Device for detecting high temperature resistance of chip

Abstract

A chip high temperature resistance detection device comprises a detection machine, a detection chamber is arranged in the detection machine, a lower shell is fixedly connected to the lower side wall of the detection chamber, an upper shell is arranged above the lower shell, a placement net plate is arranged in the lower shell, and a plurality of electric heating tubes are installed between the inner walls of the front and rear sides of the lower shell and the upper shell. Circular grooves are formed in the four corners of the upper side wall of the lower shell, and lifting plates are slidably arranged in the circular grooves. Compared with the prior art, the device has the advantages that heat generated in the detection process can be effectively collected and stored through the arranged heat recovery mechanism. The recovered heat is reused for preheating during next detection, so that the utilization rate of energy is greatly improved, and the detection efficiency is improved; and through the arrangement of the rapid cooling mechanism, the temperature of the chip can be rapidly reduced after detection is finished, so that the scalding risk caused by high temperature in the taking process of an operator is effectively avoided, and the operation safety is greatly improved.

Description

Technical Field

[0001] This utility model relates to the field of chip testing technology, and in particular to a chip high-temperature resistance testing device. Background Technology

[0002] Chips operate based on the physical properties of semiconductor materials, integrating electronic components onto a small semiconductor wafer through specific manufacturing processes. The main steps include design, manufacturing, and packaging. Chips can perform specific functions, such as data processing, signal amplification, and information storage, and are widely used in computers, communications, consumer electronics, industrial control, automotive electronics, and medical devices. High-temperature resistance testing is a crucial component of chip reliability testing, designed to evaluate the chip's performance stability and reliability under high-temperature conditions.

[0003] Chinese patent CN220063906U discloses a testing device for the high-temperature resistance performance of HEMT power chips, including a heat insulation box. A lower shell is installed on the inner wall of the heat insulation box, and a guide post is fixedly connected to the top of the lower shell. An upper shell is slidably installed on the outer wall of the guide post. A groove is provided on the adjacent side of the upper shell and the lower shell. Multiple heating tubes are installed at equal intervals inside the groove. A mesh is fixedly connected to the top of the lower shell. An outer shell is installed on the opposing side of the lower shell and the upper shell. Multiple infrared temperature sensors are installed at equal intervals on the inner wall of the outer shell. Multiple temperature measuring holes are arranged at equal intervals on the inner wall of the groove. One end of the temperature measuring hole opens in the direction corresponding to the detection end of the infrared temperature sensor, and the other end of the temperature measuring hole opens in the direction corresponding to the mesh.

[0004] As described above, after the testing is completed, the heat generated by the heating equipment is directly dissipated into the environment and is not effectively utilized. This not only wastes energy but also increases testing costs. In addition, after high-temperature testing, the chip temperature rises significantly, posing a risk of burns when removing the chip. Utility Model Content

[0005] The main purpose of this invention is to provide a chip high-temperature resistance testing device, which can effectively solve the problems in the background art.

[0006] To achieve the above objectives, the technical solution adopted by this utility model is as follows: a chip high-temperature resistance performance testing device, comprising a testing machine, wherein the testing machine has a testing chamber, a lower shell is fixedly connected to the lower side wall of the testing chamber, an upper shell is provided above the lower shell, a mesh plate is provided inside the lower shell, several electric heating tubes are installed between the inner walls of the front and rear sides of the lower shell and the upper shell, circular grooves are provided at the four corners of the upper side wall of the lower shell, a lifting plate is slidably provided in the circular groove, a connecting rod is fixedly connected to the upper side wall of the lifting plate, the upper end of the connecting rod is fixedly connected to the upper shell, a spring is provided between the lifting plate and the lower side wall of the circular groove, heat exchange tubes are provided inside the lower shell and the upper shell, a heat recovery mechanism is also provided inside the testing chamber, and a rapid cooling mechanism is provided on one outer wall of the testing machine.

