Multi-channel radio frequency front-end device and radio direction-finding positioning system

By using modular design and probe pad connections, the problem of cross-interference between digital lines and RF cables in multi-channel RF front-end devices is solved, improving the reliability and production efficiency of the devices.

CN224176732UActive Publication Date: 2026-04-28GUANGZHOU CHENCHUANG TECH DEV CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
GUANGZHOU CHENCHUANG TECH DEV CO LTD
Filing Date
2025-01-14
Publication Date
2026-04-28

AI Technical Summary

Technical Problem

In the prior art, the digital lines and RF cables inside and outside the multi-channel RF front-end device are prone to cross each other, causing mutual interference and affecting the reliability of the device.

Method used

The modular design separates the power conversion circuit, power adapter board and RF circuit board through the housing, and uses probes and pads for electrical connection, reducing the number of traces and avoiding cross-connections.

Benefits of technology

It reduces the number of traces in multi-channel RF front-end devices, improves device reliability, prevents signal interference, simplifies the assembly process, and increases production efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of radio direction finding and positioning, in particular to a multi-channel radio frequency front-end device and a radio direction finding and positioning system.The multi-channel radio frequency front-end device comprises a shell, a power conversion circuit, a power adapter plate and a radio frequency circuit board; the shell comprises a power conversion circuit mounting cavity, a power adapter plate mounting cavity and a radio frequency circuit board mounting cavity which are isolated from one another; the power conversion circuit is arranged in the power conversion circuit mounting cavity; the power supply adapter plate is arranged in the power supply adapter plate mounting cavity; the power supply adapter plate is electrically connected with the power supply conversion circuit; the radio frequency circuit board is arranged in the radio frequency circuit board mounting cavity; the radio frequency circuit board is electrically connected with the power supply adapter plate through a probe and a bonding pad; wherein the radio frequency circuit board is provided with a radio frequency input connector, a local oscillator input connector and an IQ signal output connector, and the radio frequency input connector, the local oscillator input connector and the IQ signal output connector are all welded on the radio frequency circuit board.
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Description

Technical Field

[0001] This application relates to the field of radio direction finding and positioning technology, and in particular to multi-channel radio frequency front-end devices and radio direction finding and positioning systems. Background Technology

[0002] Radio direction finding and positioning systems can determine the direction and specific location of a radiation source based on the propagation characteristics of electromagnetic waves, thereby achieving radio positioning.

[0003] In existing technologies, radio direction finding and positioning systems typically include an array antenna, a local oscillator signal source, a multi-channel RF front-end device, a data acquisition device, and a data processing server. The array antenna has multiple antenna elements, which are connected to the multi-channel RF front-end device via RF cables. The antenna elements convert radio signals into RF signals and transmit them to the RF front-end device. The local oscillator signal source is also connected to the multi-channel RF front-end device via an RF cable. The multi-channel RF front-end device is connected to the data acquisition device via a digital line, and the data acquisition device acquires the IQ signals output by the multi-channel RF front-end device. The data acquisition device is coupled to the data processing server, which receives the IQ signals from the data acquisition device and processes them using a direction finding and positioning algorithm to obtain the processing results.

[0004] The multi-channel RF front-end device contains a power conversion circuit, a power adapter board, and an RF circuit board. The external power supply powers the RF circuit board after passing through the power conversion circuit and the power adapter board. The RF circuit board is equipped with an RF input interface, a local oscillator input interface, and an IQ signal output interface. These interfaces are connected to the RF circuit board through a large number of digital lines or RF cables.

[0005] It is evident that a large number of digital lines and RF cables exist both inside and outside the multi-channel RF front-end device. These digital lines and RF cables are prone to crossing each other, causing mutual interference and affecting the reliability of the multi-channel RF front-end. Utility Model Content

[0006] This application provides a multi-channel radio frequency front-end device and a radio direction finding and positioning system to solve the problem in the prior art where the crossover of digital lines and radio frequency cables causes mutual interference, affecting the reliability of the multi-channel radio frequency front-end.

