and a second lower bridge switch connected to each other. The first upper bridge switch and the second upper bridge switch are arranged along a first direction, and the first lower bridge switch and the second lower bridge switch are arranged along a first direction. The first connection node of the first upper bridge switch and the first lower bridge switch and the second connection node of the second upper bridge switch and the second lower bridge switch are respectively connected to a motor.
[0007] A temperature sensor is disposed on a circuit board, and the temperature sensor is located between the first upper bridge switch and the second upper bridge switch in a first direction; and / or the temperature sensor is located between the first lower bridge switch and the second lower bridge switch in a first direction.
[0008] According to one embodiment of this application, the circuit board is provided with multiple heat-conducting structures, and the temperature sensor and each switching transistor are disposed on the heat-conducting structures.
[0009] According to one embodiment of this application, the thermally conductive structure is a heat dissipation pad, thermally conductive adhesive, or an insulating thermally conductive pad.
[0010] According to one embodiment of this application, the temperature sensor is located in a first direction between the first lower bridge switch and the second lower bridge switch, and is located on the central axis of the line connecting the first lower bridge switch and the second lower bridge switch.
[0011] According to one embodiment of this application, the temperature sensor, the first lower bridge switch, and the second lower bridge switch are arranged collinearly along a first direction.
[0012] According to one embodiment of this application, the temperature sensor is a patch temperature sensor or a thermistor.
[0013] According to one embodiment of this application, the switching transistor is a metal-oxide-semiconductor field-effect transistor, an insulated-gate bipolar transistor, or a bipolar transistor.
[0014] According to one embodiment of this application, the motor drive module includes multiple drive units and multiple temperature sensors. The drive units are arranged in an array. In the drive units arranged along a first direction, the temperature sensors are located between two adjacent upper bridge switching transistors; and / or the temperature sensors are located between two adjacent lower bridge switching transistors.
[0015] Secondly, this application provides a motor drive thermal protection system, including a protection unit and the aforementioned motor drive module. The protection unit is electrically connected to the drive unit and temperature sensor in the motor drive module, respectively. The protection unit is configured to receive the detection signal output by the temperature sensor and output a drive signal to the drive unit.
[0016] Thirdly, this application provides a photovoltaic cleaning device, including a motor and the aforementioned motor drive module, wherein the motor and the motor drive module are electrically connected.
[0017] According to several embodiments of the present application, the motor drive module, motor drive thermal protection system, and photovoltaic cleaning device, during motor operation, when the upper bridge switch is driven by a chopper signal, the lower bridge switch connected to it generates a large amount of heat, and when the lower bridge switch is driven by a chopper signal, the upper bridge switch connected to it generates a large amount of heat. By arranging temperature sensors between the two upper bridge switches and / or between the two lower bridge switches, the heating status of other switches in the motor drive module can be inferred by detecting the heating status of the switch with the large amount of heat generated. Reducing the number of temperature sensors can lower costs.
[0018] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description
[0019] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:
[0020] Figure 1 This is one of the structural schematic diagrams of the motor drive module provided in the embodiments of this application;
[0021] Figure 2 This is a circuit topology diagram of the motor drive module provided in the embodiments of this application;
[0022] Figure 3 This is a schematic diagram of the current flow path provided in an embodiment of this application;
[0023] Figure 4 This is the second structural schematic diagram of the motor drive module provided in the embodiments of this application.
[0024] Figure label:
[0025] Circuit board 10, drive unit 20, temperature sensor 30, motor M, first upper bridge switch Q1, first lower bridge switch Q2, second upper bridge switch Q3, second lower bridge switch Q4, power supply voltage node VDD, ground node GND. Detailed Implementation
[0026] The embodiments of this application are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.
[0027] In the following description, a "circuit" refers to a conductive loop consisting of at least one element or sub-circuit connected by an electrical or electromagnetic link. When an element or circuit is said to be "coupled to" or "connected to" another element, or when an element / circuit is said to be "coupled at" or "connected at" two nodes, it can be directly coupled to or connected to the other element, or there may be intermediate elements. The connection between elements can be physical, logical, or a combination thereof. Conversely, when an element is said to be "directly coupled to" or "directly connected to" another element, it means that there are no intermediate elements between them.
