Silicon carbide crystal alignment bonding equipment
By detecting a reference circle on a silicon carbide crystal and using a robotic arm to drive the annular support coaxially with the bonding disk, the problem of the bonding disk center offset before the silicon carbide crystal is rolled round is solved, thus improving the defect removal rate and slice quality.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- TONGWEI MICROELECTRONICS CO LTD
- Filing Date
- 2025-04-29
- Publication Date
- 2026-04-28
AI Technical Summary
In the prior art, the center of the bonding pad and the center of the crystal are misaligned before the silicon carbide crystal is rounded, which results in the defects on the circumference of the crystal not being removed after rounding, affecting the slice quality.
Using an adhesive bonding device and a centering device, a camera module detects the reference circle on the silicon carbide crystal. The robotic arm drives the ring support to be coaxial with the adhesive plate, ensuring that the effective part of the silicon carbide crystal is coaxial with the adhesive plate, thus achieving precise bonding.
This improves the removal rate of defects on the circumference of silicon carbide crystals after rounding, ensuring the quality of the slices.
Smart Images
Figure CN224170158U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the technical field of silicon carbide crystal rounding equipment, and more specifically, to a silicon carbide crystal alignment and bonding equipment. Background Technology
[0002] Before the silicon carbide crystal is rounded, a bonding pad needs to be bonded to the silicon surface of the crystal, and then the rounding process is performed to remove defects at the edge of the silicon carbide crystal. The remaining effective part is the defect-free silicon carbide crystal, which can then be sliced.
[0003] However, defects at the edge of silicon carbide crystals are generally non-uniform, meaning that the center of the effective part and the center of the crystal are usually offset. In the prior art, when bonding the bonding pad, it is assumed that the center of the bonding pad coincides with the center of the crystal. This may result in some defects in the circumferential direction of the crystal not being removed after rounding, resulting in defects in the wafer formed after slicing. Utility Model Content
[0004] The purpose of this invention is to provide a silicon carbide crystal alignment and bonding device, which can improve the removal rate of defects on the circumference of silicon carbide crystals after rounding.
[0005] The embodiments of this utility model can be implemented as follows:
[0006] In a first aspect, this utility model provides a silicon carbide crystal alignment and bonding device, comprising:
[0007] An adhesive bonding device, comprising an adhesive bonding disc;
[0008] The alignment device includes a robotic arm, a ring bracket, a camera module, and a gripper. The ring bracket is connected to the robotic arm, and the gripper and the camera module are both mounted on the ring bracket. The gripper is located on the lower side of the ring bracket to grip the silicon carbide crystal to be bonded. The robotic arm can drive the ring bracket to move along a preset path so that the ring bracket is coaxial with the bonding disk.
[0009] The silicon carbide crystal includes a first side and a second side. A reference circle is drawn on the first side. A camera module is used to detect the position of the reference circle. A robotic arm is used to drive a ring bracket to face the reference circle according to the position of the reference circle, and to press down the ring bracket so that the gripper can grasp the silicon carbide crystal. Then, the silicon carbide crystal is driven through a preset path and placed on the bonding tray on the second side.
[0010] In an optional embodiment, the inner side of the ring bracket has an opening, and the camera module is mounted on the side of the ring bracket away from the gripper, with the camera of the camera module located on the axis of the opening.
[0011] In an optional implementation, the number of grippers is multiple and the grippers are evenly spaced around the circumference of the annular support.
[0012] In an optional implementation, the gripper is a floating suction nozzle;
[0013] And / or the first side is a carbon surface and the second side is a silicon surface.
[0014] In an optional embodiment, the bonding device further includes a mounting frame and a pressing assembly. The pressing assembly and the bonding pad are mounted on the mounting frame along the height direction. The bonding pad is detachably mounted on the mounting frame. The pressing assembly is opposite to the bonding pad and is used to press the silicon carbide crystal located on the bonding pad.
