PVC (polyvinyl chloride) floor with miniature heat dissipation structure

Abstract

A PVC (polyvinyl chloride) floor with a miniature heat dissipation structure relates to the technical field of floors and comprises a bottom plate, a plurality of main grooves are uniformly formed in the upper surface of the bottom plate, branch grooves are formed between adjacent main grooves, and the adjacent main grooves are communicated through the branch grooves; the supporting part is located above the bottom plate and comprises auxiliary supporting layers and a supporting layer, and the auxiliary supporting layers are connected to the upper surface and the lower surface of the supporting layer correspondingly; the heat conduction part is located above the supporting part and comprises a buffer layer and a heat conduction layer, the heat conduction layer is located above the supporting part, and the buffer layer is located between the supporting part and the heat conduction layer; the wear-resistant layer is positioned above the heat conduction part; the main groove serves as a core airflow channel, the branch grooves form dense net-shaped branches, the heat dissipation area is further enlarged, cold air enters the main groove through the branch grooves and then is heated to rise, natural convection is formed, static heat conduction is converted into dynamic heat dissipation, and the heat dissipation efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of flooring technology, specifically to a PVC floor with a micro heat dissipation structure. Background Technology

[0002] PVC flooring refers to flooring made from polyvinyl chloride. Specifically, it is produced by using polyvinyl chloride and its copolymer resin as the main raw materials, adding fillers, plasticizers, stabilizers, colorants and other auxiliary materials, and processing them on a continuous sheet substrate through coating, calendering, extrusion or compression processes.

[0003] PVC flooring is a popular product in Europe, America, and Asia, particularly in Japan and South Korea. It has been a hit overseas. Since the early 1980s, PVC flooring has entered the Chinese market and is now widely recognized and used in major and medium-sized cities across China. It is used in various places such as homes, hospitals, schools, office buildings, factories, public places, supermarkets, commercial spaces, and sports venues.

[0004] Due to its lightweight, wear-resistant, and waterproof properties, PVC flooring has gradually become one of the mainstream materials for interior floor decoration. However, in scenarios where it needs to be used in conjunction with underfloor heating systems, its insufficient heat dissipation performance has become increasingly prominent. In underfloor heating systems, heat needs to be transferred to the indoor space through the floor, but the low thermal conductivity of PVC causes heat to accumulate in the lower layer of the floor, which not only prolongs the heating time but also forces the underfloor heating system to operate at high load for a long time, significantly increasing energy costs. Summary of the Invention

[0005] To address the issues of insufficient heat dissipation performance in existing PVC flooring used with underfloor heating systems, resulting in long heating times and poor heating effects, this invention proposes a PVC flooring with a micro-heat dissipation structure to solve these problems.

[0006] A PVC floor with a miniature heat dissipation structure includes a base plate with an adhesive layer on the bottom surface. The base plate can be directly pasted after peeling off the protective film or by using glue. The upper surface of the base plate has multiple main grooves evenly distributed, and branch grooves are formed between adjacent main grooves. Adjacent main grooves are connected by branch grooves.

[0007] Furthermore, the main channel serves as the primary airflow channel, while the branch channels form a mesh-like network, increasing the heat dissipation area. The uniform distribution of the channels ensures that heat is evenly diffused across the base plate surface.

[0008] Furthermore, cold air enters the main tank through the branch troughs, rises naturally after being heated, forming a convection circulation and generating a chimney effect, which transforms static heat conduction into dynamic convection heat dissipation, significantly improving heat dissipation efficiency.

[0009] Furthermore, it also includes a support portion located above the base plate. The support portion includes an auxiliary support layer and a support layer, with the upper and lower surfaces of the support layer respectively connected to the auxiliary support layer.

[0010] Furthermore, it also includes a heat-conducting part, which is located above the support part. The heat-conducting part includes a buffer layer and a heat-conducting layer. The heat-conducting layer is located above the support part, and the buffer layer is located between the support part and the heat-conducting layer.

[0011] Furthermore, it also includes a wear-resistant layer, which is located above the heat-conducting part.

[0012] Furthermore, an inclined support groove is formed on one side surface of the auxiliary support layer. The central axis of the inclined support groove forms an angle of 30° to 45° with the horizontal plane. The inclined support groove is evenly distributed along the surface of the auxiliary support layer. When the auxiliary support layer is connected to the support layer, the side surface of the auxiliary support layer with the inclined support groove faces the support layer.

