DC switching power supply convenient for heat dissipation

Abstract

The utility model discloses a DC switching power supply convenient for heat dissipation, and relates to the technical field of switching power supplies. The power source comprises a power source body, the top end of the power source body is connected with a carrying belt, the bottom end of the power source body is connected with a base through a connecting plate, heat dissipation channels and air channels are arranged in the power source body, the heat dissipation channels are located at the left and right ends of a mainboard, and the air channels are located at the upper and lower ends of the mainboard. A plurality of heat dissipation fins are connected in the heat dissipation channel, heat pipes are connected in the heat dissipation fins in an embedded mode, and the other ends of the heat pipes are connected with the mainboard; and a main fan is connected in the base. The heat dissipation channels and the air channels are arranged, the heat dissipation channels are located at the left end and the right end of the mainboard, the air channels are located at the upper end and the lower end of the mainboard and connected with each other, an all-dimensional three-dimensional heat dissipation airflow circulation path is constructed, cold air enters from the base, flows through the mainboard and then is discharged through the heat dissipation channels, the mainboard can be completely covered, and local accumulation of heat is effectively avoided; and the heat dissipation efficiency is greatly improved.

Description

Technical Field

[0001] This utility model belongs to the field of switching power supply technology, specifically, it relates to a DC switching power supply with easy heat dissipation. Background Technology

[0002] DC switching power supplies are commonly used power conversion devices that achieve voltage conversion through the high-frequency switching of switching transistors.

[0003] Chinese patent CN216122177U discloses a portable digital display switching power supply. Through the arrangement of rotating rods and cleaning frames, the two rotating rods move the two cleaning frames during the rotation of the motor shaft. Simultaneously, two return springs facilitate the reset of the two cleaning frames, allowing them to move back and forth. This movement enables the cleaning frames to drive multiple brush bristles to clean the upper surface of the filter plate, effectively preventing filter pores from clogging due to electrostatic dust accumulation. However, during high-load operation, the switching power supply generates a large amount of heat. Although the device is equipped with multiple heat dissipation holes and fan blades for auxiliary cooling, these measures may not be able to dissipate the large amount of heat in time. Especially when the ambient temperature is high, the temperature difference between the inside and outside of the heat dissipation holes decreases, reducing heat transfer efficiency. Simultaneously, the high temperature of the air blown out by the fan blades further affects the cooling effect, causing the temperature of the switching power supply body to continuously rise, affecting its performance and stability. Prolonged exposure to this condition can also shorten the lifespan of the switching power supply.

[0004] In view of this, this utility model is proposed. Utility Model Content

[0005] The technical problem to be solved by this utility model is to overcome the shortcomings of the prior art and provide a DC switching power supply that is easy to dissipate heat, thus solving the problems mentioned in the background art.

[0006] To solve the above-mentioned technical problems, the basic concept of the technical solution adopted by this utility model is as follows:

[0007] A heat-dissipating DC switching power supply includes: a power supply body, a carrying strap connected to the top of the power supply body, and a base connected to the bottom of the power supply body via a connecting plate; the power supply body has a heat dissipation channel and an air duct, the heat dissipation channel is located at the left and right ends of the motherboard, and the air duct is located at the top and bottom ends of the motherboard, and the heat dissipation channel and the air duct are connected to each other; multiple heat dissipation fins are connected inside the heat dissipation channel, heat pipes are embedded in the heat dissipation fins, and the other end of the heat pipes is connected to the motherboard; a main fan is connected inside the base, an auxiliary fan is connected to the top of the air duct, and exhaust fans are connected to both the left and right ends of the heat dissipation channel.

[0008] Optionally, a first ventilation groove is provided on the top surface of the base, and a second ventilation groove is provided on the bottom end of the base, with the first ventilation groove and the second ventilation groove corresponding to each other.

[0009] Optionally, the motherboard is located in the middle of the air duct, and the air duct is provided with multiple air holes located below the motherboard. The positions of the air holes, the first air groove, and the second air groove correspond to each other.

[0010] Optionally, a guide plate is provided at the connection between the air duct and the heat dissipation channel, and the guide plate is designed in an inclined shape.

[0011] Optionally, the heat dissipation channel extends through the left and right sides of the power supply body at both ends, and dustproof nets are connected to both ends of the heat dissipation channel.

[0012] Optionally, the exhaust fan is electrically connected to the motherboard.

[0013] Optionally, a layer of highly thermally conductive silicone grease is filled between the motherboard and the outer casing inside the power supply body, and the motherboard is provided with a hollow heat dissipation structure.

