Energy storage device

Abstract

The embodiment of the utility model provides an energy storage device, which comprises a box body structure, the box body structure comprises a power shell and a battery shell which are adjacently arranged along the front-back direction, the power shell and the battery shell are detachably connected, one side, far away from the battery shell, of the power shell is a rear side wall, and the other side of the power shell is a front side wall; a plurality of radiating fins are arranged on the outer wall surface of the rear side wall at intervals, and the power shell and the radiating fins are integrally formed; the power circuit board is arranged in the power shell, and the power circuit board comprises a plurality of heating components; the plurality of first avoiding grooves are formed in the inner wall surface of the rear side wall of the power shell, and the plurality of first avoiding grooves are respectively arranged corresponding to the plurality of heating components; and the battery module is arranged in the battery shell, and the battery module is electrically connected with the power circuit board. According to the technical scheme, the local space is reconstructed under the action of the first receding groove, and the size of the whole structure in the front-back direction can be further reduced on the basis that the heat dissipation effect is guaranteed.

Description

Technical Field

[0001] This utility model relates to the field of energy storage, and more specifically, to an energy storage device. Background Technology

[0002] With the increasing popularity of green energy, the demand for home photovoltaic systems and corresponding energy storage batteries is gradually increasing. Generally, indoor balconies receive a large proportion of sunlight, making them suitable for installing balcony photovoltaic energy storage systems. Balcony photovoltaic energy storage devices typically include a photovoltaic power generation system and an energy storage system. The photovoltaic power generation system uses photovoltaic panels to convert solar energy into direct current (DC) electricity, while the energy storage system generally uses batteries or lithium batteries to store excess electricity for future use. In related technologies, home energy storage devices require batteries, inverters, heat sinks, and other components, each with independent functions and requiring separate space, resulting in a large size and significant space requirements when placed in a home. Utility Model Content

[0003] In order to solve or improve the technical problem of large size of the above-mentioned energy storage devices, one objective of this utility model is to provide an energy storage device.

[0004] To achieve the above objectives, this utility model provides an energy storage device, comprising: a housing structure, the housing structure including a power housing and a battery housing arranged adjacent to each other in a front-rear direction, the power housing and the battery housing being detachably connected, the side of the power housing away from the battery housing being a rear sidewall, the outer wall surface of the rear sidewall being provided with a plurality of spaced heat dissipation fins, the power housing and the heat dissipation fins being integrally formed; a power circuit board, disposed within the power housing, the power circuit board including a main board body and a plurality of heat-generating components disposed on the main board body, the main board body being detachably connected to the power housing, the heat-generating components being disposed on the side of the main board body away from the battery housing; a plurality of first clearance grooves, disposed on the inner wall surface of the rear sidewall of the power housing, the plurality of first clearance grooves being respectively disposed corresponding to the plurality of heat-generating components; and a battery module, disposed within the battery housing, the battery module being electrically connected to the power circuit board.

[0005] The energy storage device provided by this utility model includes a housing structure and a power circuit board and a battery module disposed within the housing structure. The housing structure includes a power housing and a battery housing, with the battery module disposed within the battery housing. Heat dissipation fins are integrated into the power housing, effectively reducing the space required for separately placed heat dissipation fins. In this solution, the heat dissipation fins are located on the side of the power housing away from the battery housing, and the power housing and battery housing are adjacent in the front-to-back direction, thus effectively reducing the overall front-to-back dimension of the energy storage device. It is important to emphasize that, based on this, the shape of the power housing in this solution provides structural avoidance for heat-generating components on the power circuit board. Specifically, through one or more first avoidance slots, the local space is reconstructed, and the heat generated by the heat-generating components can be conducted to the outside through the heat dissipation fins in the corresponding area of ​​the first avoidance slot. Therefore, while ensuring heat dissipation, the overall front-to-back dimension of the structure can be further reduced.

[0006] In the above technical solution, the power circuit board further includes: at least one expansion board, which is electrically connected to the main board body, and the at least one expansion board is located on the rear side of the main board body.

[0007] By setting up additional expansion boards, different functions can be configured according to requirements. Since the expansion boards are located on the rear side of the main board, the size arrangement of the heat-generating components protruding from the main board reduces the possibility of integrating all the components of each expansion board onto the main board, making the main board area too large. On the other hand, it minimizes the increase in volume caused by setting up additional boards separately, reduces the size of the power circuit board in the front-to-back direction, and improves space utilization by utilizing the redundant space between the rear side wall of the power housing and the main board.

[0008] In the above technical solution, the power housing further includes: at least one second clearance groove, which is disposed on the inner wall surface of the rear side wall of the power housing, and at least one second clearance groove is respectively disposed corresponding to at least one expansion plate.