[0013] Furthermore, the inclined support groove forms an angle of 30° to 45° to effectively disperse the vertical load, dispersing the vertical load into multi-directional components, improving compressive strength, and preventing local collapse.

[0014] Furthermore, the airflow within the inclined support slots can assist in lateral heat dissipation, working in conjunction with the main slots to improve heat transfer efficiency.

[0015] Furthermore, the inclined support grooves provide mechanical support while the airflow within the grooves assists in lateral heat dissipation.

[0016] Furthermore, a heat-conducting groove is formed on the other side surface of the auxiliary support layer, and the heat-conducting groove extends through the auxiliary support layer.

[0017] Furthermore, the heat-conducting grooves penetrate the auxiliary support layer and combine with the vertical path of the fiber column to form a "horizontal + vertical" composite heat-conducting network, thereby improving the overall thermal conductivity.

[0018] Furthermore, the surface of the support layer is uniformly provided with a plurality of hexagonal honeycomb units, the hexagonal honeycomb units penetrate the support layer, the hexagonal honeycomb units include honeycomb walls, and the honeycomb walls form an air cavity around the central axis of the hexagonal honeycomb units.

[0019] Furthermore, the honeycomb structure provides a high strength-to-weight ratio, reducing the overall weight of the floor without affecting its load-bearing capacity.

[0020] Furthermore, the air cavity away from the heat source acts as an insulation layer to prevent heat from dissipating laterally.

[0021] Furthermore, the glass fiber mesh filling the air cavities of the honeycomb structure increases shear strength, and the mesh gaps allow for micro-air circulation, preventing uneven heating of the floor caused by localized high temperatures.

[0022] Furthermore, a portion of the air cavity is filled with a glass fiber mesh, and transverse glass fiber strips are installed on the surface of the support layer; the glass fiber mesh disperses stress and guides air microflow, eliminates local thermal resistance, and improves surface temperature uniformity.

[0023] Furthermore, the buffer layer has uniformly formed through holes on its surface, with fiber pillars nested inside the through holes, and positioning grooves are uniformly distributed on the upper surface of the buffer layer, with PCM microcapsules filling the positioning grooves.

[0024] Furthermore, PCM microcapsules are incorporated to absorb the instantaneous high temperatures generated by underfloor heating, direct sunlight, or equipment, thus slowing down the surface temperature rise.

[0025] Furthermore, phase change materials, such as paraffin, can absorb and release heat within a certain temperature range, thus mitigating temperature fluctuations caused by intermittent operation of underfloor heating and improving comfort.

[0026] Furthermore, the fiber column is a copper-plated nylon fiber column, which penetrates the heat-conducting groove on the surface of the auxiliary support layer and the air cavity in the support layer until it contacts the bottom surface of the main groove. The vertical paths of the heat-conducting groove and the fiber column form a transverse heat-conducting channel.

[0027] Furthermore, the copper-plated nylon fiber columns directly conduct heat from the base plate to the heat-conducting layer, reducing heat loss along the path and achieving efficient heat transfer.

[0028] Furthermore, the copper-plated nylon fiber columns penetrate the multi-layer structure, inhibiting interlayer delamination and extending the service life of the flooring.

[0029] Furthermore, the upper surface of the thermally conductive layer is fixedly connected to the lower surface of the wear-resistant layer, and the lower surface of the thermally conductive layer is fixedly connected to the upper surface of the buffer layer. The thermally conductive layer is an aluminum mold.

[0030] Furthermore, the high thermal conductivity of aluminum is utilized to quickly diffuse heat to the floor surface, reducing surface temperature differences.

[0031] Furthermore, a directional heat-conducting sheet is installed on the lower surface of the heat-conducting layer and in contact with the fiber column. The directional heat-conducting sheet is a circular graphene sheet.

[0032] Furthermore, the surface of the wear-resistant layer has a frosted texture, and alumina micro powder is added to the matrix of the wear-resistant layer to further improve the thermal conductivity.

[0033] Furthermore, the uneven surface of the wear-resistant layer helps to disrupt the laminar flow of air, and the rough surface texture can accelerate the spread and evaporation of water stains, indirectly reducing the temperature.

