Cooling fin structure
By setting clearance grooves on the heat sink structure and filling them with thermally conductive adhesive, the problem of the protective adhesive thickness affecting the thermal bridge breakage between the heat sink and the chip is solved, achieving a balance between good heat dissipation and component protection.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-13
- Publication Date
- 2026-04-10
AI Technical Summary
In existing technologies, excessively thick protective adhesive can cause the thermal bridge between the heat sink structure and the chip to break, affecting the heat dissipation effect and failing to provide effective protection for the components.
An obstacle groove is provided where the heat sink structure faces the component covered with protective adhesive. The groove is filled with thermally conductive adhesive to prevent the protective adhesive from pushing up the heat sink structure. At the same time, the groove also contains some protective adhesive to ensure thermal connection between the heat sink and the chip.
This technology achieves good thermal connection between the heat sink and the chip while increasing the thickness of the protective adhesive, preventing thermal bridge breakage, enhancing component protection, and improving product quality.
Smart Images
Figure CN224111616U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to a circuit board structure, especially a heat dissipation fin structure. BACKGROUND
[0002] The description in this section is provided only for the purpose of summarizing the background of the present disclosure and does not constitute prior art.
[0003] The substrate front of a ball grid array (BGA) product is generally provided with elements such as capacitors, wherein the elements need to be covered with protective glue, and a group of retaining walls is formed around the elements by means of the protective glue, and the interior is filled with a material with good fluidity, so as to achieve physical protection of the elements and also play a certain heat dissipation role, which is also called Dam&Fill.
[0004] Due to the existence of the Dam&Fill requirement, the protective glue on the top of the element further occupies the thickness space between the heat dissipation fin structure and the chip, and in some cases, the protective glue may lift the top heat dissipation fin structure due to excessive thickness, so that the heat dissipation fin structure is separated from the heat dissipation glue of the chip, and the heat dissipation of the chip is affected, that is, in fact, the protective glue of the element should have a certain gap with the heat dissipation fin structure to avoid heat dissipation failure.
[0005] It should be noted that the above introduction to the technical background is only to facilitate a clear and complete description of the technical scheme of the present utility model, and to facilitate the understanding of those skilled in the art. The above technical scheme cannot be considered as known to those skilled in the art just because it is described in the background section of the present utility model. CONTENT OF THE UTILITY MODEL
[0006] The utility model aims to provide a heat dissipation fin structure, which can set a avoiding groove on the heat dissipation fin structure towards the element covered with protective glue, to give way to the protective glue and avoid lifting the heat dissipation fin structure by the protective glue, so as to form a better heat dissipation effect.
[0007] In order to achieve the above purpose, the utility model discloses a heat dissipation fin structure for heat dissipation of a chip, wherein the chip is installed on the substrate, the substrate is also provided with an element on one side of the chip, and the element is covered with protective glue; the heat dissipation fin structure covers the chip and the element covered with the protective glue on the substrate, the inner wall of the heat dissipation fin structure is filled with heat conductive glue between the top surfaces of the chip, and the inner wall of the heat dissipation fin structure has a avoiding groove towards the element covered with the protective glue.
[0008] As a further description of the above technical solution, the groove of the heat dissipation fin structure is recessed in the vertical direction, and at least part of the protective glue extends into the groove in the vertical direction, so that the top of the protective glue is higher than the top surface of the chip.
[0009] As a further description of the above technical solution, the outer wall top surface of the heat dissipation fin structure is provided as a plane parallel to the substrate.
[0010] As a further description of the above technical solution, the inner wall of the heat dissipation fin structure is provided as a plane parallel to the substrate at the contact with the heat-conducting glue.
[0011] As a further description of the above technical solution, the inner wall of the heat dissipation fin structure is provided as a plane parallel to the substrate at the contact with the heat-conducting glue.
[0012] As a further description of the above technical solution, the substrate is provided with a plurality of elements covered with the protective glue outside one of the chips, and the heat dissipation fin structure covers one of the chips and a plurality of the elements covered with the protective glue on the substrate.
[0013] As a further description of the above technical solution, there is a gap between the top of the protective glue and the groove, and the size of the gap is 200 um.
[0014] As a further description of the above technical solution, the thickness of the heat-conducting glue is 70 um.