[0007] As a further description of the above technical solution, the heat recovery mechanism includes a water tank, a phase change heat storage device, a circulating pump, an inlet pipe, an outlet pipe, a first tee, a first connecting pipe, a phase change inlet pipe, a phase change outlet pipe, a second tee, and a second connecting pipe. The water tank, the phase change heat storage device, and the circulating pump are fixedly connected to the rear of the lower side wall of the detection chamber. The inlet of the circulating pump is connected to the water tank through an inlet pipe, and the outlet is connected to an outlet pipe. The other end of the outlet pipe is equipped with a first tee, and the other two ports of the first tee are connected to the first connecting pipe. The other end of the first connecting pipe is connected to one end of a heat exchanger. The inlet of the phase change heat storage device is connected to a phase change inlet pipe, and the outlet is connected to the water tank through a phase change outlet pipe. The other end of the phase change inlet pipe is equipped with a second tee, and the other two ports of the second tee are connected to the other end of the heat exchanger through a second connecting pipe.

[0008] As a further description of the above technical solution, the rapid cooling mechanism includes a duct, a thermoelectric cooling chip, a radiator, temperature-conducting fins, and an exhaust fan. The duct is fixedly connected to one outer wall of the testing machine. A thermoelectric cooling chip is embedded in one side wall of the duct. A radiator is installed on the hot side of the thermoelectric cooling chip and temperature-conducting fins are installed on the cold side. An exhaust fan is installed inside the duct.

[0009] As a further description of the above technical solution, the inlet pipe, outlet pipe, first connecting pipe, phase change inlet pipe, phase change outlet pipe and second connecting pipe are all flexible hoses.

[0010] As a further description of the above technical solution, the heat exchange tube is a copper tube.

[0011] As a further description of the above technical solution, the duct wall is provided with several air inlets.

[0012] As a further description of the above technical solution, the front side wall of the testing box is provided with a door.

[0013] Compared with the prior art, the present invention has the following beneficial effects:

[0014] 1. The heat recovery mechanism effectively collects and stores the heat generated during the testing process. This recovered heat is reused for preheating in the next test, thus significantly improving energy utilization and testing efficiency.

[0015] 2. The rapid cooling mechanism can quickly reduce the chip temperature after testing, effectively avoiding the risk of burns to operators during the chip removal process and greatly improving operational safety. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of a chip high-temperature resistance testing device according to the present invention;

[0017] Figure 2 This is a schematic diagram of the lower housing structure of a chip high-temperature resistance testing device according to the present invention;

[0018] Figure 3 This is a cross-sectional view of the lower housing of a chip high-temperature resistance testing device according to the present invention;

[0019] Figure 4 This is a schematic diagram of the heat recovery mechanism of a chip high-temperature resistance testing device according to the present invention;

[0020] Figure 5 This is an exploded view of the rapid cooling mechanism of a chip high-temperature resistance testing device according to this utility model;

[0021] Figure 6 This is a cross-sectional view of the air duct of a chip high-temperature resistance testing device according to this utility model;

[0022] In the diagram: 1. Testing machine; 11. Testing chamber; 2. Lower shell; 3. Upper shell; 21. Mesh plate placement; 22. Heating element; 23. Circular groove; 24. Lifting plate; 25. Adapter rod; 26. Spring; 27. Heat exchanger tube; 4. Heat recovery mechanism; 5. Rapid cooling mechanism; 41. Water tank; 42. Phase change heat storage device; 43. Circulating pump; 44. Inlet pipe; 45. Outlet pipe; 46. First tee; 47. First connecting pipe; 48. Phase change inlet pipe; 49. Phase change outlet pipe; 410. Second tee; 411. Second connecting pipe; 51. Air duct; 52. Semiconductor cooling chip; 53. Radiator; 54. Temperature-conducting fins; 55. Exhaust fan; 511. Air inlet. Detailed Implementation

[0023] To make the technical means, creative features, and objectives of this utility model easier to understand, the following describes this utility model in conjunction with specific embodiments.