[0034] Compared with the prior art, the present invention has the following beneficial effects:

[0035] 1. Microstructure-based synergistic heat dissipation: The main channel serves as the core airflow channel, while the branch channels form a dense network, further expanding the heat dissipation area. Cool air enters the main channel through the branch channels, is heated, and rises, forming natural convection. This transforms static heat conduction into dynamic heat dissipation, improving heat dissipation efficiency. The hexagonal honeycomb units, through biomimetic design, reduce material usage while maintaining compressive strength. The honeycomb air cavity forms a heat insulation layer, reducing downward heat loss and ensuring concentrated upward heat transfer. The oblique support channels assist in lateral heat dissipation through airflow, forming a three-dimensional heat dissipation network with the main channel, further improving heat dissipation efficiency.

[0036] 2. Multiple heat conduction paths: Copper-plated nylon fiber pillars penetrate the base plate, support layer and heat conduction layer to directly transfer heat. Oriented graphene sheets are installed at the contact point between the fiber pillars and the aluminum mold heat conduction layer to avoid heat accumulation. The aluminum mold heat conduction layer utilizes the high thermal conductivity of aluminum to quickly diffuse heat and further reduce the surface temperature difference. The heat conduction grooves of the auxiliary support layer provide lateral heat conduction paths, forming a composite heat conduction network with the vertical fiber pillars to improve thermal conductivity.

[0037] 3. Intelligent temperature control and structural stability optimization: The wax-based phase change material absorbs and releases heat in the range of 25-30℃, which can suppress temperature fluctuations caused by the intermittent operation of the underfloor heating, reduce energy consumption from frequent start-stop cycles, and save energy; the honeycomb structure combined with the glass fiber mesh further improves the shear strength and extends the service life of the floor; the fiber columns run through the multi-layer structure, inhibiting interlayer delamination and further reducing the deformation rate of the floor after long-term use. Attached Figure Description

[0038] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0039] Figure 1 A three-dimensional structural diagram of a PVC floor with a miniature heat dissipation structure;

[0040] Figure 2 for Figure 1 Enlarged view of section A in the middle;

[0041] Figure 3 An exploded view of a PVC floor with a miniature heat dissipation structure.

[0042] Figure 4 for Figure 3 Enlarged view of section B;

[0043] Figure 5 This is a three-dimensional structural diagram of the base plate;

[0044] Figure 6 This is a three-dimensional structural diagram of the support layer;

[0045] Figure 7 for Figure 6 Enlarged view of section C;

[0046] Figure 8 This is a 3D structural diagram of the buffer layer;

[0047] Figure 9 This is a horizontal cross-sectional view of the buffer layer;

[0048] Figure 10 This is a horizontal cross-sectional view of the buffer layer.

[0049] In the picture:

[0050] 1. Base plate; 101. Main channel; 102. Branch channel;

[0051] 2. Auxiliary support layer; 201. Angled support groove;

[0052] 3. Support layer; 301. Honeycomb wall; 302. Air cavity; 303. Transverse fiberglass strip;

[0053] 4. Buffer layer; 401. Fiber column; 402. PCM microcapsule;

[0054] 5. Thermal conductive layer;

[0055] 6. Wear-resistant layer. Detailed Implementation

[0056] To make the objectives, technical solutions, and advantages of this utility model clearer, the following detailed description is provided in conjunction with embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this utility model.

[0057] The application principle of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.

[0058] Example 1

[0059] like Figure 1 , Figure 5 As shown, a PVC floor with a micro heat dissipation structure includes a base plate 1. The upper surface of the base plate 1 is evenly provided with a plurality of main grooves 101, and a branch groove 102 is provided between adjacent main grooves 101. Adjacent main grooves 101 are connected through the branch grooves 102.

[0060] The main slot (101) serves as the main airflow channel, while the branch slots (102) form a mesh-like network to increase the heat dissipation area. The uniform distribution of the slots ensures that heat is evenly diffused on the surface of the base plate (1).

[0061] Cold air enters the main tank through the branch troughs, rises naturally after being heated, forming a convection circulation and generating a chimney effect, which transforms static heat conduction into dynamic convection heat dissipation, significantly improving heat dissipation efficiency.

[0062] It also includes a support part, which is located above the base plate 1. The support part includes an auxiliary support layer 2 and a support layer 3, with the upper and lower surfaces of the support layer 3 respectively connected to the auxiliary support layer 2.

[0063] It also includes a heat-conducting part, which is located above the support part. The heat-conducting part includes a buffer layer 4 and a heat-conducting layer 5. The heat-conducting layer 5 is located above the support part, and the buffer layer 4 is located between the support part and the heat-conducting layer 5.

[0064] It also includes a wear-resistant layer 6, which is located above the heat-conducting part.

