Fixing tool for coating film on micro semiconductor probe head

By designing a fixed fixture consisting of an upper plate, a middle plate, and a bottom plate, and using limiting steps and positioning components to stabilize and fix the probe, the problem of easy probe displacement during the coating process is solved, thus improving the coating effect.

CN224160682UActive Publication Date: 2026-04-24SUZHOU LANGRUI ELECTRONICS TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SUZHOU LANGRUI ELECTRONICS TECH CO LTD
Filing Date
2025-05-29
Publication Date
2026-04-24

AI Technical Summary

Technical Problem

Existing tooling cannot effectively fix the fine semiconductor probe head, causing the probe to easily shift during the coating process and affecting the coating effect.

Method used

The fixture consists of an upper plate, a middle plate, and a bottom plate. The probe is securely fixed by the limiting step abutting against the probe step and the bottom face of the bottom plate abutting against the bottom end of the probe, combined with the positioning component and the locking component.

Benefits of technology

To ensure the stability of the probe during the coating process, avoid displacement, and improve coating uniformity and quality.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of semiconductor testing, in particular to a fixing tool for coating a fine semiconductor probe head, which comprises a tool body, the tool body comprises an upper plate, a middle plate and a bottom plate which are sequentially stacked and detachably fixed, the upper plate is provided with a small hole for a probe to penetrate through, and a probe head protrudes out of the surface of the upper plate; the middle plate is provided with a middle hole for the probe to penetrate through, the end face of the bottom plate abuts against the bottom end of the probe, and a limiting step which abuts against the upper step portion of the probe in a limiting mode is formed between the upper plate and the middle plate. The limiting step is in limiting contact with the step part on the probe, and the end face of the bottom plate is in contact with the bottom end of the probe, so that the probe is stably fixed, displacement and shaking of the probe in the coating process are avoided, and the coating uniformity and quality are improved.
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Description

Technical Field

[0001] This application relates to the technical field of semiconductor testing, and in particular to a fixture for coating micro-semiconductor probes. Background Technology

[0002] Semiconductors are materials whose conductivity lies between that of conductors and insulators. Their electrical properties directly determine the working efficiency and reliability of devices, and semiconductor probes are needed to achieve microscopic characterization and performance testing of semiconductor materials.

[0003] The tiny semiconductor probes are made of conductive copper. The probes are slender and have steps. In the field of semiconductor testing, a tungsten alloy film layer needs to be deposited on the probe tip using the PVD process to achieve insulation, wear resistance, and non-soldering. It is required that all parts except the probe tip must be completely covered. Ordinary tooling cannot effectively hold the tiny probes. Displacement is likely to occur during the coating process, making it impossible to accurately locate non-coated areas. This can easily cause film contamination and affect the coating effect of the probe tip.

[0004] Therefore, a fixture is needed for coating micro-semiconductor probes to solve the problem that existing fixtures cannot securely fix micro-semiconductor probes and improve the coating effect of probes. Utility Model Content

[0005] In order to accurately position and stably hold the fine probe and achieve full coverage of the non-coated area, this application provides a fixing fixture for coating fine semiconductor probe tips.

[0006] This application provides a fixture for coating micro-semiconductor probes, which adopts the following technical solution:

[0007] A fixture for coating a micro-semiconductor probe tip includes a fixture body. The fixture body includes an upper plate, a middle plate, and a bottom plate that are stacked and detachably fixed in sequence. The upper plate has a small hole for the probe to pass through, with the probe tip protruding from the surface of the upper plate. The middle plate has a central hole for the probe to pass through. The end face of the bottom plate abuts against the bottom end of the probe. A limiting step is formed between the upper plate and the middle plate, which mutually limits and abuts against the upper step portion of the probe.

[0008] By adopting the above technical solution, the upper plate, middle plate and bottom plate can be detached and fixed, which facilitates the assembly and disassembly of the tooling body and the installation and removal of the probe. The probe passes through the upper plate through the small hole and through the middle plate through the middle hole. The probe tip protrudes from the surface of the upper plate, which facilitates the coating operation on the tip. The limiting step formed between the upper plate and the middle plate abuts against the step part of the probe. The bottom plate abuts against the bottom end of the probe, thereby fixing and limiting the position of the probe and ensuring the stability of the probe during the coating process.

[0009] Optionally, the inner diameter of the small hole is smaller than the inner diameter of the middle hole, and the small hole and the middle hole are coaxially arranged.

[0010] By adopting the above technical solution, the inner diameter of the small hole is smaller than that of the middle hole, which better fits the shape of the probe. The small hole and the middle hole are set coaxially, which allows the probe to be stably installed inside the upper plate and the middle plate, restricting the radial position of the probe and ensuring the accuracy of probe placement.

