Multilayer PCB control board for analog signal processing

Abstract

The utility model discloses a multi-layer PCB control board for analog signal processing, which comprises multi-layer stacked control boards, vapor chambers, heat dissipation pipes, heat dissipation fins, a fan, a motor, an air duct and a packaging cover plate, the multi-layer stacked control boards are stacked to form a composite PVB control board, the vapor chambers are arranged in the middle of the interior of each multi-layer stacked control board, and the heat dissipation fins are arranged in the middle of the interior of each multi-layer stacked control board. The outer sides of the vapor chambers extend out and are connected with side radiating pipes, radiating fins are integrally formed at the two ends of the outer side of each radiating pipe, a fan is installed in the center of the interior of each radiating pipe, a motor is installed in the center of the outer side of each radiating pipe and connected with the corresponding internal fan, and an air channel is formed in each radiating pipe. And a heat dissipation channel can be provided for the fan through the air duct, and packaging cover plates are mounted at the top and the bottom of the multi-layer stacked control panel. The control panel is reasonable in design, the control panel is highly integrated, the size of the control panel is greatly reduced, the large-area vapor chamber is matched with the radiator to rapidly dissipate heat, the temperature of the control panel is increased, and energy efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of PCB control boards, and in particular to a multilayer PCB control board for analog signal processing. Background Technology

[0002] Multilayer PCB control boards, as the core carrier of modern electronic devices, are widely used in communication equipment, industrial control, and consumer electronics due to their advantages such as high-density wiring, optimized signal integrity, and improved space utilization. However, with the acceleration of trends such as increased chip computing power, more complex functional modules, and miniaturization of devices, the shortcomings of existing technologies in system integration and thermal management efficiency are becoming increasingly prominent, becoming a key bottleneck restricting the development of high-performance electronic devices. Utility Model Content

[0003] The purpose of this invention is to provide a multilayer PCB control board for analog signal processing to solve the problems mentioned in the background art.

[0004] To achieve the above objectives, this utility model provides the following technical solution:

[0005] A multilayer PCB control board for analog signal processing includes multilayer stacked control boards, a heat spreader, heat pipes, heat sinks, a fan, a motor, air ducts, and a cover plate. The multilayer stacked control boards are stacked to form a composite PVB control board, and a heat spreader is installed in the center of each multilayer stacked control board. The heat spreader extends outward and connects to the side heat pipes. Heat sinks are integrally formed at both ends of the outer side of the heat pipes. A fan is installed in the center of the heat pipe, and a motor is installed in the center of the outer side of the heat pipe and connected to the internal fan. An air duct is opened inside the heat pipe and provides a heat dissipation channel for the fan. A cover plate is installed on the top and bottom of the multilayer stacked control boards.

[0006] Preferably, the multi-layer stacked control board further includes a fixed frame and an embedded PCB control board. A heat spreader is installed in the center of the fixed frame. Embedded PCB control boards are installed in the fixed frame at both the top and bottom ends of the heat spreader. Each multi-layer stacked control board is formed into a double-sided control board that is in contact with the heat spreader through the embedded PCB control boards, resulting in a higher degree of integration.

[0007] The beneficial effects of this utility model are: the utility model has a reasonable design, a highly integrated control board, which greatly reduces the size of the control board, and a large-area heat dissipation plate combined with a heat sink to quickly dissipate heat, thereby increasing the temperature of the control board and improving energy efficiency. Attached Figure Description

[0008] Figure 1This is a schematic diagram of the structure of the multilayer PCB control board for analog signal processing according to this utility model;

[0009] Figure 2 This is a schematic diagram of the structure of the multilayer PCB control board for analog signal processing according to this utility model.

[0010] In the diagram: 1. Multi-layer stacked control board, 2. Heat spreader, 3. Heat pipe, 4. Heat sink fins, 5. Fan, 6. Motor, 7. Air duct, 8. Encapsulation cover, 9. Fixing frame, 10. Embedded PCB control board. Detailed Implementation

[0011] The present invention will be further described below with reference to the accompanying drawings and specific embodiments:

[0012] like Figures 1-2 As shown, a multilayer PCB control board for analog signal processing includes a multilayer stacked control board 1, a heat spreader 2, heat pipes 3, heat dissipation fins 4, a fan 5, a motor 6, an air duct 7, and a package cover 8. The multilayer stacked control boards 1 are stacked to form a composite PVB control board, and a heat spreader 2 is installed in the middle of each multilayer stacked control board 1. The heat spreader 2 extends outward and is connected to the side heat dissipation pipes 3. Heat dissipation fins 4 are integrally formed at both ends of the outer side of the heat dissipation pipes 3. A fan 5 is installed in the center of the heat dissipation pipes 3, and a motor 6 is installed in the center of the outer side of the heat dissipation pipes 3. The motor 6 is connected to the internal fan 5. An air duct 7 is opened inside the heat dissipation pipes 3, and the air duct 7 can provide a heat dissipation channel for the fan 5. A package cover 8 is installed on the top and bottom of the multilayer stacked control board 1. The multi-layer stacked control board 1 also includes a fixed frame 9 and an embedded PCB control board 10. A heat spreader 2 is installed in the center of the fixed frame 9. An embedded PCB control board 10 is installed in the fixed frame 9 and at both the top and bottom of the heat spreader 2. The embedded PCB control board 10 forms a double-sided control board that is attached to the heat spreader, thus achieving a higher degree of integration.

[0013] The working principle of this utility model is as follows: The heat dissipation plate 2 in the multi-layer stacked control board 1 of each layer is equipped with an embedded PCB control board 10 at both the top and bottom ends, which not only improves integration but also greatly improves heat dissipation efficiency. The heat dissipation is quickly dissipated through the heat dissipation pipe 3 on the side in conjunction with the fan 5 and the air duct 7.

[0014] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered exemplary in all respects, and thus equivalent variations within the scope of this invention are included within its scope.

Claims

1. A multilayer PCB control board for analog signal processing, comprising a multilayer stacked control board (1), a heat spreader (2), heat pipes (3), heat sinks (4), a fan (5), a motor (6), an air duct (7), and a package cover (8), characterized in that: The multi-layer stacked control boards (1) are stacked to form a composite PVB control board. Each multi-layer stacked control board (1) has a heat spreader (2) installed in the middle. The heat spreader (2) extends outward and is connected to the side heat dissipation pipe (3). The heat dissipation pipe (3) has heat dissipation fins (4) integrally formed at both ends. A fan (5) is installed in the center of the heat dissipation pipe (3). A motor (6) is installed in the center of the outer side of the heat dissipation pipe (3). The motor (6) is connected to the internal fan (5). An air duct (7) is opened inside the heat dissipation pipe (3). The air duct (7) can provide a heat dissipation channel for the fan (5). The top and bottom of the multi-layer stacked control board (1) are equipped with a sealing cover (8).

2. The multilayer PCB control board for analog signal processing according to claim 1, characterized in that: The multi-layer stacked control board (1) also includes a fixed frame (9) and an embedded PCB control board (10). A heat spreader (2) is installed in the center of the fixed frame (9). An embedded PCB control board (10) is installed in the fixed frame (9) and at both the top and bottom of the heat spreader (2). Each multi-layer stacked control board (1) is formed into a double-sided control board that is in contact with the heat spreader through the embedded PCB control board (10), resulting in a higher degree of integration.

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