[0007] In a first aspect, this application provides a multi-channel radio frequency front-end device, including:

[0008] The housing includes mutually isolated power conversion circuit mounting cavity, power adapter board mounting cavity and radio frequency circuit board mounting cavity;

[0009] A power conversion circuit, wherein the power conversion circuit is disposed within the power conversion circuit mounting cavity;

[0010] A power adapter board, wherein the power adapter board is disposed within a mounting cavity, and the power adapter board is electrically connected to the power conversion circuit; and

[0011] An RF circuit board is disposed within the RF circuit board mounting cavity, and the RF circuit board and the power adapter board are electrically connected through probes and pads.

[0012] The radio frequency circuit board is provided with a radio frequency input connector, a local oscillator input connector and an IQ signal output connector, all of which are soldered onto the radio frequency circuit board.

[0013] Secondly, this application provides a radio direction finding and positioning system, including:

[0014] Array antenna;

[0015] Local oscillator signal source;

[0016] In the multi-channel radio frequency front-end device described in the first aspect, the radio frequency input connector is connected to the antenna element of the array antenna via a first radio frequency cable, and the local oscillator input connector is connected to the local oscillator signal source via a second radio frequency cable;

[0017] The data acquisition device is connected to the IQ signal output connector via a digital cable; and

[0018] A data processing server, which is coupled to the acquisition device.

[0019] Compared with the prior art, this application includes at least the following beneficial effects:

[0020] The RF input connector, local oscillator input connector, and IQ signal output connector are all soldered onto the RF circuit board, avoiding the need for wires to connect them to the RF circuit board and reducing the number of traces in the multi-channel RF front-end device. Furthermore, the power adapter board and the RF circuit board are electrically connected via probes and pads, further reducing the number of traces in the multi-channel RF front-end device. Therefore, the number of traces in the multi-channel RF front-end device of this application is significantly reduced compared to existing technologies, thereby mitigating the reliability degradation caused by the crossing of digital lines and RF cables. Attached Figure Description

[0021] Figure 1 A schematic diagram of a radio direction finding and positioning system according to an embodiment of this application is shown.

[0022] Figure 2A schematic diagram of the upper part of the multi-channel radio frequency front-end device according to an embodiment of this application is shown.

[0023] Figure 3 A schematic diagram of the bottom of a multi-channel radio frequency front-end device according to an embodiment of this application is shown.

[0024] Figure 4 A block diagram of a power conversion circuit according to an embodiment of this application is shown.

[0025] Figure 5 A top view of a multi-channel radio frequency front-end device according to an embodiment of this application is shown.

[0026] Figure 6 It shows Figure 5 Sectional view at point AA.

[0027] Figure 7 A schematic diagram of the upper part of the radio frequency circuit board and power adapter board according to an embodiment of this application is shown.

[0028] Figure 8 A schematic diagram of the lower part of the radio frequency circuit board and power adapter board according to an embodiment of this application is shown.

[0029] Figure 9 A schematic diagram of a radio frequency circuit sub-board according to an embodiment of this application is shown.

[0030] Figure label:

[0031] 30. Outer shell; 31. Power conversion circuit mounting cavity; 311. AC shielding cavity; 312. DC shielding cavity; 313. First partition; 3131. First cable pass hole; 32. Power adapter board mounting cavity; 33. RF circuit board mounting cavity; 331. RF circuit board mounting sub-cavity; 34. Second partition; 341. Second cable pass hole; 35. Third partition; 36. Power input interface; 37. Power indicator light; 38. First cover plate; 39. Second cover plate;

[0032] 40. Power conversion circuit; 41. AC section; 411. AC EMI filter; 412. AC / DC converter; 42. DC section; 421. DC EMI filter; 422. DC / DC converter;

[0033] 50. Power adapter board; 51. Probe;

[0034] 60. RF circuit board; 61. RF input connector; 62. Local oscillator input connector; 63. IQ signal output connector; 64. Solder pad; 65. RF circuit sub-board. Detailed Implementation

[0035] The technical solution of this application will be further described below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely for explaining this application and not for limiting it. Furthermore, it should be noted that, for ease of description, only the parts relevant to this application are shown in the accompanying drawings, not all of them.

[0036] This application defines certain directional terms. Unless otherwise stated, the directional terms used, such as "up," "down," "left," "right," "inner," and "outer," are used for ease of understanding and therefore do not constitute a limitation on the scope of protection of this application.

