Electroplating device with automatic cleaning function for metal surface treatment

Abstract

The utility model relates to the technical field of metal surface electroplating treatment, and discloses a metal surface treatment electroplating device capable of being automatically cleaned, which comprises an electroplating tank, the inner surface of the electroplating tank is connected with a collecting hopper in a sliding manner, the top of the inner surface of the collecting hopper is hinged with a baffle plate, and the top of the outer surface of the baffle plate is hinged with a hinge rod; a limiting frame is hinged to the top of the outer surface of the hinge rod, the bottom end of the outer surface of the limiting frame is in contact connection with the top end of the outer surface of the collecting hopper, and the top of the outer surface of the limiting frame is in contact connection with the top of the outer surface of the electroplating pool. According to the anode mud collecting device, the two baffles are arranged, when the collecting hopper is lifted through hoisting equipment, the baffles can automatically turn over to shield the top of the collecting hopper due to the hinge rods and gravity, anode mud is prevented from being diffused, and when the collecting hopper is put back, the baffles can be automatically unfolded through the hinge rods, so that the anode mud can conveniently fall into the collecting hopper; and automatic cleaning of the anode mud is realized.

Description

Technical Field

[0001] This utility model relates to the field of metal surface electroplating technology, and in particular to an electroplating device for metal surface treatment that can automatically clean itself. Background Technology

[0002] Many metals readily rust and corrode in natural environments due to chemical reactions with oxygen and water; for example, iron easily forms rust in humid air. Electroplating can coat metal surfaces with highly corrosion-resistant metals such as chromium, zinc, and nickel. These metals form a dense protective film on the metal surface, isolating it from external air and moisture, thus significantly improving the metal's corrosion resistance and extending the lifespan of metal products.

[0003] A search revealed Chinese Patent Publication No. CN222434677U, which discloses an electroplating apparatus for metal surface treatment. The apparatus includes an electroplating tank, in which a filter frame is automatically removed upwards via electric control. This reduces manual labor intensity, increases the efficiency of filter frame removal, and consequently improves the cleaning efficiency of impurities within the electroplating tank. Furthermore, the filter frame not only filters and removes impurities from the electrolyte but also cleans impurities adhering to the inner wall of the electroplating tank using a scraper, resulting in a more comprehensive cleaning effect.

[0004] Considering that when the filter frame is lifted, the impurities and anode mud inside the filter frame will diffuse back into the electroplating tank due to the liquid flow, thereby reducing the effectiveness and efficiency of the filter frame in cleaning impurities in the electroplating tank, an electroplating device for metal surface treatment with automatic cleaning capability is proposed to solve the above problems. Utility Model Content

[0005] To overcome the above shortcomings, this utility model provides an electroplating device for metal surface treatment that can be automatically cleaned. It aims to solve the problem in the prior art that when the filter frame is lifted, the impurities and anode mud inside the filter frame will diffuse back into the electroplating tank due to the liquid flow, thus solving the problem of the filter frame's effectiveness and efficiency in cleaning impurities in the electroplating tank.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: an electroplating device for metal surface treatment with automatic cleaning capability, comprising an electroplating tank, a collecting hopper slidably connected to the inner surface of the electroplating tank, a baffle hinged to the top of the inner surface of the collecting hopper, a hinge rod hinged to the top of the outer surface of the baffle, a limiting frame hinged to the top of the outer surface of the hinge rod, the bottom end of the outer surface of the limiting frame contacting the top end of the outer surface of the collecting hopper, the top end of the outer surface of the limiting frame contacting the top end of the outer surface of the electroplating tank, and a positioning component provided on the inner surface of the electroplating tank.

[0007] As a further description of the above technical solution:

[0008] The positioning component includes a guide plate, a guide groove, and a positioning block. The bottom of the outer surface of the guide plate is fixedly connected to the top of the outer surface of the electroplating tank. The guide groove is opened on the top of the outer surface of the limiting frame. The outer surface of the guide plate is inserted into the inner surface of the guide groove. The outer surface of the positioning block is fixedly connected to the bottom of the inner surface of the electroplating tank. The bottom of the outer surface of the collecting hopper is in contact with the outer surface of the positioning block.

[0009] As a further description of the above technical solution:

[0010] The top of the outer surface of the guide plate and the top of the outer surface of the positioning block are both set as slopes.

[0011] As a further description of the above technical solution:

[0012] A filter screen is fixedly connected to the bottom of the inner surface of the collection hopper, and a protective post is fixedly connected to the bottom of the inner surface of the collection hopper.

[0013] As a further description of the above technical solution:

[0014] A limiting plate is fixedly connected to the middle of the inner surface of the collecting hopper, and the top of the outer surface of the limiting plate is in contact with the bottom of the outer surface of the baffle.

[0015] As a further description of the above technical solution:

[0016] A hook is fixedly connected to the top of the inner surface of the collection hopper.

[0017] As a further description of the above technical solution:

[0018] The baffle is provided in two sets.

[0019] As a further description of the above technical solution:

[0020] The hinge rod is provided in multiple sets.