[0015] Through the above technical solution, the beneficial effects of the present application are as follows:
[0016] The heat dissipation fin structure of the present application can set a groove at the part of the heat dissipation fin structure facing the element covered with the protective glue. In the case that the element on one side of the chip is covered with relatively thick protective glue, the groove can still provide space for the protective glue, avoiding the protective glue from lifting the entire heat dissipation fin structure, thus avoiding the thermal bridge between the heat dissipation fin structure and the inner wall and the top wall of the chip from being broken, ensuring the heat dissipation of the chip. At the same time, due to the existence of the groove, the protective glue on the element can be made thicker based on the same thickness of the circuit board, achieving better protection effect of the element and better product quality.
[0017] For a further understanding of the features and technical contents of the present application, please refer to the following detailed description and drawings of the present application. However, the drawings provided are only for reference and illustration, and are not intended to limit the present application. BRIEF DESCRIPTION OF DRAWINGS
[0018] In order to make the technical solutions in the specification clearer, the following will briefly introduce the drawings needed in the embodiment or prior art description. Obviously, the drawings in the following description are only some embodiments in the specification, and other drawings can be obtained by those skilled in the art without creative labor.
[0019] Figure 1 is a schematic diagram of a fin structure with a groove provided by the embodiment of the specification;
[0020] Figure 2 is a schematic diagram of a fin structure without a groove provided by the embodiment of the specification;
[0021] In the figure: 1, fin structure; 11, groove; 12, heat-conducting glue; 2, substrate; 3, chip; 4, element; 5, protective glue. DETAILED DESCRIPTION
[0022] In order to make those skilled in the art better understand the technical solutions in the specification, the following will clearly and completely describe the technical solutions in the embodiment of the specification in combination with the drawings in the embodiment of the specification. Obviously, the described embodiments are only some embodiments in the specification, not all the embodiments. Based on the embodiments in the specification, all other embodiments obtained by those skilled in the art without creative labor should belong to the protection scope of the specification.
[0023] The following is to illustrate the embodiment of the utility model through specific specific embodiments, and those skilled in the art can understand the advantages and effects of the utility model from the disclosed content in the specification. The utility model can be implemented or applied through other different specific embodiments, and each detail in the specification can be modified and changed based on different viewpoints and applications without departing from the concept of the utility model. In addition, the drawings of the utility model are only simple schematic illustrations, not the depiction of actual size, and prior declaration. The following embodiment will further illustrate the related technical content of the utility model, but the disclosed content is not used to limit the protection scope of the utility model.
[0024] It should be understood that although the terms such as "first", "second", "third" and the like may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are mainly used to distinguish one component from another component, or one signal from another signal. In addition, the term "or" used herein may include any one or more combinations of the associated listed items.
[0025] Please refer to Figure 1The heat dissipation fin structure 1 is used for dissipating heat of the chip 3, wherein the chip 3 is mounted on the substrate 2, the element 4 is mounted on one side of the chip 3, and the protective glue 5 is covered on the element 4; the heat dissipation fin structure 1 covers the chip 3 and the element 4 covered with the protective glue 5 on the substrate 2, the inner wall of the heat dissipation fin structure 1 is filled with the heat-conducting glue 12 towards the top surface of the chip 3, and the inner wall of the heat dissipation fin structure 1 has the groove 11 towards the element 4 covered with the protective glue 5.
[0026] Through the above structure, the operator only needs to mount the element 4 with a preset size height on the substrate 2, and the element 4 is covered with the protective glue 5, the specific size of the groove 11 of the heat dissipation fin structure 1 is set according to the actual height of the protective glue 5, and the heat dissipation fin structure 1 is mounted on the substrate 2, so that the heat dissipation fin structure 1 covers the chip 3 and the element 4 covered with the protective glue 5. Specifically, part of the inner wall of the heat dissipation fin structure 1 is in contact with the chip 3 through the heat-conducting glue 12, so that a heat bridge is formed between the chip 3 and the heat dissipation fin structure 1, and heat dissipation of the chip 3 is realized, and the groove 11 of the heat dissipation fin structure 1 avoids the protective glue 5 covering the element 4, so that the protective glue 5 is not in direct contact with the heat dissipation fin structure 1, and thus the heat dissipation fin structure 1 is prevented from being directly lifted up by the protective glue 5 with excessive thickness.
[0027] Specifically, as shown in the comparative example, Figure 2 Since the bottom of the heat dissipation fin structure 1 does not have any structure for avoiding the protective glue 5, in the case that the protective glue 5 is too high, the heat dissipation fin structure 1 can be lifted up, and the middle position of the heat dissipation fin structure 1 is separated from the heat-conducting glue 12, so that the heat bridge of the heat dissipation fin structure 1, the heat-conducting glue 12 and the chip 3 is broken, and the heat dissipation is affected.