[0015] In an optional embodiment, the pressing component includes a driving member and a pressing member. The driving member is mounted on the mounting bracket with its driving end facing downward. The pressing member is disposed on the driving end of the driving member, and a buffer layer is provided on the side of the pressing member away from the driving member.
[0016] In an optional embodiment, the bonding device further includes a heating element that exchanges heat with the bonding pad, the heating element being mounted on a mounting bracket, the bonding pad being connected to the heating element, and an adhesive layer being applied to the side of the bonding pad near the pressing component.
[0017] In an optional embodiment, the heating element has a placement groove for placing the adhesive tray, the axial dimension of which is larger than the axial dimension of the placement groove;
[0018] And / or, the placement slot is also provided with an air blowing channel for connection to an air source, the air blowing channel being used to blow air onto the bonding tray.
[0019] In an optional embodiment, the air blowing channel includes a connected air blowing hole and multiple airflow channels. The air blowing hole penetrates the bottom wall of the placement groove and is used to connect to an air source. The airflow channels are disposed on the bottom wall and inner peripheral wall of the placement groove. The multiple airflow channels are arranged circumferentially around the air blowing hole, and the direction of the end of the airflow channel away from the air blowing hole is parallel to the axial direction of the air blowing hole.
[0020] In an optional embodiment, the silicon carbide crystal alignment and bonding device further includes a transport device, which is spaced apart from the alignment device along a first direction. The transport device extends along a second direction and is used to transport the silicon carbide crystal along the second direction. The bonding device and the alignment device are spaced apart along the second direction. The robotic arm is rotatable in the horizontal direction to transfer the silicon carbide crystal from the transport device to the bonding tray. The first side of the silicon carbide crystal on the transport device faces upward. The first direction and the second direction form an angle. The horizontal direction is parallel to the first direction and the second direction.
[0021] The beneficial effects provided by this utility model embodiment include: A silicon carbide crystal alignment and bonding device provided by this utility model embodiment includes a bonding device and a centering device. The bonding device includes a bonding disk, and the centering device includes a robotic arm, a ring bracket, a camera module, and a gripper. The ring bracket is connected to the robotic arm, and the gripper and camera module are both mounted on the ring bracket. The gripper is located on the lower side of the ring bracket for gripping the silicon carbide crystal to be bonded. The robotic arm can drive the ring bracket to move along a preset path so that the ring bracket and the bonding disk are coaxial. A reference circle is drawn on the first side of the silicon carbide crystal. A camera module is used to detect the position of the reference circle. A robotic arm is used to align the ring support with the reference circle according to its position and press down the ring support so that the gripper can grasp the silicon carbide crystal. Then, the silicon carbide crystal is moved through a preset path and the second side of the silicon carbide crystal is placed on the bonding tray. This is to ensure that the effective part of the silicon carbide crystal is coaxial with the bonding tray. Therefore, when the silicon carbide crystal is rolled after the bonding tray and the silicon carbide crystal are bonded, the removal rate of defects on the circumference of the silicon carbide crystal after the rolling process can be improved. Attached Figure Description
[0022] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0023] Figure 1 This is a schematic diagram of the silicon carbide crystal alignment and bonding device provided in this embodiment;
[0024] Figure 2 This is an assembly diagram of the ring-shaped bracket, gripper, and camera module provided in this embodiment;
[0025] Figure 3 This is a schematic diagram of the bonding device provided in this embodiment;
[0026] Figure 4 This is a top view of the heating element provided in this embodiment;
[0027] Figure 5 A schematic diagram showing a reference circle drawn on the first side of the silicon carbide crystal provided in this embodiment.
[0028] Icons: 1-Silicon carbide crystal alignment and bonding equipment; 100-Bonding device; 110-Mounting frame; 111-Mounting beam; 112-Mounting base wall; 120-Bonding plate; 130-Pressing assembly; 131-Driver; 132-Pressing component; 133-Buffer layer; 140-Heating component; 141-Placement slot; 142-Air blowing hole; 143-Airflow channel; 144-Air blowing passage; 200-Alignment device; 210-Robotic arm; 220-Ring bracket; 221-Opening; 230-Camera module; 240-Gripper; 300-Transportation device; 2-Silicon carbide crystal; 2001-First side; 2002-Second side; 2003-Reference circle. Detailed Implementation
[0029] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.