[0014] By adopting the above technical solution, the present invention has the following beneficial effects compared with the prior art. Of course, any product implementing the present invention does not necessarily need to achieve all of the following advantages at the same time:

[0015] 1. By setting up heat dissipation channels and air ducts, the heat dissipation channels are located at the left and right ends of the motherboard, and the air ducts are located at the top and bottom ends of the motherboard and are connected to each other, thus constructing a three-dimensional heat dissipation airflow circulation path. Cool air enters from the base, flows through the motherboard and is discharged through the heat dissipation channels, which can fully cover the motherboard, effectively avoid heat accumulation in local areas, greatly improve heat dissipation efficiency, and ensure that the power supply can maintain a suitable temperature and maintain stable operation under various workloads.

[0016] 2. By setting up heat dissipation fins and combining them with heat pipes, the heat from the motherboard is quickly transferred to the heat dissipation fins using the efficient thermal conductivity of the heat pipes. Then, the increased heat dissipation area of ​​the heat dissipation fins dissipates the heat into the air. The main fan, auxiliary fan, and exhaust fan work together to be responsible for air intake, auxiliary exhaust, and enhanced airflow in the heat dissipation channel, forming good air convection and continuously providing power to the heat dissipation system. This ensures that fresh cool air always enters the heat dissipation channel, maintaining an efficient heat dissipation state.

[0017] The specific embodiments of this utility model will be described in further detail below with reference to the accompanying drawings. Attached Figure Description

[0018] The accompanying drawings described below are merely some embodiments. Those skilled in the art can obtain other drawings based on these drawings without any creative effort.

[0019] In the picture:

[0020] Figure 1 This is a schematic diagram of the overall structure;

[0021] Figure 2 This is a schematic diagram of the power supply body and base being separated.

[0022] Figure 3 This is a schematic diagram of the internal structure of the base;

[0023] Figure 4 This is a schematic diagram of the internal structure of the power supply unit;

[0024] Figure 5 This is a cross-sectional view of the power supply unit.

[0025] The attached diagram lists the components represented by each number as follows:

[0026] 1. Power supply unit; 2. Base; 3. Connecting plate; 4. Carrying strap; 5. Dust filter; 6. First ventilation slot; 7. Main fan; 8. Second ventilation slot; 9. Air vent; 10. Heat sink fins; 11. Heat pipe; 12. Air guide plate; 13. Secondary fan; 14. Motherboard; 15. Exhaust fan; 16. Air duct; 17. Heat dissipation channel.

[0027] It should be noted that these accompanying drawings and textual descriptions are not intended to limit the scope of the present invention in any way, but rather to illustrate the concept of the present invention to those skilled in the art by referring to specific embodiments. Detailed Implementation

[0028] The present invention will now be described in further detail with reference to the accompanying drawings.

[0029] Please see Figure 1-5 As shown, this embodiment provides a DC switching power supply with easy heat dissipation, including: a power supply body 1, with a carrying strap 4 connected to the top of the power supply body 1 and a base 2 connected to the bottom of the power supply body 1 via a connecting plate 3. The power supply body 1 has a heat dissipation channel 17 and an air duct 16 inside. The heat dissipation channel 17 is located at the left and right ends of the motherboard 14, and the air duct 16 is located at the top and bottom ends of the motherboard 14, and the heat dissipation channel 17 and the air duct 16 are connected. Multiple heat dissipation fins 10 are connected inside the heat dissipation channel 17, and heat pipes 11 are embedded in the heat dissipation fins 10. The other end of the heat pipes 11 is connected to the motherboard 14. A main fan 7 is connected inside the base 2, an auxiliary fan 13 is connected to the top of the air duct 16, and exhaust fans 15 are connected to both the left and right ends of the heat dissipation channel 17.

[0030] The power supply unit 1 is the core of the entire device. Its top is connected to a carrying strap 4 for easy transport, and its bottom is connected to the base 2 via a connecting plate 3, ensuring structural stability and providing the basic framework for the installation of the heat dissipation components. Heat dissipation channels 17 are designed at the left and right ends of the motherboard 14, while air ducts 16 are located at the top and bottom ends of the motherboard 14, and the two are interconnected, forming a three-dimensional airflow circulation path. This layout can dissipate heat from the motherboard 14 in all directions, preventing heat accumulation in localized areas. Multiple heat dissipation fins 10 are installed within the heat dissipation channels 17, greatly increasing the heat dissipation area. One end of a heat pipe 11 embedded in the heat dissipation fins 10 is connected to the motherboard 14. Due to the high thermal conductivity of the heat pipe 11, it can quickly transfer the heat generated by the motherboard 14 to the heat dissipation fins 10, and then dissipate the heat through the fins. The main fan 7 is installed inside the base 2, which serves as the main air intake power source. It draws in cool air from the bottom and the cool air flows upward through the air duct 16, connecting with the air ducts 16 at the top and bottom of the motherboard 14. This provides a continuous airflow for the entire cooling system. The top of the air duct 16 is connected to the auxiliary fan 13, which assists in the exhaust of air, enhances the exhaust capacity at the top, and accelerates the airflow speed within the air duct 16, ensuring that heat can be quickly expelled from the power supply body 1. The exhaust fans 15 at the left and right ends of the cooling channel 17 further enhance the airflow within the cooling channel 17, quickly expelling the hot air cooled by the heat sink 10, forming good air convection, and ensuring that fresh cool air always enters the cooling channel 17 to maintain a high-efficiency cooling state.