[0024] In the description of this utility model, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," and "the other end," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0025] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," and "connected," etc., should be interpreted broadly. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0026] Please see Figure 1-6 This utility model provides a chip high-temperature resistance testing device, including a testing machine 1. The testing machine 1 has a testing chamber 11. A lower housing 2 is fixedly connected to the lower side wall of the testing chamber 11. An upper housing 3 is provided above the lower housing 2. A placement mesh plate 21 is provided inside the lower housing 2. The chip to be tested is placed on the placement mesh plate 21 for testing. Several electric heating tubes 22 are installed between the front and rear inner walls of the lower housing 2 and the upper housing 3. The electric heating tubes 22 heat the space inside the upper housing 3 and the lower housing 2. Circular grooves 23 are opened at the four corners of the upper side wall of the lower housing 2. Sliding devices are installed in the circular grooves 23. There is a lifting plate 24, and a connecting rod 25 is fixedly connected to the upper side wall of the lifting plate 24. The upper end of the connecting rod 25 is fixedly connected to the upper housing 3. A spring 26 is provided between the lifting plate 24 and the lower side wall of the circular groove 23. When the upper housing 3 is pulled up, the connecting rod 25 will drive the lifting plate 24 to move upward and stretch the spring 26. After the upper housing 3 is released, under the action of the spring 26, the upper housing 2 will move down to cover the lower housing 2. Both the lower housing 2 and the upper housing 3 are provided with heat exchange tubes 27. A heat recovery mechanism 4 is also provided in the detection chamber 11. A rapid cooling mechanism 5 is provided on one side of the outer wall of the detection machine 1.

[0027] Specifically, such as Figure 4As shown, a chip high-temperature resistance testing device includes a heat recovery mechanism 4 comprising a water tank 41, a phase change heat storage device 42, a circulating pump 43, an inlet pipe 44, an outlet pipe 45, a first tee 46, a first connecting pipe 47, a phase change inlet pipe 48, a phase change outlet pipe 49, a second tee 410, and a second connecting pipe 411. The water tank 41, the phase change heat storage device 42, and the circulating pump 43 are fixedly connected to the rear of the lower side wall of the testing chamber 11. The inlet of the circulating pump 43 is connected to the water tank 41 via the inlet pipe 44, and its outlet is connected to the outlet pipe 45. A second tee 46 is installed at the other end of the outlet pipe 45. A first three-way connector 46 has two other ports connected to a first connecting pipe 47. The other end of the first connecting pipe 47 is connected to one end of a heat exchanger 27. The inlet of the phase change heat storage unit 42 is connected to a phase change inlet pipe 48, and the outlet is connected to the water tank 41 via a phase change outlet pipe 49. A second three-way connector 410 is installed at the other end of the phase change inlet pipe 48. The other two ports of the second three-way connector 410 are connected to the other end of the heat exchanger 27 via a second connecting pipe 411. During the testing process, the circulating pump 43 uses the inlet pipe 44 to draw water from the water tank 41 and uses the outlet pipe 49 to draw water from the water tank 41. Water pipe 45 and the first tee 46 deliver water to two first connecting pipes 47. The water then flows through the first connecting pipes 47 into the heat exchange pipes 27 inside the upper shell 3 and the lower shell 2, respectively. The heat generated in the upper shell 3 and the lower shell 2 is conducted to the water flow through the heat exchange pipes 27. The water then flows through two second connecting pipes 411 and the second tee 410 to the phase change water inlet pipe 48. The water then enters the phase change heat storage device 42 through the phase change water inlet pipe 48. The phase change material in the phase change heat storage device 42 absorbs the heat from the water flow. Finally, the water flows back to the water tank 41 through the phase change water outlet pipe 49. This creates a water circulation system, allowing the circulating water to transfer heat to the phase change material in the phase change heat storage tank 42 via the heat exchanger 27. The phase change material absorbs heat and undergoes a phase change, storing a large amount of latent heat. When the next test is performed, the water in the water tank 41 circulates under the action of the circulation pump 43. When the circulating water passes through the phase change heat storage tank 42, the phase change material releases heat due to the low water temperature, transferring the heat to the circulating water. When the circulating water flows through the heat exchanger 27, it conducts the heat to the lower shell 2 and the upper shell 3, preheating the internal space of the lower shell 2 and the upper shell 3, reducing heat waste and lowering the operating cost.

