Adsorption device for chip substrate

Abstract

The utility model relates to the technical field of chip processing, and particularly discloses a chip substrate adsorption device which comprises a base, the base is of a hollow cylinder structure with an opening in the upper surface, a motor is fixed to the bottom surface of the base in an embedded mode, the output end of the motor is fixedly connected with a bearing table, the bearing table is of a cylinder structure, and the bearing table is fixedly connected with the base. The lower surface of the bearing table is provided with an annular protrusion which is rotationally connected with the bottom surface of the base, three objective tables are annularly embedded into the upper surface of the bearing table, each objective table is of a hollow cylinder structure, and a plurality of air holes are formed in the upper surface of each objective table. According to the adsorption device for the chip substrate, the three objective tables are annularly arranged on the objective table, the air holes are formed in the surfaces of the objective tables, negative pressure can be formed on the surfaces of the objective tables through the air guide cover by means of the air pump, the chip substrate is adsorbed and fixed to the surfaces of the objective tables, and damage to the chip substrate in the chip substrate fixing process is avoided.

Description

Technical Field

[0001] This utility model relates to the field of chip processing technology, specifically to an adsorption device for a chip substrate. Background Technology

[0002] In the semiconductor manufacturing and chip packaging process, the processing of the chip substrate is a crucial step. The chip substrate is a basic component that carries the chip, providing electrical connections and mechanical support. In order to ensure the performance and quality of the chip, the chip substrate needs to be fixed during the chip processing to facilitate subsequent processing operations, such as chip mounting, wire bonding, and testing.

[0003] Currently, chip substrates are typically fixed using mechanical clamping methods, such as clamps or jaws, to hold the edges of the chip substrate in place. However, mechanical clamping may damage the edges of the substrate during the clamping process, especially for thin or fragile substrates, which may lead to substrate breakage or edge chipping, causing substrate deformation and affecting the accuracy of subsequent processing. Utility Model Content

[0004] The purpose of this invention is to provide an adsorption device for a chip substrate. This device is equipped with a suction cup structure connected to an air pump to adsorb and fix the chip substrate, thereby solving the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: an adsorption device for a chip substrate, comprising a base, wherein the base is a hollow cylindrical structure with an open upper surface, a motor is embedded and fixed on the bottom surface of the base, and a support platform is fixedly connected to the output end of the motor. The support platform is a cylindrical structure, and an annular protrusion is provided on the lower surface of the support platform and rotatably connected to the bottom surface of the base. Three loading platforms are annularly embedded on the upper surface of the support platform. The loading platforms are hollow cylindrical structures, and multiple vent holes are provided on the upper surface of the loading platforms. An air extraction structure is provided inside the loading platforms. The air extraction structure uses an air pump to achieve the adsorption and fixing process of the chip substrate. The air extraction structure includes an air guide hood, which is located inside the loading platforms and completely blocks the vent holes on the upper surface of the loading platforms.

[0006] Preferably, a connecting pipe is provided through the lower surface of the air guide hood, and the other end of the connecting pipe of the air guide hood passes through the loading platform and the support platform and is connected to the upper cylinder.

[0007] Using the above technical solution, a negative pressure can be formed on the surface of the stage by the air guide hood to adsorb and fix the chip substrate.

[0008] Preferably, the upper cylinder is a hollow annular structure with an open lower surface. The surface of the upper cylinder is provided with a rotating structure. The rotating structure connects the air pump and the air guide cover through the lower cylinder without hindering the rotation process of the support platform.

[0009] By adopting the above technical solution, the rotation structure can avoid obstructing the rotation process of the support platform.

[0010] Preferably, the rotating structure includes a lower cylinder, which is a hollow annular structure. The upper surface of the lower cylinder is connected to the lower surface of the upper cylinder, and the upper and lower cylinders are rotatably connected. The lower cylinder is fixedly installed on the bottom surface of the base, and a pipe is provided through the lower surface of the lower cylinder. The other end of the pipe on the bottom surface of the lower cylinder is connected to an air pump, and the air pump is fixedly installed on the lower surface of the base.

[0011] By adopting the above technical solution, the rotation of the lower cylinder and the upper cylinder can be avoided by using a rotating connection.

[0012] Preferably, the upper surface of the support platform is provided with a pre-fixing structure, which pre-fixes the chip substrate by means of a locking block to prevent the chip substrate from shifting.

[0013] By adopting the above technical solution, the chip substrate can be pre-fixed using the pre-fixed structure.

[0014] Preferably, the pre-fixed structure includes a support cylinder, which is fixedly installed at the center of the support platform. The support cylinder is hollow inside, and an electric push rod is fixedly installed on the upper surface of the support cylinder. A moving rod is fixedly connected to the output end of the electric push rod. The moving rod is a circular plate structure with a circular rod connected to it. Three locking blocks are arranged in a ring on the outer surface of the moving rod. The locking blocks are L-shaped and slide through the surface of the support cylinder. The three locking blocks are respectively aligned with three platforms.

[0015] By using the above technical solution, the chip substrate can be pre-fixed by the pressing block, thus preventing the chip substrate from shifting.