[0031] In this embodiment, a first ventilation groove 6 is formed on the top surface of the base 2, and a second ventilation groove 8 is formed on the bottom of the base 2. The first ventilation groove 6 and the second ventilation groove 8 correspond to each other, and this design constructs an air circulation channel for the base 2. When the main fan 7 is working, air can enter the interior of the base 2 through the second ventilation groove 8, and then enter the air duct 16 through the first ventilation groove 6, providing a continuous source of fresh cold air for the entire heat dissipation system. This top-to-bottom corresponding and continuous ventilation groove design ensures smooth airflow and reduces air resistance. The motherboard 14 is located in the middle of the air duct 16, and the air duct 16 has multiple air holes 9 located below the motherboard 14. The positions of the air holes 9, the first ventilation groove 6, and the second ventilation groove 8 correspond to each other. This layout allows the cold air entering from the base 2 to be directly blown onto the motherboard 14 through the air holes 9, effectively removing the heat generated by the motherboard 14. The setting of the air holes 9 increases the contact area between the cold air and the motherboard 14, improves the heat dissipation efficiency, and ensures that the heat generated by the motherboard 14 during operation can be dissipated in a timely manner.

[0032] A guide plate 12 is provided at the connection between the air duct 16 and the heat dissipation channel 17, and the guide plate 12 is designed in an inclined shape. The function of the guide plate 12 is to guide the airflow direction between the air duct 16 and the heat dissipation channel 17, so that the air can enter the heat dissipation channel 17 more smoothly from the air duct 16, avoiding airflow turbulence or dead angles at the connection. The inclined design can optimize the airflow path, enhance the air convection effect, and thus better utilize the heat dissipation fins 10 and heat pipes 11 for heat dissipation, thereby improving the overall heat dissipation performance.

[0033] The heat dissipation channel 17 extends through the left and right sides of the power supply body 1 at both ends, and dust filters 5 are connected to both ends of the heat dissipation channel 17. The function of the dust filters 5 is to filter dust and impurities in the air, prevent these particles from entering the interior of the power supply body 1, and avoid dust accumulation on components such as the motherboard 14 and heat sink 10, which would affect the heat dissipation effect and electrical performance. At the same time, the presence of the dust filters 5 also protects internal components such as the exhaust fan 15, reduces dust wear, and extends the service life of the equipment.

[0034] The exhaust fan 15 is electrically connected to the motherboard 14. Based on the internal temperature of the power supply unit 1 or other preset conditions, the motherboard 14 can automatically adjust the speed of the exhaust fan 15 or start and stop it to achieve intelligent heat dissipation control. For example, when the temperature rises, the motherboard 14 controls the exhaust fan 15 to accelerate its operation, enhance the airflow in the heat dissipation channel 17, and speed up the heat dissipation. When the temperature drops to a certain level, the motherboard 14 can reduce the speed of the exhaust fan 15 or stop it from working to save energy and reduce noise.

[0035] The motherboard 14 inside the power supply body 1 is filled with high thermal conductivity silicone grease between it and the outer casing. The motherboard 14 has a hollow heat dissipation structure. The high thermal conductivity silicone grease can effectively fill the tiny gap between the motherboard 14 and the outer casing, enhance the efficiency of heat transfer from the motherboard 14 to the outer casing, and allow the heat generated by the motherboard 14 to be conducted to the surface of the outer casing more quickly, and then dissipated to the surrounding environment through the outer casing. The hollow design reduces the solid part of the motherboard 14, increases the space for air circulation, and allows air to come into more direct contact with the heat-generating components on the motherboard 14, further improving the heat dissipation effect. At the same time, the hollow structure also reduces the weight of the motherboard 14, and to a certain extent optimizes the overall structure of the power supply body 1.