[0065] Example 2

[0066] like Figure 1-7 As shown, based on Embodiment 1, a PVC floor with a micro heat dissipation structure is provided. One side surface of the auxiliary support layer 2 is provided with an inclined support groove 201. The central axis of the inclined support groove 201 forms an angle of 30° to 45° with the horizontal plane. The inclined support groove 201 is evenly distributed along the surface of the auxiliary support layer 2. When the auxiliary support layer 2 is connected to the support layer 3, the side surface of the auxiliary support layer 2 with the inclined support groove 201 faces the support layer 3.

[0067] The inclined support groove 201 forms an angle of 30° to 45° to effectively disperse the vertical load, dispersing the vertical load into multi-directional components, improving compressive strength, and preventing local collapse.

[0068] The airflow within the inclined support groove 201 can assist in lateral heat dissipation, working in conjunction with the main groove 101 to improve heat transfer efficiency.

[0069] The inclined support groove 201 provides mechanical support while the airflow inside the groove assists in lateral heat dissipation.

[0070] A heat-conducting groove is provided on the other side surface of the auxiliary support layer 2, and the heat-conducting groove extends through the auxiliary support layer 2.

[0071] The heat-conducting grooves penetrate the auxiliary support layer 2 and combine with the vertical path of the fiber column 401 to form a "horizontal + vertical" composite heat-conducting network, thereby improving the overall thermal conductivity.

[0072] The surface of the support layer 3 is uniformly provided with a plurality of hexagonal honeycomb units, which penetrate the support layer 3. Each hexagonal honeycomb unit includes a honeycomb wall 301, and the honeycomb wall 301 forms an air cavity 302 around the central axis of the hexagonal honeycomb unit.

[0073] The honeycomb structure provides a high strength-to-weight ratio, reducing the overall weight of the floor without affecting its load-bearing capacity.

[0074] The air cavity 302, which is far from the heat source, acts as a heat insulation layer to prevent heat from dissipating laterally.

[0075] The glass fiber mesh of 302, which fills the air cavity of the honeycomb, increases the shear strength, and the mesh gaps allow for micro-air circulation, avoiding uneven heating of the floor caused by localized high temperatures.

[0076] The air cavity 302 is partially filled with a glass fiber mesh, and transverse glass fiber strips are installed on the surface of the support layer 3; the glass fiber mesh disperses stress and guides air microflow, eliminates local thermal resistance, and improves surface temperature uniformity.

[0077] Example 3

[0078] like Figure 1-10 As shown, a PVC floor with a micro heat dissipation structure includes a base plate 1. The upper surface of the base plate 1 is evenly provided with a plurality of main grooves 101, and a branch groove 102 is provided between adjacent main grooves 101. Adjacent main grooves 101 are connected through the branch grooves 102.

[0079] The main slot (101) serves as the main airflow channel, while the branch slots (102) form a mesh-like network to increase the heat dissipation area. The uniform distribution of the slots ensures that heat is evenly diffused on the surface of the base plate (1).

[0080] Cold air enters the main tank through the branch troughs, rises naturally after being heated, forming a convection circulation and generating a chimney effect, which transforms static heat conduction into dynamic convection heat dissipation, significantly improving heat dissipation efficiency.

[0081] It also includes a support part, which is located above the base plate 1. The support part includes an auxiliary support layer 2 and a support layer 3, with the upper and lower surfaces of the support layer 3 respectively connected to the auxiliary support layer 2.

[0082] It also includes a heat-conducting part, which is located above the support part. The heat-conducting part includes a buffer layer 4 and a heat-conducting layer 5. The heat-conducting layer 5 is located above the support part, and the buffer layer 4 is located between the support part and the heat-conducting layer 5.

[0083] It also includes a wear-resistant layer 6, which is located above the heat-conducting part.

[0084] An inclined support groove 201 is provided on one side surface of the auxiliary support layer 2. The central axis of the inclined support groove 201 forms an angle of 30° to 45° with the horizontal plane. The inclined support groove 201 is evenly distributed along the surface of the auxiliary support layer 2. When the auxiliary support layer 2 is connected to the support layer 3, the side surface of the auxiliary support layer 2 with the inclined support groove 201 faces the support layer 3.

[0085] The inclined support groove 201 forms an angle of 30° to 45° to effectively disperse the vertical load, dispersing the vertical load into multi-directional components, improving compressive strength, and preventing local collapse.