[0011] Optionally, the tooling body is provided with a first positioning component for positioning the upper plate and the middle plate at opposite installation positions.

[0012] By adopting the above technical solution, the first positioning component realizes the positioning and installation of the upper plate and the middle plate, which can ensure the accurate installation position of the upper plate and the middle plate and guarantee the accuracy and stability of the probe installation.

[0013] Optionally, the first positioning component includes a first positioning hole formed on the upper plate and a first positioning member that positions and cooperates with the first positioning hole. The first positioning member is fixedly installed on the side of the middle plate facing the upper plate.

[0014] By adopting the above technical solution, the first positioning hole and the first positioning component are positioned and matched, which can accurately position the relative installation position of the upper plate and the middle plate, improve the tooling assembly accuracy, and ensure the accuracy of probe placement.

[0015] Optionally, the tooling body is further provided with a second positioning component consisting of a positioning base plate and a middle plate.

[0016] By adopting the above technical solution and setting the second positioning component, the base plate and the middle plate are accurately installed, further improving the fixing effect of the probe.

[0017] Optionally, the second positioning component includes a second positioning hole formed on the base plate and a second positioning member that positions and cooperates with the second positioning hole. The second positioning member is fixedly installed on the side of the middle plate facing the base plate.

[0018] By adopting the above technical solution, the second positioning component on the middle plate and the second positioning hole on the bottom plate are positioned and matched, which can accurately position the installation position of the bottom plate and the middle plate, and improve the accuracy and precision of the tooling body assembly.

[0019] Optionally, the tooling body is further provided with a locking assembly for locking the upper plate, the middle plate and the bottom plate. The locking assembly includes a locking hole on the upper plate and a locking member on the bottom plate. The locking member passes through the middle plate and is threaded into the locking hole.

[0020] By adopting the above technical solution, the locking component, after passing through the middle plate, engages with the locking hole of the upper plate through a threaded connection, which can effectively fasten the upper plate, middle plate, and bottom plate, preventing displacement or loosening between the plates during the coating process, and improving the overall stability and reliability of the tooling.

[0021] Optionally, the middle plate has a through hole for the locking component to pass through, and the through hole and the locking hole are coaxially arranged.

[0022] By adopting the above technical solution, through holes are set in the middle plate, and locking components are used to tightly lock the upper plate, middle plate and bottom plate, making the tooling more stable and reliable.

[0023] Optionally, the thickness of the middle plate is less than the length from the upper step of the probe to the bottom of the probe.

[0024] By adopting the above technical solution, when the probe is fixed on the tooling body, the contact effect between the probe and the limiting step and the base plate is further strengthened, thereby enhancing the axial limiting of the probe.

[0025] Optionally, the limiting step is an annular boss structure, and the upper surface of the limiting step abuts against the step surface of the step portion.

[0026] By adopting the above technical solution, the limiting step realizes circumferential contact with the probe, which can further enhance the limiting effect on the probe step and make the probe fixation more stable and reliable.

[0027] In summary, this application includes at least one of the following beneficial technical effects:

[0028] 1. The upper plate, middle plate and bottom plate are stacked in sequence and can be detachably fixed. The limiting step and the upper step of the probe are in limiting contact, and the end face of the bottom plate is in contact with the bottom end of the probe. This achieves a stable fixation of the probe, avoids probe displacement and shaking during the coating process, and improves coating uniformity and quality.

[0029] 2. The inner diameter of the small hole is smaller than that of the middle hole, which better fits the shape of the probe. The small hole and the middle hole are set coaxially, which allows the probe to be stably inserted into the upper plate and the middle plate, restricting the radial position of the probe and ensuring the accuracy of the probe placement.

[0030] 3. The limiting step enables circumferential contact with the probe, which further enhances the limiting effect on the probe step, making the probe fixation more stable and reliable. Attached Figure Description

[0031] Figure 1 This is a structural schematic diagram of an embodiment of the present application, used to illustrate the state in which the probe is fixed on the tooling body;

[0032] Figure 2 This is a schematic diagram of the probe structure, used to illustrate the positional relationship of the stepped parts on the probe;

[0033] Figure 3 This is a partial cross-sectional view of an embodiment of this application, showing the specific structure of the first positioning component and the second positioning component;

[0034] Figure 4 for Figure 3 The enlarged schematic diagram of section A shows the positional relationship between the stepped part of the probe and the limiting step on the tooling body.

[0035] Figure 5 The exploded view of this embodiment is used to illustrate the positional relationship between the first positioning component, the second positioning component, and the locking component.

