Image forming apparatus
By introducing detector modules, shielding structures, and cooling structures into PET equipment, and utilizing liquid cooling and air cooling components to actively dissipate heat from the detector modules, the problem of poor heat dissipation in high-temperature environments of PET equipment is solved, achieving temperature stability and improved imaging performance.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- WUHAN UNITED IMAGING HEALTHCARE CO LTD
- Filing Date
- 2024-12-16
- Publication Date
- 2026-04-28
AI Technical Summary
Existing insertion-type PET equipment has poor heat dissipation performance in high-temperature enclosed environments, causing the temperature of the detector's electronic components to rise sharply, affecting imaging performance and reducing service life.
It employs a detector module, a shielding structure, and a cooling structure. The cooling structure includes liquid cooling components and gas cooling components, which actively dissipate heat from the detector module using liquid or gaseous refrigerants, reducing reliance on the shielding structure.
It effectively reduces the temperature of the detector module, stabilizes imaging performance, extends the service life of the equipment, and at the same time keeps the shielding performance of the shielding structure unaffected.
Smart Images

Figure CN224166299U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of medical device technology, and more specifically, relates to an imaging device. Background Technology
[0002] In the medical field, imaging equipment generally includes computed tomography (CT) equipment, positron emission tomography (PET) equipment, and magnetic resonance imaging (MRI) equipment. PET equipment can be combined with MRI equipment to form a PET-MR system. A PET-MR system is a hybrid imaging device that integrates a PET scanner and an MRI scanner, enabling simultaneous PET and MRI imaging.
[0003] During image scanning in insertion PET and MR devices, MR devices generate alternating strong magnetic fields and high-frequency vibrations. The alternating strong magnetic field causes the temperature of the internal detector electronics in the PET device to rise rapidly, thus affecting the detector's imaging performance. Existing insertion PET devices generally use air cooling or natural cooling to dissipate heat from the electronic components of the PET detector. However, due to the performance limitations of air cooling or natural cooling, when insertion PET devices operate in a high-temperature, enclosed environment for extended periods, the temperature of the internal PET detector electronics also rises sharply, affecting the detector's imaging performance and reducing its lifespan. Utility Model Content
[0004] The purpose of this utility model embodiment is to provide an imaging device to solve the technical problem of poor heat dissipation performance and poor imaging performance of the existing insert-type PET device.
[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows: an imaging device is provided, including a detector module, a shielding structure, and a cooling structure for transmitting refrigerant to the detector module. The shielding structure includes an inner shielding cylinder, an outer shielding cylinder, and two shielding rings. The detector module is disposed between the inner shielding cylinder and the outer shielding cylinder. The shielding rings connect the ends of the inner shielding cylinder and the outer shielding cylinder. The cooling structure is used to cool the detector module.
[0006] Optionally, the cooling structure includes at least one of a liquid cooling component and an air cooling component, wherein the refrigerant of the liquid cooling component is a liquid and the refrigerant of the air cooling component is a gas.
[0007] Optionally, the detector module includes a scintillation crystal, a first circuit board and a second circuit board disposed on one side of the scintillation crystal, and a third circuit board disposed on the other side of the scintillation crystal.
[0008] Optionally, the cooling structure includes a liquid cooling assembly, and the number of detector modules is multiple. At least one of the first circuit board, the second circuit board, and the third circuit board dissipates heat through the liquid cooling assembly. The liquid cooling assembly includes a liquid input structure, a liquid distributor, a liquid cooling plate, and a liquid output structure. The circuit board that dissipates heat through the liquid cooling assembly is in contact with the liquid cooling plate. The liquid distributor has a liquid supply port communicating with the liquid input structure and multiple detector liquid supply ports that supply liquid to each of the detector modules respectively.
[0009] Optionally, multiple detector modules are arranged sequentially along the circumference, the liquid distributor is annular, and the liquid supply port is located at the first end of the liquid distributor, while the detector supply port is located at the second end of the liquid distributor; the first end of the liquid distributor also has a liquid return port communicating with the liquid output structure, and the second end of the liquid distributor also has multiple detector return ports for collecting the liquid returning from the detector modules, and the liquid input structure and the liquid output structure are located at the same end of the detector modules.