[0009] One or more second clearance grooves are provided on the inner wall surface of the rear side wall of the power housing, which can correspond one-to-one with the projection area of ​​the expansion board, so as to facilitate the clearance of the expansion board and make full use of the protruding size of the heat-generating components. Without additionally extending the front-to-back dimension of the power housing, the functions of multiple expansion boards can be taken into account.

[0010] In the above technical solution, the dimensions of the heat dissipation fins in the front-to-back direction are greater than the depth of any of the first clearance slots.

[0011] By defining the dimensional relationship between the heat dissipation fins and the first clearance slot, i.e., the size of the heat dissipation fins is greater than the depth of any first clearance slot in the front-back direction, the maximum heat dissipation efficiency and the compactness of the structure can be balanced.

[0012] In the above technical solution, the power housing further includes: a mounting groove, which is disposed on the inner wall surface of the rear side wall of the power housing; wherein, a first clearance groove is disposed at the bottom of the mounting groove, and the first clearance groove is recessed backward in the front-rear direction.

[0013] By using a composite design of a mounting slot nested within a first clearance slot, the space utilization, heat dissipation efficiency, and assembly precision of the power housing are further optimized. The mounting slot is located on the inner wall of the rear side wall of the power housing and can be die-cast integrally with the housing. The first clearance slot is located at the bottom of the mounting slot and is recessed backward in the front-back direction, thus making the mounting slot nested within the first clearance slot, resulting in a smaller size of the power housing in the front-back direction.

[0014] In the above technical solution, the power housing also includes: wiring grooves, which are located on both sides of the mounting groove and extend along the direction of gravity.

[0015] Wiring slots are added on both sides of the power housing mounting slot, specifically on the left and right sides, and extend along the direction of gravity. The specific extension dimension can be the same as the mounting slot, or slightly longer than the dimension of the mounting slot in the direction of gravity, so as to facilitate wiring in the wiring slot.

[0016] In the above technical solution, the power housing further includes: a heat-conducting protrusion disposed on the inner wall surface of the rear side wall, and the heat-conducting protrusion is disposed opposite to the heat-generating component; wherein, at least some of the heat-generating components and the heat-conducting protrusion are provided with an insulating heat-conducting structure, and at least some of the heat-generating components and the heat-conducting protrusion have a gap between them.

[0017] By setting thermally conductive protrusions on the inner wall of the rear side of the power housing and designing the insulating thermally conductive contact area and the gap isolation area differently, directional and efficient heat dissipation is achieved.

[0018] In the above technical solution, a first mounting port is provided on the side of the power housing facing the battery housing, and a second mounting port is provided on the side of the battery housing facing the power housing. The battery housing and the power housing are detachably connected through the first mounting port and the second mounting port. The plane of the main board is parallel to the plane of the first mounting port or the included angle is less than a preset angle.

[0019] Through the precise docking design of the first and second mounting ports, combined with the parallel or near-parallel layout of the main body and the mounting port plane, efficient assembly is achieved. The housing structure includes a power housing and a battery housing. The power housing and the battery housing are respectively provided with a first mounting port and a second mounting port on their opposite sides. That is, the power housing and the battery housing are arranged adjacent to each other in the front-to-back direction. The first mounting port is opened on the contact surface of the power housing, and the second mounting port is opened on the contact surface of the battery housing. After installation, the battery module is installed in the battery housing, and the power circuit board is installed in the power housing. The power circuit board and the battery module (heat-sensitive) are arranged in separate compartments. Since the power circuit board generates a large amount of electromagnetic interference during operation, and the battery module is highly sensitive to electromagnetic interference, the mutual interference between the two can be reduced by separating them.

[0020] In the above technical solution, the power housing further includes: a heat dissipation groove, which is disposed on the outer wall surface of the rear side wall, and one end of the heat dissipation fins in the front-rear direction is connected to the bottom of the heat dissipation groove, and the extension dimension of the heat dissipation fins in the front-rear direction is not greater than the groove depth of the heat dissipation groove; wherein, the groove depth of any first clearance groove is not greater than the groove depth of the heat dissipation groove.

[0021] By setting heat dissipation grooves on the outer wall surface of the rear side wall, the heat dissipation grooves and heat dissipation fins are nested together. The heat dissipation grooves are set on the outer wall surface of the rear side wall of the power housing and extend along the direction of gravity. The heat dissipation fins are integrally formed with the bottom of the heat dissipation groove at one end in the front-back direction. The extension dimension in the front-back direction is not greater than the groove depth of the heat dissipation groove.

[0022] In the above technical solution, the energy storage device further includes: a connecting column, which is provided on the inner wall surface of the rear side wall, and a first connecting hole is provided in the connecting column; a second connecting hole is provided on the main body; wherein, the connecting piece passes through the second connecting hole and is threadedly connected to the first connecting hole.