[0028] In the description, the terms "first," "second," etc., are used to distinguish similar objects, not to describe a specific order or sequence. It should be understood that such numerical descriptors can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class, not limited in number; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.
[0029] Furthermore, the use of terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicates that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.
[0030] Currently available intelligent photovoltaic module cleaning robots often get stuck at support points due to issues such as differences in bracket angles and heights, and inconsistencies in the angles between single-axis brackets. Even when the current of the upper and lower motors hasn't reached the overcurrent limit set in the motor drive unit, the robot continues to operate at a slightly higher current. Prolonged operation under these conditions may cause the switching transistors in the motor drive module to overheat and be damaged. Therefore, it is necessary to design a method for overheating protection of the switching transistors under these conditions.
[0031] Overheat protection methods for switching transistors typically involve placing temperature sensors around the transistors to monitor their temperature in real time. However, in related technologies, a temperature sensor is usually placed near each switching transistor, which is both space-consuming and costly.
[0032] Reference Figure 1 , Figure 1 The structure of a motor drive module provided in an embodiment of this application is shown. One embodiment of this application proposes a motor drive module including: a circuit board 10, a drive unit 20, and a temperature sensor 30. The drive unit 20 is disposed on the circuit board 10 and includes a first upper bridge switch Q1 and a first lower bridge switch Q2 connected to each other, and a second upper bridge switch Q3 and a second lower bridge switch Q4 connected to each other. The first upper bridge switch Q1 and the second upper bridge switch Q3 are arranged along a first direction, and the first lower bridge switch Q2 and the second lower bridge switch Q4 are also arranged along a first direction. The first connection node of the first upper bridge switch Q1 and the first lower bridge switch Q2, and the second connection node of the second upper bridge switch Q3 and the second lower bridge switch Q4 are respectively connected to a motor M. The temperature sensor 30 is disposed on the circuit board 10, and the temperature sensor 30 is located between the first upper bridge switch Q1 and the second upper bridge switch Q3 in the first direction; and / or the temperature sensor 30 is located between the first lower bridge switch Q2 and the second lower bridge switch Q4 in the first direction.
[0033] Reference Figure 2 , Figure 2The circuit topology of the motor drive module provided in the embodiments of this application is shown. To better illustrate the working principle of the motor drive module proposed in the embodiments of this application, the following uses… Figure 2 The circuit topology shown is used as an example for illustration.
[0034] The first upper-bridge switch Q1 and the second upper-bridge switch Q3 can be electrically connected to the power supply voltage node VDD, and the first lower-bridge switch Q2 and the second lower-bridge switch Q4 can be electrically connected to the ground node. The power supply voltage node VDD is mainly used to provide electrical energy to drive the motor M.
[0035] The connection node of the first upper bridge switch and the first lower bridge switch forms the first output terminal, and the connection node of the second upper bridge switch and the second lower bridge switch forms the second output terminal. The motor M is electrically connected between the first and second output terminals, which enables the efficient transmission of electrical energy provided by the power supply voltage node from the drive module to the motor M.
[0036] A motor drive module typically includes a controller. The controller is mainly used to apply PWM (Pulse Width Modulation) signals to each switch to control it. The controller can change the direction of the current flowing through the motor M by controlling the conduction of different switches, thereby changing the direction of the motor M. It can also change the speed of the motor M by changing the duty cycle of the drive signal.
[0037] It is understood that in the motor drive module proposed in this application, if the controller applies a chopping signal to the first upper bridge switch Q1, it should apply a constant-on signal to the corresponding second lower bridge switch Q4; if it applies a chopping signal to the second upper bridge switch Q3, it should apply a constant-on signal to the corresponding first lower bridge switch Q2. Similarly, when the controller applies a chopping signal to the first lower bridge switch Q2, it applies a constant-on signal to the corresponding second upper bridge switch Q3; when the controller applies a chopping signal to the second lower bridge switch Q4, it applies a constant-on signal to the corresponding first upper bridge switch Q1.