[0010] Optionally, the cooling structure further includes an air-cooling component, wherein the first circuit board and the second circuit board dissipate heat through the liquid-cooling component, and the third circuit board dissipates heat through the air-cooling component; the first circuit board and the second circuit board are both in contact with the liquid-cooling plate; the air-cooling component includes a cooler, a first heat exchanger, a second heat exchanger, a gas input structure, and a gas output structure, wherein the hot end of the cooler is in contact with the liquid-cooling plate, the cold end of the cooler is in contact with the first heat exchanger, the second heat exchanger is in contact with the third circuit board, and the gas input structure, the first heat exchanger, the second heat exchanger, and the gas output structure are sequentially connected to form an air-cooling channel.
[0011] Optionally, in the same detector module, the first circuit board, the second circuit board, and the third circuit board are all cooled by the liquid cooling assembly. There are two liquid cooling plates. The first circuit board and the second circuit board are in contact with one of the liquid cooling plates, and the third circuit board is in contact with the other liquid cooling plate.
[0012] Optionally, the cooling structure further includes an air-cooling component, wherein the first circuit board dissipates heat through the liquid-cooling component, and the second and third circuit boards dissipate heat through the air-cooling component; the first circuit board is in contact with the liquid-cooling plate; the air-cooling component includes a cooler, a third heat exchanger, two fourth heat exchangers, a gas input structure, and a gas output structure, wherein the hot end of the cooler is in contact with the liquid-cooling plate, the cold end of the cooler is in contact with the third heat exchanger, the two fourth heat exchangers are in contact with the second circuit board and the third circuit board respectively, and the gas input structure, the third heat exchanger, the two fourth heat exchangers, and the gas output structure are sequentially connected to form an air-cooling channel.
[0013] Optionally, the gas output structure is an exhaust port or an exhaust pipe.
[0014] Optionally, a shock-absorbing structure is provided between the same end of the inner shielding cylinder and the outer shielding cylinder and the adjacent shielding ring.
[0015] The beneficial effects of the imaging device provided by this utility model are as follows: Compared with the prior art, the imaging device of this utility model includes a detector module, a shielding structure, and a cooling structure. The detector module is located inside the shielding structure to reduce the impact of radio frequency interference signals from the internal electronic components of the imaging device on surrounding imaging devices. The cooling structure is used to cool the detector module, quickly removing the heat generated by the internal electronic components of the imaging device. This stabilizes the temperature and imaging performance of the imaging device and extends its service life. It eliminates the need for large-area openings on the surface of the imaging device for air cooling, effectively ensuring the shielding performance of the imaging device. Attached Figure Description
[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0017] Figure 1 A three-dimensional structural diagram of the imaging device provided in the embodiments of this utility model;
[0018] Figure 2 A schematic diagram of the structure of an imaging device inserted into an MR device according to an embodiment of the present utility model;
[0019] Figure 3 A cross-sectional view of a first imaging device provided in an embodiment of this utility model;
[0020] Figure 4A simplified internal structure diagram of the first imaging device provided in this embodiment of the utility model;
[0021] Figure 5 for Figure 4 Sectional view along line AA;
[0022] Figure 6 A three-dimensional structural diagram of the first heat exchanger and the second heat exchanger provided for embodiments of this utility model;
[0023] Figure 7 A three-dimensional structural diagram of the liquid dispenser provided in an embodiment of this utility model;
[0024] Figure 8 A structural diagram of the exhaust port at the end of the imaging device provided in an embodiment of this utility model;
[0025] Figure 9 This is a schematic diagram of the structure of a second imaging device provided in an embodiment of the present utility model;
[0026] Figure 10 This is a schematic diagram of the structure of a third imaging device provided in an embodiment of the present invention.
[0027] The following are the labeling elements in the figure:
[0028] 100 - Imaging device; 10 - Detector module; 11 - First circuit board; 12 - Second circuit board; 13 - Third circuit board; 14 - Scintillation crystal; 20 - Shielding structure; 21 - Inner shielding cylinder; 22 - Outer shielding cylinder; 23 - Shielding ring; 24 - Shock absorption structure; 40 - Cooling structure; 41 - Liquid cooling assembly; 411 - Liquid input structure; 412 - Liquid output structure; 413 - Distributor; 4131 - Distributor supply port; 4132 - Detector supply port; 4133 - Detector return port; 4134 - Distributor return port; 414 - Liquid cooling plate; 42 - Gas cooling assembly; 421 - Gas input structure; 422 - Gas output structure; 423 - Refrigerator; 424 - First heat exchanger; 425 - Second heat exchanger; 426 - Microchannel structure;
[0029] 200-gradient coil. Detailed Implementation
[0030] To make the technical problems, technical solutions, and beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.
[0031] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.
[0032] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0033] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.