[0028] Of course, in the above embodiment, it should be noted that the recessed size of the groove 11 needs to match the height of the protective glue 5, as long as the heat dissipation fin structure 1 is not lifted up by the protective glue 5, that is, in most cases, the protective glue 5 does not contact the inner wall surface of the groove 11 of the heat dissipation fin structure 1, and in the case of extreme size, the protective glue 5 just contacts the inner wall surface of the groove 11.
[0029] Further, the groove 11 of the heat dissipation fin structure 1 is recessed in the vertical direction, and at least part of the protective glue 5 extends into the groove 11 in the vertical direction, so that the top height of the protective glue 5 is higher than the top surface of the chip 3. That is, in this embodiment, due to the existence of the groove 11 recessed in the vertical direction, the thickness of the protective glue 5 can be further increased and accommodated in the groove 11, while ensuring good thermal connection between the heat dissipation fin structure 1 and the chip 3, the thickness of the protective glue 5 can be made thicker, and the quality of the product is better.
[0030] Further, the outer wall top surface of the fin structure 1 is arranged as a plane parallel to the substrate 2. Meanwhile, the inner wall of the fin structure 1 at the groove 11 is arranged as a plane parallel to the substrate 2, so that the inner wall of the fin 1 forms a stepped structure. Specifically, the fin structure 1 is concave at the protective glue 5 at the horizontal position to form the groove 11, and is convex at the position adjacent to the heat-conducting glue 12 to form a stepped structure connected with the heat-conducting glue 12, and the space is reasonably utilized.
[0031] Further, the substrate 2 is provided with a plurality of elements 4 covered with the protective glue 5 at the outer side of the chip 3, and the fin structure 1 covers the chip 3 and the plurality of elements 4 covered with the protective glue 5 on the substrate 2. Specifically, in the embodiment, a pair of elements 4 are mirror-imaged at the left and right sides of the chip 3, have the same size, and are respectively covered with a certain thickness of the corresponding protective glue 5 to form a resistance-capacitance covering. Of course, in some other embodiments, elements 4 with different sizes and the thickness of the protective glue 5 can be arranged, as long as the fin structure 1 can cover all of them, and the two ends of the fin structure 1 fall on the substrate 2.
[0032] Further, the top of the protective glue and the groove have a certain gap, the size of the gap is 200um, and the thickness of the heat-conducting glue is 70um, that is, the redundant space at the groove 11 is relatively large, and the thickness of the fin structure 1 at the top of the chip 3 is ensured, and the stability is relatively good.
[0033] The above disclosed content is only the preferred feasible embodiment of the utility model, and does not limit the patent application range of the utility model, so that all equivalent technical changes made by applying the utility model specification and drawing contents are included in the patent application range of the utility model.
[0034] Each embodiment in the specification is described in a progressive manner, and the same or similar parts of each embodiment can be referred to each other, and each embodiment mainly describes the difference from other embodiments.
[0035] Although the present application is described through embodiments, those skilled in the art know that the present application has many modifications and changes without departing from the spirit of the present application, and it is hoped that the attached embodiments include these modifications and changes without departing from the present application.
Claims
1. A fin structure for heat dissipation of a chip, wherein, The chip is mounted on a substrate, the substrate is further mounted with an element on one side of the chip, and the element is covered with a protective glue; characterized in that the fin structure collectively covers the chip and the element covered with the protective glue on the substrate, the inner wall of the fin structure is filled with a heat-conducting glue between the top surfaces of the chip, and the inner wall of the fin structure has a recessed groove towards the element covered with the protective glue.
2. The fin structure of claim 1, wherein: The groove of the fin structure is recessed in the vertical direction, and at least part of the protective glue extends into the groove in the vertical direction, so that the top of the protective glue is higher than the top surface of the chip.
3. The fin structure of claim 1, wherein: The top surface of the outer wall of the fin structure is provided as a plane parallel to the substrate.
4. The fin structure of claim 1, wherein: The inner wall of the fin structure is provided as a plane parallel to the substrate at the contact with the heat-conducting glue.
5. The fin structure of claim 2, wherein: The inner wall of the fin structure is provided as a plane parallel to the substrate at the inner wall of the groove, so that the inner wall of the fin forms a stepped structure.
6. The fin structure of claim 1, wherein: The substrate is provided with a plurality of elements covered with the protective glue on the outer side of one chip, and the fin structure collectively covers one chip and a plurality of elements covered with the protective glue on the substrate.
7. The fin structure of claim 1, wherein: The top of the protective glue has a gap with the groove, and the size of the gap is 200 um.
8. The fin structure of claim 1, wherein: The thickness of the heat-conducting glue is 70 um.