[0036] Working principle:

[0037] The main fan 7 inside the base 2 starts up, serving as the main air intake power source. It draws in cold air from the outside through the second ventilation slot 8 at the bottom of the base 2. Since the first ventilation slot 6 and the second ventilation slot 8 correspond to each other, the cold air smoothly enters the interior of the base 2 and flows into the air duct 16 through the first ventilation slot 6. The air duct 16 is located at the top and bottom of the motherboard 14, and multiple air holes 9 are provided below the motherboard 14, corresponding to the positions of the first and second ventilation slots 8. The cold air entering the air duct 16 is blown directly onto the motherboard 14 through the air holes 9, carrying away the heat generated by the motherboard 14 during operation and initially reducing the temperature of the motherboard 14.

[0038] The hot air absorbed by the air ducts 16 at the top and bottom of the motherboard 14 is connected to the heat dissipation channels 17 located at the left and right ends of the motherboard 14. The hot air flows into the heat dissipation channels 17. During this process, the inclined guide plate 12 at the connection between the air ducts 16 and the heat dissipation channels 17 plays a role in guiding the hot air smoothly into the heat dissipation channels 17 and avoiding airflow turbulence. Multiple heat dissipation fins 10 are set in the heat dissipation channels 17, and one end of the heat pipe 11 embedded in them is connected to the motherboard 14. The heat pipe 11 uses its high thermal conductivity to quickly transfer the heat from the motherboard 14 to the heat dissipation fins 10. The heat dissipation fins 10 greatly increase the heat dissipation area, allowing the heat to be dissipated into the surrounding air more quickly and further reducing the temperature of the hot air. The exhaust fans 15 at the left and right ends of the heat dissipation channels 17 start up and quickly exhaust the hot air after it has been cooled by the heat dissipation fins 10 to the power supply body 1. At the same time, the auxiliary fan 13 at the top of the air duct 16 assists in the airflow exhaust, enhances the top exhaust capacity, accelerates the airflow speed in the air duct 16, and ensures continuous air circulation in the entire heat dissipation system.

[0039] This utility model is not limited to the above-described embodiments. Anyone should know that structural changes made under the guidance of this utility model, and any technical solutions that are the same as or similar to this utility model, fall within the protection scope of this utility model. Technical aspects, shapes, and structures not described in detail in this utility model are all publicly known technologies.

Claims

1. A DC switching power supply with easy heat dissipation, characterized in that, include: The power supply body (1) has a carrying strap (4) connected to the top end and a base (2) connected to the bottom end via a connecting plate (3). The power supply body (1) is provided with a heat dissipation channel (17) and an air duct (16). The heat dissipation channel (17) is located at the left and right ends of the motherboard (14), and the air duct (16) is located at the top and bottom ends of the motherboard (14). The heat dissipation channel (17) and the air duct (16) are connected. Multiple heat dissipation fins (10) are connected inside the heat dissipation channel (17), and heat pipes (11) are embedded in the heat dissipation fins (10). The other end of the heat pipes (11) is connected to the motherboard (14). The base (2) is connected to a main fan (7), the top of the air duct (16) is connected to an auxiliary fan (13), and the left and right ends of the heat dissipation channel (17) are connected to exhaust fans (15).

2. The heat-dissipating DC switching power supply according to claim 1, characterized in that: The top surface of the base (2) is provided with a first ventilation groove (6), and the bottom end of the base (2) is provided with a second ventilation groove (8), and the first ventilation groove (6) and the second ventilation groove (8) correspond to each other.

3. The heat-dissipating DC switching power supply according to claim 2, characterized in that: The main board (14) is located in the middle of the air duct (16), and the air duct (16) is provided with multiple air holes (9). The air holes (9) are located below the main board (14), and the positions of the air holes (9), the first ventilation groove (6) and the second ventilation groove (8) correspond to each other.

4. A heat-dissipating DC switching power supply according to claim 1, characterized in that: The air duct (16) and the heat dissipation channel (17) are both provided with a guide plate (12), and the guide plate (12) is designed in an inclined shape.

5. A heat-dissipating DC switching power supply according to claim 1, characterized in that: The heat dissipation channel (17) extends through the left and right sides of the power supply body (1) at both ends, and dustproof nets (5) are connected to both ends of the heat dissipation channel (17).

6. A heat-dissipating DC switching power supply according to claim 1, characterized in that: The exhaust fan (15) is electrically connected to the motherboard (14).

7. A heat-dissipating DC switching power supply according to claim 1, characterized in that: The motherboard (14) inside the power supply body (1) is filled with a high thermal conductivity silicone grease layer between itself and its outer casing, and the motherboard (14) is provided with a hollow heat dissipation structure.

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