Temperature and vibration composite integrated sensor

Abstract

The utility model discloses a temperature and vibration composite integrated sensor, which belongs to the technical field of signal detection, and comprises an upper shell, a rotating box is rotatably connected in the upper shell, a bottom shell is integrally formed below the upper shell, a mems sensor is fixedly connected onto the rotating box, and the mems sensor is fixedly connected onto the bottom shell. The bottom of the rotating box is rotatably connected with a pressure sensor, and one side, far away from the rotating box, of the pressure sensor is fixedly connected with NITI spiral memory metal, in the device, the heat conducting rod and the device shell are in contact measurement, the NITI spiral memory metal is pressed and heated to stretch to guarantee attachment, and the NITI spiral memory metal is matched with the pressure sensor to form secondary verification; in the vibration detection process, the pressure sensor and the MEMS sensor work together, secondary verification is formed through conversion of pressure data and acceleration values, the temperature and the vibration quantity are detected through multi-stage verification on the whole, and the detection accuracy is further improved.

Description

Technical Field

[0001] This utility model relates to the field of signal detection technology, specifically to an integrated sensor combining temperature and vibration. Background Technology

[0002] In many fields such as modern industrial production, energy development, aerospace and transportation, equipment operation status monitoring and fault diagnosis are crucial. Temperature and vibration are two key parameters reflecting the health status of equipment. By monitoring and analyzing them in real time, equipment failures can be effectively prevented, production safety can be ensured, equipment operating efficiency can be improved and service life can be extended.

[0003] In the patent titled "A High-Precision Triaxial Temperature-Vibration Composite Sensor" (publication number CN215639594U), existing temperature-vibration composite sensors primarily focus on temperature detection with axial vibration detection as a secondary function. They mostly measure acceleration by mounting a mass block to detect the pressure or shear force generated during vibration. This method suffers from drawbacks such as complex structure, cumbersome manufacturing, small vibration detection range, and low sensitivity. Furthermore, due to manufacturing errors, each sensor requires individual calibration, making it unsuitable for high-precision, multi-axial signal detection. Additionally, traditional sensors typically use bolts for mounting... Fixed on the object under test, the direction of vibration measurement cannot be adjusted, and due to issues with manufacturing precision and errors, it is impossible to quickly adjust to a suitable angle, affecting the accuracy of the measurement results. However, by setting a mounting base that can rotate around its axis, and placing a temperature sensor probe at the bottom of the mounting base, and placing a MEMS accelerometer chip and a signal processing chip at the top of the mounting base, it is possible to simultaneously detect the vibration and temperature signals of the object under test. This not only has the advantages of simple and compact structure, easy assembly and debugging, but also the vibration detection direction of the sensor is adjustable, reducing the impact of manufacturing errors and adapting to various testing environments.

[0004] However, in existing industrial testing processes, temperature changes are mostly uncontrollable, and mechanical vibrations are more intense when operating at high power. Furthermore, as power increases, temperature also increases. Without real-time contact, monitoring solely through thermal sensitivity can lead to certain errors. Therefore, a temperature-vibration composite integrated sensor is proposed. Summary of the Invention

[0005] The purpose of this invention is to provide an integrated sensor combining temperature and vibration to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: an integrated temperature and vibration sensor, comprising: an upper shell, a rotating box rotatably connected inside the upper shell, a bottom shell integrally formed below the upper shell, a MEMS sensor fixedly connected to the rotating box, a pressure sensor rotatably connected to the bottom of the rotating box, a NITI spiral memory metal fixedly connected to the side of the pressure sensor away from the rotating box, a temperature sensor fixedly connected to the end of the NITI spiral memory metal away from the pressure sensor, a heat-conducting rod fixedly connected to the end of the temperature sensor away from the NITI spiral memory metal, and a processing chip installed inside the rotating box, the processing chip being electrically connected to the MEMS sensor, the pressure sensor, and the temperature sensor.