[0086] The airflow within the inclined support groove 201 can assist in lateral heat dissipation, working in conjunction with the main groove 101 to improve heat transfer efficiency.

[0087] The inclined support groove 201 provides mechanical support while the airflow inside the groove assists in lateral heat dissipation.

[0088] A heat-conducting groove is provided on the other side surface of the auxiliary support layer 2, and the heat-conducting groove extends through the auxiliary support layer 2.

[0089] The heat-conducting grooves penetrate the auxiliary support layer 2 and combine with the vertical path of the fiber column 401 to form a "horizontal + vertical" composite heat-conducting network, thereby improving the overall thermal conductivity.

[0090] The surface of the support layer 3 is uniformly provided with a plurality of hexagonal honeycomb units, which penetrate the support layer 3. Each hexagonal honeycomb unit includes a honeycomb wall 301, and the honeycomb wall 301 forms an air cavity 302 around the central axis of the hexagonal honeycomb unit.

[0091] The honeycomb structure provides a high strength-to-weight ratio, reducing the overall weight of the floor without affecting its load-bearing capacity.

[0092] The air cavity 302, which is far from the heat source, acts as a heat insulation layer to prevent heat from dissipating laterally.

[0093] The glass fiber mesh of 302, which fills the air cavity of the honeycomb, increases the shear strength, and the mesh gaps allow for micro-air circulation, avoiding uneven heating of the floor caused by localized high temperatures.

[0094] The air cavity 302 is partially filled with a glass fiber mesh, and transverse glass fiber strips are installed on the surface of the support layer 3; the glass fiber mesh disperses stress and guides air microflow, eliminates local thermal resistance, and improves surface temperature uniformity.

[0095] The heat generated by the underfloor heating system is first transferred to the baseboard 1 at the bottom of the floor.

[0096] The main groove 101 and the branch groove 102 on the surface of the base plate form a dense airflow channel. Cold air enters from the branch groove, is heated and rises through the main groove, forming a chimney effect, which accelerates the transfer of heat from the base plate 1 to the upper layer.

[0097] Heat enters the support layer 3 through the base plate 1. The honeycomb walls 301 of the hexagonal honeycomb units 302 provide mechanical support. The air cavity 302 inside the honeycomb unit serves as a heat insulation layer to reduce heat loss downwards. The glass fiber mesh 303 fills part of the honeycomb cavity, enhancing the compressive strength and guiding air micro-circulation through the gaps to avoid local thermal resistance.

[0098] Copper-plated nylon fiber column 401 penetrates the base plate, support layer to heat-conducting layer 5, and uses the high thermal conductivity of copper plating to establish a vertical heat conduction path to directly transfer heat to heat-conducting layer 5.

[0099] The inclined support groove 201 and the heat conduction groove of the auxiliary support layer 2 provide a transverse heat conduction channel, forming a "vertical + transverse" composite heat conduction network.

[0100] The heat-conducting layer 5 is preferably made of aluminum, with a thermal conductivity of 237W / m·K, which balances cost and thermal conductivity, and quickly and evenly diffuses heat to the floor surface.

[0101] Oriented graphene sheets are installed at the contact point between the fiber column 401 and the aluminum mold, increasing the local heat flux density by 3 times and preventing heat accumulation.

[0102] The buffer layer 4 has uniformly formed through holes on its surface, and fiber pillars 401 are nested inside the through holes. The upper surface of the buffer layer 4 has uniformly distributed positioning grooves, and the positioning grooves are filled with PCM microcapsules 402.

[0103] The PCM microcapsules 402 are incorporated to absorb the instantaneous high temperatures generated by underfloor heating, direct sunlight, or equipment, thus slowing down the surface temperature rise.

[0104] Phase change materials, such as paraffin wax, absorb and release heat in the range of 25-30°C, which can smooth out temperature fluctuations caused by intermittent operation of underfloor heating and improve comfort.

[0105] The fiber column 401 is a copper-plated nylon fiber column, which penetrates the auxiliary support layer 2 and the support layer 3 until it contacts the bottom surface of the main groove 101.

[0106] The copper-plated nylon fiber columns directly conduct heat from the base plate to the heat-conducting layer 5, reducing heat loss along the path and achieving efficient heat transfer.

[0107] Copper-plated nylon fiber columns run through the multi-layer structure, inhibiting interlayer delamination and extending the lifespan of the flooring.