[0034] A PET-MR device is a hybrid imaging device that integrates a PET scanner and an MRI scanner, enabling simultaneous PET and MR imaging. Specifically, the PET scanner is inserted into the MRI scanner for use.
[0035] During image scanning in insertion PET and MR devices, the MR device generates alternating strong magnetic fields and high-frequency vibrations. The alternating strong magnetic field causes a rapid increase in temperature of the internal detector electronics in the PET device, thus affecting the detector's imaging performance. Existing insertion PET devices generally use air cooling or natural cooling to dissipate heat from the electronic components of the PET detector. However, due to the performance limitations of air cooling or natural cooling, when insertion PET devices operate for extended periods in a high-temperature, enclosed environment, the temperature of the internal PET detector electronics also rises sharply, affecting the detector's imaging performance and reducing its lifespan. To improve the speed of air cooling and natural cooling, some PET devices incorporate structures such as heat dissipation holes on their surface. This reduces the shielding performance of the PET device, affecting the imaging quality of both PET and MR devices.
[0036] To alleviate and solve the above technical problems, this utility model also provides an imaging device 100, which includes a detector module 10, a shielding structure 20 and a cooling structure 40. The cooling structure 40 can transfer refrigerant to the detector module 10 to cool the detector module 10 quickly. Moreover, there is no need to open heat dissipation vents on the shielding structure 20, which can ensure the shielding effect of the shielding structure 20.
[0037] The imaging device 100 provided in the embodiments of this utility model will now be described.
[0038] Please see Figure 1 and Figure 2 The imaging device 100 can be inserted into the gradient coil 200 of the MR device. Most of the outer surface of the imaging device 100 is wrapped by the gradient coil 200. Therefore, the imaging device 100 has poor heat exchange with the air and heat is easily accumulated inside the imaging device 100. Thus, the passive heat dissipation capacity of the imaging device 100 is poor.
[0039] Please refer to the following: Figures 3 to 5 The imaging device 100 includes a detector module 10, a shielding structure 20, and a cooling structure 40 for transmitting refrigerant to the detector module 10. The shielding structure 20 includes an inner shielding cylinder 21, an outer shielding cylinder 22, and two shielding rings 23. The detector module 10 is disposed between the inner shielding cylinder 21 and the outer shielding cylinder 22. The shielding rings 23 connect the ends of the inner shielding cylinder 21 and the ends of the outer shielding cylinder 22. The cooling structure 40 is used to cool the detector module 10.
[0040] The detector module 10 is the main functional module in the imaging device 100. The detector module 10 has a structure that generates heat when powered on, such as circuit boards and electronic devices. Therefore, the detector module 10 is the heat generation module in the imaging device 100. Active heat dissipation of the detector module 10 can prevent heat from accumulating in the detector module 10.
[0041] The shielding structure 20 is used to shield electromagnetic signals and prevent electromagnetic waves emitted by the detector module 10 and the electronic components in the MR equipment from interfering with each other. The shielding structure 20 is generally made of metallic material. The shielding structure 20 includes an inner shielding cylinder 21, an outer shielding cylinder 22, and two shielding rings 23. The inner shielding cylinder 21 is disposed inside the outer shielding cylinder 22, and the detector module 10 is located between the inner shielding cylinder 21 and the outer shielding cylinder 22. The structure formed by the inner shielding cylinder 21 and the outer shielding cylinder 22 can be called a shielding cylinder. The two axial ends of the shielding cylinder are respectively called the first end and the second end. The shielding rings 23 connect the ends of the inner shielding cylinder 21 and the outer shielding cylinder 22; that is, one shielding ring 23 connects the first end of the inner shielding cylinder 21 and the first end of the outer shielding cylinder 22, and the other shielding ring 23 connects the second end of the inner shielding cylinder 21 and the second end of the outer shielding cylinder 22. Thus, the shielding structure 20 forms a Faraday cage, and the detector module 10 is located inside the shielding structure 20.
[0042] The cooling structure 40 can deliver refrigerant to the detector module 10, thereby removing heat from the detector module 10. The refrigerant can be a liquid, gas, etc. Specifically, the cooling structure 40 includes at least a refrigerant input structure and a refrigerant output structure. The refrigerant enters the interior of the imaging device 100 through the refrigerant input structure, removes heat from the detector module 10, and is output from the refrigerant output structure.