[0023] The power circuit board is fixed to the power housing by a threaded connection. Specifically, the power housing is provided with a connecting post, one end of which is provided with a first connecting hole with threads. By providing a second connecting hole on the main body of the power circuit board, the power circuit board can be connected to the power housing under the action of the connector, thereby realizing the detachable connection between the power circuit board and the power housing.

[0024] In the above technical solution, the energy storage device further includes: a positioning column, which is provided on the inner wall surface of the rear side wall along the front-rear direction. The positioning column includes a column body and a positioning protrusion provided at one end of the column body; a positioning hole, which is provided on the main body. The shape of the positioning hole is adapted to the shape of the positioning protrusion; wherein, the main body is abutted against one end of the column body through the cooperation of the positioning hole and the positioning protrusion.

[0025] Since multiple heat-generating components are arranged on the side of the main board of the power circuit board facing the rear side wall, and multiple first clearance grooves with matching shapes are arranged on the rear side wall of the power housing, when the main board is assembled onto the power housing, the protruding heat-generating components may collide with the first clearance grooves, causing them to fall off or malfunction. Therefore, the pre-positioning of the main board is achieved through the precise matching design of the positioning pins and positioning holes.

[0026] In the above technical solution, the heating element includes a capacitor element and an inductor element. The shape of some of the first clearance slots is adapted to the shape of the capacitor element, and the shape of some of the first clearance slots is adapted to the shape of the inductor element.

[0027] Heat-generating components are classified into capacitor components and inductor components. For multiple first clearance slots, the shape and position of the first clearance slots are set according to the specific type and corresponding position of the heat-generating components. On the one hand, this can improve the utilization rate of space, and on the other hand, it can increase the heat dissipation area. Attached Figure Description

[0028] Figure 1 A schematic diagram of the structure of an energy storage device according to an embodiment of the present invention is shown;

[0029] Figure 2 A schematic diagram of the structure of a power housing according to an embodiment of the present invention is shown;

[0030] Figure 3 A schematic diagram of the structure of a power housing according to an embodiment of the present invention is shown;

[0031] Figure 4 A schematic diagram of the structure of a power circuit board according to an embodiment of the present invention is shown;

[0032] Figure 5 An exploded view of an energy storage device according to an embodiment of the present invention is shown.

[0033] Figure 6 A schematic diagram of the structure of a power housing according to an embodiment of the present invention is shown;

[0034] Figure 7 A schematic diagram of the structure of a power housing according to an embodiment of the present invention is shown;

[0035] Figure 8 An exploded view of an energy storage device according to an embodiment of the present invention is shown.

[0036] Figure 9 A schematic diagram of an energy storage component according to an embodiment of the present invention is shown;

[0037] Figure 10 A schematic diagram of an energy storage component according to an embodiment of the present invention is shown;

[0038] Figure 11 A schematic diagram of the structure of a power housing according to an embodiment of the present invention is shown;

[0039] Figure 12 A schematic diagram of the structure of a power circuit board according to an embodiment of the present invention is shown;

[0040] Figure 13 A schematic diagram of the structure of a battery casing according to an embodiment of the present invention is shown.

[0041] in, Figures 1 to 13 The correspondence between the reference numerals and component names in the attached drawings is as follows:

[0042] 100: Energy storage device; 102: Housing structure; 104: Power housing; 1042: First mounting port; 106: Battery housing; 1062: Second mounting port; 108: Power circuit board; 1082: Main board; 1084: Heating components; 1085: Capacitor components; 1086: Inductor components; 1088: Expansion board; 1088a: Input filter board; 1088b: Low-voltage driver board; 1088c: High-voltage driver board; 1088d: Main control board; 1088e: Insulated Gate Bipolar Transistor (IGBT); 110: Battery Module; 114: Battery Management and Protection Board; 116: Support Board; 118: Heat Dissipation Fins; 1242: First Clearance Groove; 1244: Second Clearance Groove; 1246: Thermally Conductive Protrusion; 1262: Mounting Groove; 1264: Wiring Groove; 128: Heat Dissipation Groove; 1302: Connecting Post; 1304: First Connecting Hole; 1306: Second Connecting Hole; 1322: Positioning Post; 1324: Post Body; 1326: Positioning Protrusion; 1328: Positioning Hole;

[0043] 200: Energy storage component; 202: Power supply device. Detailed Implementation

[0044] To better understand the above-mentioned objectives, features, and advantages of the embodiments of this utility model, the embodiments of this utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0045] Many specific details are set forth in the following description in order to provide a full understanding of this application. However, embodiments of the present invention may also be implemented in other ways different from those described herein. Therefore, the scope of protection of this application is not limited to the specific embodiments disclosed below.