[0007] As a further preferred embodiment of this technical solution: the upper outer shell is provided with a sealing cover, and multiple threaded holes are provided on the top surface of the upper outer shell and the outside of the sealing cover. Bolts are threaded into the internal threads of the threaded holes, and a connecting rod is installed on the top of the sealing cover.

[0008] As a further preferred embodiment of this technical solution: a rotary guide groove is provided inside the upper outer shell, and an outer rotary guide ring is fixedly connected to the outside of both the MEMS sensor and the rotating box, and the outer rotary guide ring is slidably connected to the inside of the rotary guide groove.

[0009] As a further preferred embodiment of this technical solution: a vertical guide groove is provided inside the bottom housing, and a slider is fixedly connected to the outside of the temperature sensor, the slider being slidably connected inside the vertical guide groove.

[0010] As a further preferred embodiment of this technical solution: the bottom opening of the upper outer shell has an integrally formed barrier portion on its inner wall.

[0011] As a further preferred embodiment of this technical solution: a metal plug rod is fixedly connected to the signal output terminal of the pressure sensor, and a metal plug sleeve is soldered to one of the signal input terminals of the processing chip, with the metal plug rod inserted into the interior of the metal plug sleeve.

[0012] As a further preferred embodiment of this technical solution: the NITI spiral memory metal is covered with a silver-plated anti-wave sleeve, which is made of multiple strands of silver-plated copper wires interwoven together, and has elasticity in stretching and bending.

[0013] As a further preferred embodiment of this technical solution: two reinforcing plates are fixedly connected to the rotating box, and the side of the reinforcing plate away from the rotating box is attached to the outer wall of the MEMS sensor.

[0014] Compared with the prior art, the beneficial effects of this utility model are:

[0015] In this invention, the heat-conducting rod contacts the equipment shell for measurement. The NITI spiral memory metal top pressure and thermal expansion ensure a close fit. It works in conjunction with a pressure sensor to form a secondary verification, avoiding the impact of temperature sensor failure on the detection. In vibration detection, the pressure sensor and MEMS sensor work together to form a secondary verification by converting pressure data and acceleration values. Overall, the temperature and vibration are detected through multi-level verification, further increasing the accuracy of the detection. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of an integrated temperature and vibration sensor according to the present invention.

[0017] Figure 2 This is an exploded structural diagram of an integrated temperature and vibration sensor according to the present invention.

[0018] Figure 3 This is a schematic diagram of the vertical guide groove in an integrated temperature and vibration sensor of this utility model.

[0019] Figure 4 This is a cross-sectional schematic diagram of the rotating box in an integrated temperature and vibration sensor of this utility model.

[0020] Figure 5 This is a schematic diagram of the rotating guide groove in an integrated temperature and vibration sensor according to the present invention.

[0021] Figure 6 This is a schematic diagram of the NITI spiral memory metal and silver-plated anti-wave sleeve in an integrated temperature and vibration composite sensor of this utility model.

[0022] In the diagram: 1. Bottom outer shell; 2. Upper outer shell; 3. Sealing cover; 4. Connecting rod; 5. Rotating box; 6. NITI spiral memory metal; 7. Temperature sensor; 8. Heat-conducting rod; 9. MEMS sensor; 10. Outer rotating guide ring; 11. Rotating guide groove; 12. Vertical guide groove; 13. Reinforcing plate; 14. Pressure sensor; 15. Metal plug rod; 16. Metal plug sleeve; 17. Processing chip; 18. Slider; 19. Barrier part; 20. Silver-plated anti-surge sleeve. Detailed Implementation