[0037] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0038] In the description of this application, unless otherwise expressly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0039] like Figure 1 As shown in the figure, this application provides a radio direction finding and positioning system, which includes an array antenna, a local oscillator signal source, a multi-channel radio frequency front-end device, a data acquisition device, and a data processing server.

[0040] like Figure 1 As shown in the embodiment of this application, a 20-channel array antenna is used as an example. The 20-channel array antenna includes 20 independent array antennas and 20 independent antenna matching modules (e.g., antenna matching module 1, antenna matching module 2... antenna matching module 19 and antenna matching module 20), and each array antenna is coupled to a corresponding antenna matching module.

[0041] like Figure 1As shown, the multi-channel RF front-end device is a 20-channel RF front-end device. The 20-channel RF front-end device includes 10 RF circuit boards (e.g., RF circuit board 1, RF circuit board 2... RF circuit board 9 and RF circuit board 10). Each RF circuit board includes two gain adjustment units, two IQ quadrature modulators, and a 1-to-2 power divider.

[0042] Specifically, the RF circuit board 1 includes a gain adjustment unit 1, a gain adjustment unit 2, an IQ quadrature modulator 1, an IQ quadrature modulator 2, and a 1-to-2 power divider 1. The RF circuit board 10 includes a gain adjustment unit 19, a gain adjustment unit 20, an IQ quadrature modulator 19, an IQ quadrature modulator 20, and a 1-to-2 power divider 10.

[0043] In addition, such as Figure 1 As shown, each antenna matching module is coupled to a corresponding gain adjustment unit. Specifically, antenna matching module 1 is coupled to gain adjustment unit 1, antenna matching module 2 is coupled to gain adjustment unit 2, ... antenna matching module 19 is coupled to gain adjustment unit 19, and antenna matching module 20 is coupled to gain adjustment unit 20.

[0044] Within each RF circuit board, gain adjustment units are coupled one-to-one with IQ quadrature modulators. For example, gain adjustment unit 1 is coupled to IQ quadrature modulator 1, and gain adjustment unit 2 is coupled to IQ quadrature modulator 2.

[0045] Within each RF circuit board, a 1-to-2 power divider is coupled to two IQ quadrature modulators. For example, 1-to-2 power divider 1 is coupled to IQ quadrature modulator 1 and IQ quadrature modulator 2.

[0046] Each 1-to-2 power divider is coupled to a multi-channel power divider, which in turn is coupled to a local oscillator signal source.

[0047] The acquisition device is coupled to each RF circuit board. On one hand, the acquisition device can send control signals to the RF circuit boards; on the other hand, it can receive IQ quadrature data from the RF circuit boards. The acquisition device includes a multi-channel A / D converter and an FPGA processing platform.

[0048] The data processing server is coupled with the acquisition device.

[0049] In a radio direction finding and positioning system, each antenna element in the antenna array converts spatial radio signals into radio frequency (RF) signals. The antenna matching module filters and amplifies the RF signals before transmitting them to the RF circuit board via an RF cable. The RF circuit board receives the gain control signal from the acquisition device, and after attenuation and amplification, it enters the quadrature modulator, ultimately outputting analog IQ signals. The acquisition device receives the IQ signals output from the RF circuit board, performs AD conversion via a multi-channel A / D converter, and then performs software radio digital signal processing (SRF) via an FPGA, outputting IQ data suitable for processing by a data processor. The data processing server receives the IQ data from the acquisition device, processes it using a direction finding and positioning algorithm, and sends the results to the client for display.

[0050] It should be noted that existing multi-channel RF front-end devices contain a large number of traces, which can easily lead to RF cables and digital lines crossing each other, affecting the reliability of the multi-channel RF front-end. Therefore, the multi-channel RF front-end device provided in this application uses a modular design to minimize the number of traces within the multi-channel RF front-end device, thereby improving its reliability.

[0051] like Figure 2 As shown, the multi-channel RF front-end device includes a housing 30. Exemplarily, the housing 30 is generally U-shaped, but it can also be other shapes. A power input interface 36 and a power indicator light 37 are provided on the right side of the housing 30. The power input interface 36 is used to connect to an external power source, such as 220V AC. When the power input interface 36 is connected to an external power source, the power indicator light 37 illuminates. The upper surface of the housing 30 has a recessed area in the middle, and multiple RF input connectors 61 and multiple local oscillator input connectors 62 are provided on the sidewalls on both the front and rear sides of the recessed area. Multiple IQ signal output connectors 63 are provided on the front and rear sides of the housing 30.