[0030] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.
[0031] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.
[0032] In the description of this utility model, it should be noted that if terms such as "upper," "lower," "inner," or "outer" are used to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the utility model product is usually placed during use, they are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.
[0033] Furthermore, the terms "first" and "second" are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.
[0034] It should be noted that, where there is no conflict, the features in the embodiments of this utility model can be combined with each other.
[0035] The following describes in detail, with reference to the accompanying drawings, the specific structure of a silicon carbide crystal bonding and alignment device provided by this utility model and its corresponding technical effects.
[0036] It should be noted that, with Figure 1 For reference, the first direction is direction a, and the second direction is direction b.
[0037] Please combine Figure 5 and refer to Figures 1-3 The present invention provides a silicon carbide crystal bonding and alignment device, which includes a bonding device 100 and an alignment device 200.
[0038] The bonding device 100 includes a bonding tray 120, and the alignment device 200 includes a robotic arm 210, a ring bracket 220, a camera module 230, and a gripper 240. The ring bracket 220 is connected to the robotic arm 210. The gripper 240 and the camera module 230 are both mounted on the ring bracket 220. The gripper 240 is located on the lower side of the ring bracket 220 to grip the silicon carbide crystal 2 to be bonded. The robotic arm 210 can drive the ring bracket 220 to move along a preset path so that the ring bracket 220 is coaxial with the bonding tray 120. The silicon carbide crystal 2 includes a first side 2001 and a second side 2002 opposite to each other. A reference circle 2003 is drawn on the first side 2001. The camera module 230 is used to detect the position of the reference circle 2003. The robotic arm 210 is used to drive the ring bracket 220 to face the reference circle 2003 according to the position of the reference circle 2003, and to press down the ring bracket 220 so that the gripper 240 grips the silicon carbide crystal 2, thereby driving the silicon carbide crystal 2 through a preset path and placing the second side 2002 of the silicon carbide crystal 2 on the bonding plate 120.
[0039] It should be noted that the reference circle 2003 drawn on the first side 2001 of the silicon carbide crystal 2 can be drawn by the operator. The reference circle 2003 can be understood as the effective area on the silicon carbide crystal 2. The fact that the annular support 220 is directly opposite the reference circle 2003 on the first side 2001 of the silicon carbide crystal 2 can be understood as the axis of the annular support 220 being coaxial with the axis of the reference circle 2003. At this time, when the robotic arm 210 drives the annular support 220 to press down, the reference circle 2003 and the annular support 220 are coaxial after the gripper 240 grips the silicon carbide crystal 2.
[0040] In this embodiment, coaxiality should not be limited to coaxiality in a strict sense; it is sufficient as long as the axes of the two are approximately coaxial.
[0041] The aforementioned preset path can be a path pre-set by the staff based on the relative position of the bonding plate 120 and the centering device, so as to ensure that the robotic arm 210 of the centering device can drive the ring bracket 220 to be aligned with the bonding plate 120. Since this technology is a conventional setting in the field of robotic arm technology, it will not be described in detail here.
[0042] Since the robotic arm 210 in this embodiment can drive the annular support 220 to move along a preset path so that the annular support 220 is coaxial with the bonding tray 120, after the annular support 220 is coaxial with the reference circle 2003 and the silicon carbide crystal 2 is grasped, after the robotic arm 210 drives the annular support 220 to move along the preset path, the silicon carbide crystal 2 can be positioned directly above the bonding tray 120, and the reference circle 2003 is also coaxial with the bonding tray 120. Then, the robotic arm 210 can drive the annular support 220 to press down until the silicon carbide crystal 2 is placed on the bonding tray 120, and then the gripper 240 releases the silicon carbide crystal 2. At this time, the reference circle 2003 on the silicon carbide crystal 2 is coaxial with the bonding tray 120, that is, the effective part of the silicon carbide crystal 2 is coaxial with the bonding tray 120.