[0043] The imaging device 100 in the above embodiments includes a detector module 10, a shielding structure 20, and a cooling structure 40. The detector module 10 is located inside the shielding structure 20 to reduce the impact of radio frequency interference signals from the internal electronic components of the imaging device 100 on surrounding imaging devices 100. The cooling structure 40 is used to cool the detector module 10, quickly removing the heat generated by the internal electronic components of the imaging device 100. This stabilizes the temperature and imaging performance of the imaging device 100 and extends its service life. It eliminates the need for large-area openings on the surface of the imaging device 100 for air cooling, effectively ensuring the shielding performance of the imaging device 100.
[0044] Please refer to some embodiments of this utility model. Figure 4 and Figure 5 The cooling structure 40 includes at least one of a liquid cooling component 41 and a gas cooling component 42. The liquid cooling component 41 uses a liquid as the refrigerant, and the gas cooling component 42 uses a gas as the refrigerant. Both the liquid cooling component 41 and the gas cooling component 42 can cool the detector module 10, and the appropriate cooling structure 40 can be used according to the actual scenario.
[0045] When the liquid cooling component 41 is in operation, it introduces a cryogenic liquid into the imaging device 100, and then a high-temperature liquid is output from the imaging device 100; alternatively, it introduces a room-temperature liquid into the imaging device 100, cools it through the cooler 423, and after heat exchange with the detector module 10, the high-temperature liquid is output from the imaging device 100. When the gas cooling component 42 is in operation, it introduces a cryogenic gas into the imaging device 100, and then a high-temperature gas is output from the imaging device 100; alternatively, it introduces a room-temperature gas into the imaging device 100, cools it through the cooler 423, and after heat exchange with the detector module 10, the high-temperature gas is output from the imaging device 100.
[0046] Please refer to some embodiments of this utility model. Figure 5 The detector module 10 includes a scintillation crystal 14, a first circuit board 11 and a second circuit board 12 disposed on one side of the scintillation crystal 14, and a third circuit board 13 disposed on the other side of the scintillation crystal 14. The scintillation crystal 14 is a crystal that can convert the kinetic energy of high-energy particles such as X-rays into light energy and emit a flash when struck, thus allowing doctors to see X-rays penetrating the human body. The scintillation crystal 14 has a first side and a second side disposed opposite to each other. The first circuit board 11 and the second circuit board 12 are both located on the first side of the scintillation crystal 14, and the third circuit board 13 is located on the second side of the scintillation crystal 14.
[0047] The arrangement of the first circuit board 11, the second circuit board 12 and the third circuit board 13 is relatively dispersed to avoid excessive heat concentration and facilitate heat dissipation for each circuit board.
[0048] In some embodiments, the first circuit board 11 and the second circuit board 12 are arranged side by side, that is, the first circuit board 11 and the second circuit board 12 are spaced apart in a direction perpendicular to the thickness direction of the first circuit board 11, so that the first circuit board 11 and the second circuit board 12 have no overlapping parts, which can accelerate heat dissipation.
[0049] In some embodiments, the second circuit board 12 and the third circuit board 13 are attached to the first and second sides of the scintillation crystal 14, which can make full use of the internal space of the imaging module.
[0050] Please refer to some embodiments of this utility model. Figure 3 and Figure 7The cooling structure 40 includes a liquid cooling assembly 41. There are multiple detector modules 10. At least one of the first circuit board 11, the second circuit board 12, and the third circuit board 13 dissipates heat through the liquid cooling assembly 41. The liquid cooling assembly 41 includes a liquid input structure 411, a liquid distributor 413, a liquid cooling plate 414, and a liquid output structure 412. The circuit board that dissipates heat through the liquid cooling assembly 41 is in contact with the liquid cooling plate 414. The liquid distributor 413 has a liquid supply port 4131 that communicates with the liquid input structure 411 and multiple detector supply ports 4132 that supply liquid to each detector module 10 respectively.
[0051] Each detector module 10 is located inside the shielding structure 20. A liquid input structure 411 is used to input refrigerant, and a distributor 413 divides the input refrigerant into multiple liquid flow channels, which then flow to each detector module 10, cooling each module and increasing the cooling rate of the imaging device 100. A liquid cooling plate 414 provides cooling and facilitates heat exchange with the detector modules 10. A liquid output structure 412 outputs the heat-exchanged liquid, typically a high-temperature liquid. The liquid input structure 411, distributor 413, liquid cooling plate 414, and liquid output structure 412 can be sequentially connected to form a liquid cooling channel. The number of detector liquid supply ports 4132 is the same as the number of detector modules 10, with each port corresponding to a detector module 10. The circuit board that dissipates heat through the liquid cooling assembly 41 is at least one of the first circuit board 11, the second circuit board 12, and the third circuit board 13.