[0108] The upper surface of the heat-conducting layer 5 is fixedly connected to the lower surface of the wear-resistant layer 6, and the lower surface of the heat-conducting layer 5 is fixedly connected to the upper surface of the buffer layer 4. The heat-conducting layer 5 is an aluminum mold.

[0109] The high thermal conductivity of aluminum allows heat to be quickly diffused to the floor surface, reducing surface temperature differences.

[0110] A directional heat-conducting sheet is installed on the lower surface of the heat-conducting layer 5 and in contact with the fiber column 401. The directional heat-conducting sheet is a circular graphene sheet.

[0111] The surface of the wear-resistant layer 6 has a frosted texture, and alumina micro powder is added to the matrix of the wear-resistant layer 6 to further improve the thermal conductivity.

[0112] The uneven surface of the wear-resistant layer 6 helps to disrupt the laminar flow of air, and the rough surface texture can accelerate the spread and evaporation of water stains, indirectly reducing the temperature.

[0113] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention.

[0114] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A PVC floor with a miniature heat dissipation structure, characterized in that: Includes a base plate (1), on the upper surface of which a plurality of main grooves (101) are evenly provided, and branch grooves (102) are provided between adjacent main grooves (101), and adjacent main grooves (101) are connected through the branch grooves (102); The support part is located above the base plate (1). The support part includes an auxiliary support layer (2) and a support layer (3). The upper and lower surfaces of the support layer (3) are respectively connected to the auxiliary support layer (2). A heat-conducting part is located above the support part. The heat-conducting part includes a buffer layer (4) and a heat-conducting layer (5). The heat-conducting layer (5) is located above the support part, and the buffer layer (4) is located between the support part and the heat-conducting layer (5). Wear-resistant layer (6) is located above the heat-conducting part.

2. The PVC floor with a micro heat dissipation structure according to claim 1, characterized in that: An inclined support groove (201) is provided on one side surface of the auxiliary support layer (2). The central axis of the inclined support groove (201) forms an angle of 30° to 45° with the horizontal plane. The inclined support groove (201) is evenly distributed along the surface of the auxiliary support layer (2). When the auxiliary support layer (2) is connected to the support layer (3), the side surface of the auxiliary support layer (2) with the inclined support groove (201) faces the support layer (3).

3. The PVC floor with a micro heat dissipation structure according to claim 2, characterized in that: A heat-conducting groove is provided on the other side surface of the auxiliary support layer (2), and the heat-conducting groove penetrates the auxiliary support layer (2).

4. The PVC floor with a micro heat dissipation structure according to claim 2, characterized in that: The support layer (3) has a plurality of hexagonal honeycomb units uniformly distributed on its surface. The hexagonal honeycomb units penetrate the support layer (3). Each hexagonal honeycomb unit includes a honeycomb wall (301), and the honeycomb wall (301) forms an air cavity (302) around the central axis of the hexagonal honeycomb unit.

5. The PVC floor with a micro heat dissipation structure according to claim 4, characterized in that: Part of the air cavity (302) is filled with a glass fiber mesh, and transverse glass fiber strips are mounted on the surface of the support layer (3).

6. The PVC floor with a micro heat dissipation structure according to claim 1, characterized in that: The buffer layer (4) has through holes uniformly formed on its surface, and fiber pillars (401) are nested inside the through holes. Positioning grooves are uniformly distributed on the upper surface of the buffer layer (4), and PCM microcapsules (402) are filled inside the positioning grooves.

7. The PVC floor with a micro heat dissipation structure according to claim 6, characterized in that: The fiber column (401) is a copper-plated nylon fiber column, and the fiber column (401) penetrates the auxiliary support layer (2) and the support layer (3) until it contacts the bottom surface of the main groove (101).

8. The PVC floor with a micro heat dissipation structure according to claim 6, characterized in that: The upper surface of the heat-conducting layer (5) is fixedly connected to the lower surface of the wear-resistant layer (6), and the lower surface of the heat-conducting layer (5) is fixedly connected to the upper surface of the buffer layer (4). The heat-conducting layer (5) is an aluminum mold.

9. The PVC floor with a micro heat dissipation structure according to claim 8, characterized in that: The thermally conductive layer (5) is a portion of the lower surface of the aluminum mold that is in contact with the fiber column (401) on which a directional thermally conductive sheet is installed. The directional thermally conductive sheet is a circular graphene sheet.

10. A PVC floor with a micro heat dissipation structure according to claim 8, characterized in that: The wear-resistant layer (6) has a frosted texture on its surface.

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