[0016] Compared with the prior art, the beneficial effects of this utility model are: the adsorption device for the chip substrate:

[0017] 1. In this device, three platforms are arranged in a ring on the platform. The surface of the platform is provided with ventilation holes. By using an air pump, a negative pressure can be formed on the surface of the platform using an air guide hood, which will adsorb and fix the chip substrate on the surface of the platform, thus avoiding damage to the chip substrate during the fixing process.

[0018] 2. The support platform in this device rotates under the drive of the motor, which can drive the surface stage to rotate, thereby simultaneously adsorbing and fixing multiple chip substrates, and using the rotating support platform to quickly switch between different chip substrates, increasing the efficiency of chip substrate processing.

[0019] 3. In this device, a support cylinder is installed on the upper surface of the support platform, and a sliding block is installed on the surface of the support cylinder. The electric push rod can drive the block downward to pre-fix the chip substrate, so as to prevent the chip substrate from shifting before the air pump is started. Attached Figure Description

[0020] Figure 1 This is a front view structural diagram of the present invention;

[0021] Figure 2 This is a schematic diagram of the structure of this utility model from below;

[0022] Figure 3 This is a schematic diagram of the front section structure of the base of this utility model;

[0023] Figure 4 This is a schematic diagram of the orthographic section of the platform structure of this utility model;

[0024] Figure 5 This is a schematic diagram of the front section structure of the support cylinder of this utility model;

[0025] Figure 6 This is a schematic diagram of the front section structure of the upper cylinder of this utility model.

[0026] In the diagram: 1. Base; 2. Motor; 3. Support platform; 4. Carrying platform; 5. Upper cylinder; 6. Lower cylinder; 7. Air pump; 8. Support cylinder; 9. Electric push rod; 10. Moving rod; 11. Locking block; 12. Air guide cover. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0028] Please see Figures 1-6 This utility model provides a technical solution: an adsorption device for a chip substrate, including a base 1, a motor 2, a support platform 3, a loading platform 4, an upper cylinder 5, a lower cylinder 6, an air pump 7, a support cylinder 8, an electric push rod 9, a moving rod 10, a locking block 11, and an air guide cover 12.

[0029] The base 1 is a hollow cylindrical structure with an open upper surface. A motor 2 is embedded and fixed on the bottom surface of the base 1. The output end of the motor 2 is fixedly connected to a support platform 3. The support platform 3 is a cylindrical structure. The lower surface of the support platform 3 is provided with an annular protrusion that is rotatably connected to the bottom surface of the base 1. The upper surface of the support platform 3 is provided with a pre-fixing structure. The pre-fixing structure pre-fixes the chip substrate through the locking block 11 to prevent the chip substrate from shifting. The pre-fixing structure includes a support cylinder 8, which is fixedly installed at the center of the support platform 3. The support cylinder 8 is hollow inside. An electric push rod 9 is fixedly installed on the upper surface of the support cylinder 8. The output end of the electric push rod 9 is fixedly connected to a moving rod 10. The moving rod 10 is a circular plate structure with a circular rod connected to it. The outer surface of the moving rod 10 is provided with three locking blocks 11 in an annular shape. The locking blocks 11 slide through the surface of the support cylinder 8. The three locking blocks 11 are respectively aligned with three platforms 4.

[0030] like Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, when using this device to adsorb and fix the chip substrate, the chip substrate is placed on the surface of the stage 4, so that the vent holes on the surface of the stage 4 are in contact with the chip substrate. The electric push rod 9 is activated, and the electric push rod 9 drives the moving rod 10 to move downward inside the support cylinder 8. The moving rod 10 drives the locking block 11 to slide downward and pre-fix the chip substrate on the surface of the stage 4, so as to avoid displacement of the chip substrate due to airflow during the adsorption and fixation process. The motor 2 is activated, and the motor 2 drives the support stage 3 to rotate. The rotating support stage 3 will drive the stage 4 and the chip substrate on the surface to rotate synchronously, and the angle will change, so as to facilitate the switching of different chip substrates and the processing of different chip substrates.

[0031] Three platforms 4 are annularly embedded in the upper surface of the support platform 3. Each platform 4 is a hollow cylindrical structure with multiple ventilation holes on its upper surface. An air extraction structure is installed inside each platform 4, which uses an air pump 7 to adsorb and fix the chip substrate. The air extraction structure includes an air guide hood 12, which is located inside the platform 4 and completely blocks the ventilation holes on the upper surface of the platform 4. A connecting pipe is installed through the lower surface of the air guide hood 12, and the other end of the connecting pipe passes through the platform 4 and the support platform 3 to connect with the upper cylinder 5, which is a hollow cylinder. The upper cylinder 5 has an open lower surface and a rotating structure on its surface. The rotating structure connects the air pump 7 to the air guide hood 12 via the lower cylinder 6 without hindering the rotation of the support platform 3. The rotating structure includes the lower cylinder 6, which is a hollow annular structure. The upper surface of the lower cylinder 6 is connected to the lower surface of the upper cylinder 5. The upper cylinder 5 and the lower cylinder 6 are rotatably connected. The lower cylinder 6 is fixedly installed on the bottom surface of the base 1. A pipe is provided through the lower surface of the lower cylinder 6. The other end of the pipe on the bottom surface of the lower cylinder 6 is connected to the air pump 7. The air pump 7 is fixedly installed on the lower surface of the base 1.