[0052] By using the distributor 413, the refrigerant can be introduced into each adjacent detector module 10 to dissipate heat from each detector module 10, thereby accelerating the heat dissipation speed and preventing heat concentration.
[0053] In some embodiments, the liquid cooling plate 414 may be a water cooling plate, that is, the refrigerant is water. The interior of the liquid cooling plate 414 may be serpentine or other shapes, which can increase the length of the flow channel within a limited area and improve the heat exchange efficiency of the liquid cooling plate 414 and the circuit board.
[0054] In some embodiments, the liquid input into the liquid input structure 411 is a cryogenic liquid. After the cryogenic liquid enters the liquid cooling plate 414 and exchanges heat with the detector module 10, the high-temperature liquid flows out from the liquid input structure 411.
[0055] In some embodiments, the liquid inlet structure 411 and the liquid outlet structure 412 are liquid flow pipes or liquid flow channels formed by a shell structure.
[0056] Please refer to some embodiments of this utility model. Figure 3 and Figure 7Multiple detector modules 10 are arranged sequentially along the circumference. The liquid distributor 413 is annular, with the liquid supply port 4131 located at the first end of the liquid distributor 413 and the detector supply port 4132 located at the second end of the liquid distributor 413. The first end of the liquid distributor 413 also has a liquid return port 4134 connected to the liquid output structure 412. The second end of the liquid distributor 413 also has multiple detector return ports 4133 for collecting the liquid returning from the detector modules 10. The liquid input structure 411 and the liquid output structure 412 are located at the same end of the detector modules 10.
[0057] The distributor 413 is annular, with its two ends in the axial direction being the first end and the second end, respectively. There is one distributor supply port 4131 and one distributor return port 4134. The number of detector supply ports 4132 and detector return ports 4133 are the same as the number of detector modules 10. Each detector supply port 4132, each detector module 10 corresponding to a liquid cooling plate 414, and each detector return port 4133 are sequentially connected. Specifically, the liquid input structure 411, distributor supply port 4131, detector supply port 4132, liquid cooling plate 414, detector return port 4133, distributor return port 4134, and liquid output structure 412 can be sequentially connected to form a liquid cooling channel.
[0058] Multiple detector modules 10 are arranged in a ring, and the distributor 413 is also ring-shaped, allowing the detector supply port 4132 and detector return port 4133 on the distributor 413 to be set one-to-one with each detector module 10, facilitating the connection of the liquid flow channels. Furthermore, the high-temperature liquid return flow after heat exchange is also collected through the distributor 413, making the internal structure of the equipment more compact. It also allows the liquid input structure 411 and liquid output structure 412 to be located at the same end of the detector module 10, facilitating liquid transport and recovery.
[0059] In some embodiments, at the second end of the liquid dispenser 413, a detector supply port 4132 and a detector return port 4133 are arranged adjacently to form a liquid interface group. The number of liquid interface groups is the same as the number of detector modules 10. Multiple liquid interface groups are arranged sequentially at intervals along the circumference of the liquid dispenser 413.
[0060] In some embodiments, the dispenser 413 is disposed inside the shielding structure 20 and at one axial end of the detector module 10 to shorten the distance between the dispenser 413 and the detector module 10.
[0061] Please refer to some embodiments of this utility model. Figure 4 and Figure 5The cooling structure 40 also includes an air-cooling component 42. The first circuit board 11 and the second circuit board 12 are both cooled by the liquid-cooling component 41, and the third circuit board 13 is cooled by the air-cooling component 42. The first circuit board 11 and the second circuit board 12 are both in contact with the liquid-cooling plate 414. The air-cooling component 42 includes a cooler 423, a first heat exchanger 424, a second heat exchanger 425, a gas input structure 421, and a gas output structure 422. The hot end of the cooler 423 is in contact with the liquid-cooling plate 414, the cold end of the cooler 423 is in contact with the first heat exchanger 424, and the second heat exchanger 425 is in contact with the third circuit board 13. The gas input structure 421, the first heat exchanger 424, the second heat exchanger 425, and the gas output structure 422 are connected in sequence to form an air-cooling channel.