[0038] Reference Figure 3 For ease of understanding, this application uses the example of the controller applying a chopping signal to the first upper bridge switch Q1 (i.e., the first upper bridge switch Q1 switches between the on and off states) and a constant-on signal to the corresponding second lower bridge switch Q4 when the motor M rotates forward, and the controller applying a chopping signal to the second upper bridge switch Q3 and a constant-on signal to the corresponding first lower bridge switch Q2 when the motor M rotates in reverse. Figure 3 The current flow path under this operating condition is shown.
[0039] like Figure 3As shown in the flow path (1), when the motor M rotates forward and the first upper bridge switch Q1 is in the conducting state, the current passes sequentially through the power supply voltage node VDD, the first upper bridge switch Q1, the first output terminal, the motor M, the second output terminal, the second lower bridge switch Q4, and the ground node GND; Figure 3 As shown in the flow path (2), when the motor M rotates forward and the first upper bridge switch Q1 is in the off state, the current passes through the second output terminal, the second lower bridge switch Q4, the body diode of the first lower bridge switch Q2, the first output terminal and the motor M in sequence.
[0040] As explained above, since the first upper-bridge switch Q1 switches between the on and off states, the switching losses are manifested as heat. The second lower-bridge switch Q4 is always on, and its switching losses are negligible. Therefore, when motor M rotates forward, the heat generated by the first upper-bridge switch Q1 is greater than that generated by the second lower-bridge switch Q4. When the first upper-bridge switch Q1 is off, the current maintaining the forward rotation of motor M freewheels through the body diode of the first lower-bridge switch Q2. The forward voltage drop of the body diode is much higher than the voltage drop generated by the channel resistance of the MOSFET. The losses in the body diode are directly dissipated as heat inside the first lower-bridge switch Q2. Therefore, the heat generated by the first lower-bridge switch Q2 is greater than that generated by the first upper-bridge switch Q1. In summary, when motor M rotates forward, the heat generated by the first lower-bridge switch Q2 is the greatest, followed by the first upper-bridge switch Q1, and the heat generated by the second lower-bridge switch Q4 is the least. Similarly, when motor M reverses, the second lower bridge switch Q4 generates the most heat, followed by the second upper bridge switch Q3, and the first lower bridge switch Q2 generates the least heat.
[0041] As explained above, the first lower bridge switch Q2 generates the most heat when motor M rotates forward, and the second lower bridge switch Q4 generates the most heat when motor M rotates in reverse. In other words, the temperatures of the first lower bridge switch Q2 and the second lower bridge switch Q4 are relatively high during motor M's operation. The first direction can be... Figure 1 The temperature sensor 30 is located in the X direction. Therefore, in the first direction, the temperature sensor 30 is located between the first lower bridge switch Q2 and the second lower bridge switch Q4, and can detect the temperature of the first lower bridge switch Q2 and the second lower bridge switch Q4. When the temperature of the first lower bridge switch Q2 or the second lower bridge switch Q4 reaches a preset threshold, protective measures are taken to improve the reliability of the motor drive module.
[0042] In other embodiments, when motor M rotates forward, the controller applies a constant-current signal to the first upper-bridge switch Q1 and a chopping signal to the corresponding second lower-bridge switch Q4. When motor M rotates in reverse, the controller applies a constant-current signal to the second upper-bridge switch Q3 and a chopping signal to the corresponding first lower-bridge switch Q2. As can be seen from the foregoing description, in this case, the second upper-bridge switch Q3 generates the most heat when motor M rotates forward, and the first upper-bridge switch Q1 generates the most heat when motor M rotates in reverse. Therefore, the temperature sensor 30 is located between the first upper-bridge switch Q1 and the second upper-bridge switch Q3 in the first direction, and can take protective measures even when the temperature of the first upper-bridge switch Q1 or the second upper-bridge switch Q3 reaches a preset threshold, thereby improving the reliability of the motor drive module.