[0032] like Figure 4 , Figure 5 and Figure 6 As shown, after the chip substrate is placed on the surface of the stage 4, the air pump 7 is started. When the air pump 7 is pumping air, it is connected to the lower cylinder 6 through a pipe. The surface of the lower cylinder 6 is rotatably connected to the upper cylinder 5 and finally connected to the air guide shroud 12 through a pipe. Therefore, when the air pump 7 is pumping air, the air in the air guide shroud 12 is extracted, and a negative pressure is formed in the air vents on the surface of the stage 4, which adsorbs and fixes the chip substrate on the surface of the stage 4, facilitating the subsequent processing of the chip substrate. When the motor 2 drives the support stage 3 to rotate, the support stage 3 will synchronously drive the upper cylinder 5 to rotate on the surface of the lower cylinder 6. Therefore, the upper cylinder 5 and the lower cylinder 6 will not interfere with the rotation of the support stage 3.

[0033] Working Principle: When using the adsorption device for this chip substrate, the chip substrate is placed on the surface of the stage 4. The electric push rod 9 is activated, causing the moving rod 10 and the locking block 11 to move downwards, pre-fixing the chip substrate. The air pump 7 is then activated to draw air, creating negative pressure through the air vents on the surface of the stage 4 via the air pump 7 and the air guide shroud 12, adsorbing and fixing the chip substrate onto the surface of the stage 4. The motor 2 is then activated, causing the support platform 3 to rotate. The rotation of the support platform 3, in turn, rotates the stage 4, causing the angle of the chip substrate to change. This allows for the switching of different chip substrates for processing.

[0034] Motor 2 drives the support platform 3 to rotate, and the rotating support platform 3 will drive the surface stage 4 and the chip substrate to rotate synchronously, causing changes in angle, which facilitates the switching of different chip substrates and increases the overall practicality.

[0035] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An adsorption device for a chip substrate, comprising a base (1), wherein the base (1) is a hollow cylindrical structure with an open upper surface, a motor (2) is embedded and fixed on the bottom surface of the base (1), and a support platform (3) is fixedly connected to the output end of the motor (2), wherein the support platform (3) is a cylindrical structure, characterized in that: The lower surface of the support platform (3) is provided with an annular protrusion that is rotatably connected to the bottom surface of the base (1). The upper surface of the support platform (3) is embedded with three platforms (4). The platforms (4) are hollow cylindrical structures. The upper surface of the platforms (4) is provided with multiple ventilation holes. The interior of the platforms (4) is provided with an air extraction structure. The air extraction structure uses an air pump (7) to perform the adsorption and fixation process on the chip substrate. The air extraction structure includes an air guide cover (12). The air guide cover (12) is located inside the platforms (4) and completely blocks the ventilation holes on the upper surface of the platforms (4).

2. The chip substrate adsorption device according to claim 1, characterized by: A connecting pipe is provided through the lower surface of the air guide hood (12), and the other end of the connecting pipe of the air guide hood (12) passes through the loading platform (4) and the support platform (3) and is connected to the upper cylinder (5).

3. The chip substrate adsorption device according to claim 2, characterized by: The upper cylinder (5) is a hollow annular structure with an open lower surface. The surface of the upper cylinder (5) is provided with a rotating structure. The rotating structure connects the air pump (7) and the air guide cover (12) through the lower cylinder (6) without hindering the rotation process of the support platform (3).

4. The chip substrate adsorption device according to claim 3, characterized by: The rotating structure includes a lower cylinder (6), which is a hollow annular structure. The upper surface of the lower cylinder (6) is connected to the lower surface of the upper cylinder (5). The upper cylinder (5) and the lower cylinder (6) are rotatably connected. The lower cylinder (6) is fixedly installed on the bottom surface of the base (1). A pipe is provided through the lower surface of the lower cylinder (6). The other end of the pipe on the bottom surface of the lower cylinder (6) is connected to an air pump (7). The air pump (7) is fixedly installed on the lower surface of the base (1).

5. The chip substrate adsorption device according to claim 1, characterized by: The upper surface of the support platform (3) is provided with a pre-fixing structure. The pre-fixing structure pre-fixes the chip substrate through the card block (11) to prevent the chip substrate from shifting.

6. The chip substrate adsorption device according to claim 5, wherein: The pre-fixed structure includes a support cylinder (8), which is fixedly installed at the center of the support platform (3). The support cylinder (8) is hollow inside. An electric push rod (9) is fixedly installed on the upper surface of the support cylinder (8). A moving rod (10) is fixedly connected to the output end of the electric push rod (9). The moving rod (10) is a circular plate structure with a circular rod connected to it. Three locking blocks (11) are arranged in a ring on the outer surface of the moving rod (10). The locking blocks (11) are L-shaped and slide through the surface of the support cylinder (8). The three locking blocks (11) are respectively aligned with the three platforms (4).

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