[0043] Therefore, since the effective part of the silicon carbide crystal 2 can be guaranteed to be coaxial with the bonding pad 120, the removal rate of defects on the circumference of the silicon carbide crystal 2 can be improved after the bonding pad 120 and the silicon carbide crystal 2 are bonded and then rolled.
[0044] It should be noted that, in order to ensure that the bonding pad 120 is bonded to the silicon surface of the silicon carbide crystal 2, in this embodiment, the first side 2001 of the silicon carbide crystal 2 can be the carbon surface of the silicon carbide crystal 2, and the second side 2002 of the silicon carbide crystal 2 can be the silicon surface of the silicon carbide crystal 2.
[0045] It should be noted that the gripping component 240 mentioned above can be a suction nozzle, that is, the suction nozzle can be connected to a vacuum generator. When the vacuum generator is drawing a vacuum, the suction force of the vacuum is used to grip the silicon carbide crystal 2. After the vacuum generator stops drawing a vacuum, the vacuum generator releases the silicon carbide crystal 2.
[0046] It should be noted that since the carbon surface of the silicon carbide crystal 2 may not be flat, in order to ensure the reliability of adsorption of the silicon carbide crystal 2, in this embodiment, the gripper 240 can be a floating nozzle, that is, the floating nozzle can float in the axial direction of the silicon carbide crystal 2 so that the nozzle can be tightly attached to the first side 2001 of the silicon carbide crystal 2.
[0047] In detail, in order to ensure that the gripper 240 can firmly grip the silicon carbide crystal 2, in this embodiment, there are multiple grippers 240 and the multiple grippers 240 are evenly spaced around the annular support 220. That is to say, in this embodiment, the suction nozzle is evenly spaced around the annular support 220.
[0048] It should be noted that "multiple" in this embodiment can be understood as two or more. In this embodiment, the number of nozzles is four. Of course, in other embodiments, the number of nozzles can also be two, three, five or six. The number of nozzles is not limited in detail here.
[0049] In detail, the inner side of the ring bracket 220 has an opening 221. The camera module 230 is installed on the side of the ring bracket 220 away from the gripper 240. The camera of the camera module 230 is located on the axis of the opening 221 to ensure that the camera can successfully detect the reference circle 2003 on the first side 2001 of the silicon carbide crystal 2, so that the robotic arm can drive the ring bracket 220 to face the reference circle 2003.
[0050] It should be noted that the alignment device in this embodiment can be an existing alignment device, as long as it can ensure that the reference circle 2003 detected by the camera module 230 on the ring bracket 220 is aligned with the reference circle 2003 by the robotic arm 210.
[0051] Since the centering device 200 is a conventional device in the prior art, the principle of the centering device 200 will not be described in detail here.
[0052] In detail, to facilitate the strong bonding between the adhesive pad 120 and the silicon carbide crystal 2, in this embodiment, the adhesive pad also includes a mounting frame 110 and a pressing component 130. The pressing component 130 and the adhesive pad 120 are mounted on the mounting frame 110 along the height direction. The adhesive pad 120 is detachably mounted on the mounting frame 110. The pressing component 130 is opposite to the adhesive pad 120 and is used to press the silicon carbide crystal 2 located on the adhesive pad 120.
[0053] In other words, after the silicon carbide crystal 2 is placed on the bonding pad 120, during the bonding process between the bonding pad 120 and the silicon carbide crystal 2, the silicon carbide crystal 2 can be pressed down by the pressing component 130 to ensure the firmness of the bonding between the silicon carbide crystal 2 and the bonding pad 120.
[0054] Optionally, the mounting bracket 110 may be provided with a mounting beam 111 and a mounting base wall 112, with the mounting beam 111 and the mounting base wall 112 spaced apart along the height direction, and the aforementioned pressing assembly is mounted on the mounting beam 111.