[0046] The following reference Figures 1 to 13 This invention describes an energy storage device provided according to some embodiments of the present invention.

[0047] In view of this, such as Figure 1 and Figure 8 As shown, this application provides an embodiment of an energy storage device 100, including a housing structure 102 and a power circuit board 108 and a battery module 110 disposed within the housing structure 102. The housing structure 102 includes a power housing 104 and a battery housing 106. The battery module 110 is disposed within the battery housing 106. Heat dissipation fins 118 are integrated on the power housing 104, effectively reducing the space required for separately disposed heat dissipation fins 118. It can be understood that in this solution, the heat dissipation fins 118 are disposed on the side of the power housing 104 away from the battery housing 106. The power housing 104 and the battery housing 106 are arranged adjacent to each other in the front-rear direction, thereby effectively reducing the overall size of the energy storage device 100 in the front-rear direction. It should be emphasized that, based on this, the shape of the power housing 104 in this solution is structurally designed to avoid the heat-generating components 1084 on the power circuit board 108 that generate significant heat. Figure 3 Under the action of one or more first clearance slots 1242 shown, the local space is reconstructed. The heat generated by the heat-generating component 1084 can be conducted to the outside through the heat dissipation fins 118 in the corresponding area of ​​the first clearance slot 1242, thereby further reducing the size of the overall structure in the front-back direction while ensuring the heat dissipation effect.

[0048] Furthermore, the heat dissipation fins 118 and the power housing 104 are integrally formed by high-pressure die casting. A guide groove is provided between two adjacent heat dissipation fins 118, which can limit the direction of the guide groove to be consistent with the natural convection or forced air cooling airflow, thereby optimizing the airflow distribution. In addition, heat is directly conducted to the root of the corresponding fin through the bottom of the first clearance groove 1242, shortening the heat transfer path and improving heat dissipation efficiency.

[0049] Furthermore, the fin root is designed with transverse reinforcing ribs to improve bending stiffness and reduce deformation under vibration conditions.

[0050] Furthermore, the first clearance groove 1242 is formed on the inner wall surface of the rear side wall of the power housing 104, corresponding one-to-one with the heat-generating components 1084, for example... Figure 4The width of the Insulated-Gate Bipolar Transistor (IGBT) 1088e and Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) can be slightly larger than the projection of the heat-generating component 1084, for example, 3 mm larger in one direction. Furthermore, an insulating ceramic coating can be applied to the first clearance groove 1242.

[0051] The components located on the power circuit board 108 may also include ordinary components. In this case, a third clearance groove can be provided on the power housing 104, which can save space under the action of the third clearance groove corresponding to the ordinary components.

[0052] After assembly, a small gap, such as no more than 0.5 mm, can be set between the bottom of the first clearance groove 1242 and the surface of the heat-generating component 1084, and the groove can be filled with high thermal conductivity silicone grease.

[0053] By embedding components in the first clearance groove 1242, the safety clearance can be effectively reduced compared to the traditional 3mm safety clearance, for example, reduced to 0.5mm, thereby reducing the thickness of the power housing 104 and ultimately reducing the overall front-to-back dimensions of the entire unit.

[0054] In some embodiments, optionally, such as Figure 4 and Figure 5 As shown, by setting an additional expansion board 1088, different functions can be set according to requirements. Since the expansion board 1088 is set on the rear side of the main board 1082, and the heating element 1084 protrudes from the main board 1082, on the one hand, it reduces the possibility of integrating all the components of each expansion board 1088 onto the main board 1082, making the area of ​​the main board 1082 too large. On the other hand, it minimizes the increase in volume caused by setting an additional board separately, reduces the size of the power circuit board 108 in the front-to-back direction, and improves space utilization by utilizing the redundant space between the rear side wall of the power housing 104 and the main board 1082.

[0055] Furthermore, the expansion board 1088 can be connected to the motherboard 1082 via an L-shaped bracket, so that the expansion board 1088 is perpendicular to the motherboard 1082.

[0056] Furthermore, the power circuit board 108 and the expansion board 1088 are electrically connected via a board-to-board connector or a flexible circuit.

[0057] The expansion board 1088 includes, but is not limited to, an input filter board 1088a, a low-voltage driver board 1088b, a high-voltage driver board 1088c, and a main control board 1088d.

[0058] In some embodiments, optionally, such as Figure 2 As shown, one or more second clearance grooves 1244 are provided on the inner wall surface of the rear side wall of the power housing 104, which can correspond one-to-one with the projection area of ​​the expansion plate 1088, so as to avoid the expansion plate 1088, make full use of the protruding size of the heat-generating component 1084, and take into account the functions of multiple expansion plates 1088 without additionally extending the front-rear dimensions of the power housing 104.

[0059] Furthermore, an insulating step may be provided at the edge of the second clearance groove 1244.