[0062] In the air-cooling assembly 42, the cooler 423 transfers heat, causing the temperature to rise in some areas and fall in others. The cooler 423 is generally used in the manufacture of portable refrigerators, insulated boxes, and hot / cold water dispensers. The first heat exchanger 424 and the second heat exchanger 425 are both devices that transfer part of the heat from a hot fluid to a cold fluid; they are also called heat exchangers. The gas input structure 421 is the channel for gas to enter the imaging device 100, and the gas output structure 422 is the channel for gas to exit the imaging device 100. When the air-cooling assembly 42 is working, heat transfer occurs in the cooler 423. One end of the cooler 423 experiences a temperature increase, forming the hot end of the cooler 423, while the other end experiences a temperature decrease, forming the cold end of the cooler 423. Normal temperature gas is input from gas input structure 421, becomes low temperature gas after passing through first heat exchanger 424, and then passes through second heat exchanger 425. The low temperature gas exchanges heat with the second heat exchanger 425, the temperature of third circuit board 13 decreases, the low temperature gas becomes high temperature gas, and is output to the outside of imaging device 100 through gas output structure 422.
[0063] In the liquid cooling assembly 41, the cryogenic liquid enters the interior of the imaging device 100 through the liquid input structure 411, and flows to the liquid cooling plate 414 corresponding to each detector module 10 through the liquid distributor 413. After the liquid cooling plate 414 exchanges heat with the first circuit board 11, the second circuit board 12 and the cooler 423, the liquid temperature in the liquid cooling plate 414 rises and is output to the outside of the imaging device 100 through the liquid output structure 412.
[0064] The first circuit board 11 and the second circuit board 12 share the same liquid cooling plate 414, which can reduce the number of liquid cooling plates 414. At the same time, the liquid cooling plate 414 is used to dissipate heat from the hot end of the cooler 423, making the design more reasonable and the cooling capacity fully utilized.
[0065] In some embodiments, thermal pads are provided between the first circuit board 11 and the liquid cooling plate 414, and between the second circuit board 12 and the liquid cooling plate 414, which can improve heat exchange efficiency.
[0066] In some embodiments, a thermal pad is provided between the third circuit board 13 and the second heat exchanger 425 to improve heat exchange efficiency.
[0067] Please refer to some embodiments of this utility model. Figure 9 In the same detector module 10, the first circuit board 11, the second circuit board 12, and the third circuit board 13 are all cooled by a liquid cooling assembly 41. There are two liquid cooling plates 414. The first circuit board 11 and the second circuit board 12 are in contact with one of the liquid cooling plates 414, and the third circuit board 13 is in contact with the other liquid cooling plate 414. The two liquid cooling plates 414 are located on opposite sides of the scintillation crystal 14, which is a reasonable layout.
[0068] The first circuit board 11 and the second circuit board 12 share the same liquid cooling plate 414, which reduces the number of liquid cooling plates 414. Moreover, all three circuit boards use liquid cooling plates 414 for heat dissipation, eliminating the need for air cooling components 42, and their internal structure is relatively simple.
[0069] In some embodiments, the imaging device 100 has a liquid input structure 411 and a liquid output structure 412, and two liquid cooling plates 414 share the same liquid input structure 411 and the same liquid output structure 412. Alternatively, the imaging device 100 has one liquid input structure 411 and two liquid output structures 412, and the two liquid cooling plates 414 share the same liquid input structure 411, with each liquid cooling plate 414 connected to a corresponding liquid output structure 412. Alternatively, the imaging device 100 has two liquid input structures 411 and one liquid output structure 412, and the two liquid cooling plates 414 are connected to their respective liquid input structures 411, sharing the same liquid output structure 412. Alternatively, the imaging device 100 has two liquid input structures 411 and two liquid output structures 412, with each liquid cooling plate 414 connected to its respective liquid input structure 411 and liquid output structure 412.
[0070] Please refer to some embodiments of this utility model. Figure 10The cooling structure 40 also includes an air-cooling component 42. The first circuit board 11 dissipates heat through the liquid-cooling component 41, and the second circuit board 12 and the third circuit board 13 dissipate heat through the air-cooling component 42. The first circuit board 11 is in contact with the liquid-cooling plate 414. The air-cooling component 42 includes a cooler 423, a third heat exchanger, two fourth heat exchangers, a gas input structure 421, and a gas output structure 422. The hot end of the cooler 423 is in contact with the liquid-cooling plate 414, and the cold end of the cooler 423 is in contact with the third heat exchanger. The two fourth heat exchangers are in contact with the second circuit board 12 and the third circuit board 13, respectively. The gas input structure 421, the third heat exchanger, the two fourth heat exchangers, and the gas output structure 422 are connected in sequence to form an air-cooling channel.