[0021] This utility model has the following beneficial effects:

[0022] 1. In this utility model, by providing two sets of baffles, when the collection bucket is lifted by the lifting equipment, the baffles will automatically flip and cover the top of the collection bucket due to the hinge rod and gravity, preventing the anode mud from spreading. When the collection bucket is put back, the baffles can automatically unfold through the hinge rod, making it convenient for the anode mud to fall into the collection bucket, thus realizing the automatic cleaning of the anode mud and greatly improving the cleaning efficiency.

[0023] 2. In this utility model, by fixing and connecting a protective column to the bottom of the inner surface of the collection hopper, it is possible to effectively prevent the workpiece from damaging the filter screen when it is placed into the electroplating tank, thereby extending the service life of the filter device and ensuring the stability of the anode mud isolation effect. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the main structure of an electroplating device for automatically cleaning metal surface treatment proposed in this utility model.

[0025] Figure 2 This is a schematic diagram of the electroplating tank structure of an electroplating device for automatically cleaning metal surface treatment proposed in this utility model.

[0026] Figure 3 This is a schematic diagram of the collection hopper structure of an electroplating device for metal surface treatment that can be automatically cleaned, as proposed in this utility model.

[0027] Figure 4 This is a schematic diagram of the baffle closure structure of an electroplating device for automatic cleaning of metal surfaces proposed in this utility model.

[0028] Figure 5 This is a bottom view of the collection hopper structure of an electroplating device for automatically cleaning metal surface treatment proposed in this utility model.

[0029] Figure 6 This is a cross-sectional view of the collection hopper of an electroplating device for metal surface treatment that can be automatically cleaned, as proposed in this utility model.

[0030] Figure 7 This is a front view of the collection hopper of an electroplating device for metal surface treatment that can be automatically cleaned, as proposed in this utility model.

[0031] Legend:

[0032] 1. Electroplating tank; 2. Limiting frame; 3. Guide plate; 4. Baffle; 5. Positioning block; 6. Guide groove; 7. Collection hopper; 8. Protective post; 9. Hook; 10. Hinge rod; 11. Filter screen; 12. Limiting plate. Detailed Implementation

[0033] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0034] Reference Figure 1 , Figure 3 - Figure 4This utility model provides an embodiment of an electroplating device for automatically cleaning metal surface treatment, comprising an electroplating tank 1, a collecting hopper 7 slidably connected to the inner surface of the electroplating tank 1, allowing the collecting hopper 7 to move vertically along the inner surface of the electroplating tank 1, a baffle 4 hinged to the top of the inner surface of the collecting hopper 7, allowing the baffle 4 to flip along the top of the inner surface of the collecting hopper 7, a hinge rod 10 hinged to the top of the outer surface of the baffle 4, allowing the hinge rod 10 to control the flipping of the baffle 4 during movement, and a limit frame 2 hinged to the top of the outer surface of the hinge rod 10. When the limiting frame 2 moves vertically, it can drive the hinge rod 10 to move. The bottom end of the outer surface of the limiting frame 2 contacts the top end of the outer surface of the collecting hopper 7, so that the bottom end of the limiting frame 2 can close with the top end of the collecting hopper 7. The top end of the outer surface of the limiting frame 2 contacts the top end of the outer surface of the electroplating tank 1, so that the limiting frame 2 can be restricted to a specified position when it contacts the top end of the outer surface of the electroplating tank 1. The inner surface of the electroplating tank 1 is provided with a positioning component, so that the limiting frame 2 and the collecting hopper 7 can be kept in a specified position when inserted into the electroplating tank 1.

[0035] Reference Figure 2 - Figure 3 The positioning component includes a guide plate 3, a guide groove 6, and a positioning block 5. The bottom of the outer surface of the guide plate 3 is fixedly connected to the top of the outer surface of the electroplating tank 1, providing a fixed support for the guide plate 3 via the top of the outer surface of the electroplating tank 1. The guide groove 6 is formed on the top of the outer surface of the limiting frame 2, allowing the limiting frame 2 to be positioned by passing through the guide groove 6. The outer surface of the guide plate 3 is inserted into the inner surface of the guide groove 6, allowing the limiting frame 2 to be inserted into the guide plate 3 via the guide groove 6 and held at a designated position on the electroplating tank 1. The outer surface of block 5 is fixedly connected to the bottom of the inner surface of electroplating tank 1, and the bottom of the inner surface of electroplating tank 1 provides a fixed support for positioning block 5. The bottom of the outer surface of collecting hopper 7 is in contact with the outer surface of positioning block 5, so that when collecting hopper 7 is inserted into the bottom of electroplating tank 1, it can be held in a designated position by positioning block 5. The top of the outer surface of guide plate 3 and the top of the outer surface of positioning block 5 are both set as slopes, so that when the limiting frame 2 and collecting hopper 7 are inserted into electroplating tank 1, they can be inserted more smoothly and can be automatically corrected.