[0060] When there are relatively protruding components on the expansion board 1088, they can be arranged in the corresponding area of ​​the second clearance groove 1244. It can be understood that the shape of the second clearance groove 1244 should be adapted to the shape of the expansion board 1088 with the protruding components. The greater the degree of protrusion of the components, the larger the groove size of the second clearance groove 1244, the larger the size of the expansion board 1088, and the deeper the groove of the second clearance groove 1244.

[0061] Furthermore, the edge of the extension plate 1088 is provided with a positioning boss, which is in clearance fit with the side wall of the second clearance groove 1244.

[0062] Furthermore, the width of the second clearance groove 1244 is 4mm larger than the maximum outer dimension of the extension plate 1088 (2mm tolerance on each side).

[0063] In some embodiments, the dimensional relationship between the heat dissipation fins 118 and the first clearance grooves 1242 is optionally defined, that is, the size of the heat dissipation fins 118 in the front-back direction is greater than the groove depth of any of the first clearance grooves 1242, which can take into account both maximizing heat dissipation efficiency and structural compactness.

[0064] Furthermore, the root of the heat dissipation fin 118 is flush with the bottom of the first clearance groove 1242, and the fin extends in the forward and backward direction, covering the clearance groove area and expanding outward.

[0065] Furthermore, the outer edge of the first clearance groove 1242 is provided with a guide slope, the specific inclination angle of which can be selected as 45°, to guide the airflow into the fin gap.

[0066] The first clearance groove 1242 only requires shallow grooves to provide expansion space for components and avoid the weakening of the shell strength caused by traditional deep grooves. The heat dissipation fins 118 extend in the front and back directions to reuse the external space of the shell. The overall front and back dimensions are smaller than those of the heat dissipation fins 118 and the shell alone, resulting in a higher degree of miniaturization.

[0067] In some embodiments, optionally, the composite design of mounting groove 1262 nested with first clearance groove 1242 further optimizes the space utilization, heat dissipation efficiency and assembly accuracy of power housing 104. The mounting groove 1262 is located on the inner wall surface of the rear side wall of power housing 104 and can be integrally die-cast with the housing. The first clearance groove 1242 is located at the bottom of mounting groove 1262 and is recessed rearward in the front-rear direction, so that the mounting groove 1262 nests with the first clearance groove 1242, and the power housing 104 has a smaller size in the front-rear direction.

[0068] Furthermore, the power circuit board 108 is fixed to the positioning reference surface of the mounting slot 1262 by four countersunk screws.

[0069] The heat dissipation path of the heat-generating component 1084 is as follows: heat-generating component 1084 → phase change material → first clearance groove 1242 → mounting groove 1262 housing → heat dissipation fins 118.

[0070] Furthermore, the first clearance groove 1242 is embedded inside the mounting groove 1262, thereby reducing the overall front-to-back dimensions of the machine.

[0071] Furthermore, the inner wall of the mounting groove 1262 and the guide slope of the first clearance groove 1242 form a gradually narrowing flow channel, which increases the airflow speed.

[0072] In some embodiments, optionally, wiring grooves 1264 are added on both sides of the mounting groove 1262 of the power housing 104, specifically on the left and right sides, and extend along the direction of gravity. The specific extension dimension can be the same as that of the mounting groove 1262, or slightly longer than the dimension of the mounting groove 1262 in the direction of gravity, so as to facilitate wiring in the wiring groove 1264.

[0073] Furthermore, a stepped layered structure can be set inside the wiring groove 1264 to accommodate the layered fixing of cables of different diameters.

[0074] Furthermore, the wall of the wiring trough 1264 has pre-set mounting holes for securing nylon cable ties or metal clamps.

[0075] The wiring groove 1264 and the power housing 104 are integrally die-cast.

[0076] Furthermore, the edge of the wiring trough 1264 is provided with a rounded corner guide structure to prevent the cable from being bent and damaged.

[0077] Furthermore, high-voltage cables are placed on the upper step, while low-voltage signal lines are located on the lower step, with a spacing of ≥10mm to reduce electromagnetic interference.

[0078] Alternatively, the high-voltage cable can be placed in the wiring slot 1264 on one side of the mounting slot 1262, and the low-voltage signal cable can be placed in the wiring slot 1264 on the other side of the mounting slot 1262, so as to minimize mutual interference.

[0079] The high-voltage cables include positive and negative terminals for connecting the photovoltaic system, while the low-voltage signal lines include antennas and grounding wires for communication.

[0080] In some embodiments, optionally, such as Figure 2 As shown, a heat-conducting protrusion 1246 is provided on the inner wall of the rear side wall of the power housing 104, and the insulating heat-conducting contact area and the gap isolation area are designed differently to achieve directional and efficient heat dissipation.