[0028] Specifically, such as Figure 5 and Figure 6As shown, a chip high-temperature resistance testing device includes a rapid cooling mechanism 5 comprising a duct 51, a thermoelectric cooler 52, a heat sink 53, thermally conductive fins 54, and an exhaust fan 55. The duct 51 is fixedly connected to one side of the outer wall of the testing machine 1. A thermoelectric cooler 52 is embedded in one side wall of the duct 51. The heat sink 53 is installed on the hot side of the thermoelectric cooler 52, and the thermally conductive fins 54 are installed on the cold side. An exhaust fan 56 is installed inside the duct 51. The thermoelectric cooler 52 can cool the thermally conductive fins 54, and the heat sink 53 dissipates heat from the hot side of the thermoelectric cooler 52, ensuring the normal cooling of the thermoelectric cooler 52. When the exhaust fan 55 is working, outside air enters into the duct 51 through the air inlet 511, is converted into cold air through heat exchange, and is then blown onto the chip after testing, allowing the chip to cool down. This avoids the risk of burns caused by high temperature during the chip handling process and greatly improves the safety of the operation.

[0029] Specifically, such as Figure 4 As shown, a chip high-temperature resistance testing device includes a water inlet pipe 44, a water outlet pipe 45, a first connecting pipe 47, a phase change water inlet pipe 48, a phase change water outlet pipe 49, and a second connecting pipe 411, all of which are flexible hoses.

[0030] Specifically, such as Figure 3 As shown, a chip high-temperature resistance performance testing device is provided, wherein the heat exchange tube 27 is a copper tube to ensure the heat exchange efficiency of the heat exchange tube 27.

[0031] Specifically, such as Figure 5 As shown, a chip high temperature resistance testing device has several air inlets 511 on the wall of the air duct 51, through which outside air enters the air duct 51.

[0032] It should be noted that this utility model is a chip high-temperature resistance testing device. In use, pulling up the upper housing 3 causes the adapter rod 25 to move the lifting plate 24 upwards, stretching the spring 26. Then, the chip to be tested is placed on the placement mesh plate 21. After releasing the upper housing 3, the upper housing 2 moves downwards to cover the lower housing 2 under the action of the spring 26. Then, the heating element 22 is activated to heat the chip for high-temperature testing. During the testing process, the circulating pump 43 uses the inlet pipe 44 to draw water from the water tank 41 and uses the outlet pipe 45 and the first and third... Water is delivered through pipe 46 to two first connecting pipes 47. The water then flows through these pipes into heat exchange pipes 27 inside the upper shell 3 and lower shell 2, respectively. Heat generated in the upper shell 3 and lower shell 2 is conducted to the water through the heat exchange pipes 27. The water then flows through two second connecting pipes 411 and a second three-way connector 410 to the phase change inlet pipe 48. From there, it enters the phase change heat storage device 42. The phase change material in the heat storage device 42 absorbs the heat from the water, and the water then flows back through the phase change outlet pipe 49. The water flows into the water tank 41, forming a water circulation system. This allows the circulating water to transfer heat to the phase change material in the phase change heat storage device 42 via the heat exchanger 27. The phase change material absorbs heat and undergoes a phase change, storing a large amount of latent heat. After the test, the thermoelectric cooler 52 cools the thermally conductive fins 54, and the heat sink 53 dissipates heat from the hot surface of the thermoelectric cooler 52, ensuring normal cooling. When the exhaust fan 55 is working, outside air enters the air duct 51 through the air inlet 511, is converted into cold air through heat exchange, and then blows onto the chip after the test. The upper part of the chip can be cooled, avoiding the risk of burns caused by high temperature during the handling process, which greatly improves the safety of operation. When the next test is performed, the water in the water tank 41 is circulated by the circulation pump 43. When the circulating water passes through the phase change heat storage device 42, the phase change material releases heat due to the low water temperature, and transfers the heat to the circulating water. When the circulating water flows through the heat exchange tube 27, the heat is conducted to the lower shell 2 and the upper shell 3, preheating the internal space of the lower shell 2 and the upper shell 3, reducing heat waste and lowering the cost of use.