[0071] In the air-cooling assembly 42, the cooler 423 transfers heat, causing the temperature to rise in some areas and fall in others. The third and fourth heat exchangers are devices that transfer some of the heat from the hot fluid to the cold fluid; they are also called heat exchangers. The gas input structure 421 is the channel for gas to enter the imaging device 100, and the gas output structure 422 is the channel for gas to exit the imaging device 100. When the air-cooling assembly 42 is working, heat transfer occurs in the cooler 423. One end of the cooler 423 heats up, forming the hot end, while the other end cools down, forming the cold end. Room temperature gas enters through the gas input structure 421, becomes low-temperature gas after passing through the third heat exchanger, and then passes through two fourth heat exchangers. The low-temperature gas exchanges heat with the fourth heat exchangers, causing the temperatures of the second circuit board 12 and the third circuit board 13 to decrease. The low-temperature gas becomes high-temperature gas and is then output to the outside of the imaging device 100 through the gas output structure 422.
[0072] In the liquid cooling assembly 41, the cryogenic liquid enters the interior of the imaging device 100 through the liquid input structure 411, and flows to the liquid cooling plate 414 corresponding to each detector module 10 through the liquid distributor 413. After the liquid cooling plate 414 exchanges heat with the first circuit board 11 and the cooler 423, the liquid temperature in the liquid cooling plate 414 rises, and is output to the outside of the imaging device 100 through the liquid output structure 412.
[0073] In some embodiments, the second circuit board 12 and the third circuit board 13 are respectively attached to the opposite sides of the scintillation crystal 14 so that they can both be cooled by the air-cooling assembly 42.
[0074] In some embodiments of this utility model, the cooler 423 is a semiconductor cooler. The semiconductor cooler connects two different metals with a conductor. When a direct current is applied, the temperature at one junction decreases and the temperature at the other junction increases.
[0075] In some embodiments of this utility model, the first circuit board 11 is a detector control board (Module Control Board, abbreviated as MCB board), and the second circuit board 12 and the third circuit board 13 are both SiPM array boards (SiPM Array Board, abbreviated as SAB board).
[0076] In some embodiments of this utility model, the heat exchanger is provided with a microchannel structure 426 inside. The microchannel structure 426 has a large surface area, which can improve the heat exchange efficiency of the heat exchanger and make the circuit board cool down faster.
[0077] In some embodiments, the microchannel structure 426 includes a plurality of fins arranged at intervals in sequence, and / or includes a plurality of protrusions arranged in an array.
[0078] It should be noted that the aforementioned heat exchanger refers to at least one of the first heat exchanger 424, the second heat exchanger 425, the third heat exchanger, and the fourth heat exchanger.
[0079] In some embodiments, please refer to Figure 6 Both the first heat exchanger 424 and the second heat exchanger 425 have microchannel structures 426.
[0080] In some embodiments of this utility model, the gas input structure 421 is an air inlet or an air inlet pipe.
[0081] In some embodiments of this utility model, the gas output structure 422 is an exhaust port or an exhaust pipe.
[0082] In some embodiments, please refer to Figure 8 , Figure 8 The left side shows a three-dimensional structural diagram of one end of the imaging device 100. Figure 8 The right side shows an enlarged view of the structure at point B in the left image. As can be seen, the imaging device 100 has multiple exhaust ports at one end, allowing high-temperature gases to escape.
[0083] Please refer to some embodiments of this utility model. Figure 3 A shock-absorbing structure 24 is provided between the same end of the inner shielding cylinder 21 and the outer shielding cylinder 22 and the adjacent shielding ring 23. The inner shielding cylinder 21 and the outer shielding cylinder 22 can be referred to as shielding cylinders. A shock-absorbing structure 24 is provided between one axial end of the shielding cylinder and one of the shielding rings 23, and a shock-absorbing structure 24 is also provided between the other axial end of the shielding cylinder and the other shielding ring 23.
[0084] By setting the shock-absorbing structure 24, the imaging device 100 can alleviate and absorb the impact force when it is inserted into the MR device, thereby reducing the impact force on the detector module 10.
[0085] In some embodiments, the shock-absorbing structure 24 is a structure that can deform under stress, such as an airbag, spring, or elastic material.
[0086] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. An imaging device, characterized in that: The device includes a detector module (10), a shielding structure (20), and a cooling structure (40) for transmitting refrigerant to the detector module (10). The shielding structure (20) includes an inner shielding cylinder (21), an outer shielding cylinder (22), and two shielding rings (23). The detector module (10) is disposed between the inner shielding cylinder (21) and the outer shielding cylinder (22). The shielding rings (23) connect the ends of the inner shielding cylinder (21) and the ends of the outer shielding cylinder (22). The cooling structure (40) is used to cool the detector module (10).