[0023] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0024] Example

[0025] Please see Figures 1-6This utility model provides a technical solution: an integrated temperature and vibration composite sensor, comprising: an upper shell 2, a rotating box 5 rotatably connected inside the upper shell 2, a bottom shell 1 integrally formed below the upper shell 2, a MEMS sensor 9 fixedly connected to the rotating box 5, a pressure sensor 14 rotatably connected to the bottom of the rotating box 5, an NITI spiral memory metal 6 fixedly connected to the side of the pressure sensor 14 away from the rotating box 5, a temperature sensor 7 fixedly connected to the end of the NITI spiral memory metal 6 away from the pressure sensor 14, a heat-conducting rod 8 fixedly connected to the end of the temperature sensor 7 away from the NITI spiral memory metal 6, and a processing chip 17 installed inside the rotating box 5, the processing chip 17 being electrically connected to the MEMS sensor 9, the pressure sensor 14, and the temperature sensor 7.

[0026] In this embodiment, specifically: during use, the heat-conducting rod 8 can be brought into contact with the device to be monitored. When the heat-conducting rod 8 comes into contact with the device, the heat emitted by the device's casing is first conducted to the heat-conducting rod 8. Upon contact with the heat emitted by the device's casing, the heat-conducting rod 8 conducts the temperature to the temperature sensor 7. This forms a contact-type temperature measurement between the temperature sensor 7 and the heat-conducting rod 8. During the measurement process, the NITI spiral shape memory metal 6 presses against the temperature sensor 7, thereby ensuring that the temperature sensor 7 and the heat-conducting rod 8 remain in continuous contact with the device's casing. When the heat-conducting rod 8 generates high temperature upon contact with the device casing, it conducts the high temperature to the NITI spiral memory metal 6 through the casing of the temperature sensor 7. When the NITI spiral memory metal 6 comes into contact with the high temperature, it will undergo elongation deformation, creating a telescoping effect inside the bottom casing 1. As the device continues to generate high temperatures, the NITI spiral memory metal 6 will continue to extend, thereby continuously pressing the temperature sensor 7 and the heat-conducting rod 8 against the outer wall of the device. Furthermore, when the heat-conducting rod 8 is in use, it can be magnetically attracted to the surface of the device casing, strengthening the connection between the rod and the device.

[0027] In this embodiment, specifically: as the NITI spiral memory metal 6 continuously extends and drives the temperature sensor 7 and the heat-conducting rod 8 to continuously press against the outer wall of the device, the extension of the NITI spiral memory metal 6 is bidirectional. The bidirectional extension can press against the pressure sensor 14 connected to the NITI spiral memory metal 6. When the NITI spiral memory metal 6 applies force to the pressure sensor 14, the pressure sensor 14 will detect the force applied by the NITI spiral memory metal 6, thereby converting the applied force into data, and converting the pressure data into heat data. That is, the more pressure the pressure sensor 14 is subjected to, the more external heat there is. This forms a secondary verification of temperature detection, avoiding the phenomenon of inaccurate heat detection when the temperature sensor 7 is damaged.

[0028] In this embodiment, specifically: when the heat-conducting rod 8 contacts the housing of the device to be detected, and the housing vibrates, the vibration will be continuously transmitted to the NITI spiral memory metal 6 through the heat-conducting rod 8. The NITI spiral memory metal 6 will further compress the pressure sensor 14, and generate pressure data again through the compression of the pressure sensor 14. The vibration of the device is monitored through the pressure data.

[0029] In this embodiment, specifically: inside the bottom housing 1, when vibration is transmitted to the bottom housing 1, the overall vibration will cause the MEMS sensor 9 to rotate. When the MEMS sensor 9 rotates, it can collect the acceleration value of the detected object, which can be directly converted into an electrical signal. After noise reduction and amplification by the processing chip 17, it is output, thereby forming a secondary verification of the vibration status of the monitoring device and further increasing the accuracy of vibration detection.

[0030] like Figure 1 As shown, the upper outer shell 2 is covered with a sealing cover 3. Multiple threaded holes are provided on the top surface of the upper outer shell 2 and the outside of the sealing cover 3. Bolts are threaded inside the threaded holes. A connecting rod 4 is installed on the top of the sealing cover 3.