[0043] In other embodiments, the motor drive module includes a first temperature sensor 30 and a second temperature sensor 30. The first temperature sensor 30 is located between the first upper bridge switch Q1 and the second upper bridge switch Q3 in a first direction, and the second temperature sensor 30 is located between the first lower bridge switch Q2 and the second lower bridge switch Q4 in a first direction. By using two temperature sensors 30, the temperature of four switches can be detected, improving the versatility of the motor drive module.
[0044] According to the motor drive module of this application, during the operation of motor M, when the upper bridge switch is driven by the chopper signal, the lower bridge switch connected to it generates a large amount of heat, and when the lower bridge switch is driven by the chopper signal, the upper bridge switch connected to it generates a large amount of heat. By arranging the temperature sensor 30 between the two upper bridge switches and / or between the two lower bridge switches, the heating status of other switches in the motor drive module can be inferred by detecting the heating status of the switch with the large amount of heat generated. Reducing the number of temperature sensors 30 can reduce costs.
[0045] In some embodiments, the circuit board 10 is provided with multiple heat-conducting structures, and the temperature sensor 30 and each switching transistor are disposed on the heat-conducting structures.
[0046] The heat-conducting structure has good thermal conductivity and can form a heat transfer path through close contact. The heat generated by each switching transistor during operation can be transferred to the temperature sensor 30 through the heat-conducting structure, enabling the temperature sensor 30 to monitor the temperature changes of the switching transistors in real time and accurately.
[0047] The specific type of thermal conductive medium can be determined based on the actual application scenario and is not limited here. For example, the thermal conductive material can be thermal grease or thermal silicone, etc.
[0048] In some embodiments, the thermally conductive structure is a heat dissipation pad, thermally conductive adhesive, or an insulating thermally conductive pad.
[0049] The switching transistor can be fixed to the circuit board 10 by a heat dissipation pad. The heat dissipation pad is usually made of a material with good conductivity, such as copper or tin-plated copper. This helps to reduce the resistance of the solder joint, improve the conductivity of the circuit, and effectively increase the heat dissipation area of the switching transistor.
[0050] The thermally conductive adhesive has excellent thermal conductivity, facilitating heat transfer between the temperature sensor 30 and the circuit board 10. Furthermore, the adhesive possesses good adhesion, allowing the temperature sensor 30 to be directly bonded to the circuit board 10, simplifying the installation process, improving production efficiency, and resulting in a more rational and compact layout of the motor drive module on the circuit board 10.
[0051] The insulating thermally conductive pad not only has excellent thermal conductivity but also good insulation properties. It can protect other electronic components on the unit board 40 from electrical interference from the temperature sensor 30, ensuring the stable operation of the entire circuit system and improving circuit safety.
[0052] In some embodiments, the temperature sensor 30 is located in a first direction between the first lower bridge switch Q2 and the second lower bridge switch Q4, and is located on the central axis of the line connecting the first lower bridge switch Q2 and the second lower bridge switch Q4.
[0053] The temperature sensor 30 is located on the central axis of the line connecting the first lower bridge switch Q2 and the second lower bridge switch Q4, which allows the temperature sensor 30 to have consistent sensitivity to the heating of the two switches, thereby detecting the heat from the two switches evenly.
[0054] In some embodiments, the distance between the temperature sensor 30 and the first lower-bridge switch Q2 and the second lower-bridge switch Q4 is less than or equal to a preset threshold. This allows the measured temperature to be closer to the internal temperature of the two switches driven by the constant-current signal, improving the accuracy and reliability of the detection results. The specific value of the preset threshold can be determined according to the actual application scenario and is not limited here. For example, the preset threshold can be 10mm or 15mm, etc.
[0055] In some embodiments, the temperature sensor 30, the first lower bridge switch Q2, and the second lower bridge switch Q4 are arranged collinearly along a first direction.