2. The imaging device as described in claim 1, characterized in that: The cooling structure (40) includes at least one of a liquid cooling component (41) and an air cooling component (42), wherein the refrigerant of the liquid cooling component (41) is a liquid and the refrigerant of the air cooling component (42) is a gas.
3. The imaging device as described in claim 1, characterized in that: The detector module (10) includes a scintillation crystal (14), a first circuit board (11) and a second circuit board (12) disposed on one side of the scintillation crystal (14), and a third circuit board (13) disposed on the other side of the scintillation crystal (14).
4. The imaging device as described in claim 3, characterized in that: The cooling structure (40) includes a liquid cooling assembly (41), and there are multiple detector modules (10). At least one of the first circuit board (11), the second circuit board (12), and the third circuit board (13) dissipates heat through the liquid cooling assembly (41). The liquid cooling assembly (41) includes a liquid input structure (411), a liquid distributor (413), a liquid cooling plate (414), and a liquid output structure (412). The circuit board that dissipates heat through the liquid cooling assembly (41) is in contact with the liquid cooling plate (414). The liquid distributor (413) has a liquid supply port (4131) communicating with the liquid input structure (411) and multiple detector supply ports (4132) that supply liquid to each of the detector modules (10).
5. The imaging device as described in claim 4, characterized in that: Multiple detector modules (10) are arranged in sequence along the circumference. The liquid distributor (413) is annular, and the liquid supply port (4131) is located at the first end of the liquid distributor (413), while the detector supply port (4132) is located at the second end of the liquid distributor (413). The first end of the liquid distributor (413) also has a liquid return port (4134) that communicates with the liquid output structure (412). The second end of the liquid distributor (413) also has multiple detector return ports (4133) that collect the return liquid from the detector modules (10). The liquid input structure (411) and the liquid output structure (412) are located at the same end of the detector modules (10).
6. The imaging device as described in claim 4, characterized in that: The cooling structure (40) further includes an air-cooling component (42). The first circuit board (11) and the second circuit board (12) dissipate heat through the liquid-cooling component (41), and the third circuit board (13) dissipates heat through the air-cooling component (42). The first circuit board (11) and the second circuit board (12) are both in contact with the liquid-cooling plate (414). The air-cooling component (42) includes a cooler (423), a first heat exchanger (424), a second heat exchanger (425), a gas input structure (421), and a gas output structure (422). The hot end of the cooler (423) is in contact with the liquid-cooling plate (414), the cold end of the cooler (423) is in contact with the first heat exchanger (424), and the second heat exchanger (425) is in contact with the third circuit board (13). The gas input structure (421), the first heat exchanger (424), the second heat exchanger (425), and the gas output structure (422) are sequentially connected to form an air-cooling channel.
7. The imaging device as described in claim 4, characterized in that: In the same detector module (10), the first circuit board (11), the second circuit board (12) and the third circuit board (13) are all cooled by the liquid cooling assembly (41). There are two liquid cooling plates (414). The first circuit board (11) and the second circuit board (12) are in contact with one of the liquid cooling plates (414), and the third circuit board (13) is in contact with the other liquid cooling plate (414).
8. The imaging device as described in claim 4, characterized in that: The cooling structure (40) further includes an air-cooling component (42). The first circuit board (11) dissipates heat through the liquid-cooling component (41), and the second circuit board (12) and the third circuit board (13) dissipate heat through the air-cooling component (42). The first circuit board (11) is in contact with the liquid-cooling plate (414). The air-cooling component (42) includes a cooler (423), a third heat exchanger, two fourth heat exchangers, a gas input structure (421), and a gas output structure (422). The hot end of the cooler (423) is in contact with the liquid-cooling plate (414), and the cold end of the cooler (423) is in contact with the third heat exchanger. The two fourth heat exchangers are in contact with the second circuit board (12) and the third circuit board (13), respectively. The gas input structure (421), the third heat exchanger, the two fourth heat exchangers, and the gas output structure (422) are connected in sequence to form an air-cooling channel.
9. The imaging device as described in claim 6 or 8, characterized in that: The gas output structure (422) is an exhaust port or an exhaust pipe.
10. The imaging device according to any one of claims 1-8, characterized in that: A shock-absorbing structure (24) is provided between the same end of the inner shielding cylinder (21) and the outer shielding cylinder (22) and the adjacent shielding ring (23).