[0031] In this embodiment, specifically: during use, the sealing cover 3 is connected to the outside via the connecting rod 4, and the sealing cover 3 is aligned with the upper outer shell 2. After alignment, the sealing cover 3 and the upper outer shell 2 are connected by bolts to complete the overall installation. During maintenance, the sealing cover 3 can also be opened to facilitate the maintenance of the components inside the bottom outer shell 1 and the upper outer shell 2.

[0032] like Figures 1-5 As shown, the upper outer shell 2 has a rotary guide groove 11 inside, and the mems sensor 9 and the rotating box 5 are both fixedly connected to an outer rotary guide ring 10. The outer rotary guide ring 10 is slidably connected to the inside of the rotary guide groove 11.

[0033] In this embodiment, specifically: when the mems sensor 9 rotates inside the upper housing 2, the outer rotation guide ring 10 is slidably connected to the inside of the rotation guide groove 11, thereby guiding the rotation of the mems sensor 9 and assisting the rotation of the mems sensor 9.

[0034] like Figure 3 As shown, a vertical guide groove 12 is provided inside the bottom outer shell 1, and a slider 18 is fixedly connected to the outside of the temperature sensor 7. The slider 18 is slidably connected inside the vertical guide groove 12.

[0035] In this embodiment, specifically: during use, the slider 18 is slidably connected to the inside of the vertical guide groove 12, which can guide the movement direction of the temperature sensor 7. At the same time, the process of guiding the temperature sensor 7 reduces the problem of the heat-conducting rod 8 being randomly pointed due to the force it is subjected to.

[0036] In this embodiment, specifically: the bottom opening of the upper outer shell 2 is integrally formed with a blocking part 19. By setting the blocking part 19, the phenomenon that the temperature sensor 7 can directly move out of the bottom outer shell 1 can be prevented.

[0037] In this embodiment, specifically: a metal plug rod 15 is fixedly connected to the signal output terminal of the pressure sensor 14, and a metal plug sleeve 16 is soldered to one of the signal input terminals of the processing chip 17. The metal plug rod 15 is inserted into the interior of the metal plug sleeve 16. By inserting the metal plug rod 15 into the interior of the metal plug sleeve 16, not only can the connection stability between the pressure sensor 14 and the processing chip 17 be increased, but an electrical connection can also be formed between the pressure sensor 14 and the metal plug sleeve 16.

[0038] In this embodiment, specifically: the NITI spiral memory metal 6 is covered with a silver-plated anti-wave sleeve 20. The silver-plated anti-wave sleeve 20 is made of multiple strands of silver-plated copper wires interwoven together, which has elasticity for stretching and bending. By covering the outside with the silver-plated anti-wave sleeve 20, the elasticity of the NITI spiral memory metal 6 itself can be increased, ensuring the stretching performance of the NITI spiral memory metal 6.

[0039] like Figures 2-4 As shown, two reinforcing plates 13 are fixedly connected to the rotating box 5, and the side of the reinforcing plate 13 away from the rotating box 5 is attached to the outer wall of the mems sensor 9.

[0040] In this embodiment, specifically, by setting up the reinforcing plate 13, the mems sensor 9 can be supported, ensuring the stability of the mems sensor 9 during rotation.

[0041] Working principle: The heat-conducting rod 8 is brought into contact with the outer shell of the device to be monitored. The heat emitted by the outer shell is conducted to the temperature sensor 7 through the heat-conducting rod 8, realizing contact temperature measurement. At the same time, the NITI spiral shape memory metal 6 applies top pressure to the temperature sensor 7, making the heat-conducting rod 8 fit tightly against the outer shell of the device. When the device generates high temperature, the heat is conducted to the NITI spiral shape memory metal 6 through the heat-conducting rod 8 and the temperature sensor 7, causing it to expand due to heat and continuously press against the temperature sensor 7 and the heat-conducting rod 8, ensuring contact stability. The heat-conducting rod 8 can also be magnetically attracted to the outer shell of the device to enhance the connection. During this process, the bidirectional extension of the NITI spiral shape memory metal 6 will act on the pressure sensor 14. The pressure sensor 14 converts the pressure data into heat data, forming a secondary verification of the temperature detection, and avoiding inaccurate detection due to damage to the temperature sensor 7.