[0033] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A chip high-temperature resistance performance testing device, comprising a testing machine (1), wherein the testing machine (1) has a testing chamber (11), a lower housing (2) is fixedly connected to the lower side wall of the testing chamber (11), an upper housing (3) is provided above the lower housing (2), a mesh plate (21) is provided inside the lower housing (2), and a plurality of electric heating tubes (22) are installed between the inner walls of the front and rear sides of the lower housing (2) and the upper housing (3), characterized in that: The lower housing (2) has a circular groove (23) at each of the four corners of the upper side wall. A lifting plate (24) is slidably installed in the circular groove (23). A connecting rod (25) is fixedly connected to the upper side wall of the lifting plate (24). The upper end of the connecting rod (25) is fixedly connected to the upper housing (3). A spring (26) is installed between the lifting plate (24) and the lower side wall of the circular groove (23). Heat exchange tubes (27) are installed in both the lower housing (2) and the upper housing (3). A heat recovery mechanism (4) is also installed in the detection chamber (11). A rapid cooling mechanism (5) is installed on one side of the outer wall of the detection machine (1).

2. The chip high-temperature resistance performance detection device according to claim 1, characterized in that: The heat recovery mechanism (4) includes a water tank (41), a phase change heat storage device (42), a circulating pump (43), an inlet pipe (44), an outlet pipe (45), a first tee (46), a first connecting pipe (47), a phase change inlet pipe (48), a phase change outlet pipe (49), a second tee (410), and a second connecting pipe (411). The water tank (41), the phase change heat storage device (42), and the circulating pump (43) are fixedly connected to the rear of the lower side wall of the detection chamber (11). The inlet of the circulating pump (43) is connected to the water tank (41) through the inlet pipe (44), and the outlet is connected to the outlet pipe (45). The other end of the pipe (45) is equipped with a first tee (46), and the other two ports of the first tee (46) are connected to a first connecting pipe (47). The other end of the first connecting pipe (47) is connected to one end of the heat exchanger (27). The inlet end of the phase change heat storage device (42) is connected to a phase change water inlet pipe (48), and the outlet end is connected to the water tank (41) via a phase change water outlet pipe (49). The other end of the phase change water inlet pipe (48) is equipped with a second tee (410), and the other two ports of the second tee (410) are connected to the other end of the heat exchanger (27) via a second connecting pipe (411).

3. The chip high-temperature resistance performance detection device according to claim 1, characterized in that: The rapid cooling mechanism (5) includes a duct (51), a semiconductor cooling chip (52), a radiator (53), a temperature-conducting fin (54), and an exhaust fan (55). The duct (51) is fixedly connected to one side of the outer wall of the testing machine (1). The semiconductor cooling chip (52) is embedded in one side wall of the duct (51). The hot side of the semiconductor cooling chip (52) is equipped with a radiator (53) and the cold side is equipped with a temperature-conducting fin (54). An exhaust fan (55) is installed inside the duct (51).

4. The chip high-temperature resistance performance detection device according to claim 2, characterized in that: The inlet pipe (44), outlet pipe (45), first connecting pipe (47), phase change inlet pipe (48), phase change outlet pipe (49), and second connecting pipe (411) are all flexible hoses.

5. The chip high-temperature resistance performance detection device according to claim 2, characterized in that: The heat exchange tube (27) is a copper tube.

6. The chip high-temperature resistance performance detection device according to claim 3, characterized in that: The air duct (51) has several air inlets (511) on its wall.

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