Bimorph for wireless jacquard comb

Abstract

The utility model provides a bimorph for a wireless jacquard comb, which is characterized in that the bimorph comprises a substrate, ceramic chips and an electrode layer, gold-plated copper films are arranged at the end parts of the two surfaces of the substrate, the ceramic chips are adhered to the two surfaces of the substrate, the bottom surfaces of the ceramic chips are electrically connected with the gold-plated copper films, the electrode layer is arranged on the surfaces of the ceramic chips, and the electrode layer is arranged on the surface of the substrate. And the insulating paint is coated on the electrode layer, and the end part of the substrate, which is provided with the gold-plated copper film, is in a wedge-shaped design. The anti-corrosion capability is improved by arranging the gold-plated copper film, and meanwhile, the wedge-shaped design of the end part is convenient to insert and assemble.

Description

Technical Field

[0001] This utility model relates to a dual-chip solution for a wireless jacquard comb. Background Technology

[0002] Domestic and international warp knitting machine manufacturers are striving to develop warp knitting machines with double needle beds and eight guide bars. These machines are characterized by their ability to create more three-dimensional patterned fabrics. New patterned fabrics can only be designed and implemented after the development of new machine models, and market demand is constantly expanding. However, a challenge lies in arranging more guide bars within a limited space. Therefore, the development of smaller wireless Jacquard combs has been prioritized. The core component, the piezoelectric dual-chip, also needs unique performance and requirements to work with the wireless Jacquard combs. Due to limited installation space, this dual-chip uses a plug-in insertion method into the wireless Jacquard comb. Compared to currently used dual-chips, it requires better corrosion and dust resistance, as well as higher dimensional accuracy to achieve the desired assembly effect. Utility Model Content

[0003] The purpose of this invention is to address the aforementioned problems in existing technologies by proposing a dual-chip solution for wireless jacquard combs. This solution improves corrosion resistance by using a gold-plated copper film, and features a wedge-shaped end design for easy insertion and assembly.

[0004] The purpose of this utility model can be achieved through the following technical solution: a dual-chip for wireless jacquard comb, characterized in that it includes a substrate, a ceramic sheet, and an electrode layer. Both ends of the substrate are provided with gold-plated copper film. The ceramic sheet is bonded to both sides of the substrate and the bottom surface of the ceramic sheet is electrically connected to the gold-plated copper film. The electrode layer is disposed on the surface of the ceramic sheet, and the insulating varnish is coated on the electrode layer. The end of the substrate with the gold-plated copper film is designed in a wedge shape.

[0005] Furthermore, the edge of the gold-plated copper film has a certain distance from the end of the substrate.

[0006] Furthermore, the substrate is rectangular.

[0007] Furthermore, the edge of the electrode layer is spaced a certain distance from the edge of the ceramic sheet.

[0008] Furthermore, the insulating varnish is applied to the electrode layer and the ceramic sheet, with a portion of the electrode layer exposed.

[0009] Furthermore, the gold-plated copper film also contains a nickel-plated layer.

[0010] Furthermore, the wedge shape at the end of the substrate is designed to be trapezoidal or arc-shaped.

[0011] Furthermore, the end of the substrate has an electroplating tank for depositing a nickel plating layer and a gold-plated copper film, and the electroplating tank is flush with the surface of the substrate after covering the nickel plating layer and the gold-plated copper film.

[0012] Compared with the prior art, the advantages of this application are: it improves corrosion resistance by setting a gold-plated copper film, and the wedge-shaped design at the end facilitates insertion and assembly. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of a dual-chip chip;

[0014] Figure 2 This is a side view of the dual-chip wafer;

[0015] Figure 3 This is a schematic diagram of the trapezoidal shape at the end of the substrate;

[0016] Figure 4 This is a schematic diagram of an electroplating tank;

[0017] Figure 5 This is a schematic diagram of the nickel plating layer and the gold-plated copper film;

[0018] Figure 6 This is a schematic diagram of the arc shape at the end of the substrate;

[0019] In the figure, 1 is the substrate; 101 is the electroplating tank; 2 is the gold-plated copper film; 21 is the nickel plating layer; 3 is the ceramic sheet; 4 is the electrode layer; and 5 is the insulating varnish. Detailed Implementation

[0020] The following are specific embodiments of the present invention, and the technical solution of the present invention will be further described in conjunction with the accompanying drawings.