[0042] When the device casing vibrates, the vibration is conducted to the NITI spiral memory metal 6 via the heat-conducting rod 8, which in turn compresses the pressure sensor 14 to generate pressure data to monitor the vibration. At the same time, when the vibration is transmitted to the bottom casing 1, it drives the MEMS sensor 9 in the upper casing 2 to rotate. The sensor 9 achieves stable rotation by sliding in the rotation guide groove 11 through the outer rotating guide ring 10. The sensor collects acceleration values ​​and converts them into electrical signals. After noise reduction and amplification by the processing chip 17, the signals are output to form a secondary verification of vibration detection, thereby improving the accuracy of the detection.

[0043] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A temperature-vibration compound integrated sensor, characterized by The device includes: an upper outer shell (2), a rotating box (5) rotatably connected inside the upper outer shell (2), a bottom outer shell (1) integrally formed below the upper outer shell (2), a mems sensor (9) fixedly connected to the rotating box (5), a pressure sensor (14) rotatably connected to the bottom of the rotating box (5), an NITI spiral memory metal (6) fixedly connected to the side of the pressure sensor (14) away from the rotating box (5), a temperature sensor (7) fixedly connected to the end of the NITI spiral memory metal (6) away from the pressure sensor (14), a heat-conducting rod (8) fixedly connected to the end of the temperature sensor (7) away from the NITI spiral memory metal (6), and a processing chip (17) installed inside the rotating box (5), the processing chip (17) being electrically connected to the mems sensor (9), the pressure sensor (14) and the temperature sensor (7).

2. The temperature-vibration compound integrated sensor according to claim 1, wherein: The upper outer shell (2) is covered with a sealing cover (3). Multiple threaded holes are provided on the top surface of the upper outer shell (2) and the outside of the sealing cover (3). Bolts are threaded inside the threaded holes. A connecting rod (4) is installed on the top of the sealing cover (3).

3. The temperature-vibration compound integrated sensor according to claim 1, wherein: The upper outer shell (2) has a rotary guide groove (11) inside. The mems sensor (9) and the rotating box (5) are both fixedly connected to an outer rotary guide ring (10), which is slidably connected to the inside of the rotary guide groove (11).

4. The temperature-vibration compound integrated sensor according to claim 1, wherein: The bottom outer shell (1) has a vertical guide groove (12) inside, and the temperature sensor (7) is fixedly connected to a slider (18) on the outside. The slider (18) is slidably connected to the inside of the vertical guide groove (12).

5. The temperature-vibration compound integrated sensor according to claim 1, wherein: The bottom opening of the upper outer shell (2) has an integrally formed barrier (19) on the inner wall.

6. The integrated temperature and vibration sensor according to claim 1, characterized in that: The signal output terminal of the pressure sensor (14) is fixedly connected to a metal plug rod (15), and one of the signal input terminals of the processing chip (17) is welded with a metal plug sleeve (16). The metal plug rod (15) is inserted into the interior of the metal plug sleeve (16).

7. The temperature-vibration compound integrated sensor according to claim 1, wherein: The NITI spiral memory metal (6) is covered with a silver-plated anti-wave sleeve (20), which is made of multiple strands of silver-plated copper wires interwoven together and has elasticity for stretching and bending.

8. The temperature-vibration compound integrated sensor according to claim 1, wherein: Two reinforcing plates (13) are fixedly connected to the rotating box (5), and the side of the reinforcing plate (13) away from the rotating box (5) is attached to the outer wall of the mems sensor (9).

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