[0081] Furthermore, the thermally conductive protrusion 1246 is a cylindrical or square column protrusion with a diameter / side length matching the projection of the heating element 1084. The protrusion surface is precision milled, and an insulating thermally conductive structure, such as a gasket or elastic thermal insulation foam, is filled between the thermally conductive protrusion 1246 and the heating element 1084.

[0082] Among them, high-heat-generating components such as IGBTs and MOSFETs are in direct contact with the thermally conductive protrusions 1246 through an insulating thermally conductive structure, while low-heat-generating components such as resistors and signal capacitors can maintain a gap with the thermally conductive protrusions 1246 and rely on natural convection for heat dissipation to avoid excessive heat conduction leading to local overheating of the casing.

[0083] The gap area is filled with silicone rubber foam, which expands and deforms by absorbing heat from the components.

[0084] Among them, high-heat-generating components can be directly aligned with the center of the heat-conducting protrusion 1246 for directional heat conduction.

[0085] In some embodiments, optionally, such as Figure 8 , Figure 11 and Figure 13As shown, through the precise docking design of the first mounting port 1042 and the second mounting port 1062, combined with the parallel or nearly parallel layout of the main body 1082 and the mounting port plane, efficient assembly is achieved. The housing structure 102 includes a power housing 104 and a battery housing 106. The power housing 104 and the battery housing 106 are respectively provided with the first mounting port 1042 and the second mounting port 1062 on opposite sides, that is, the power housing 104 and the battery housing 106 are arranged adjacent to each other in the front-to-back direction. The first mounting port 1042 is opened on the contact surface of the power housing 104, and the second mounting port 1062 is opened on the contact surface of the battery housing 106. After installation, the battery module 110 is installed in the battery housing 106, and the power circuit board 108 is installed in the power housing 104. By separating the power circuit board 108 and the battery module 110 (heat sensitive) into compartments, since the power circuit board 108 will generate a large amount of electromagnetic interference during operation, and the battery module 110 is highly sensitive to electromagnetic interference, the mutual interference between the two can be reduced by separating them.

[0086] By restricting the plane of the main board body 1082 to be parallel or approximately parallel to the plane of the first mounting port 1042, the overall structure of the main board body 1082 is smaller in the front-to-back direction when it is assembled onto the power housing 104. The main board body 1082 is parallel to the mounting port plane (i.e., perpendicular to the heat sink fins 118), and the heat from the heat-generating components 1084 is directly conducted to the root of the fins.

[0087] The heat dissipation airflow is perpendicular to the 1082 plane of the motherboard, resulting in lower airflow resistance and improved convection heat dissipation efficiency.

[0088] In some embodiments, optionally, such as Figure 6 and Figure 7 As shown, a heat dissipation groove 128 is provided on the outer wall surface of the rear side wall, and the heat dissipation groove 128 and the heat dissipation fin 118 are nested together. The heat dissipation groove 128 is located on the outer wall surface of the rear side wall of the power housing 104 and extends along the direction of gravity. The heat dissipation fin 118 is integrally formed with the bottom of the heat dissipation groove 128 at one end in the front-to-back direction. The extension dimension in the front-to-back direction is not greater than the groove depth of the heat dissipation groove 128.

[0089] Furthermore, the first clearance groove 1242 is formed in the reinforcing rib area between the heat dissipation grooves 128, and its depth matches that of the heat dissipation grooves 128 to avoid weakening the overall strength of the casing.

[0090] It is understandable that the heat dissipation fins 118 are embedded in the heat dissipation groove 128, and the heat is conducted through the side wall of the groove, which can significantly increase the effective heat dissipation area.

[0091] By limiting the extension dimension of the heat dissipation fins 118 to no greater than the depth of the heat dissipation groove 128, the fins are fully embedded in the groove, and the overall front-to-back dimension of the machine only increases the groove depth.

[0092] In some embodiments, optionally, the power circuit board 108 is fixed to the power housing 104 by a threaded connection, specifically, as shown in the example below. Figure 11 and Figure 12 As shown, a connecting post 1302 is provided on the power housing 104. One end of the connecting post 1302 is provided with a first connecting hole 1304 with threads. By providing a second connecting hole 1306 on the main body 1082 of the power circuit board 108, the power circuit board 108 can be connected to the power housing 104 under the action of the connector, thereby realizing the detachable connection between the power circuit board 108 and the power housing 104.

[0093] Furthermore, the power circuit board 108 may be provided with 6 to 10 connecting posts 1302, distributed in a rectangular array. The connecting posts 1302 are provided with M3 threaded holes, namely the first connecting holes 1304. The corresponding positions of the power circuit board 108 are provided with unthreaded second connecting holes 1306. The second connecting part can be a screw. The connection between the power circuit board 108 and the power housing 104 can be achieved by tightening the screw.