[0056] Temperature sensor 30 is located on the central axis of the first lower bridge switch Q2 and the second lower bridge switch Q4, and the three are arranged collinearly. This makes the distance between temperature sensor 30 and the first lower bridge switch Q2 and the distance between temperature sensor 30 and the second lower bridge switch Q4 the same and the shortest, reducing space occupation, optimizing circuit layout, and shortening the heat conduction path to improve thermal coupling efficiency.
[0057] In some embodiments, the temperature sensor 30 is a patch temperature sensor 30 or a thermistor.
[0058] The surface mount temperature sensor 30 has advantages such as small size, light weight, and easy integration. The surface mount temperature sensor 30 has a fast response speed, enabling it to quickly sense changes in ambient temperature and convert the temperature signal into an electrical signal output.
[0059] A thermistor measures temperature by utilizing the property that the resistivity of a semiconductor material changes with temperature. Thermistors are characterized by high sensitivity, fast response speed, and simple structure.
[0060] In some embodiments, the switching transistor is a metal-oxide-semiconductor field-effect transistor, an insulated-gate bipolar transistor, or a bipolar transistor.
[0061] The specific type of switching transistors constituting the driving unit 20 can be selected according to the actual application scenario, and is not limited here. For example, each switching transistor can be a MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor), an IGBT (Insulated-Gate Bipolar Transistor), or a bipolar transistor, etc.
[0062] Reference Figure 4 , Figure 4 The structure of a motor drive module provided in an embodiment of this application is shown. In some embodiments, the motor drive module includes a plurality of drive units 20 and a plurality of temperature sensors 30. The drive units 20 are arranged in an array. In the drive units 20 arranged along a first direction, the temperature sensors 30 are located between two adjacent upper bridge switching transistors; and / or the temperature sensors 30 are located between two adjacent lower bridge switching transistors.
[0063] A device typically powered by a motor M may include multiple motors M, each requiring a corresponding motor drive module to provide electrical power. The number of motor drive modules can be selected based on the number of motors M in the device, and is not limited here.
[0064] In a motor drive module comprising multiple drive units 20, a temperature sensor 30 is provided between the upper bridge switch and / or lower bridge switch of two adjacent drive units 20 arranged along the first direction. When the temperature sensor 30 in one drive unit 20 fails, the temperature sensor 30 between two adjacent drive units 20 can still detect the temperature, thereby improving the safety and reliability of the motor drive module.
[0065] One embodiment of this application provides a motor drive thermal protection system, including a protection unit and the aforementioned motor drive module. The protection unit is electrically connected to the drive unit 20 and the temperature sensor 30 in the motor drive module, respectively. The protection unit is configured to receive the detection signal output by the temperature sensor 30 and output a drive signal to the drive unit 20.
[0066] The specific structure and working principle of the motor drive module can be referred to in the aforementioned embodiments, and will not be repeated here.
[0067] Taking the temperature sensor 30 located between the first lower bridge switch Q2 and the second lower bridge switch Q4 as an example, the protection unit can receive temperature data from the temperature sensor 30 in real time. This data reflects the temperature of the first lower bridge switch Q2 and the second lower bridge switch Q4 during operation. If the temperature of either the first lower bridge switch Q2 or the second lower bridge switch Q4 exceeds a first preset threshold, it indicates that it may be in an overload or abnormal operating state, and continued operation may lead to performance degradation or even damage. When the protection unit detects that the temperature of the first lower bridge switch Q2 or the second lower bridge switch Q4 exceeds the first preset threshold, it can stop applying drive signals to each switch, causing the switch to stop working. This effectively protects the switch, avoids the risk of damage due to overheating, ensures the stable operation of the entire circuit system, and improves the reliability and safety of the motor drive module.
[0068] The specific value of the first preset threshold can be selected according to the actual application scenario, and is not limited here. For example, the first preset threshold can be 85℃ or 90℃, etc.
[0069] In other embodiments, the protection unit is further configured to resume applying a drive signal to each switch when the temperature of the temperature sensor 30 drops to less than or equal to a second preset threshold after each switch stops working, wherein the second preset threshold is less than a first preset threshold.