[0052] When wiring the multi-channel RF front-end device, the RF input connector 61 is connected to the antenna matching module via an RF cable so that the multi-channel RF front-end device can receive radio signals from the array antenna; the local oscillator input connector 62 is connected to the multi-channel power divider via an RF cable so that the multi-channel RF front-end device can receive local oscillator signals from the local oscillator signal source; and the IQ signal output connector 63 is connected to the acquisition device via a digital line.

[0053] like Figure 2 As shown, a second cover plate 39 is provided at the bottom of the outer casing 30, which closes the opening at the bottom of the outer casing 30. Figure 3As shown, when the second cover plate 39 is removed, the power conversion circuit mounting cavity 31 and the power adapter plate mounting cavity 32 located at the bottom of the housing 30 are exposed. In other words, the power conversion circuit mounting cavity 31 has a second mounting port facing downward, and the power adapter plate mounting cavity 32 has a third mounting port facing downward. The second cover plate 39 can cover the second mounting port and the third mounting port, so that the bottom of the housing 30 is closed.

[0054] like Figure 3 As shown, the power conversion circuit 40 is disposed in the power conversion circuit mounting cavity 31. The power conversion circuit 40 includes an AC part 41 and a DC part 42. The input terminal of the AC part 41 is connected to the power input interface 36, the output terminal of the AC part 41 is connected to the input terminal of the DC part 42, and the output terminal of the DC part 42 is connected to the power adapter board 50 located in the power adapter board mounting cavity 32.

[0055] like Figure 3 As shown, the power conversion circuit mounting cavity 31 includes an AC shielding cavity 311, a DC shielding cavity 312, and a first partition 313 disposed between the AC shielding cavity 311 and the DC shielding cavity 312. The first partition 313 isolates the AC shielding cavity 311 and the DC shielding cavity 312 from each other.

[0056] In addition, such as Figure 3 As shown, the AC shielding cavity 311 is closer to the power input interface 36 than the DC shielding cavity 312.

[0057] like Figure 3 As shown, a first wire hole 3131 is provided on the first partition plate 313, and the first wire (not shown) connecting the AC part 41 and the DC part 42 passes through the first wire hole 3131.

[0058] like Figure 3 and Figure 4 As shown, the AC section 41 includes an AC EMI filter 411 and an AC / DC converter 412. The input terminal of the AC EMI filter 411 is connected to the power input interface 36, the output terminal of the AC EMI filter 411 is connected to the input terminal of the AC / DC converter 412, and the output terminal of the AC / DC converter 412 is connected to the input terminal of the DC section 42.

[0059] like Figure 3 and Figure 4 As shown, the DC section 42 includes a DC EMI filter 421 and a DC / DC converter 422. The input terminal of the DC EMI filter 421 is connected to the output terminal of the AC / DC converter, the output terminal of the DC EMI filter 421 is connected to the input terminal of the DC / DC converter 422, and the output terminal of the DC / DC converter 422 is connected to the power adapter board 50.

[0060] like Figure 3 As shown, a second partition 34 is provided between the power conversion circuit mounting cavity 31 and the power adapter board mounting cavity 32, isolating the power conversion circuit mounting cavity 31 and the power adapter board mounting cavity 32 from each other. A second wire through hole 341 is provided on the second partition 34, through which the second wire (not shown) connecting the power adapter board 50 and the DC / DC converter 422 passes.

[0061] like Figure 3 As shown, the second wire hole 341 is closer to the DC section 42 of the power conversion circuit 40 than the AC section 41 of the power conversion circuit 40.

[0062] like Figure 2 and Figure 5 As shown, the outer casing 30 also includes a first cover plate 38, which covers the protrusion on the front or rear side of the recessed area.

[0063] like Figure 5 As shown, when the first cover plate 38 is removed, the RF circuit board mounting cavity 33 can be exposed on the upper side of the housing 30. That is, the RF circuit board mounting cavity 33 has a first mounting opening facing upward, and the first cover plate 38 can cover the first mounting opening, thereby sealing the upper side of the housing 30.