[0036] Reference numerals: 1. Tooling body; 111. Upper plate; 112. Small hole; 121. Middle plate; 122. Middle hole; 131. Base plate; 2. Limiting step; 3. Probe; 311. Needle head; 312. Step portion; 4. First positioning assembly; 411. First positioning hole; 412. First positioning element; 5. Second positioning assembly; 511. Second positioning hole; 512. Second positioning element; 6. Locking assembly; 611. Locking hole; 612. Through hole; 613. Locking element. Detailed Implementation

[0037] The following is in conjunction with the appendix Figure 1-5 This application will be described in further detail.

[0038] Example:

[0039] A fixture for coating micro-semiconductor probes, reference Figure 1 and Figure 2 The fixture body 1 includes an upper plate 111, a middle plate 121, and a bottom plate 131. The upper plate 111, middle plate 121, and bottom plate 131 are stacked sequentially. The upper plate 111, middle plate 121, and bottom plate 131 are fixedly connected and can be quickly disassembled, facilitating the installation and removal of the probe 3. Combined with… Figure 4The upper plate 111 has multiple small holes 112 penetrating through it, and the middle plate 121 has multiple central holes 122 penetrating through it. The positions of the small holes 112 and the central holes 122 correspond one-to-one. The probe 3 is inserted through the small holes 112 and the central holes 122. A limiting step 2 is provided between the upper plate 111 and the middle plate 121, formed by the corresponding small holes 112 and central holes 122, to allow the probe 3 to... The upper plate 111 and the middle plate 121 are positioned together. The probe 3 includes a needle 311 and a step 312. The needle 311 of the probe 3 extends out of the small hole 112 and protrudes from the surface of the upper plate 111, which facilitates the coating work on the needle 311. The step 312 of the probe 3 abuts against the limiting step 2. The bottom end of the probe 3 abuts against the upper surface of the base plate 131, so that the probe 3 is firmly fixed on the tooling body 1, and the probe 3 is prevented from shifting during the coating process.

[0040] refer to Figure 3 and Figure 4 The small hole 112 and the middle hole 122 are coaxially arranged, which facilitates the probe 3 to accurately penetrate the small hole 112 and the middle hole 122. The inner diameter of the small hole 112 is smaller than the inner diameter of the middle hole 122. A limiting step 2 is formed between the upper plate 111 and the middle plate 121. The limiting step 2 is an annular boss structure. The lower surface of the limiting step 2 abuts against the upper surface of the upper step 312 of the probe 3. The thickness of the middle plate 121 is less than the length from the step 312 of the probe 3 to the bottom of the probe 3. The probe 3 will have a slight elastic deformation, which enhances the contact stability between the probe 3 and the limiting step 2 and the bottom plate 131, and ensures the axial limiting of the probe 3.

[0041] refer to Figure 3 and Figure 5 The tooling body 1 is provided with a first positioning component 4, which is disposed on the upper plate 111 and the middle plate 121. The first positioning component 4 includes a first positioning hole 411 and a first positioning element 412. The first positioning hole 411 is disposed through the upper plate 111, and the first positioning element 412 is fixedly installed on the side of the middle plate 121 facing the upper plate 111. In this embodiment, the first positioning element 412 is a positioning pin and is fixed to the side of the middle plate 121 facing the upper plate 111 by welding. The first positioning hole 411 and the first positioning element 412 are clearance-fitted to facilitate the assembly and disassembly of the upper plate 111 and the middle plate 121. The positioning fit between the first positioning hole 411 and the first positioning element 412 ensures the accuracy of the installation position of the upper plate 111 and the middle plate 121.

[0042] refer to Figure 3 and Figure 5The tooling body 1 is also provided with a second positioning component 5, which is disposed on the middle plate 121 and the bottom plate 131. The second positioning component 5 includes a second positioning hole 511 and a second positioning element 512. The second positioning hole 511 is disposed through the bottom plate 131, and the second positioning element 512 is fixedly installed on the side of the middle plate 121 facing the bottom plate 131. In this embodiment, the second positioning element 512 is a positioning pin and is fixed to the side of the middle plate 121 facing the bottom plate 131 by welding. The second positioning hole 511 and the second positioning element 512 are clearance-fitted to facilitate the assembly and disassembly of the middle plate 121 and the bottom plate 131. The positioning fit between the second positioning hole 511 and the second positioning element 512 ensures the accuracy of the installation position of the middle plate 121 and the bottom plate 131.

[0043] refer to Figure 1 and Figure 5 The tooling body 1 is also provided with a locking assembly 6, which includes a locking hole 611, a through hole 612, and a locking member 613. The locking hole 611 is disposed through the upper plate 111, and the through hole 612 is disposed through the middle plate 121. The locking hole 611 and the through hole 612 are coaxially arranged. The locking member 613 is detachably installed on the bottom plate 131. In this embodiment, the locking hole 611 is a threaded hole, and the locking member 613 is a bolt that is threaded with the locking hole 611. After the locking member 613 passes through the through hole 612, it is threaded with the locking hole 611 to realize the locking and fixing of the upper plate 111, the middle plate 121 and the bottom plate 131.