[0036] Reference Figure 5 - Figure 7A filter screen 11 is fixedly connected to the bottom of the inner surface of the collecting hopper 7, allowing the anode mud to be isolated within the collecting hopper 7. A protective post 8 is fixedly connected to the bottom of the inner surface of the collecting hopper 7 to prevent damage to the filter screen 11 when the workpiece is placed into the electroplating tank 1. A limiting plate 12 is fixedly connected to the middle of the inner surface of the collecting hopper 7, providing fixed support for the limiting plate 12. The top of the outer surface of the limiting plate 12 contacts the bottom of the outer surface of the baffle 4, allowing the limiting plate 12 to be stopped when it is flipped downwards along the inner surface of the collecting hopper 7. The restriction of plate 12 ensures that baffle 4 can only be flipped downwards to a designated position. Hook 9 is fixedly connected to the top of the inner surface of collection bucket 7, allowing collection bucket 7 to be connected to lifting equipment via hook 9, thus enabling collection bucket 7 to move vertically. There are two sets of baffle 4 to completely cover the top of collection bucket 7. Multiple sets of hinge rods 10 are provided to ensure greater stability when limit frame 2 drives baffle 4 to flip downwards via hinge rods 10. Furthermore, when baffle 4 is fully extended, it will be in a slightly tilted state to ensure that baffle 4 can flip downwards when collection bucket 7 is rising.

[0037] Working principle: When a certain amount of anode mud is collected in the collection hopper 7, the lifting hook on the lifting equipment is connected to the hook 9 on the collection hopper 7. Then, the collection hopper 7 is lifted upwards by the lifting equipment. As the collection hopper 7 moves upwards, the baffle 4 will flip downwards due to gravity and the hinge action of the hinge rod 10, blocking the top of the collection hopper 7. This prevents the anode mud from spreading outwards from the collection hopper 7 due to the flow of liquid when the collection hopper 7 is lifted upwards. When it rises to a certain position, the top of the collection hopper 7 will... When the bottom of the limiting frame 2 is in contact with the limiting frame 2, the limiting frame 2 is pulled out of the electroplating tank 1. When the cleaned collecting hopper 7 is placed into the electroplating tank 1, when the collecting hopper 7 moves down to a certain position, the limiting frame 2 will contact the top of the electroplating tank 1 and stop moving down. The collecting hopper 7 is not restricted and continues to move down. When the collecting hopper 7 continues to move down, the two sets of baffles 4 on the collecting hopper 7 will be opened outward simultaneously due to the action of the hinge rod 10, so that the anode mud generated by the workpiece during electroplating can fall into the collecting hopper 7.

[0038] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. An electroplating apparatus for automatically cleaning metal surface treatment, comprising an electroplating tank (1), characterized in that: The inner surface of the electroplating tank (1) is slidably connected to a collection hopper (7). A baffle (4) is hinged to the top of the inner surface of the collection hopper (7). A hinge rod (10) is hinged to the top of the outer surface of the baffle (4). A limiting frame (2) is hinged to the top of the outer surface of the hinge rod (10). The bottom of the outer surface of the limiting frame (2) is in contact with the top of the outer surface of the collection hopper (7). The top of the outer surface of the limiting frame (2) is in contact with the top of the outer surface of the electroplating tank (1). A positioning component is provided on the inner surface of the electroplating tank (1).

2. The electroplating apparatus for automatically cleaning metal surface treatment according to claim 1, characterized in that: The positioning component includes a guide plate (3), a guide groove (6), and a positioning block (5). The bottom of the outer surface of the guide plate (3) is fixedly connected to the top of the outer surface of the electroplating tank (1). The guide groove (6) is opened on the top of the outer surface of the limiting frame (2). The outer surface of the guide plate (3) is inserted into the inner surface of the guide groove (6). The outer surface of the positioning block (5) is fixedly connected to the bottom of the inner surface of the electroplating tank (1). The bottom of the outer surface of the collecting hopper (7) is in contact with the outer surface of the positioning block (5).

3. The electroplating apparatus for automatically cleaning metal surface treatment according to claim 2, characterized in that: The top of the outer surface of the guide plate (3) and the top of the outer surface of the positioning block (5) are both set as slopes.

4. The electroplating apparatus for automatically cleaning metal surface treatment according to claim 1, characterized in that: A filter screen (11) is fixedly connected to the bottom of the inner surface of the collection hopper (7), and a protective column (8) is fixedly connected to the bottom of the inner surface of the collection hopper (7).

5. The electroplating apparatus for automatically cleaning metal surface treatment according to claim 1, characterized in that: A limiting plate (12) is fixedly connected to the middle of the inner surface of the collecting hopper (7), and the top of the outer surface of the limiting plate (12) is in contact with the bottom of the outer surface of the baffle (4).

6. The electroplating apparatus for automatically cleaning metal surface treatment according to claim 1, characterized in that: A hook (9) is fixedly connected to the top of the inner surface of the collection hopper (7).

7. The electroplating apparatus for automatically cleaning metal surface treatment according to claim 1, characterized in that: The baffle (4) is provided in two sets.

8. The electroplating apparatus for automatically cleaning metal surface treatment according to claim 1, characterized in that: The hinge rod (10) is provided in multiple sets.

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