[0055] In detail, in this embodiment, the pressing assembly 130 includes a driving member 131 and a pressing member 132. The driving member 131 is mounted on the mounting bracket 110 with its driving end facing downwards. That is, the driving member 131 is mounted on the mounting beam 111. The pressing member 132 is disposed on the driving end of the driving member 131, and a buffer layer 133 is provided on one end of the pressing member 132 from the driving member 131. In other words, the buffer layer 133 can be made of a buffering material (such as polyurethane material). When the pressing assembly 130 is only pressing the silicon carbide crystal 2 on the adhesive plate 120, the buffer layer 133 can prevent damage to the silicon carbide crystal 2 caused by pressing.
[0056] Optionally, the aforementioned drive component 131 can be one of a drive cylinder, a drive electric cylinder, or a drive hydraulic cylinder. Of course, the drive component 131 can also be other types of linear drive structures.
[0057] The bonding device 100 also includes a heating element 140 that exchanges heat with the bonding plate 120. The heating element 140 is mounted on the mounting frame 110. Specifically, the heating element 140 is mounted on the mounting bottom wall 112 of the mounting frame 110. The bonding plate 120 is connected to the heating element 140. The side of the bonding plate 120 near the pressing component 130 is coated with an adhesive layer.
[0058] The heating element 140 can be a graphite heating element 140.
[0059] In other words, after the silicon carbide crystal 2 is placed on the bonding pad 120, the bonding pad 120 can be heated by the heating element 140 to melt the adhesive layer on the bonding pad 120, and then the heating element 140 can stop heating so that the silicon carbide crystal 2 and the bonding pad 120 are bonded together through the adhesive layer.
[0060] Please refer to Figures 3-4 Optionally, the heating element 140 has a placement groove 141 for placing the adhesive tray 120. The circumferential dimension of the adhesive tray 120 is larger than the axial dimension of the placement groove 141. That is, the adhesive tray 120 will protrude from the placement groove 141. Understandably, the placement groove 141 makes it easier for the user to pick up and put down the adhesive tray 120.
[0061] The placement slot 141 is provided with an air blowing channel 144 for connecting to an air source. The air blowing channel 144 is used to blow air onto the bonding tray 120. It can be understood that after the adhesive layer on the bonding tray 120 melts, in order to accelerate the solidification of the adhesive layer so that the silicon carbide crystal 2 can bond with the bonding tray 120, air can be blown onto the bonding tray 120 through the air blowing channel 144 to cool the bonding tray 120 and accelerate the solidification speed of the adhesive layer on the bonding tray 120.
[0062] Optionally, the air blowing channel 144 includes a connected air blowing hole 142 and a plurality of air flow channels 143. The air blowing hole 142 penetrates the bottom wall of the placement groove 141 and is used to connect to an air source. The plurality of air flow channels 143 are disposed on the bottom wall and the inner peripheral wall of the placement groove 141. The plurality of air flow channels 143 are arranged circumferentially around the air blowing hole 142. The direction of the end of the air flow channel 143 away from the air blowing hole 142 is parallel to the axial direction of the air blowing hole 142. That is, the end of the air flow channel 143 away from the air blowing hole 142 faces upward. It can be understood that the air flow channels 143 and the air blowing hole 142 located on the bottom wall can blow air onto the bottom wall of the bonding tray 120, and the air flow channels located on the inner peripheral wall of the placement groove 141 can blow air onto the outer peripheral wall of the bonding tray 120 to improve the solidification speed of the adhesive layer on the bonding tray 120.
[0063] Optionally, in some embodiments, there are multiple pressing components 130, adhesive pads 120 and heating elements 140, and the multiple pressing components 130, adhesive pads 120 and heating elements 140 are arranged in a one-to-one correspondence. Specifically, the multiple pressing components 130 are spaced apart along the extension direction of the mounting beam 111, and the extension direction of the mounting beam 111 is parallel to the width direction of the mounting frame 110. The multiple heating elements 140 are spaced apart along the width direction of the mounting frame 110, and the multiple adhesive pads 120 are also spaced apart along the width direction of the mounting frame 110.