[0044] The implementation principle of this application embodiment is as follows: When fixing the probe 3 using the tooling body 1, the probe 3 passes sequentially through the small hole 112 of the upper plate 111 and the middle hole 122 of the middle plate 121. The probe tip 311 protrudes from the surface of the upper plate 111. By using the coaxial arrangement of the small hole 112 and the middle hole 122, the precise position of the probe 3 is ensured. The stepped portion 312 on the probe 3 abuts against the limiting step 2, and at the same time, the bottom end of the probe 3 abuts against the upper surface of the base plate 131. The probe 3 undergoes slight elastic deformation, which enhances the contact stability between the probe 3 and the limiting step 2 and the base plate 131. During the process, the upper plate 111 and the middle plate 121 are quickly positioned by the clearance fit between the first positioning member 412 and the first positioning hole 411, and the middle plate 121 and the bottom plate 131 are quickly positioned by the clearance fit between the second positioning member 512 and the second positioning hole 511, ensuring that the tooling body 1 is installed in an accurate position and facilitating the assembly and disassembly of the tooling body 1. The locking member 613 passes through the through hole 612 of the middle plate 121 and is threadedly engaged with the locking hole 611 of the upper plate 111, firmly locking the upper plate 111, the middle plate 121 and the bottom plate 131, thus completing the stable fixing of the probe 3 on the tooling body 1.

[0045] The above are all preferred embodiments of this application and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A fixture for coating micro-semiconductor probes, comprising a fixture body (1), characterized in that: The tooling body (1) includes a detachable and fixed upper plate (111), a middle plate (121) and a bottom plate (131) stacked in sequence. The upper plate (111) has a small hole (112) for the probe (3) to pass through and the needle (311) protruding from the surface of the upper plate (111). The middle plate (121) has a central hole (122) for the probe (3) to pass through. The end face of the bottom plate (131) abuts against the bottom end of the probe (3). A limiting step (2) is formed between the upper plate (111) and the middle plate (121) to limit and abut against the upper step (312) of the probe (3).

2. The fixture for coating micro-semiconductor probes according to claim 1, characterized in that: The inner diameter of the small hole (112) is smaller than the inner diameter of the middle hole (122), and the small hole (112) and the middle hole (122) are coaxially arranged.

3. The fixture for coating micro-semiconductor probes according to claim 1, characterized in that: The tooling body (1) is provided with a first positioning component (4) in which the positioning upper plate (111) and the middle plate (121) are installed in relative positions.

4. The fixture for coating micro-semiconductor probes according to claim 3, characterized in that: The first positioning component (4) includes a first positioning hole (411) opened on the upper plate (111) and a first positioning member (412) that is positioned and engaged with the first positioning hole (411). The first positioning member (412) is fixedly installed on the side of the middle plate (121) facing the upper plate (111).

5. The fixture for coating micro-semiconductor probes according to claim 3, characterized in that: The tooling body (1) is also provided with a second positioning component (5) for the positioning base plate (131) and the middle plate (121).

6. The fixture for coating micro-semiconductor probes according to claim 5, characterized in that: The second positioning component (5) includes a second positioning hole (511) opened on the base plate (131) and a second positioning member (512) that is positioned and engaged with the second positioning hole (511). The second positioning member (512) is fixedly installed on the side of the middle plate (121) facing the base plate (131).

7. The fixture for coating micro-semiconductor probes according to claim 1, characterized in that: The tooling body (1) is also provided with a locking assembly (6) for locking the upper plate (111), the middle plate (121) and the bottom plate (131). The locking assembly (6) includes a locking hole (611) opened on the upper plate (111) and a locking member (613) provided on the bottom plate (131). The locking member (613) passes through the middle plate (121) and is threadedly engaged with the locking hole (611).

8. The fixture for coating micro-semiconductor probes according to claim 6, characterized in that: The middle plate (121) has a through hole (612) for the locking member (613) to pass through, and the through hole (612) and the locking hole (611) are coaxially arranged.

9. The fixture for coating micro-semiconductor probes according to claim 1, characterized in that: The thickness of the middle plate (121) is less than the length from the upper step (312) of the probe (3) to the bottom of the probe (3).

10. A fixture for coating micro-semiconductor probes according to claim 1, characterized in that: The limiting step (2) is an annular boss structure, and the upper surface of the limiting step (2) abuts against the step surface of the step part (312).