[0094] The top of the connecting post 1302 is provided with a 2mm guide cone angle, which automatically corrects the positional deviation when inserted into the second connecting hole 1306.

[0095] The connecting column 1302 and the power housing 104 can be integrally formed.

[0096] In some embodiments, optionally, since multiple heat-generating components 1084 are provided on the side of the main board body 1082 of the power circuit board 108 facing the rear sidewall, and multiple first clearance grooves 1242 with matching shapes are provided on the rear sidewall of the power housing 104, when the main board body 1082 is assembled onto the power housing 104, the protruding heat-generating components 1084 may collide with the first clearance grooves 1242, resulting in detachment or failure. Therefore, the pre-positioning of the main board body 1082 is achieved through the precise matching design of the positioning post 1322 and the positioning hole 1328.

[0097] Specifically, the positioning post 1322 includes a post body 1324 and a positioning protrusion 1326. The post body 1324 is disposed on the inner wall of the rear side wall of the power housing 104 along the front-rear direction. The positioning protrusion 1326 is disposed at the front end of the post body 1324. The shape of the positioning hole 1328 is mirror-symmetrical to that of the positioning protrusion 1326. For example, the D-shaped protrusion corresponds to the D-shaped hole. After the main board body 1082 is connected to the post body 1324 through the cooperation of the positioning hole 1328 and the positioning protrusion 1326, it can be locked and fixed through the cooperation of the first connecting hole 1304, the second connecting hole 1306 and the connector.

[0098] Furthermore, a ring-shaped reinforcing rib is provided at the base of the main body.

[0099] In some embodiments, optionally, such as Figure 4 As shown, the heat-generating components 1084 are categorized into capacitor components 1085 and inductor components 1086. For the multiple first clearance slots 1242, the shape and position of the first clearance slots 1242 are set according to the specific type and corresponding position of the heat-generating components 1084. For example, the shape of the first clearance slot 1242 corresponding to the capacitor component 1085 can be a cylindrical groove adapted to an electrolytic capacitor, or a cuboid groove adapted to a film capacitor. The size of the first clearance slot 1242 needs to be larger than the outer diameter of the capacitor component 1085, specifically by 1mm to 2mm. The shape of the first clearance slot 1242 corresponding to the inductor component 1086 can be a U-shaped slot or a stepped slot, and the slot depth needs to cover at least 90% of the height of the inductor component 1086.

[0100] Furthermore, this application also provides an embodiment of an energy storage system 200, wherein at least one power supply device 202 is provided at the bottom of the energy storage device 100, specifically as follows: Figure 9 As shown, a power supply device 202 is provided at the bottom of the energy storage device 100 to enhance the energy storage capacity of the energy storage system 200, or as... Figure 10 As shown, two power supply devices 202 are installed at the bottom of the energy storage device 100 to further enhance the energy storage capacity.

[0101] In some embodiments, optionally, such as Figure 5 As shown, a battery management protection board 116 is provided. Part or all of the structure of the battery management protection board 114 is set inside the power housing 104 and is located on the side of the power circuit board 108 facing the first mounting port 1042 (i.e., close to the mating surface of the battery housing 106). The distance between the battery management protection board 114 and the power circuit board 108 is small, so that the battery management protection board 114 and the power circuit board 108 are arranged in a concentrated manner. When the two are connected, the wiring distance is short, and a board-to-board connector can be used. The connection can be achieved by simply plugging and unplugging, reducing interference and shortening unnecessary wiring.

[0102] Furthermore, the battery management protection board 114 is located in the docking area between the power housing 104 and the battery housing 106, and the signal line of the battery module 110 can be directly connected to the battery management protection board 114 through the first mounting port 1042, with a shorter path.

[0103] In some embodiments, optionally, a bracket plate 116 detachably connected to the power housing 104 is provided inside the power housing 104, and the battery management protection board 114 and the power circuit board 108 are respectively disposed on both sides of the bracket plate 116. On the one hand, this can reduce electromagnetic interference between the battery management protection board 114 and the power circuit board 108, ensuring the normal operation of the circuit board. On the other hand, the bracket plate 116 can play a certain heat insulation role, so that the heat of the power circuit board 108 and the heat of the battery management protection board 114 are separated as much as possible, and at the same time, the heat transfer to the battery module 110 is reduced.

[0104] In addition, the bracket plate 116 provides a fixation for the battery management protection board 114 to ensure the stable position of the battery management protection board 114 within the power housing 104.

[0105] Furthermore, if the battery management protection board 114 is directly fixed to the power housing 104, housing vibration (especially high-frequency vibration) will be directly transmitted to the battery management protection board 114, causing solder joint fatigue or component desoldering. Using the bracket plate 116 as an intermediate support improves the vibration resistance of the battery management protection board 114.