[0021] like Figure 1-6 As shown, a dual-chip microcomputer for a wireless jacquard comb is characterized by comprising a substrate 1, a ceramic sheet 3, and an electrode layer 4. Both ends of the substrate 1 are provided with gold-plated copper films 2. The ceramic sheet 3 is bonded to both sides of the substrate 1 and the bottom surface of the ceramic sheet 3 is electrically connected to the gold-plated copper films 2. The electrode layer 4 is disposed on the surface of the ceramic sheet 3, and the insulating varnish 5 is coated on the electrode layer 4. The ends of the substrate 1 with the gold-plated copper films 2 are designed in a wedge shape.

[0022] Furthermore, the edge of the gold-plated copper film 2 is spaced a certain distance from the end of the substrate 1.

[0023] Furthermore, the substrate 1 is rectangular.

[0024] Furthermore, the wedge shape at the end of the substrate 1 is designed to be trapezoidal or arc-shaped.

[0025] This spacing is a wedge-shaped design section, which can be trapezoidal or arc-shaped, to facilitate the insertion of the two crystals into the Jacquard comb.

[0026] Furthermore, the edge of the electrode layer 4 is spaced apart from the edge of the ceramic sheet 3.

[0027] Furthermore, the insulating varnish 5 is coated on the electrode layer 4 and the ceramic sheet 3, with a portion of the electrode layer 4 exposed. The edges of the electrode layer 4 and the ceramic sheet 3 are spaced apart, allowing the insulating varnish 5 to be coated on both, thus increasing insulation properties.

[0028] Furthermore, the gold-plated copper film 2 also includes a nickel-plated layer 21. The nickel-plated layer 21 can increase the adhesion of the gold-plated copper film and further enhance its corrosion resistance.

[0029] Furthermore, the end of the substrate 1 has an electroplating tank 101 for plating the nickel layer 21 and the gold-plated copper film 2, and the electroplating tank 101 is flush with the surface of the substrate 1 after covering the nickel layer 21 and the gold-plated copper film 2. By setting the electroplating tank 101 for plating the nickel layer 21 and the gold-plated copper film 2, the electroplated nickel layer 21 and the gold-plated copper film 2 will not be higher than the surface of the substrate 1, which greatly reduces wear during insertion and removal.

[0030] The dual-chip design of this application adopts a wedge-shaped design at the front end of the substrate 1, which makes it easy to insert the dual-chip into the Jacquard comb. At the same time, a gold-plated copper film 2 is provided at the insertion end to improve its corrosion resistance. This pluggable dual-chip structure design is ingenious and the wedge-shaped front end design meets the requirements of pluggable assembly, while also having corrosion resistance.

[0031] The above-described technical solution of this utility model addresses the problem that existing technical solutions are too simplistic and provides a solution that is significantly different from existing technologies. The parts not covered in this application's technical solution are the same as or can be implemented using existing technologies, and will not be described in detail here.

[0032] The technical solutions in the above embodiments have clearly and completely described the content of this utility model. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

Claims

1. A dual-chip wireless jacquard comb, characterized in that, It includes a substrate, a ceramic sheet, and an electrode layer. Both ends of the substrate are provided with gold-plated copper film. The ceramic sheet is bonded to both sides of the substrate and the bottom surface of the ceramic sheet is electrically connected to the gold-plated copper film. The electrode layer is disposed on the surface of the ceramic sheet and is coated with insulating varnish. The end of the substrate with the gold-plated copper film is designed in a wedge shape.

2. The dual-chip wireless jacquard comb according to claim 1, characterized in that: The edge of the gold-plated copper film is spaced a certain distance from the end of the substrate.

3. The dual-chip wireless jacquard comb according to claim 1, characterized in that: The substrate is rectangular.

4. The dual-chip solution for a wireless jacquard comb according to claim 1, characterized in that: The edge of the electrode layer is spaced a certain distance from the edge of the ceramic sheet.

5. A dual-chip wireless jacquard comb according to claim 1, characterized in that, The insulating varnish is applied to the electrode layer and the ceramic sheet, with a portion of the electrode layer exposed.

6. The dual-chip solution for a wireless jacquard comb according to claim 1, characterized in that, The gold-plated copper film also contains a nickel-plated layer.

7. The dual-chip wireless jacquard comb according to claim 1, characterized in that, The wedge-shaped design at the end of the substrate is either trapezoidal or arc-shaped.

8. A dual-chip wireless jacquard comb according to claim 6, characterized in that, The substrate has an electroplating tank at its end for mounting a nickel plating layer and a gold-plated copper film, and the electroplating tank is flush with the substrate surface after covering the nickel plating layer and the gold-plated copper film.

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