[0064] As can be seen from this embodiment, the first mounting port of the power conversion circuit mounting cavity 31 and the second mounting port of the power adapter board mounting cavity 32 both face downwards, and the third mounting port of the radio frequency circuit board mounting cavity 33 faces upwards. That is, the first mounting port and the second mounting port both face a third direction, and the third mounting port faces a fourth direction opposite to the third direction.

[0065] like Figure 5 As shown, an RF circuit board 60 is disposed within the RF circuit board mounting cavity 33. Specifically, the RF circuit board mounting cavity 33 may include mutually isolated RF circuit board mounting sub-cavities 331, for example, each RF circuit board mounting cavity 33 may include five RF circuit board mounting sub-cavities 331. One RF circuit board 65 is mounted within each RF circuit board mounting sub-cavity 331.

[0066] like Figure 6 As shown, the RF circuit board mounting cavity 33 is located above the power adapter board mounting cavity 32. A third partition 35 is provided between the power adapter board mounting cavity 32 and the RF circuit board mounting cavity 33, which isolates the power adapter board mounting cavity 32 and the RF circuit board mounting cavity 33 from each other.

[0067] Furthermore, in this embodiment, the radio frequency circuit sub-board 65 is mounted on the upper surface of the third partition 35 by screws, and the power adapter board 50 is mounted on the lower surface of the third partition 35 by screws.

[0068] like Figure 7 and Figure 8 As shown, each RF circuit sub-board 65 is electrically connected to the power adapter board 50. Specifically, the upper surface of the power adapter board 50 is provided with a plurality of upwardly protruding probes 51, and the lower surface of the RF circuit sub-board 65 is provided with pads 64. The upper ends of the probes 51 abut against the pads 64, thereby electrically connecting the RF circuit sub-board 65 to the power adapter board 50.

[0069] Understandably, the third partition 35 is provided with a through hole (not shown) for the probe 51 to pass through.

[0070] like Figure 9 As shown, the RF circuit board 60 or RF circuit sub-board 65 is provided with an RF input connector 61, a local oscillator input connector 62, and an IQ signal output connector 63. All three connectors are soldered directly onto the RF circuit board 60. That is, the RF input connector 61, local oscillator input connector 62, and IQ signal output connector 63 are directly connected to the RF circuit board 60, eliminating the need for additional wires. This reduces the number of traces on the RF circuit board 60 and avoids trace crossings that could degrade the reliability of the multi-channel RF front-end device.

[0071] As an example, the RF input connector 61 can be an SMA connector.

[0072] As an example, the local oscillator input connector 62 can be an SMA connector.

[0073] As an example, the IQ signal output connector 63 can be an HDIM connector.

[0074] like Figure 9 As shown, the interfaces of RF input connector 61 and local oscillator input connector 62 face a first direction, while the interface of IQ signal output connector 63 faces a second direction opposite to the first direction. Therefore, the first RF line connecting RF input connector 61 and the second RF input line connecting local oscillator input connector 62 will not cross the digital lines connecting IQ signal output connector 63.

[0075] In summary, this application has at least the following beneficial effects:

[0076] The RF circuit board 60 is equipped with a connector for connection to external lines, which avoids a large number of lines running inside the cavity and interference signals on the lines being coupled into the RF circuit.

[0077] The radio frequency circuit sub-boards 65 are respectively set in a radio frequency circuit board mounting cavity 331 to improve the isolation between channels and prevent external interference signals from being introduced.

[0078] The modular design simplifies assembly and improves production efficiency.

[0079] The power adapter board 50 and the radio frequency circuit board 60 are connected by probe 51, which facilitates installation and avoids power interference caused by long cable runs.

[0080] The RF circuit has high requirements for power supply ripple and prevents low-frequency common-mode interference from leaking to the output. In the power conversion circuit 40, the principle of minimizing the power supply loop path is adhered to, and the AC and DC parts are prevented from interfering with each other by using a separate cavity.

[0081] Although this application has been described in detail above with general descriptions, specific embodiments, and experiments, some modifications or improvements can be made to it, which will be obvious to those skilled in the art. Therefore, all such modifications or improvements made without departing from the spirit of this application fall within the scope of protection claimed in this application.