[0106] In this utility model, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance; the term "multiple" refers to two or more unless otherwise explicitly defined. The terms "install," "connect," "join," and "fix" should be interpreted broadly. For example, "connect" can be a fixed connection, a detachable connection, or an integral connection; "join" can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0107] In the description of this utility model, it should be understood that the terms "upper", "lower", "left", "right", "front", "rear", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or unit referred to must have a specific orientation or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0108] In the description of this specification, the terms "one embodiment," "some embodiments," "specific embodiment," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0109] The above are merely preferred embodiments of this utility model and are not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. An energy storage device, characterized by, include: The housing structure includes a power housing and a battery housing arranged adjacent to each other in the front-to-back direction. The power housing and the battery housing are detachably connected. The side of the power housing away from the battery housing is a rear sidewall. The outer wall surface of the rear sidewall is provided with a plurality of spaced heat dissipation fins. The power housing and the heat dissipation fins are integrally formed. A power circuit board is disposed inside the power housing. The power circuit board includes a main board body and a plurality of heat-generating components disposed on the main board body. The main board body is detachably connected to the power housing. The heat-generating components are disposed on the side of the main board body away from the battery housing. Multiple first clearance slots are provided on the inner wall surface of the rear side wall of the power housing, and the multiple first clearance slots are respectively provided corresponding to the multiple heat-generating components; A battery module is disposed inside the battery housing, and the battery module is electrically connected to the power circuit board.

2. The energy storage device of claim 1, wherein, The power circuit board also includes: At least one expansion board, wherein the at least one expansion board is electrically connected to the motherboard body, and the at least one expansion board is disposed on the rear side of the motherboard body.

3. The energy storage device of claim 2, wherein, The power housing also includes: At least one second clearance groove is provided on the inner wall surface of the rear side wall of the power housing, and the at least one second clearance groove is respectively provided with the at least one expansion plate.

4. The energy storage device of claim 1, wherein, The dimensions of the heat dissipation fins in the front-back direction are greater than the depth of any of the first clearance slots.

5. The energy storage device of claim 1, wherein, The power housing also includes: The mounting groove is provided on the inner wall surface of the rear side wall of the power housing; The first clearance groove is located at the bottom of the mounting groove, and the first clearance groove is recessed backward along the front-back direction.

6. The energy storage device of claim 5, wherein, The power housing also includes: Wiring grooves are provided on both sides of the mounting groove, and the wiring grooves extend along the direction of gravity.

7. The energy storage device of claim 5, wherein, The power housing also includes: A thermally conductive protrusion is provided on the inner wall surface of the rear sidewall, and the thermally conductive protrusion is disposed opposite to the heating element; Wherein, at least some of the heating elements are provided with an insulating thermally conductive structure between them and the thermally conductive protrusion, and at least some of the heating elements are provided with a gap between them and the thermally conductive protrusion.

8. The energy storage device according to any one of claims 1 to 7, characterized in that, The power housing has a first mounting port on the side facing the battery housing, and the battery housing has a second mounting port on the side facing the power housing. The battery housing and the power housing are detachably connected through the first mounting port and the second mounting port. Wherein, the plane on which the motherboard body is located is parallel to the plane on which the first mounting port is located, or the angle between them is less than a preset angle.

9. The energy storage device of any one of claims 1-7, wherein, The power housing also includes: A heat dissipation groove is provided on the outer wall surface of the rear side wall. One end of the heat dissipation fins in the front-rear direction is connected to the bottom of the heat dissipation groove. The extension dimension of the heat dissipation fins in the front-rear direction is not greater than the groove depth of the heat dissipation groove. Wherein, the depth of any of the first clearance slots is not greater than the depth of the heat dissipation slot.

10. The energy storage device of any one of claims 1-7, wherein, The energy storage device also includes: A connecting post is provided on the inner wall surface of the rear side wall, and a first connecting hole is provided in the connecting post; The second connection hole is provided on the main board body; The connector passes through the second connecting hole and is threadedly connected to the first connecting hole.

11. The energy storage device of any one of claims 1-7, wherein, Also includes: A positioning post is provided on the inner wall surface of the rear side wall along the front-rear direction. The positioning post includes a post body and a positioning protrusion provided at one end of the post body. A positioning hole is provided on the main body, and the shape of the positioning hole is adapted to the shape of the positioning protrusion; The main board body is abutted against one end of the column body through the positioning hole and the positioning protrusion.

12. The energy storage device of claim 1, wherein, The heating element includes a capacitor and an inductor. The shape of a portion of the first clearance slots is adapted to the shape of the capacitor, and the shape of a portion of the first clearance slots is adapted to the shape of the inductor.

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