[0064] Optionally, in this embodiment, the silicon carbide crystal alignment and bonding device 1 further includes a transport device 300. The transport device 300 and the centering device 200 are spaced apart along a first direction. The transport device 300 extends along a second direction and is used to transport the silicon carbide crystal 2 along the second direction. The bonding device 100 and the centering device 200 are spaced apart along the second direction. The robotic arm 210 can rotate in the horizontal direction to transfer the silicon carbide crystal 2 on the transport device 300 to the bonding tray 120. The first surface of the silicon carbide crystal 2 on the transport device 300 faces upward. The first direction and the second direction form an angle. The horizontal direction is parallel to the first direction and the second direction. The height direction is perpendicular to the horizontal direction, that is, the height direction is perpendicular to the first direction and the second direction.
[0065] In detail, the number of the above-mentioned transport devices 300 can be two. The two transport devices 300 are arranged at intervals along the first direction and are respectively located on both sides of the centering device 200. The robotic arm 210 in the centering device 200 can rotate in the horizontal direction to grab the silicon carbide crystals 2 on the two transport devices 300. It should be noted that the width direction of the above-mentioned mounting frame 110 is parallel to the first direction.
[0066] Of course, the robotic arm 210 can also drive the ring support 220 to move in the vertical direction, so that the ring support 220 can carry the silicon carbide crystal 2 to be placed on the bonding plate 120.
[0067] In summary, the silicon carbide crystal alignment and bonding device 1 provided by this utility model embodiment includes a bonding device 100 and a centering device 200. The bonding device 100 includes a bonding disk 120, and the centering device 200 includes a robotic arm 210, a ring bracket 220, a camera module 230, and a gripper 240. The ring bracket 220 is connected to the robotic arm 210, and the gripper 240 and the camera module 230 are both mounted on the ring bracket 220. The gripper 240 is located on the lower side of the ring bracket 220 to grip the silicon carbide crystal 2 to be bonded. The robotic arm 210 can drive the ring bracket 220 to move along a preset path so that the ring bracket 220 is coaxial with the bonding disk 120. A reference circle 2003 is drawn on the first side 2001 of the silicon carbide crystal 2. The camera module 230 is used to detect the position of the reference circle 2003. The robotic arm 210 is used to drive the ring bracket 220 to face the reference circle 2003 according to the position of the reference circle 2003, and to press down the ring bracket 220 so that the gripper 240 grips the silicon carbide crystal 2. Then, the silicon carbide crystal 2 is driven through a preset path and the second side 2002 of the silicon carbide crystal 2 is placed on the bonding tray 120 to ensure that the effective part of the silicon carbide crystal 2 is coaxial with the bonding tray 120. Therefore, when the bonding tray 120 and the silicon carbide crystal 2 are bonded together and then rolled, the removal rate of defects on the circumference of the silicon carbide crystal 2 after the rolling process can be improved.
[0068] The above description is only a specific embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present utility model should be included within the protection scope of the present utility model.
Claims
1. A silicon carbide crystal alignment and bonding device, characterized in that, include: An adhesive device (100) comprising an adhesive disc (120); Alignment device (200), the alignment device (200) includes a robotic arm (210), a ring bracket (220), a camera module (230) and a gripper (240). The ring bracket (220) is connected to the robotic arm (210). The gripper (240) and the camera module (230) are both mounted on the ring bracket (220). The gripper (240) is located on the lower side of the ring bracket (220) for gripping the silicon carbide crystal (2) to be bonded. The robotic arm (210) can drive the ring bracket (220) to move along a preset path so that the ring bracket (220) is coaxial with the bonding disk (120). The silicon carbide crystal (2) includes a first side (2001) and a second side (2002) opposite to each other. A reference circle (2003) is drawn on the first side (2001). The camera module (230) is used to detect the position of the reference circle (2003). The robotic arm (210) is used to drive the ring bracket (220) to face the reference circle (2003) according to the position of the reference circle (2003), and to press down the ring bracket (220) so that the gripper (240) grips the silicon carbide crystal (2), thereby driving the silicon carbide crystal (2) through the preset path and placing the second side (2002) on the adhesive tray (120).