Claims

1. A multi-channel radio frequency front-end device, characterized in that, include: The housing (30) includes mutually isolated power conversion circuit mounting cavity (31), power adapter board mounting cavity (32) and radio frequency circuit board mounting cavity (33); A power conversion circuit (40) is disposed within the power conversion circuit mounting cavity (31); A power adapter board (50) is disposed in the power adapter board mounting cavity (32) and is electrically connected to the power conversion circuit (40). as well as Radio frequency circuit board (60) is disposed in the radio frequency circuit board mounting cavity (33), and the radio frequency circuit board (60) and the power adapter board (50) are electrically connected through probes (51) and pads (64); The radio frequency circuit board (60) is provided with a radio frequency input connector (61), a local oscillator input connector (62) and an IQ signal output connector (63), and the radio frequency input connector (61), the local oscillator input connector (62) and the IQ signal output connector (63) are all soldered on the radio frequency circuit board (60).

2. The multi-channel radio frequency front-end device according to claim 1, characterized in that, The power conversion circuit (40) includes an AC section (41) and a DC section (42). The power conversion circuit mounting cavity (31) includes an AC shielding cavity (311), a DC shielding cavity (312), and a first partition (313) disposed between the AC shielding cavity (311) and the DC shielding cavity (312). The AC part (41) is disposed in the AC shielding cavity (311), the DC part (42) is disposed in the DC shielding cavity (312), and the first wire connecting the AC part (41) and the DC part (42) passes through the first wire hole (3131) of the first partition (313).

3. The multi-channel radio frequency front-end device according to claim 1, characterized in that, A second partition (34) is provided between the power conversion circuit mounting cavity (31) and the power adapter plate mounting cavity (32). A second wire hole (341) is provided on the second partition (34), and the second wire connecting the power conversion circuit (40) and the power adapter plate (50) passes through the second wire hole (341).

4. The multi-channel radio frequency front-end device according to claim 3, characterized in that, The second through hole (341) is closer to the DC portion (42) of the power conversion circuit (40) than the AC portion (41) of the power conversion circuit (40).

5. The multi-channel radio frequency front-end device according to claim 1, characterized in that, A third partition (35) is provided between the power adapter mounting cavity (32) and the radio frequency circuit board mounting cavity (33). A through hole is provided on the third partition (35), and the probe (51) passes through the through hole.

6. The multi-channel radio frequency front-end device according to claim 1, characterized in that, The RF input connector (61) is an SMA connector; and / or The local oscillator input connector (62) is an SMA connector; and / or The IQ signal output connector (63) is an HDIM connector.

7. The multi-channel radio frequency front-end device according to any one of claims 1 to 6, characterized in that, The RF circuit board mounting cavity (33) includes multiple RF circuit board mounting sub-cavities (331) that are isolated from each other. The RF circuit board (60) includes multiple independent RF circuit sub-boards (65), and each RF circuit sub-board (65) is disposed in a corresponding RF circuit board mounting sub-cavity (331).

8. The multi-channel radio frequency front-end device according to any one of claims 1 to 6, characterized in that, The interfaces of the RF input connector (61) and the local oscillator input connector (62) face a first direction, and the interface of the IQ signal output connector (63) faces a second direction opposite to the first direction.

9. The multi-channel radio frequency front-end device according to any one of claims 1 to 6, characterized in that, The power conversion circuit mounting cavity (31) has a first mounting port, the power adapter board mounting cavity (32) has a second mounting port, and the radio frequency circuit board mounting cavity (33) has a third mounting port. The first mounting port and the second mounting port both face a third direction, while the third mounting port faces a fourth direction opposite to the third direction.

10. A radio direction finding and positioning system, characterized in that, include: Array antenna; Local oscillator signal source; The multi-channel radio frequency front-end device according to any one of claims 1 to 9, wherein the radio frequency input connector (61) is connected to the antenna element of the array antenna via a first radio frequency cable, and the local oscillator input connector (62) is connected to the local oscillator signal source via a second radio frequency cable; The acquisition device is connected to the IQ signal output connector (63) via a digital line; as well as A data processing server, which is coupled to the acquisition device.