[0070] The specific value of the second preset threshold can be selected according to the actual application scenario, and is not limited here. For example, the second preset threshold can be 30℃ or 40℃, etc.
[0071] According to the motor drive thermal protection system of this application, during the operation of motor M, when the upper bridge switch is driven by the chopper signal, the lower bridge switch connected to it generates a large amount of heat, and when the lower bridge switch is driven by the chopper signal, the upper bridge switch connected to it generates a large amount of heat. By arranging the temperature sensor 30 between the two upper bridge switches and / or between the two lower bridge switches, the heating status of other switches in the motor drive module can be inferred by detecting the heating status of the switch with the large amount of heat generated. Reducing the number of temperature sensors 30 can reduce costs.
[0072] One embodiment of this application proposes a photovoltaic cleaning device, including a motor M and the aforementioned motor drive module, wherein the motor M is electrically connected to the motor drive module.
[0073] The specific structure and working principle of the motor drive module can be referred to in the aforementioned embodiments, and will not be repeated here.
[0074] According to the photovoltaic cleaning device of this application, during the operation of motor M, the heat generated by the switching tube in the constant current mode is greater than that of the switching tube operating in chopper mode. By placing a single temperature sensor 30 between the two switching tubes in constant current mode, the heat generation of the switching tubes in the motor drive module can be determined by detecting the heat generation of the switching tube with the highest temperature, thereby reducing costs.
[0075] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.
Claims
1. A motor drive module, characterized in that, The motor drive module includes: Circuit board; The drive unit, disposed on the circuit board, includes a first upper bridge switch and a first lower bridge switch connected to each other, and a second upper bridge switch and a second lower bridge switch connected to each other. The first upper bridge switch and the second upper bridge switch are arranged along a first direction, and the first lower bridge switch and the second lower bridge switch are arranged along the first direction. The first connection node of the first upper bridge switch and the first lower bridge switch and the second connection node of the second upper bridge switch and the second lower bridge switch are respectively connected to the motor. A temperature sensor is disposed on the circuit board, the temperature sensor being located between the first upper bridge switch and the second upper bridge switch in the first direction; and / or the temperature sensor being located between the first lower bridge switch and the second lower bridge switch in the first direction.
2. The motor drive module according to claim 1, characterized in that, The circuit board is provided with multiple heat-conducting structures, and the temperature sensor and each switching transistor are all disposed on the heat-conducting structures.
3. The motor drive module according to claim 2, characterized in that, The thermally conductive structure is a heat dissipation pad, thermally conductive adhesive, or an insulating thermally conductive pad.
4. The motor drive module according to claim 1, characterized in that, The temperature sensor is located between the first lower bridge switch and the second lower bridge switch in the first direction, and is located on the central axis of the line connecting the first lower bridge switch and the second lower bridge switch.
5. The motor drive module according to claim 4, characterized in that, The temperature sensor, the first lower bridge switch, and the second lower bridge switch are arranged collinearly along the first direction.
6. The motor drive module according to claim 1, characterized in that, The temperature sensor is a patch temperature sensor or a thermistor.
7. The motor drive module according to claim 1, characterized in that, The switching transistor is a metal-oxide-semiconductor field-effect transistor, an insulated-gate bipolar transistor, or a bipolar transistor.
8. The motor drive module according to any one of claims 1-7, characterized in that, The motor drive module includes multiple drive units and multiple temperature sensors. The drive units are arranged in an array. In the drive units arranged along the first direction, the temperature sensor is located between two adjacent upper bridge switching transistors; and / or the temperature sensor is located between two adjacent lower bridge switching transistors.
9. A motor drive thermal protection system, characterized in that, The device includes a protection unit and a motor drive module according to any one of claims 1-8. The protection unit is electrically connected to the drive unit and the temperature sensor in the motor drive module, respectively. The protection unit is configured to receive the detection signal output by the temperature sensor and output a drive signal to the drive unit.
10. A photovoltaic cleaning device, characterized in that, It includes a motor and a motor drive module according to any one of claims 1-8, wherein the motor is electrically connected to the motor drive module.