2. The silicon carbide crystal alignment and bonding device according to claim 1, characterized in that: The inner side of the ring bracket (220) has an opening (221), and the camera module (230) is installed on the side of the ring bracket (220) away from the gripper (240). The camera of the camera module (230) is located on the axis of the opening (221).
3. The silicon carbide crystal alignment and bonding device according to claim 1, characterized in that: The number of grippers (240) is multiple and the multiple grippers (240) are evenly spaced around the annular support (220) in the circumference.
4. The silicon carbide crystal alignment and bonding device according to claim 1, characterized in that: The gripper (240) is a floating suction nozzle; And / or the first side (2001) is a carbon surface and the second side (2002) is a silicon surface.
5. The silicon carbide crystal alignment and bonding device according to claim 1, characterized in that: The bonding device (100) further includes a mounting bracket (110) and a pressing assembly (130). The pressing assembly (130) and the bonding pad (120) are mounted on the mounting bracket (110) along the height direction. The bonding pad (120) is detachably mounted on the mounting bracket (110). The pressing assembly (130) is opposite to the bonding pad (120). The pressing assembly (130) is used to press the silicon carbide crystal (2) located on the bonding pad (120).
6. The silicon carbide crystal alignment and bonding device according to claim 5, characterized in that: The pressing assembly (130) includes a driving member (131) and a pressing member (132). The driving member (131) is mounted on the mounting bracket (110) with the driving end of the driving member (131) facing downward. The pressing member (132) is disposed at the driving end of the driving member (131), and a buffer layer (133) is provided on the side of the pressing member (132) away from the driving member (131).
7. The silicon carbide crystal alignment and bonding device according to claim 5, characterized in that: The bonding device (100) further includes a heating element (140) that exchanges heat with the bonding pad (120). The heating element (140) is mounted on the mounting bracket (110). The bonding pad (120) is connected to the heating element (140). The side of the bonding pad (120) near the pressing assembly (130) is coated with an adhesive layer.
8. The silicon carbide crystal alignment and bonding device according to claim 7, characterized in that: The heating element (140) has a placement groove (141) for placing the adhesive tray (120), the axial dimension of the adhesive tray (120) being larger than the axial dimension of the placement groove (141); And / or, the placement slot (141) is also provided with an air blowing channel (144) for connection to an air source, the air blowing channel (144) for blowing air onto the adhesive tray (120).
9. The silicon carbide crystal alignment and bonding device according to claim 8, characterized in that: The air blowing channel (144) includes a connected air blowing hole (142) and a plurality of air flow channels (143). The air blowing hole (142) penetrates the bottom wall of the placement groove (141) and is used to connect to an air source. The air flow channels (143) are disposed on the bottom wall and the inner peripheral wall of the placement groove (141). The plurality of air flow channels (143) are arranged circumferentially around the air blowing hole (142). The orientation of the end of the air flow channel (143) away from the air blowing hole (142) is parallel to the axial direction of the air blowing hole (142).
10. The silicon carbide crystal alignment and bonding device according to claim 1, characterized in that: The silicon carbide crystal alignment and bonding equipment further includes a transport device (300), which is spaced apart from the alignment device (200) along a first direction. The transport device (300) extends along a second direction and is used to transport the silicon carbide crystal (2) along the second direction. The bonding device (100) is spaced apart from the alignment device (200) along the second direction. The robotic arm (210) is rotatable in the horizontal direction to transfer the silicon carbide crystal (2) of the transport device (300) to the bonding tray (120). The first side (2001) of the silicon carbide crystal (2) on the transport device (300) faces upward. The first direction and the second direction form an angle. The horizontal direction is parallel to the first direction and the second direction.